Abstract: A method of making a PEEK-PEoEK copolymer having RPEEK and RPEoEK repeat units in a molar ratio RPEEK/RPEoEK ranging from 95/5 to 45/55, the PEEK-PEoEK copolymer obtained from the method and the polymer composition including the PEEK-PEoEK copolymer, at least one reinforcing filler, at least one additive, or a combination thereof, shaped articles including the polymer composition, polymer-metal junctions including the polymer composition. Also described are methods of making the polymer composition, methods of making the shaped articles, and methods of making the polymer-metal junctions.

Abstract: A film capacitor that includes: a dielectric resin film; and a metal layer on at least one surface of the dielectric resin film. The dielectric resin film contains at least one skeleton selected from the group consisting of a biphenyl skeleton, a bisphenol acetophenone skeleton, a bisphenol fluorene skeleton, a bisphenol S skeleton, a bisphenol cyclohexanone skeleton, and an epoxy-modified bisphenol A skeleton.

Abstract: A polymer blend, including: (i) a poly(aryl ether ketone); (ii) a polysiloxane; and (iii) a block copolymer containing polysiloxane blocks. A process for manufacturing the polymer blend, the use of the polymer blend for the manufacture of parts, notably in the petroleum, cabling, aeronautical, motor vehicle, electronics, electrotechnical, composite, additive manufacturing and medical device sectors and also a part at least partially manufactured from said blend.

Abstract: A device for detecting airborne contaminants includes a protonated, electrically conductive sensing material with affinity for binding with, and capable of being deprotonated by, the airborne contaminant. Electronics measure a property of the sensing material that is sensitive to deprotonation and generates signals indicative of the airborne contaminant. A method for detecting airborne contaminants includes: determining a property change of the protonated, electrically conductive material; and determining presence of the airborne contaminant based on the change.

Abstract: A device for detecting airborne contaminants includes a protonated, electrically conductive sensing material with affinity for binding with, and capable of being deprotonated by, the airborne contaminant. Electronics measure a property of the sensing material that is sensitive to deprotonation and generates signals indicative of the airborne contaminant. A method for detecting airborne contaminants includes: determining a property change of the protonated, electrically conductive material; and determining presence of the airborne contaminant based on the change.

Abstract: A catalyst for use with a phenolic resins which imparts accelerated curing at reduced temperatures. The catalyst is selected from elemental halogen or opium polyhalide compounds of the general formula: O+X(2n+1)?, where 1?n?4, Q is onium group, preferably selected from ammonium, sulfonium and phosphonium; and X is a halide. Each X may be the same or different and may include mixed halides such a X?Br2Cl or Cl2Br.

Abstract: This invention relates to compositions and a process for stabilizing or solubilize a phenolic resin containing a mixture of linear phenolic resins and calixarenes. The process comprises contacting the phenolic resin with an epoxide, to at least partially alkoxylate the phenolic hydroxyl groups of the calixarenes. This process forms a stabilized or solubilized phenolic resin with an increased solubility in a hydrocarbon solvent.

Abstract: A resin composition containing the reaction product of a 5-hydroxymethyl furfural (HMF) produced in-situ from e.g., glucose and a phenolic compound. Phenolic compounds include phenol, cardanol and bio-phenol. The resin is heat-curable using cross-linking agents such as tetraethylammonium chloride or lignin, etc.

Abstract: A support material for use in an additive manufacturing system to print a support structure for a three-dimensional part. The support material includes a base resin that is substantially miscible with a part material used to print the three-dimensional part, and has a glass transition temperature within about 10° C. of a glass transition temperature of the part material. The support material also includes a dispersed resin that is substantially immiscible with the base resin, where the base resin and the dispersed resin are each thermally stable for use in the additive manufacturing system in coordination with the part material.

Abstract: The present invention relates to molding compositions comprising (A) from 29 to 89% by weight of at least one polyarylene ether sulfone having an average number of phenolic end groups per chain of from 0 to 0.2, (B) from 0.5 to 20% by weight of a thermotropic polymer, (C) from 0.5 to 10% by weight of a polyarylene ether having predominantly OH end groups, (D) from 10 to 70% by weight of at least one fibrous or particulate filler, (E) from 0 to 40% by weight of additives or processing aids, where the total of the proportions by weight is 100% by weight, based on the thermoplastic molding composition.

Abstract: An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler.

Abstract: The invention provides a retarded acid-curing pre-polymeric composition wherein the composition comprises an acid, a pre-polymer and hydroxylamine; use of hydroxylamine as a retarder for an acid-curing pre-polymer composition; a method of retarding the curing of an acid-curing pre-polymeric composition which method comprises the step of adding hydroxylamine to the pre-polymer to form a pre-polymer mixture; and a method of curing a retarded acid-curing pre-polymeric composition wherein the method comprises the step of heating the composition to an elevated temperature for use in improving processing and controlling reactivity in a wide range of industrial applications.

Abstract: The present invention relates to a process for the production of low-halogen-content polybiphenyl sulfone polymers, to the resultant polybiphenyl sulfone polymers, to polybiphenyl sulfone polymers having less than 400 ppm content of polymer-bonded halogen, to thermoplastic molding compositions comprising these polybiphenyl sulfone polymers, and to their use for the production of moldings, of fibers, of films, of membranes, or of foams.

Abstract: The present invention is a nanotechnology-based personal sensor device composed of molecularly imprinted polymers that are interrogated using radio frequency identification (RFID) technology for use in simultaneously monitoring airborne contaminants, e.g., of second-hand cigarette smoke.

Abstract: A battery capable of improving the safety when the battery is broken while securing the cycle characteristics is provided. The battery includes a cathode, an anode, and an electrolyte. The anode includes an anode active material layer that has a resin containing sulfur (S). Compared to a case not having the resin containing resin, a sufficient discharge capacity can be obtained even when charge and discharge is repeated, and smoking and ignition are not easily generated when the battery is broken. Thereby, the cycle characteristics are secured, and the safety when the battery is broken is improved.

Abstract: The present invention relates to a process for the production of low-chlorine-content polybiphenyl sulfone polymers, to the polybiphenyl sulfone polymers obtainable in this way, to polybiphenyl sulfone polymers with less than 800 ppm content of organically bonded chlorine, to thermoplastic molding compositions and moldings, fibers, films, membranes, or foams comprising the polybiphenyl sulfone polymers mentioned, and also to their use for the production of moldings, of fibers, of films, of membranes, or of foams.

Abstract: There is provided a porous formed article which can remove hazardous substances at a high speed, has a high adsorption capacity and has high durability to cleaning chemicals and further which is scarcely broken even if being repeatedly used, and which contains an organic polymeric resin and an inorganic ion-adsorbing material, wherein the organic polymeric resin is a polyether sulfone resin and/or a polysulfone resin, and is an organic polymeric resin having a hydroxyl group.

Abstract: The present invention provides Mannich base derivatives of N,N?-dimethyl secondary diamine polymers including Mannich base derivatives of methylamine-terminated poly-(N-methylazetidine) and Mannich base derivatives of methylamine-terminated poly-(N-methylazacycloheptane). Amine curing agent compositions and amine-epoxy compositions containing Mannich base derivatives of N,N?-dimethyl secondary diamine polymers are also disclosed.

Abstract: A soluble n-type copolymer that is useful in electronic and photonic devices. Embodiments of the invention include an n-type copolymer having a soluble n-type perylene copolymer having base formula A, where R is a backbone segment, where R1 and R2 are independently selected from the group consisting of alkyl, fluorinated alkyl, functionalized alkyl, aryl, fluorinated aryl, and functionalized aryl, and where n ranges from about 2 to 50,000.

Abstract: The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

Abstract: A coating for implantable medical devices and a method for fabricating thereof are disclosed. The coating includes a mixture of a hydrophobic polymer and a polymeric hydrophilic additive, wherein the hydrophobic polymer and the hydrophilic additive form a physically entangled or interpenetrating system.

Abstract: Thermoplastic toughened epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising a tri functional epoxy resin and/or tetra functional epoxy, a thermoplastic component and 4,4?-Bis(p-aminophenoxy) biphenyl (BAPB) as the curing agent. The use of BAPB as a curative was found to increase the resistance of the cured resin to attack by solvents.

Abstract: An adhesive composition includes a first part comprising about 15 to about 60 wt % of an epoxy compound, about 35 to about 80 wt % of an epoxy novolac, and about 5 to about 25 wt % of an epoxy-based reactive diluent based on the total weight of epoxy compound, epoxy novolac, and reactive diluent; and a second part comprising less than about 20 wt % of a hydroxyaromatic solvent, about 80 to about 99 wt % of a Mannich base, and about 1 to about 20 wt % of a tertiary amine, based on the total weight of hydroxyaromatic solvent, Mannich base, and tertiary amine, the first and second parts being present in a volume ratio of about 0.8:1 to about 1.2:1. Additives to further enhance the properties may be included. A method of forming an adhesive layer includes applying the adhesive composition to a surface.

Abstract: An adsorptive carrier includes one or more high-molecular-weight compounds each of which includes two or more aromatic ring-containing repeating units, the aromatic rings being covalently bound to each other via a structure represented by Formula (I): wherein R1 represents hydrogen or an organic group, and R2 represents an organic group.

Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.

Abstract: The present invention relates to a process for the production of low-chlorine-content polybiphenyl sulfone polymers, to the polybiphenyl sulfone polymers obtainable in this way, to polybiphenyl sulfone polymers with less than 800 ppm content of organically bonded chlorine, to thermoplastic molding compositions and moldings, fibers, films, membranes, or foams comprising the polybiphenyl sulfone polymers mentioned, and also to their use for the production of moldings, of fibers, of films, of membranes, or of foams.

Abstract: The invention relates to a process for improving the stability of a base-modified alkylphenol-aldehyde resin (such as an amine-modified alkylphenol-aldehyde resin). The process comprises the step of reacting a base-modified alkylphenol-aldehyde resin with a salicylic acid to stabilize the base-modified alkylphenol-aldehyde resin. The invention also relates to a modified alkylphenol-aldehyde resin formed from the stabilizing process, and its use in a tackifier composition and rubber composition.

Abstract: The invention relates to an in-situ process for preparing an alkylphenol-aldehyde resin. The process comprises the step of providing a raw alkylphenol composition. The raw alkylphenol composition comprises one or more alkylphenol compounds and at least about 1 wt % phenol. Each alkylphenol compound has one or more alkyl substituents. The raw alkylphenol composition is reacted directly, without pre-purification, with one or more aldehydes to form an in-situ alkylphenol-aldehyde resin. The invention also relates to an in-situ alkylphenol-aldehyde resin formed from the in-situ process, and its use in a tackifier composition and rubber composition. The tackifier composition and rubber composition containing the in-situ alkylphenol-aldehyde resin show, inter alia, improved tack performance.

Abstract: The present invention relates to a process for preparing a block copolymer comprising polyarylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated polyarylene ether with a monomeric alkylene oxide. The present invention also relates to a block copolymer obtainable from this process. The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.

Abstract: A composition having a crosslinking compound that has the following structure (I) wherein R is OH, NH2, halide, ester, amine, ether, or amide, and x is 2-6 and A is an arene moiety having a molecular weight of less than about 10,000. A mixture including the composition and a polymer, a method for forming the mixture and a crosslinked polymer are also disclosed.

Abstract: Fasteners, such as bolts, nuts and screws, rivets, pins, and retaining rings, made of a highly kinked rigid-rod polyarylene exhibiting outstanding characteristics, notably a high torque and a high tensile elongation, a measure of practical toughness.

Abstract: Methods for making wet gels and dried gels therefrom are provided. The method for making a wet gel can include combining a hydroxybenzene compound, an aldehyde compound, and an additive to produce a reaction mixture. The additive can include a carboxylic acid, an anhydride, a homopolymer, a copolymer, or any mixture thereof. At least the hydroxybenzene compound and the aldehyde compound can be reacted to produce a wet gel. The reaction mixture can include about 10 wt % to about 65 wt % of the hydroxybenzene compound, about 5 wt % to about 25 wt % of the aldehyde compound, up to about 85 wt % of the carboxylic acid, up to about 40 wt % of the anhydride, up to about 40 wt % of the homopolymer, and up to about 40 wt % of the copolymer, where weight percent values are based on the combined weight of the hydroxybenzene compound, the aldehyde compound, and the additive.

Abstract: A method for preparing a polyethersulfone includes oxidation of a poly arylene ether sulfone-sulfide compound including a repeat unit represented by Formula 1 with an aqueous solution of an organic acid and an aqueous solution of hydrogen peroxide. In the method, the overall process is carried out under mild conditions of about 190° C. or less, thereby enabling economic preparation of a polyethersulfone without complicated post-treatment, such as separation of by-products formed from a basic compound, and the like. wherein R1, R2, R3 and R4 are each independently a C1 to C10 hydrocarbon group, and a, b, c and d are each independently an integer from 0 to 4.

Abstract: The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.

Abstract: The present invention relates to a method for preparing polymer-nanoparticles having a core-shell structure by uniformly coating a polymer on metal and inorganic particles, polymer-nanoparticles prepared thereby, and a polymer-nanoparticle composite comprising the same, and more specifically, a method for preparing polymer-nanoparticles having a core-shell structure by uniformly coating a polymer on metal and inorganic particles, polymer-nanoparticles prepared thereby, and a polymer-nanoparticle composite including the same, wherein when forming a polymer coating layer on surfaces of particles that are not subjected to separate surface treatment, excessive polymers uncoated on nanoparticles are easily removed by adding to an ionic liquid or an apolar solvent so that the polymer coating layer is formed with a nanometer-scale uniform thickness and a dense coating density, thereby showing excellent dispersibility in a polymer matrix.

Abstract: An organosiloxane-modified novolak resin comprising structural units having formula (1) wherein R1 is an organosiloxy group having a monovalent C1-C10 hydrocarbon group bonded to silicon, and R2 is H or C1-C4 alkyl or alkoxy. The resin has high heat resistance and high strength inherent to novolak resins and low stress inherent to organosilicon compounds.

Abstract: The present invention relates to a process for preparing a block copolymer comprising poly-arylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated poly-arylene ether with a monomeric alkylene oxide. The present invention also relates to a block copolymer obtainable from this process. The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.

Abstract: A bulk heterojunction-type organic photovoltaic cell, i.e., BHJ solar cell, has a photoelectric conversion layer containing a mixture of a donor domain and an acceptor domain. The donor domain contains a polymer as a donor (photoelectric conversion material), and the polymer is obtained by reaction of a polyphenylene represented by the following general formula (1). For example, the acceptor domain contains phenyl-C61-butyric acid methyl ester (PCBM) as an acceptor. At least one of R1 to R6 in the general formula (1) is an alkoxy group, and R7 to R10 independently represent a hydrogen atom, an alkyl group, or an alkoxy group.

Abstract: An emulsifier for emulsion polymerization includes a compound represented by the following general: X=H, —(CH2)a—SO3M, —(CH2)b—COOM, —PO3M2, —P(B)O2M, or —CO—CH2—CH(SO3M)-COOM Y= Z=

Abstract: The invention provides modified polysulfones substituted in one or more of the phenyl rings by functional groups and membranes composed of the modified polysulfones. Also provided are methods for the preparation of monodispersed nanoporous polymeric membranes. The membranes are useful for reverse osmosis, nanofiltration, and ultrafiltration, particularly for purification of water.

Abstract: A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).

Abstract: The present polymeric materials can be patterned with relatively low photo-exposure energies and are thermally stable, mechanically robust, resist water penetration, and show good adhesion to metal oxides, metals, metal alloys, as well as organic materials. In addition, these polymeric materials can be solution-processed (e.g., by spin-coating), and can exhibit good chemical (e.g., solvent and etchant) resistance in the cured form.

Abstract: A thermoplastic polyurethane is formed by the reaction of a specific hydroxy-diterminated poly(phenylene ether) and an organic diisocyanate. The polyurethane-forming reaction optionally employs diols other than the hydroxy-diterminated poly(phenylene ether). Compared to thermoplastic polyurethanes lacking the residue of the hydroxy-diterminated poly(phenylene ether), the thermoplastic polyurethanes described herein exhibit properties including one or more of improved heat and oxidation resistance, improved resistance to acids, bases, and solvent, and reduced water absorption.

Abstract: Certain embodiments are directed to cyanate resin blends comprising, for example, a mixture of a cyanate monomer and a cyanate oligomer. The resin blends are effective to provide a dielectric constant of less than 2.7, a glass transition temperature of at least 150° C. and a moisture absorption of less than 1.5%. Radomes using the resin are also described.

Abstract: A flame-retardant resin composition comprises a base resin (A), such as a polyamide resin, and an aromatic organophosphorus oligomer or polymer.

Abstract: The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.

Abstract: Epoxy resin compositions utilizing phosphazene blocked azole compounds as curing catalyst are provided. Also provided are epoxy resins cured with phosphazene blocked azole compounds and methods of making cured epoxy resins using curing catalysts of phosphazene blocked azole compounds.

Abstract: A resin composition constituting dielectric resin films of a film capacitor includes a first atom group including at least one functional group selected from among a methylene group, an aromatic ring and an ether group and having a relatively small molar polarizability, and a second atom group including at least one functional group selected from among a hydroxyl group, an amino group and a carbonyl group and having a relatively large molar polarizability. The resin composition satisfies the condition that a value calculated from the formula (sum of absorption band intensities of first atom group)/(sum of absorption band intensities of second atom group) is 1.0 or more. Herein, as absorption band intensities of the functional groups, peak intensities detected in specific wavenumber ranges are employed.

Abstract: Thermoplastic polymer particles directly cross-linked together or cross-linked via a separate and independent polymer network to form an inter-penetrating network are disclosed herein, along with methods of manufacturing and use as interleaf tougheners of pre-pregs and composite articles.

Abstract: The invention relates to an antireflective coating composition comprising a crosslinkable polymer, where the crosslinkable polymer comprises at least one unit of fused aromatic moiety, at least one unit with a phenylene moiety in the backbone of the polymer, and at least one hydroxybiphenyl unit, furthermore where the polymer comprises a crosslinking moiety of structure (4), where R?3, R?3 and R??3 are independently hydrogen or a C1-C4alkyl. The invention further relates to a process for forming an image using the composition.