Two Or More Phenolic Reactants Patents (Class 528/104)
  • Patent number: 10526277
    Abstract: Di(amido(alkyl)phenol) compounds and upgraded molecular weight polymers made from such compounds have particular utility in coating compositions, especially for use on food and beverage contact substrates that are formed into or will be formed into containers or container components.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: January 7, 2020
    Assignee: SWIMC LLC
    Inventors: Sebastien Gibanel, Benoit Prouvost, Bernard Boutevin
  • Patent number: 9790361
    Abstract: A phosphorus-containing polyester composite and method of manufacturing the same is related to the field of compound formulation. The composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acryl chloride compound and (C) a monofunctional aromatic phenol compound used as a blocking agent. The composite is used as a curing agent for epoxy. The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite being environment friendly and having low dielectric, low dielectric loss factor and high heat resistance. It can be used in an integrated circuit board and used as a semiconductor packaging material.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: October 17, 2017
    Assignee: Jiangsu Yoke Technology Co., Ltd
    Inventors: Tung-Ying Hsieh, Qi Shen, Jung-Che Lu, Ti-Kai Yu
  • Patent number: 9777106
    Abstract: Use of biologically-derived polyphenols for the preparation of epoxy resins is described. Examples of biologically-derived polyphenols include resveratrol, genistein, daidzein, and polyphenols synthesized from tyrosine. Because the epoxy resins are prepared from biologically-derived materials, they provide epoxy resins that will degrade into biologically harmless materials. The epoxy resins can be used to provide coating compositions.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: October 3, 2017
    Assignee: Case Western Reserve University
    Inventor: Horst A. von Recum
  • Patent number: 8703862
    Abstract: The present invention relates to thermoplastic molding compositions composed of the following components: (A) at least one polyarylene ether (A1) having an average of at most 0.1 phenolic end groups per polymer chain, and at least one polyarylene ether (A2) having an average of at least 1.5 phenolic end groups per polymer chain, (B) at least one fibrous or particulate filler, and (C) optionally further additives and/or processing aids. The present invention further relates to a process for producing the thermoplastic molding compositions of the invention, the use of these for producing moldings, fibers, foams, or films, and to the resultant moldings, fibers, foams, and films.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: April 22, 2014
    Assignee: BASF SE
    Inventors: Martin Weber, Christian Maletzko, Mark Völkel
  • Patent number: 8686104
    Abstract: A polymer of formula (I): where: n is an integer from 10 to 5,000; m is an integer from 10 to 5,000; Ar1 and Ar3 are the same or different and are residues derived from a tetra-hydroxy aromatic monomer, the tetra-hydroxy aromatic monomer being wherein R is the same or different and is H or a C1-C8 alkyl, C2-C8 alkenyl or C3-C8 cycloalkyl group; and, Ar2 and Ar4 are the same or different and are residues derived from a tetra-halogenated aromatic monomer, the tetra-halogenated aromatic monomer being wherein X is F, Cl or Br, and R1 and R2 are the same or different and are wherein y is an integer from 1 to 8; with the proviso that when Ar1 is the same as Ar3 and Ar2 is the same as Ar4, R1 and R2 are not both —CN is useful as a material for gas separation, vapor separation, adsorbents or catalysis.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: April 1, 2014
    Assignee: National Research Council of Canada
    Inventors: Naiying Du, Michael D. Guiver, Gilles P. Robertson
  • Patent number: 8247051
    Abstract: A coating composition is provided for use in laminate substrates useful in packaging of liquids and solids where the coating provides and increased resistance to the permeability of gases such as oxygen and carbon dioxide. In one embodiment the coating composition is a dispersion or a solution that comprises at least one hydroxyl functional polyetheramine, phosphoric acid and a defoamer. The backbone of the polyetheramine has diglycidyl ether linkages that comprise about 5 to about 70 mole percent resorcinol diglycidyl ether. The coating composition can be applied to substrates by coating applications such as spraying, rolling reverse and direct, rolling direct and reverse gravure, kiss coat, flow coating, brushing, dipping and curtain-wall coating, for example.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: August 21, 2012
    Assignee: The Glidden Company
    Inventors: Daniel Bode, Cathy Li, Kenneth J. Gardner
  • Patent number: 7977445
    Abstract: Aqueous, storage-stable emulsions of ?-silyl terminated polymers are useful as adhesives, sealing compounds and coating materials. The ?-silyl terminated polymers correspond to the general formula (I): in which R1 is a linear or branched alkyl or alkoxy group containing 1 to 4 carbon atoms, R2 and R3 independently of one another are linear or branched alkyl groups containing 1 to 4 carbon atoms, R4 and R6 independently of one another are divalent organic connecting groups, R5 is a hydrophobic divalent polymer group; and R7 is a CH2SiR1(OR2)(OR3) group, in which R1, R2 and R3 have the above meaning or R7 stands for a group that lends the polymer of the general formula (I) the property of self-emulsification in water by forming an oil in water emulsion.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: July 12, 2011
    Assignee: Henkel AG & Co. KGaA
    Inventors: Erik Hattemer, Lothar Unger, Andreas Ferencz, Thomas Bachon, Daniela Braun, Tamara Schmidt, Werner Juettner
  • Patent number: 7910181
    Abstract: Various embodiments of the present invention are directed to methods for manufacturing complex, anisotropic materials with desirable properties for information storage, processing, and display. Certain of these methods involve employing a magnetic field during manufacture to induce desired orientations of precursors, subunits, and/or molecular subassemblies. The applied magnetic field steers the precursors, subunits, and/or molecular subassemblies into desirable orientations while the precursors, subunits, and/or molecular subassemblies are assembled or self-assemble into a complex, anisotropic material. One embodiment of the present invention is a class of new, complex, well-ordered, network-like materials that include a ferromagnetic-material-based framework in which organic and/or organometallic compounds are organized.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: March 22, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Patricia A. Beck, Sean Zhang
  • Patent number: 7902316
    Abstract: A polyethersulfone composition is disclosed which comprises structural units derived from bisphenol-A and 4,4?-biphenol, the structural units derived from 4,4?-biphenol being present in an amount corresponding to greater than 65 mole percent based on total moles of structural units derived from diphenolic monomers, wherein the polyethersulfone has a weight average molecular weight (Mw) of at least 54,000 grams per mole as measured by gel permeation chromatography. The polyethersulfone compositions of the invention display outstanding impact strength as measured using ASTM D256. Surprisingly, the polyethersulfone compositions of the invention show enhanced impact strength relative to known polyethersulfones such as RADEL R, a commercially available polyethersulfone engineering thermoplastic comprised of structural units derived from a dihalodiarylsulfone and 4,4?-biphenol and having a Notched Izod impact strength of about 700 Joules per meter.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: March 8, 2011
    Assignee: Sabic Innovative Plastics IP B.V.
    Inventors: Donald Scott Johnson, Daniel Steiger, Daniel Joseph Brunelle, Sean Elliot Armstrong
  • Patent number: 7858173
    Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: December 28, 2010
    Assignee: Nippon Steel Chemicals Co., Ltd.
    Inventors: Masao Gunji, Chiaki Asano
  • Patent number: 7714033
    Abstract: The objective of the present invention is to provide a photosensitive insulating resin composition which is highly sensitive to g-line and h-line and enables to form a surface-protecting film, an interlayer insulation film and a planarized film that are excellent in various properties including resolution, electrical insulation property and thermal shock resistance, a cured product and an electronic component having the cured product. The present photosensitive insulating resin composition comprises an alkali-soluble resin having a phenolic hydroxyl group, a radiation sensitive acid generator comprising an s-triazine derivative represented by the following general formula (1), and a crosslinking agent. [In the formula (1), R is hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxyl group having 1 to 4 carbon atoms, X is a halogen atom and Y is oxygen atom or sulfur atom.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: May 11, 2010
    Assignee: JSR Corporation
    Inventors: Atsushi Ito, Hirofumi Goto, Hirofumi Sasaki, Ryuichi Okuda
  • Patent number: 7632912
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: December 15, 2009
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
  • Patent number: 7589164
    Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: September 15, 2009
    Inventors: Raj B. Durairaj, Mark A. Lawrence
  • Patent number: 7560518
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: July 14, 2009
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
  • Publication number: 20090131622
    Abstract: A method for producing a branched-polyether resin composition of the present invention includes a first step of obtaining a reaction mixture including: (1-A) a branched-polyether resin (X) containing a hydroxyl group, an acryloyl group, and an epoxy group and (1-B) at least one resin component selected from the group consisting of (1-B-1) a diacrylate (A2) of an aromatic difunctional epoxy resin, (1-B-2) a monoacrylate (A1) of an aromatic difunctional epoxy resin, and (1-B-3) an aromatic difunctional epoxy resin (B) other than (A1) and (A2); and a second step of mixing the reaction mixture and an unsaturated monocarboxylic acid, and reacting the epoxy group in the reaction mixture and a carboxyl group in the unsaturated monocarboxylic acid.
    Type: Application
    Filed: December 20, 2005
    Publication date: May 21, 2009
    Applicant: Dainippon Ink and Chemicals, Inc.
    Inventors: Eiju Ichinose, Hideyuki Ishida, Masatoshi Motomura
  • Patent number: 7527863
    Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.1 unit of a structure represented by the following formula (1) per molecular chain: wherein n is an integer of 9 or more, R1 is an organic substituent having an epoxy group, and R2 is a hydrogen atom or an organic substituent having an epoxy group.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: May 5, 2009
    Assignee: Asahi Kasei Chemicals Corporation
    Inventor: Tetsuji Tokiwa
  • Publication number: 20080269420
    Abstract: The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.
    Type: Application
    Filed: December 15, 2006
    Publication date: October 30, 2008
    Inventors: Tat Hung Tong, Benjamin J. Vining, Richard D. Hreha, Thomas J. Barnell
  • Patent number: 7393904
    Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.
    Type: Grant
    Filed: August 17, 2007
    Date of Patent: July 1, 2008
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenji Ishii, Yasumasa Norisue, Kiyonari Hiramatsu, Makoto Miyamoto, Makoto Yamazaki, Daisuke Ohno
  • Patent number: 7390540
    Abstract: Various embodiments of the present invention are directed to methods for manufacturing complex, anisotropic materials with desirable properties for information storage, processing, and display. Certain of these methods involve employing a magnetic field during manufacture to induce desired orientations of precursors, subunits, and/or molecular subassemblies. The applied magnetic field steers the precursors, subunits, and/or molecular subassemblies into desirable orientations while the precursors, subunits, and/or molecular subassemblies are assembled or self-assemble into a complex, anisotropic material. One embodiment of the present invention is a class of new, complex, well-ordered, network-like materials that include a ferromagnetic-material-based framework in which organic and/or organometallic compounds are organized.
    Type: Grant
    Filed: July 21, 2004
    Date of Patent: June 24, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Patricia A. Beck, Sean Zhang
  • Patent number: 7368520
    Abstract: Crosslinked polymer blends comprising a poly(arylene ether) and a nonlinear optical chromophore. Also featured are electro-optic devices incorporating these blends.
    Type: Grant
    Filed: June 19, 2006
    Date of Patent: May 6, 2008
    Assignee: Lumera Corporation
    Inventors: Diyun Huang, Timothy M. Londergan
  • Patent number: 7341783
    Abstract: An object of the invention is to provide a functionalized polyphenylene ether useful for polymer alloys or electrical or electronic materials such as printed boards or insulating sealants. The invention relates to a functionalized polyphenylene ether having an average of not fewer than 0.1 unit of a structure represented by the following formula (1) per molecular chain: wherein n is an integer of 9 or more, R1 is an organic substituent having an epoxy group, and R2 is a hydrogen atom or an organic substituent having an epoxy group.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: March 11, 2008
    Assignee: Asahi Kasei Chemicals Corporation
    Inventor: Tetsuji Tokiwa
  • Patent number: 7196156
    Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: March 27, 2007
    Assignee: Indspec Chemical Corporation
    Inventors: Raj B. Durairaj, Mark A. Lawrence
  • Patent number: 7196155
    Abstract: A process comprising: a) reacting a diphenol monomer A with a monomer B having two locations for reaction with A to form arylene ether monomer C and b) reacting arylene ether monomer C with a diphenol monomer D to form a polymer, where monomer A is HX1-Q1-X1H;??(II) monomer B is arylene ether monomer C is and monomer D is wherein: Q1 comprises at least one aryl or heteroaryl group; Q2 comprises at least one aryl or heteroaryl group; X1 is O bonded directly to an aryl carbon of Q1; X2 is O bonded directly to an aryl carbon of Q2; Z is a linker comprising at least one —(C(R2)2)— group; Y is a single bond or linker group (e.g., comprising up to about 50 carbons); R1 is independently at each occurrence H, a halogen, an alkyl group, a heteroalkyl group, an aryl group, or a heteroaryl group; R2 is independently at each occurrence H, an alkyl group, or a heteroalkyl group; and R3 is H or a crosslinkable group.
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: March 27, 2007
    Assignee: Lumera Corporation
    Inventors: Baoquan Chen, Timothy M. Londergan
  • Patent number: 7101957
    Abstract: Crosslinked polymer blends comprising a poly(arylene ether) and a nonlinear optical chromophore. Also featured are electro-optic devices incorporating these blends.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: September 5, 2006
    Assignee: Lumera Corporation
    Inventors: Diyun Huang, Timothy M. Londergan
  • Patent number: 7087701
    Abstract: A polymer comprising units having the formula (I) wherein: Q1 comprises at least one aryl or heteroaryl group; Q2 comprises at least one aryl or heteroaryl group; X1 is O bonded directly to an aryl carbon of Q1; X2 is O bonded directly to an aryl carbon of Q2; Z is a linker comprising at least one —C(R2)2)— group; Y is a single bond or linker group (e.g., comprising up to about 50 carbons); R1 is independently at each occurrence H, a halogen, an alkyl group, a heteroalkyl group, an aryl group, or a heteroaryl group; R2 is independently at each occurrence H, an alkyl group, or a heteroalkyl group; and R3 is H or a crosslinkable group.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: August 8, 2006
    Assignee: Lumera Corporation
    Inventor: Timothy M. Londergan
  • Patent number: 7067593
    Abstract: A polymer comprising units having the formula (I) wherein: Q1 comprises at least one aryl or heteroaryl group; Q2 comprises at least one aryl or heteroaryl group; X1 is O bonded directly to an aryl carbon of Q1; X2 is O bonded directly to an aryl carbon of Q2; Z is a linker comprising at least one —(C(R2)2)— group; Y is a single bond or linker group (e.g., comprising up to about 50 carbons); R1 is independently at each occurrence H, a halogen, an alkyl group, a heteroalkyl group, an aryl group, or a heteroaryl group; R2 is independently at each occurrence H, an alkyl group, or a heteroalkyl group; and R3 is H or a crosslinkable group.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: June 27, 2006
    Assignee: Lumera Corporation
    Inventor: Timothy M. Londergan
  • Patent number: 7038004
    Abstract: A process comprising: a) reacting a diphenol monomer A with a monomer B having two locations for reaction with A to form arylene ether monomer C and b) reacting arylene ether monomer C with a diphenol monomer D to form a polymer, where monomer A is HX1—Q1—X1H;??(II) monomer B is arylene ether monomer C is and monomer D is wherein: Q1 comprises at least one aryl or heteroaryl group; Q2 comprises at least one aryl or heteroaryl group; X1 is O bonded directly to an aryl carbon of Q1; X2 is O bonded directly to an aryl carbon of Q2; Z is a linker comprising at least one —C(R2)2)— group; Y is a single bond or linker group (e.g., comprising up to about 50 carbons); R1 is independently at each occurrence H, a halogen, an alkyl group, a heteroalkyl group, an aryl group, or a heteroaryl group; R2 is independently at each occurrence H, an alkyl group, or a heteroalkyl group; and R3 is H or a crosslinkable group.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: May 2, 2006
    Assignee: Lumera Corporation
    Inventors: Baoquan Chen, Timothy M. Londergan
  • Patent number: 6936355
    Abstract: A luminescent polymer, suitable for use in an active layer of an organic light-emitting device, organic solid state lasers, a photovoltaic cell or an electrochromic display and exhibiting good stability and microstructure control, which has the structure wherein Ar1 and Ar2 are aromatic or heteroaromatic rings, such as phenyl, biphenyl, fluorene, thiophene, pyridyl, or their substituted aromatic or heteroaromatic rings with or without deuterium, and R1 and R2 are independently each selected from the group consisting of hydrogen, deuterium, substituted or unsubstituted alkyl, alkoxyl, aryl and heteroaryl, or halogen, wherein D represents deuterium and n is an integer greater than 3. Electronic devices and methods of making them which employ these luminescent polymers are also described.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: August 30, 2005
    Assignee: Canon Kabushiki Kaisha
    Inventors: X. Charles Li, Kazunori Ueno, Bing R. Hsieh
  • Patent number: 6762251
    Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, and an insulation film produced therefrom.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: July 13, 2004
    Assignee: Tohto Kasei Co., Ltd.
    Inventors: Masao Gunji, Chiaki Asano, Hiroshi Sato
  • Patent number: 6753086
    Abstract: An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule, (C) a molecular compound represented by any one of general formulae (1) and (2) and (D) an inorganic filler. The material exhibits an increased curing rate and an excellent storage stability. (P represents phosphorus atom, R1, R2, R3 and R4 each represent a substituted or unsubstituted aromatic group or an alkyl group, A1 and A2 each represent a divalent aromatic group, B1 represents a single bond, a divalent group selected from ether groups, sulfone groups, sulfide groups and carbonyl groups or a divaient organic group having 1 to 13 carbon atoms and 0≦m≦0.75.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: June 22, 2004
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Hiroshi Nagata, Yoshiyuki Goh
  • Patent number: 6664366
    Abstract: Thermally stable polymers comprising chain members derived from at least one 1,3-dihydroxybenzene moiety and at least one aromatic dicarboxylic acid moiety, said polymer being substantially free of anhydride linkages linking at least two mers of the polymer chain, are prepared using an interfacial method comprising the steps of: (a) combining at least one 1,3-dihydroxybenzene moiety and at least one catalyst in a mixture of water and at least one organic solvent substantially immiscible with water; (b) adding to the mixture from (a) a controlled stoichiometric ratio of at least one acid chloride and at least one base while maintaining the pH between about 4 and about 8.5, and (c) adjusting the pH of the reaction mixture to a value in the range of about 7 and about 9 following complete addition of acid chloride, and stirring the reaction mixture for a time sufficient to destroy any anhydride linkages in the polymer chain.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: December 16, 2003
    Assignee: General Electric Company
    Inventors: James Manio Silva, David Michel Dardaris, Gregory Allen O'Neil, Joseph Anthony Suriano
  • Patent number: 6663930
    Abstract: Gel formation is prevented in the reaction between a sulfonyl-chloride-containing resin and a polyamine by first forming an adduct between the resin with an aminophenol. The prevention of gel formation enables sulfonyl-chloride containing resin to be used in admixture with acrylates and epoxy resin to form a polyamine-curable adhesive composition having excellent adhesive properties and chemical resistance.
    Type: Grant
    Filed: February 6, 1999
    Date of Patent: December 16, 2003
    Assignee: Forty Ten L.L.C.
    Inventor: Shah A. Haque
  • Publication number: 20030207126
    Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at least comparable cure speeds and physical properties for the reaction products formed therefrom.
    Type: Application
    Filed: March 15, 2002
    Publication date: November 6, 2003
    Applicant: LOCTITE CORPORATION
    Inventors: Qinyan Zhu, Shabbir Attarwala
  • Patent number: 6620862
    Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: September 16, 2003
    Assignees: Amkor Technology, Inc., Nitto Denko Corporation
    Inventors: Hirotaka Ueda, Masaki Mizutani
  • Patent number: 6596843
    Abstract: Thermally stable polymers comprising resorcinol arylate chain members are prepared using an interfacial method comprising the steps of: interfacial method for preparing polymers comprising resorcinol arylate polyester chain members substantially free of anhydride linkages linking at least two mers of the polymer chain, comprising the steps of: (a) preparing an aqueous solution comprising at least one resorcinol moiety, said solution having a pH less than or equal to about 5; (b) after step (a), preparing a mixture comprising the resorcinol moiety, at least one catalyst and at least one organic solvent substantially immiscible with water; and (c) adding to the mixture from (b) at least one dicarboxylic acid dichloride while maintaining the pH between 3 and 8.5 through the presence of an acid acceptor, wherein the total molar amount of acid chloride groups is stoichiometrically deficient relative to the total molar amount of phenolic groups.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: July 22, 2003
    Assignee: General Electric Company
    Inventors: Daniel Joseph Brunelle, Paul Dean Sybert, Gregory Allen O'Neil, Joseph Anthony Suriano, Tiberiu Mircea Siclovan, Zhaohui Su
  • Patent number: 6569983
    Abstract: A water-soluble branched polyhydroxyetheramine, wherein the branched polyhydroxyetheramine is prepared by reacting an amine having two reactive hydrogen atoms with a diepoxide to form a polyhydroxyetheramine and then reacting the polyhydroxyetheramine with an N-alkylating agent, an aqueous composition comprising the branched polyhydroxyetheramine and use of the branched polyhydroxyetheramine to modify the permeability to water of a subterranean formation are disclosed.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: May 27, 2003
    Assignee: Ondeo Nalco Energy Services, L.P.
    Inventors: Duane Treybig, Kin-Tai Chang, Dennis Williams
  • Publication number: 20030060592
    Abstract: Disclosed is a fusing release agent comprising the reaction product of a primary- or secondary-amino-functionalized polyorganosiloxane oil and a low molecular weight, non-sterically-hindered aldehyde or ketone.
    Type: Application
    Filed: September 25, 2002
    Publication date: March 27, 2003
    Applicant: Xerox Corporation
    Inventors: George J. Heeks, Santokh S. Badesha, Samuel Kaplan, David J. Gervasi, Che C. Chow, Arnold W. Henry
  • Patent number: 6506868
    Abstract: The present invention provides a partial condensate of glycidyl ether group-containing alkoxysilane which is obtainable by dealcoholization reaction between glycidol and a partial condensate of alkoxysilane, compositions comprising the same and preparation methods thereof. Further, the present invention provides an alkoxy-containing silane-modified polyimide resin, alkoxy-containing silane-modified polyamide-imide resin and alkoxy-containing silane-modified phenol resin which are modified with the partial condensate of glycidyl ether group-containing alkoxysilane, and preparation methods thereof.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: January 14, 2003
    Assignee: Arakawa Chemical Industries, Ltd.
    Inventors: Hideki Goda, Shoji Takeda, Tetsuji Higashino
  • Patent number: 6491845
    Abstract: Hardeners for epoxy resins are disclosed which have the capability of curing at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. These novel hardeners include a range of reactivity which results in a range of pot lives from minutes to months. These materials co-cure readily with polyamines and have little or no amine odor. Mixture viscosity can be controlled over a wide range independent of filler concentration which allows a broad range of applications from coating and casting to adhesives. Class I hardeners contain a mixture of polyols, polyamines and tertiary amines and cure at temperatures between 20-50° C., while class II hardeners have the same polyols mixed with one or more tertiary amines and cure between 65-100° C. Class III hardeners contain the same polyols combined with either imadazole or dicyandiamide, and optionally, a tertiary amine and cure at 120° C.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: December 10, 2002
    Inventor: Richard D. Schile
  • Patent number: 6455116
    Abstract: A composition comprising a poly(hydroxy aminoether) and an effective amount of a propoxylated or ethoxylated phenol, process for preparing the same and articles prepared from the composition.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: September 24, 2002
    Assignee: Dow Global Technologies Inc.
    Inventors: Guang-Ming Xia, John M. Beckerdite, Wendy D. Hoenig
  • Patent number: 6437084
    Abstract: A method of preparing a poly(arylene ether) includes oxidatively coupling a monohydric phenol in a reaction solution at a reaction temperature that exceeds the cloud point temperature of the reaction solution. The oxidative coupling occurs in the presence of a metal complex catalyst, and when the catalyst includes an amine ligand, the method facilitates incorporation of the amine ligand into the poly(arylene ether) resin. The amine-incorporated poly(arylene ether) resins prepared by the method are useful in the preparation of higher molecular weight poly(arylene ether) resins and compatibilized blends of poly(arylene ether) resins with other thermoplastics.
    Type: Grant
    Filed: November 12, 2001
    Date of Patent: August 20, 2002
    Assignee: General Electric Company
    Inventors: Joop Birsak, Hugo Gerard Eduard Ingelbrecht, David Parrillo, Mukund Parthasarathy, Probjot Singh
  • Publication number: 20020111459
    Abstract: A polymer comprising recurring units of formula (2) is prepared by effecting deblocking reaction on a polymer comprising recurring units of formula (1) in the presence of an acid catalyst.
    Type: Application
    Filed: December 6, 2001
    Publication date: August 15, 2002
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takanobu Takeda, Osamu Watanabe
  • Patent number: 6323300
    Abstract: Disclosed is an aromatic copolymer comprising a plurality of aromatic copolymer chains, each comprising (A) recurring 2,6-diphenylphenol units and (B) phenolic comonomer units, each comonomer unit being independently selected from the group consisting of (i) an oxyphenylene monomer unit which is monosubstituted with a monovalent aromatic group or a halogen atom, (ii) an &agr;-oxynaphthylene monomer unit, (iii) a &bgr;-oxynaphthylene monomer unit, and (iv) an oxyphenylene monomer unit which is substituted with at least one aliphatic group, wherein the amounts of (A) and (B) are from 50 to 98% by weight and from 2 to 50% by weight, based on the weight of the aromatic copolymer, provided that, when (iv) is present as the comonomer unit, the amount of (iv) is 20% by weight or less, based on the weight of (B), and wherein the aromatic copolymer has a weight average molecular weight of from 1,000 to 3,000,000. A method for producing the aromatic copolymer is also disclosed.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: November 27, 2001
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Kohei Kita, Tsuneaki Tanabe, Mitsuo Konishi
  • Patent number: 6291589
    Abstract: Thermally stable polymers comprising resorcinol arylate chain members are prepared using an interfacial method comprising the steps of: (a) combining at least one resorcinol moiety and at least one catalyst in a mixture of water and at least one organic solvent substantially immiscible with water; and (b) adding to the mixture from (a) at least one dicarboxylic acid dichloride while maintaining the pH between 3 and 8.5 through the presence of an acid acceptor, wherein the total molar amount of acid chloride groups is stoichiometrically deficient relative to the total molar amount of phenolic groups.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: September 18, 2001
    Assignee: General Electric Company
    Inventors: Daniel Joseph Brunelle, Joseph Anthony Suriano, Taeseok Jang, Tiberiu Mircea Siclovan, James Edward Pickett, Gregory Allen O'Neil
  • Patent number: 6291077
    Abstract: A lactone chain-extended polyester polyol of the present invention comprises the reaction product of a lactone and a previously chain-extended phenolic-based hydroxyl compound. The previously chain-extended phenolic-based hydroxyl compound may comprise the reaction product of (i) a lactone or an alkoxylating agent selected from the group consisting of alkylene oxides and alkylene carbonates, and (ii) a phenolic aralkylation polymer comprising the reaction product of a phenolic monomer having at least two free reactive positions; a styrene derivative; and a coupling agent. The previously chain-extended phenolic-based hydroxyl compound also may be chain-extended by reacting with a lactam to produce a lactam chain-extended polyester polyamide. The polyols and polyamides of the present invention provide unique combinations of hard and soft functionalities, which translates into materials exhibiting a unique combination of toughness and hardness.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: September 18, 2001
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: Rajan Hariharan, David A. Hutchings, Kenneth A. Bourlier, Ellen V. Nagy
  • Patent number: 6265522
    Abstract: Thermally stable polymers comprising resorcinol arylate chain members are prepared using an interfacial method comprising the steps of: (a) combining at least one resorcinol moiety and at least one catalyst in a mixture of water and at least one organic solvent substantially immiscible with water; and (b) adding to the mixture from (a) at least one dicarboxylic acid dichloride while maintaining the pH between 3 and 8.5 through the presence of an acid acceptor, wherein the total molar amount of acid chloride groups is stoichiometrically deficient relative to the total molar amount of phenolic groups.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: July 24, 2001
    Assignee: General Electric Company
    Inventors: Daniel Joseph Brunelle, Joseph Anthony Suriano, Taeseok Jang, Tiberiu Mircea Siclovan, James Edward Pickett, Gregory Allen O'Neil
  • Patent number: 6255365
    Abstract: An epoxy resin composition comprising (a) an epoxy resin comprising a mixture of the following components: (1) about 50-95 parts by weight of a novolak type epoxy resin, and (2) about 5-50 parts by weight of 4,4′-biphenol type epoxy resin (b) a phenolic resin represented by the general formula (II) (where R, which may be the same or different, represents an alkyl group having 1-10 carbon atoms, a substituted or unsubstituted phenyl group, a substituted or unsubstituted aralkyl group, an alkoxyl group or a halogen atom; Z, which may be the same or different, represents a divalent hydrocarbon group having 1-15 carbon atoms, provided that at least one Z is a divalent hydrocarbon group having 5-15 carbon atoms; n is a number of 0-8 on the average value; and i, which may be the same or different, is an integer of 0-3) as an epoxy resin hardener, (c) an inorganic filler, and (d) a curing accelerator.
    Type: Grant
    Filed: July 27, 1999
    Date of Patent: July 3, 2001
    Assignee: Shell Oil Company
    Inventors: Atsuhito Hayakawa, Yasuyuki Murata
  • Patent number: 6248204
    Abstract: The present invention provides a room-temperature curable, reinforced thermosetting epoxy resin composition. The composition includes an epoxy resin first component, and an epoxy resin hardener second component. The epoxy resin component includes an epoxy resin, and may further include an inorganic and/or organic filler component, such as a structural reinforcement component. The epoxy resin hardener component includes an amine-based hardener, and may further include an inorganic and/or organic filler component. Cured reaction products of the composition demonstrate at about room temperature an adhesive strength of at least about 6500 psi, such as about 8000 to about 10000, and a fracture toughness of at least about 10 in-lbs/in2, such as about 20 to about 35 in-lbs/in2. In addition, the cured reaction products of the composition demonstrate a creep resistance at about room temperature at least about 6000 psi of at least about 1 hour.
    Type: Grant
    Filed: May 14, 1999
    Date of Patent: June 19, 2001
    Assignee: Loctite Corporation
    Inventor: Charles F. Schuft
  • Patent number: 6242533
    Abstract: The present invention relates to a novolak type phenol resin, in particular a novolak type phenol resin for resists suitable for forming resist patterns. The novolak type phenol resin of the present invention is obtained by reacting at least a vinylphenol having a vinyl group and a phenolic hydroxyl group, such as parahydroxystyrene, or a polyvinylphenol, which is a polymer of the vinylphenol, a compound (A) such as 4,4′-methylenebis(2-hydroxymethyl-3,6-dimethylphenol) and/or a compound (B) such as 2,6-dihydroxymethyl-4-phenol, in a ratio of 1 to 40 moles of the compound (A) and/or compound (B) to 100 moles of the vinylphenol or 100 moles of structural unit of the vinylphenol contained in the polyvinylphenol in the presence of an acid and having a weight average molecular weight of 2,000 to 20,000. Such a novolak type phenol resin provides good pattern shape, heat resistance, resolution, and sensitivity in resists for lithography.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: June 5, 2001
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Yoshiaki Kurimoto, Katsuhiro Maruyama, Akira Yoshitomo, Satoru Yoshida, Satoru Kitano
  • Patent number: 6207789
    Abstract: The present invention provides a resin containing in the backbone chain a structural unit represented by the following Formula (I) or (II), as a novel phenolic resin having a high Tg, a low moisture absorption, a low molding shrinkage, high adhesive properties and high flow properties. The present invention also provides a resin composition and a molding material each containing the above resin, and an electronic component device having a device element encapsulated with it.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: March 27, 2001
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Haruaki Sue, Shinsuke Hagiwara, Fumio Furusawa, Seiichi Akagi, Kazuyoshi Tendo