Solid Polymer Derived From Phenolic Reactant Patents (Class 525/534)
  • Patent number: 10266633
    Abstract: A resin composition containing the reaction product of a 5-hydroxymethyl furfural (HMF) produced in-situ from e.g., glucose and a phenolic compound. Phenolic compounds include phenol, cardanol and bio-phenol. The resin is heat-curable using cross-linking agents such as tetraethylammonium chloride or lignin, etc.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: April 23, 2019
    Assignee: THE UNIVERSITY OF WESTERN ONTARIO
    Inventors: Chunbao Xu, Yongsheng Zhang, Zhongshun Yuan
  • Patent number: 10059053
    Abstract: A support material for use in an additive manufacturing system to print a support structure for a three-dimensional part. The support material includes a base resin that is substantially miscible with a part material used to print the three-dimensional part, and has a glass transition temperature within about 10° C. of a glass transition temperature of the part material. The support material also includes a dispersed resin that is substantially immiscible with the base resin, where the base resin and the dispersed resin are each thermally stable for use in the additive manufacturing system in coordination with the part material.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: August 28, 2018
    Assignee: Stratasys, Inc.
    Inventors: Vittorio L. Jaker, Luke M. B. Rodgers
  • Patent number: 9567463
    Abstract: The present invention relates to molding compositions comprising (A) from 29 to 89% by weight of at least one polyarylene ether sulfone having an average number of phenolic end groups per chain of from 0 to 0.2, (B) from 0.5 to 20% by weight of a thermotropic polymer, (C) from 0.5 to 10% by weight of a polyarylene ether having predominantly OH end groups, (D) from 10 to 70% by weight of at least one fibrous or particulate filler, (E) from 0 to 40% by weight of additives or processing aids, where the total of the proportions by weight is 100% by weight, based on the thermoplastic molding composition.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: February 14, 2017
    Assignee: BASF SE
    Inventors: Martin Weber, Christian Maletzko, Florian Hennenberger
  • Patent number: 9497857
    Abstract: An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler.
    Type: Grant
    Filed: September 13, 2010
    Date of Patent: November 15, 2016
    Assignee: Denka Company Limited
    Inventors: Kenji Miyata, Toshitaka Yamagata
  • Patent number: 9487644
    Abstract: The invention provides a retarded acid-curing pre-polymeric composition wherein the composition comprises an acid, a pre-polymer and hydroxylamine; use of hydroxylamine as a retarder for an acid-curing pre-polymer composition; a method of retarding the curing of an acid-curing pre-polymeric composition which method comprises the step of adding hydroxylamine to the pre-polymer to form a pre-polymer mixture; and a method of curing a retarded acid-curing pre-polymeric composition wherein the method comprises the step of heating the composition to an elevated temperature for use in improving processing and controlling reactivity in a wide range of industrial applications.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: November 8, 2016
    Assignee: BAC2 LIMITED
    Inventor: Graham Simpson Murray
  • Patent number: 9469732
    Abstract: The present invention relates to a process for the production of low-halogen-content polybiphenyl sulfone polymers, to the resultant polybiphenyl sulfone polymers, to polybiphenyl sulfone polymers having less than 400 ppm content of polymer-bonded halogen, to thermoplastic molding compositions comprising these polybiphenyl sulfone polymers, and to their use for the production of moldings, of fibers, of films, of membranes, or of foams.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: October 18, 2016
    Assignee: BASF SE
    Inventors: Martin Weber, Christian Maletzko, Gerhard Lange, Jörg Erbes, Matthias Dietrich, Nicolas Inchaurrondo, Christoph Sigwart
  • Patent number: 9429536
    Abstract: The present invention is a nanotechnology-based personal sensor device composed of molecularly imprinted polymers that are interrogated using radio frequency identification (RFID) technology for use in simultaneously monitoring airborne contaminants, e.g., of second-hand cigarette smoke.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: August 30, 2016
    Assignee: TRUSTEES OF DARTMOUTH COLLEGE
    Inventors: Joseph J. BelBruno, Susanne E. Tanski
  • Patent number: 9385373
    Abstract: A battery capable of improving the safety when the battery is broken while securing the cycle characteristics is provided. The battery includes a cathode, an anode, and an electrolyte. The anode includes an anode active material layer that has a resin containing sulfur (S). Compared to a case not having the resin containing resin, a sufficient discharge capacity can be obtained even when charge and discharge is repeated, and smoking and ignition are not easily generated when the battery is broken. Thereby, the cycle characteristics are secured, and the safety when the battery is broken is improved.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: July 5, 2016
    Assignee: SONY CORPORATION
    Inventors: Yoshikazu Kato, Kenichi Kawase
  • Patent number: 9365680
    Abstract: The present invention relates to a process for the production of low-chlorine-content polybiphenyl sulfone polymers, to the polybiphenyl sulfone polymers obtainable in this way, to polybiphenyl sulfone polymers with less than 800 ppm content of organically bonded chlorine, to thermoplastic molding compositions and moldings, fibers, films, membranes, or foams comprising the polybiphenyl sulfone polymers mentioned, and also to their use for the production of moldings, of fibers, of films, of membranes, or of foams.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: June 14, 2016
    Assignee: BASF SE
    Inventors: Martin Weber, Christian Maletzko, Gerhard Lange, Jörg Erbes, Matthias Dietrich, Nicholas Inchaurrondo
  • Patent number: 9359227
    Abstract: There is provided a porous formed article which can remove hazardous substances at a high speed, has a high adsorption capacity and has high durability to cleaning chemicals and further which is scarcely broken even if being repeatedly used, and which contains an organic polymeric resin and an inorganic ion-adsorbing material, wherein the organic polymeric resin is a polyether sulfone resin and/or a polysulfone resin, and is an organic polymeric resin having a hydroxyl group.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: June 7, 2016
    Assignee: Asahi Kasei Chemicals Corporation
    Inventor: Akihiro Omori
  • Patent number: 9334409
    Abstract: The present invention provides Mannich base derivatives of N,N?-dimethyl secondary diamine polymers including Mannich base derivatives of methylamine-terminated poly-(N-methylazetidine) and Mannich base derivatives of methylamine-terminated poly-(N-methylazacycloheptane). Amine curing agent compositions and amine-epoxy compositions containing Mannich base derivatives of N,N?-dimethyl secondary diamine polymers are also disclosed.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: May 10, 2016
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Frederick Herbert Walker, Michael Ian Cook, Gamini Ananda Vedage, Robert Marjo Theodoor Rasing
  • Patent number: 9315623
    Abstract: A soluble n-type copolymer that is useful in electronic and photonic devices. Embodiments of the invention include an n-type copolymer having a soluble n-type perylene copolymer having base formula A, where R is a backbone segment, where R1 and R2 are independently selected from the group consisting of alkyl, fluorinated alkyl, functionalized alkyl, aryl, fluorinated aryl, and functionalized aryl, and where n ranges from about 2 to 50,000.
    Type: Grant
    Filed: August 20, 2013
    Date of Patent: April 19, 2016
    Assignee: The United States of America as Represented by the Secretary of the Navy
    Inventors: William C. Lai, Alfred Baca, Benjamin Harvey, M. Joseph Roberts, Heather Meylemans
  • Patent number: 9245667
    Abstract: The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: January 26, 2016
    Assignee: ITEQ CORPORATION
    Inventors: Meng-Song Yin, Li-Chun Chen
  • Patent number: 9175162
    Abstract: A coating for implantable medical devices and a method for fabricating thereof are disclosed. The coating includes a mixture of a hydrophobic polymer and a polymeric hydrophilic additive, wherein the hydrophobic polymer and the hydrophilic additive form a physically entangled or interpenetrating system.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: November 3, 2015
    Assignee: Advanced Cardiovascular Systems, Inc.
    Inventors: Stephen D. Pacetti, Yiwen Tang
  • Patent number: 9068040
    Abstract: Thermoplastic toughened epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising a tri functional epoxy resin and/or tetra functional epoxy, a thermoplastic component and 4,4?-Bis(p-aminophenoxy) biphenyl (BAPB) as the curing agent. The use of BAPB as a curative was found to increase the resistance of the cured resin to attack by solvents.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: June 30, 2015
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Patent number: 9040607
    Abstract: An adhesive composition includes a first part comprising about 15 to about 60 wt % of an epoxy compound, about 35 to about 80 wt % of an epoxy novolac, and about 5 to about 25 wt % of an epoxy-based reactive diluent based on the total weight of epoxy compound, epoxy novolac, and reactive diluent; and a second part comprising less than about 20 wt % of a hydroxyaromatic solvent, about 80 to about 99 wt % of a Mannich base, and about 1 to about 20 wt % of a tertiary amine, based on the total weight of hydroxyaromatic solvent, Mannich base, and tertiary amine, the first and second parts being present in a volume ratio of about 0.8:1 to about 1.2:1. Additives to further enhance the properties may be included. A method of forming an adhesive layer includes applying the adhesive composition to a surface.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: May 26, 2015
    Assignee: BLACK & DECKER INC.
    Inventor: James E. Surjan
  • Patent number: 9023947
    Abstract: An adsorptive carrier includes one or more high-molecular-weight compounds each of which includes two or more aromatic ring-containing repeating units, the aromatic rings being covalently bound to each other via a structure represented by Formula (I): wherein R1 represents hydrogen or an organic group, and R2 represents an organic group.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: May 5, 2015
    Assignee: Toray Industries, Inc.
    Inventors: Naotoshi Tomita, Yoshiyuki Ueno
  • Publication number: 20150119485
    Abstract: The present invention relates to a process for the production of low-chlorine-content polybiphenyl sulfone polymers, to the polybiphenyl sulfone polymers obtainable in this way, to polybiphenyl sulfone polymers with less than 800 ppm content of organically bonded chlorine, to thermoplastic molding compositions and moldings, fibers, films, membranes, or foams comprising the polybiphenyl sulfone polymers mentioned, and also to their use for the production of moldings, of fibers, of films, of membranes, or of foams.
    Type: Application
    Filed: January 8, 2015
    Publication date: April 30, 2015
    Inventors: Martin Weber, Christian Maletzko, Gerhard Lange, Jörg Erbes, Matthias Dietrich, Nicholas Inchaurrondo
  • Publication number: 20150118499
    Abstract: A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.
    Type: Application
    Filed: March 19, 2013
    Publication date: April 30, 2015
    Inventors: Etsuko Suzuki, Kazuo Arita
  • Publication number: 20150112024
    Abstract: The invention relates to a process for improving the stability of a base-modified alkylphenol-aldehyde resin (such as an amine-modified alkylphenol-aldehyde resin). The process comprises the step of reacting a base-modified alkylphenol-aldehyde resin with a salicylic acid to stabilize the base-modified alkylphenol-aldehyde resin. The invention also relates to a modified alkylphenol-aldehyde resin formed from the stabilizing process, and its use in a tackifier composition and rubber composition.
    Type: Application
    Filed: October 15, 2014
    Publication date: April 23, 2015
    Inventors: Timothy Edward BANACH, John Morgan WHITNEY, Milan KNEZEVIC, Todd Scott Makenzie
  • Publication number: 20150112031
    Abstract: The present invention relates to a process for preparing a block copolymer comprising polyarylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated polyarylene ether with a monomeric alkylene oxide. The present invention also relates to a block copolymer obtainable from this process. The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.
    Type: Application
    Filed: December 23, 2014
    Publication date: April 23, 2015
    Applicant: BASF SE
    Inventors: Martin Weber, Thomas Weiss, Christian Maletzko, Bastiaan B. Pieter Staal, Claudia Spang
  • Publication number: 20150112023
    Abstract: The invention relates to an in-situ process for preparing an alkylphenol-aldehyde resin. The process comprises the step of providing a raw alkylphenol composition. The raw alkylphenol composition comprises one or more alkylphenol compounds and at least about 1 wt % phenol. Each alkylphenol compound has one or more alkyl substituents. The raw alkylphenol composition is reacted directly, without pre-purification, with one or more aldehydes to form an in-situ alkylphenol-aldehyde resin. The invention also relates to an in-situ alkylphenol-aldehyde resin formed from the in-situ process, and its use in a tackifier composition and rubber composition. The tackifier composition and rubber composition containing the in-situ alkylphenol-aldehyde resin show, inter alia, improved tack performance.
    Type: Application
    Filed: October 15, 2014
    Publication date: April 23, 2015
    Inventors: Timothy Edward Banach, John Morgan Whitney, Jeffrey M. Hiscock, Todd Scott Makenzie, Gennaro Barbiero
  • Patent number: 9006353
    Abstract: A composition having a crosslinking compound that has the following structure (I) wherein R is OH, NH2, halide, ester, amine, ether, or amide, and x is 2-6 and A is an arene moiety having a molecular weight of less than about 10,000. A mixture including the composition and a polymer, a method for forming the mixture and a crosslinked polymer are also disclosed.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: April 14, 2015
    Assignee: Delsper LP
    Inventors: William Franklin Burgoyne, Jr., Andrew Francis Nordquist, Kerry A. Drake, Le Song
  • Patent number: 9006384
    Abstract: Fasteners, such as bolts, nuts and screws, rivets, pins, and retaining rings, made of a highly kinked rigid-rod polyarylene exhibiting outstanding characteristics, notably a high torque and a high tensile elongation, a measure of practical toughness.
    Type: Grant
    Filed: March 26, 2010
    Date of Patent: April 14, 2015
    Assignee: Solvay Specialty Polymers USA, LLC
    Inventors: Gregory C. Plithides, Suresh Sriram
  • Publication number: 20150087731
    Abstract: Methods for making wet gels and dried gels therefrom are provided. The method for making a wet gel can include combining a hydroxybenzene compound, an aldehyde compound, and an additive to produce a reaction mixture. The additive can include a carboxylic acid, an anhydride, a homopolymer, a copolymer, or any mixture thereof. At least the hydroxybenzene compound and the aldehyde compound can be reacted to produce a wet gel. The reaction mixture can include about 10 wt % to about 65 wt % of the hydroxybenzene compound, about 5 wt % to about 25 wt % of the aldehyde compound, up to about 85 wt % of the carboxylic acid, up to about 40 wt % of the anhydride, up to about 40 wt % of the homopolymer, and up to about 40 wt % of the copolymer, where weight percent values are based on the combined weight of the hydroxybenzene compound, the aldehyde compound, and the additive.
    Type: Application
    Filed: September 18, 2014
    Publication date: March 26, 2015
    Inventors: Xing Dong, Shahid P. Qureshi, Christopher M. Lee, Kelly A. Shoemake, Joseph Frank Ludvik
  • Publication number: 20150080537
    Abstract: A method for preparing a polyethersulfone includes oxidation of a poly arylene ether sulfone-sulfide compound including a repeat unit represented by Formula 1 with an aqueous solution of an organic acid and an aqueous solution of hydrogen peroxide. In the method, the overall process is carried out under mild conditions of about 190° C. or less, thereby enabling economic preparation of a polyethersulfone without complicated post-treatment, such as separation of by-products formed from a basic compound, and the like. wherein R1, R2, R3 and R4 are each independently a C1 to C10 hydrocarbon group, and a, b, c and d are each independently an integer from 0 to 4.
    Type: Application
    Filed: August 22, 2014
    Publication date: March 19, 2015
    Inventors: Hyun Seok KIM, Im Hyuck BAE, Dong Wan SEO, Young Sub JIN
  • Patent number: 8981014
    Abstract: The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: March 17, 2015
    Assignees: Meiwa Plastic Industries, Ltd., UFC Corporation
    Inventors: Masato Takenouchi, Tadatoshi Fujinaga, Erina Kimura, Yu-Chin Lee, Jen-Hai Liao, Sung-Chen Lo
  • Publication number: 20150073101
    Abstract: The present invention relates to a method for preparing polymer-nanoparticles having a core-shell structure by uniformly coating a polymer on metal and inorganic particles, polymer-nanoparticles prepared thereby, and a polymer-nanoparticle composite comprising the same, and more specifically, a method for preparing polymer-nanoparticles having a core-shell structure by uniformly coating a polymer on metal and inorganic particles, polymer-nanoparticles prepared thereby, and a polymer-nanoparticle composite including the same, wherein when forming a polymer coating layer on surfaces of particles that are not subjected to separate surface treatment, excessive polymers uncoated on nanoparticles are easily removed by adding to an ionic liquid or an apolar solvent so that the polymer coating layer is formed with a nanometer-scale uniform thickness and a dense coating density, thereby showing excellent dispersibility in a polymer matrix.
    Type: Application
    Filed: April 3, 2013
    Publication date: March 12, 2015
    Inventors: Byoung Gak Kim, Jong Chan Won, Yong Seok Kim, No Kyun Park, Jin Young Park
  • Publication number: 20150057416
    Abstract: An organosiloxane-modified novolak resin comprising structural units having formula (1) wherein R1 is an organosiloxy group having a monovalent C1-C10 hydrocarbon group bonded to silicon, and R2 is H or C1-C4 alkyl or alkoxy. The resin has high heat resistance and high strength inherent to novolak resins and low stress inherent to organosilicon compounds.
    Type: Application
    Filed: July 14, 2014
    Publication date: February 26, 2015
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa
  • Patent number: 8952109
    Abstract: The present invention relates to a process for preparing a block copolymer comprising poly-arylene ether and polyalkylene oxide blocks, comprising the reaction of an HO-terminated poly-arylene ether with a monomeric alkylene oxide. The present invention also relates to a block copolymer obtainable from this process. The invention additionally relates to a triblock polymer with polyalkylene oxide-polyaryl ether-polyalkylene oxide blocks.
    Type: Grant
    Filed: August 3, 2012
    Date of Patent: February 10, 2015
    Assignee: BASF SE
    Inventors: Martin Weber, Thomas Weiβ, Christian Maletzko, Bastiaan Bram Pieter Staal, Claudia Spang
  • Publication number: 20150038654
    Abstract: An emulsifier for emulsion polymerization includes a compound represented by the following general: X=H, —(CH2)a—SO3M, —(CH2)b—COOM, —PO3M2, —P(B)O2M, or —CO—CH2—CH(SO3M)-COOM Y= Z=
    Type: Application
    Filed: December 12, 2012
    Publication date: February 5, 2015
    Inventors: Asako Ogasawara, Masayuki Hashimoto
  • Publication number: 20150034880
    Abstract: A bulk heterojunction-type organic photovoltaic cell, i.e., BHJ solar cell, has a photoelectric conversion layer containing a mixture of a donor domain and an acceptor domain. The donor domain contains a polymer as a donor (photoelectric conversion material), and the polymer is obtained by reaction of a polyphenylene represented by the following general formula (1). For example, the acceptor domain contains phenyl-C61-butyric acid methyl ester (PCBM) as an acceptor. At least one of R1 to R6 in the general formula (1) is an alkoxy group, and R7 to R10 independently represent a hydrogen atom, an alkyl group, or an alkoxy group.
    Type: Application
    Filed: July 29, 2014
    Publication date: February 5, 2015
    Inventors: Kazuhiro MIURA, Takahiro MIYAZAKI, Tadahiro SHIBA
  • Patent number: 8946356
    Abstract: A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: February 3, 2015
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Shunichiro I, Koichiro Yoshida, Takaaki Miyoshi
  • Patent number: 8944257
    Abstract: The invention provides modified polysulfones substituted in one or more of the phenyl rings by functional groups and membranes composed of the modified polysulfones. Also provided are methods for the preparation of monodispersed nanoporous polymeric membranes. The membranes are useful for reverse osmosis, nanofiltration, and ultrafiltration, particularly for purification of water.
    Type: Grant
    Filed: August 20, 2008
    Date of Patent: February 3, 2015
    Assignee: Technion Research and Development Foundation Ltd.
    Inventors: Moris S. Eisen, Raphael Semiat, Natalia Vainrot
  • Publication number: 20150021597
    Abstract: The present polymeric materials can be patterned with relatively low photo-exposure energies and are thermally stable, mechanically robust, resist water penetration, and show good adhesion to metal oxides, metals, metal alloys, as well as organic materials. In addition, these polymeric materials can be solution-processed (e.g., by spin-coating), and can exhibit good chemical (e.g., solvent and etchant) resistance in the cured form.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 22, 2015
    Inventors: Shaofeng Lu, Daniel Batzel, Chun Huang, Ming Huei Wang, Meko McCray, Yu Xia, Antonio Facchetti
  • Publication number: 20150004341
    Abstract: A thermoplastic polyurethane is formed by the reaction of a specific hydroxy-diterminated poly(phenylene ether) and an organic diisocyanate. The polyurethane-forming reaction optionally employs diols other than the hydroxy-diterminated poly(phenylene ether). Compared to thermoplastic polyurethanes lacking the residue of the hydroxy-diterminated poly(phenylene ether), the thermoplastic polyurethanes described herein exhibit properties including one or more of improved heat and oxidation resistance, improved resistance to acids, bases, and solvent, and reduced water absorption.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventor: Edward Norman Peters
  • Publication number: 20150005417
    Abstract: A flame-retardant resin composition comprises a base resin (A), such as a polyamide resin, and an aromatic organophosphorus oligomer or polymer.
    Type: Application
    Filed: September 15, 2014
    Publication date: January 1, 2015
    Applicant: CHEMTURA CORPORATION
    Inventors: LARRY D. TIMBERLAKE, MARK V. HANSON, NARAYAN SUBRAMANIAM, WILLIAM R. FIELDING, MATTHEW S. BURGE
  • Publication number: 20150002364
    Abstract: Certain embodiments are directed to cyanate resin blends comprising, for example, a mixture of a cyanate monomer and a cyanate oligomer. The resin blends are effective to provide a dielectric constant of less than 2.7, a glass transition temperature of at least 150° C. and a moisture absorption of less than 1.5%. Radomes using the resin are also described.
    Type: Application
    Filed: June 25, 2014
    Publication date: January 1, 2015
    Inventors: Kapsoo Cheon, Marie J. Hersman, Ajay Padwal
  • Publication number: 20140378622
    Abstract: The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.
    Type: Application
    Filed: May 16, 2014
    Publication date: December 25, 2014
    Applicants: MEIWA PLASTIC INDUSTRIES, LTD., UFC CORPORATION
    Inventors: Masato Takenouchi, Tadatoshi Fujinaga, Erina Kimura, Yu-Chin Lee, Jen-Hai Liao, Sung-Chen Lo
  • Patent number: 8916655
    Abstract: Epoxy resin compositions utilizing phosphazene blocked azole compounds as curing catalyst are provided. Also provided are epoxy resins cured with phosphazene blocked azole compounds and methods of making cured epoxy resins using curing catalysts of phosphazene blocked azole compounds.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: December 23, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Journey Lu Zhu, Ping Shao Ren, Shaoguang Feng
  • Publication number: 20140368970
    Abstract: A resin composition constituting dielectric resin films of a film capacitor includes a first atom group including at least one functional group selected from among a methylene group, an aromatic ring and an ether group and having a relatively small molar polarizability, and a second atom group including at least one functional group selected from among a hydroxyl group, an amino group and a carbonyl group and having a relatively large molar polarizability. The resin composition satisfies the condition that a value calculated from the formula (sum of absorption band intensities of first atom group)/(sum of absorption band intensities of second atom group) is 1.0 or more. Herein, as absorption band intensities of the functional groups, peak intensities detected in specific wavenumber ranges are employed.
    Type: Application
    Filed: August 29, 2014
    Publication date: December 18, 2014
    Inventors: Tomomichi Ichikawa, Norihiro Yoshikawa, Shinichi Kobayashi, Yasunori Hioki, Ichiro Nakaso, Tomoki Inakura
  • Publication number: 20140364568
    Abstract: Thermoplastic polymer particles directly cross-linked together or cross-linked via a separate and independent polymer network to form an inter-penetrating network are disclosed herein, along with methods of manufacturing and use as interleaf tougheners of pre-pregs and composite articles.
    Type: Application
    Filed: August 27, 2014
    Publication date: December 11, 2014
    Applicant: CYTEC TECHNOLOGY CORP.
    Inventors: Yi WEI, Alexandre BAIDAK, James Senger
  • Patent number: 8906592
    Abstract: The invention relates to an antireflective coating composition comprising a crosslinkable polymer, where the crosslinkable polymer comprises at least one unit of fused aromatic moiety, at least one unit with a phenylene moiety in the backbone of the polymer, and at least one hydroxybiphenyl unit, furthermore where the polymer comprises a crosslinking moiety of structure (4), where R?3, R?3 and R??3 are independently hydrogen or a C1-C4alkyl. The invention further relates to a process for forming an image using the composition.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: December 9, 2014
    Assignee: AZ Electronic Materials (Luxembourg) S.A.R.L.
    Inventors: M. Dalil Rahman, Clement Anyadiegwu, Douglas McKenzie, JoonYeon Cho
  • Patent number: 8889816
    Abstract: Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: November 18, 2014
    Assignee: Shengyi Technology Co., Ltd.
    Inventors: Yundong Meng, Kehong Fang
  • Publication number: 20140336341
    Abstract: A curable composition, and a material obtained by curing the composition, in which the curable composition includes a vinylester polymerisable compound, jointly with a sulphonated polyaromatic thermoplastic polymer, and an N-vinyl lactam, and which is characterised in that it further includes, a first non-vinylester polymerisable compound which includes at least one isocyanurate group bearing at least two (meth)acrylate groups; and a second non-vinylester polymerisable compound which includes at least one carbopolycyclic or heteropolycyclic group bearing at least two (meth)acrylate groups.
    Type: Application
    Filed: December 4, 2012
    Publication date: November 13, 2014
    Inventors: Xavier Coqueret, Mickael Krzeminski, Brigitte Defoort
  • Patent number: 8883883
    Abstract: Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: November 11, 2014
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Masahiro Wada
  • Publication number: 20140323668
    Abstract: A composition having a crosslinking compound that has the following structure (I) wherein R is OH, NH2, halide, ester, amine, ether, or amide, and x is 2-6 and A is an arene moiety having a molecular weight of less than about 10,000. A mixture including the composition and a polymer, a method for forming the mixture and a crosslinked polymer are also disclosed.
    Type: Application
    Filed: November 18, 2011
    Publication date: October 30, 2014
    Applicant: GREENE, TWEED & CO.
    Inventors: William Franklin Burgoyne, JR., Andrew Francis Nordquist, Kerry A. Drake, Le Song
  • Patent number: 8859185
    Abstract: A resist underlayer film-forming composition includes a polymer including a repeating unit shown by a formula (1), and having a polystyrene-reduced weight average molecular weight of 3000 to 10,000, and a solvent. Each of R3 to R8 individually represent a group shown by the following formula (2) or the like. R1 represents a single bond or the like. R2 represents a hydrogen atom or the like.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: October 14, 2014
    Assignee: JSR Corporation
    Inventors: Shin-ya Minegishi, Yushi Matsumura, Shinya Nakafuji, Kazuhiko Komura, Takanori Nakano, Satoru Murakami, Kyoyu Yasuda, Makoto Sugiura
  • Patent number: 8859673
    Abstract: Polymer formulations are disclosed and described herein that comprise: at least one polymer comprising at least one hydroxy functional group, at least one acid source, and at least one acid-activated crosslinker that reacts with the polymer. In contemplated embodiments, these polymer formulations are curable at relatively low temperatures, as compared to those polymer formulations not comprising contemplated crosslinkers. Transparent films formed from these contemplated formulations are also disclosed. Organic transparent film compositions are also disclosed that comprise: at least one at least one phenol-based polymer, at least one solvent; at least one acid-activated crosslinker; and at least one acid source. Methods of forming organic transparent films with improved transmittance by depositing on a substrate the formulations disclosed herein and curing the formulations or compositions at a temperature of less than about 200° C.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: October 14, 2014
    Assignee: Honeywell International, Inc.
    Inventors: Edward Rutter, Jr., Ahila Krishnamoorthy, Joseph Kennedy
  • Publication number: 20140296452
    Abstract: A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).
    Type: Application
    Filed: March 24, 2014
    Publication date: October 2, 2014
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Dein-Run FUNG, Te-Chao LIAO, Chia-Cheng CHAO, Hao-Sheng CHEN