Abstract: A phenolic curing agent for epoxy resin powder coatings is prepared by combining (a) a linear phenolic hydroxyl-terminated resin having a weight per phenolic within the range of about 650 to about 8,000, preferably about 850 to about 950, (b) a dihydric phenol present in an amount such that the weight per hydroxyl of the mixture of (a) and (b) is within the range of about 240 to about 280, and (c) at least about 2 weight percent, based on the weight of the composition, of an imidazole cure accelerator. The described imidazole-accelerated curing agent is less susceptible to melting point depression and to sintering with storage than conventional imidazole-containing phenolic curing agents. The dihydric phenol-terminated epoxy resin is preferably prepared by reacting a dihydric phenol with a linear diepoxy resin in the presence of a phosphonium halide catalyst so as to produce a phenolic hydroxyl-terminated resin having a weight per hydroxyl within the range of about 650 to about 8,000.

Abstract: Liquid epoxy resins can be converted to non-sintering, relatively low equivalent weight, flakable solid epoxides having relatively low melt viscosities by advancing the resins with 1,1,1-tri(hydroxyphenyl)alkanes or -alkenes in which the alkane or alkene moiety contains from 1 to 11 carbons.

Abstract: High temperature resistant molding materials containing(A) 5-95 mol % of blocks having the structural unit I ##STR1## (B) 5-95 mol % of blocks having the structural unit II ##STR2## (C) 0-80 mol % of blocks having the structural unit III ##STR3## the molecular weight of the blocks being within the range 2000-20,000, where X is --O--, --S--, ##STR4## (only if a or b.noteq.0), ##STR5## (R.sup.7 =R.sup.8 =CH.sub.3 only if a or b.noteq.O) or a chemical bond, R.sup.7 and R.sup.8 are each alkoxy or alkyl of 1-6 carbon atoms, aryl or hydrogen, Q and W are each ##STR6## Z is --O-- or a chemical bond and R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are each alkyl or alkoxy of 1-6 carbon atoms, aryl, Cl or F and p, q and r are each 0 or 1 and a, b, c, d and e are each 0, 1, 2, 3 or 4.

Abstract: A novel epoxy resin composition is obtained by modifying a bisphenol-type epoxy resin and/or a halogen-containing epoxy resin with a trisphenol represented by the following general formula: ##STR1## wherein each of R.sub.1 and R.sub.2 represents hydrogen or an alkyl group havng not more than 6 carbon atoms with the proviso that at least one of them is the alkyl group, each of R.sub.3, R.sub.4 and R.sub.5 represents hydrogen or an alkyl group having not more than 4 carbon atoms, and n represents a number of 0 or 1. The composition is suitable, for example, as a paint, a casting material or a molding material.

Abstract: Epoxy resins have been found to be fortified (increased in strength and modulus yet not made brittle) by compounding:(a) a resin-forming polyepoxide(b) an amine curing agent for (a) and(c) a fortifier for (a)+(b) comprising the reaction product of(i) an aromatic polyhydroxy compound and(ii) a diepoxide with one epoxy group less reactive than the other:and heat curing the mixture. Strengths as high as 140 MPa and moduli as high as 4500 MPa have been attained with a ductile mode of failure.

Abstract: Advanced epoxy resins prepared by the reaction of diglycidyl ethers of di-secondary alcohols and dihydric phenols, said advanced resins being heat curable with suitable curing agents to afford cured coating compositions exhibiting a variety of excellent physical properties and performance characteristics.

Abstract: A composition comprising a mixture of a polyepoxide, an isocyanate and a salt of a polyamine and a polyhydric phenol and a process for curing said composition by heating it to a temperature in the range of from about 80.degree. C. to about 150.degree. C. are described.

Abstract: A spherical particulate adhesive comprising particles of a partially amine cured epoxy resin as the main component and having an average particle size of 0.3 to 500 .mu.m, in which particles of the epoxy resin contain an at least partially compatible agent homogeneously in the interior thereof. This adhesive is a heat-curable adhesive and has a very high bonding force. After bonding, the adhesive is chemically stable and is especially preferably used for bonding in the field of electronic material, such as liquid crystal display devices, which are apt to be degraded by impurities and for which high-precision bonding is required.

Abstract: 2,6-Disubstituted 4-epoxypropyl glycidyl ethers of the formula ##STR1## wherein X is a group R' or X is a group of the formula ##STR2## and each of R and R' independently of the other is C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, a halogen atom or C.sub.6 -C.sub.10 aryl, can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for application in the electronics industry, or as adhesives. Compounds of the formula are also valuable reactive diluents for curable epoxy resin mixtures.

Abstract: Adducts are prepared from partially hydrolyzed epoxy resins having an average functionality of at least about 2.6 such as a partially hydrolyzed phenol-formaldehyde epoxy novolac resin and a polyamine such as diethylenetriamine. These adducts are useful in preparing low temperature curable epoxy resin compositions.

Abstract: Epoxy resins containing both terminal hydroxyl groups and epoxy or epoxy-derived groups are prepared by advancing a polyepoxide with a polyol and terminating the reaction at a point such that the epoxy resin reaction product contains both epoxy and terminal hydroxyl groups. The controlled conversion resins have improved cure rates. The epoxy groups can be further reacted to form epoxy-derived groups to improve the cure rate even further. The epoxy resins exhibit lower melt and solution viscosities than those exhibited by conventional epoxy resins having the same epoxy equivalent weight, as well as curing quickly when used. The resins are usefully employed at high solids levels in can coating formulations and other epoxy formulations wherein the resin is applied from an organic liquid solution or aqueous dispersion.

Abstract: A heat stable, non-thermoset epoxy resin composition is disclosed which comprises reacting (A) a mixture containing (1) a relatively high molecular weight epoxy resin and (2) a relatively low molecular weight epoxy resin with (B) a monohydric phenol, a monocarboxylic acid or anhydride thereof or a monohydric alcohol. The composition does not exhibit an excessive viscosity increase at elevated temperatures making it particularly suitable for use in highway marking paint applications.

Abstract: Curable amide modified epoxy resins are prepared by polymerizing (I) the reaction product of (A) the reaction product of (1) an epoxy resin having an average of more than one 1,2-epoxy group per molecule and an average of from about 0 to about 30 aliphatic hydroxyl groups per molecule such as a diglycidyl ether of bisphenol A and (2) (a) a material having only one primary amine group per molecule such as monoethanolamine and (b) a material having only one secondary amine group per molecule such as diethanolamine wherein (a) and (b) are added sequentially with (a) being added first, or as a mixture with (B) an anhydride of an unsaturated dicarboxylic acid such as maleic anhydride with (II) a polymerizable ethylenically unsaturated monomer or mixture of monomers such as styrene and methacrylic acid. The resultant resin can be employed as is in the preparation of organic solvent borne coatings or it can be neutralized with a base so as to improve its stability in the preparation of aqueous coatings.

Abstract: Vinyl ester resins are prepared by reacting a polyepoxide of a co-oligomerization product of a mixed cyanate of a polyphenol and a polymaleimide with a monounsaturated monocarboxylic acid.

Abstract: A structural adhesive which is particularly useful in vertical substrates is composed of a mixture of two components, the first component being an epoxy resin component comprising a poly epoxide and a polyisocyanate which has been allowed to react with less than an equivalent weight of a polyamine which is a primary or secondary polyamine and the second component being a hardener for the polyepoxide comprising a mixture of primary, secondary and tertiary amines, amido amines and phenolics.

Abstract: The invention relates to epxoy resins obtained by reaction of epichlorohydrin with selected mixtures of phenols for the production of thermosetting and cold-hardening moldings, coating compositions and adhesive compositions.

Abstract: A curable epoxy resin composition, comprising (1) an alicyclic epoxy resin having an average of more than one epoxy group per molecule, (2) a polybasic acid hydrazide, and (3) a latent curing agent for said epoxy resin which comprises an addition product obtained by reacting (a) a polyfunctional epoxy compound with (b) a compound having at least one functional group in the molecule selected from the group consisting of OH, SH, COOH and CONHNH.sub.2 together with a tertiary amino group, or by reacting said components (a) and (b) with (c) an organic compound which has more than two active hydrogen atoms in the molecule, said reactions occurring under conditions in which the ratio of (a) to (b) or (a) to (b) and (c) ranges from 0.8 to 2.5 equivalents of (a) per equivalent of the total active hydrogen atoms in component (b) and in components (b) and (c), the molar ratio of (c) to (b) being 0.2:1 to 1:1, and said addition product having a softening point of 60.degree. to 180.degree. C.

Abstract: A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in the molecule and (II) a curing amount or curing-accelerating amount of a compound obtained by reacting (a) a specified amine/epoxy adduct with (b) phenolic resin(s) and/or polyhydric phenol compound(s) in a weight ratio of (a) to (b) of 1/0.1 to 1/0.8. The composition of the present invention has excellent storage stability and it is curable at a relatively low temperature to form a cured product having excellent mechanical strength, adhesiveness and water resistance.

Abstract: Advanced epoxy resin products are prepared by reacting a triglycidyl ether of a trihydric phenol such as the triglycidyl ether of 1,1,1-tri(hydroxyphenyl)methane with a dihydric phenol such as bisphenol A. These advanced epoxy resins are non-sintering solid resins useful in the preparation of electrical potting or molding compositions.

Abstract: Advanced epoxy resins having a low total aliphatic halide content are prepared by reacting an epoxy resin having an average of more than one 1,2-epoxide group per molecule with a material having an average of more than one phenolic hydroxyl group per molecule in the presence of a solvent having at least one aliphatic hydroxide group per molecule and a catalytic quantity of an alkali metal hydroxide. These low aliphatic halide-containing advanced epoxy resins are useful in formulations for preparing laminates, moldings, pottings and coatings for the electronics industry.

Abstract: A curable coating composition is prepared from two components; (1) a component having more than one epoxide group (an epoxy resin) and (2) a component having more than one group reactive with the epoxy groups of components (1) (i.e., a polyhydric phenol). Either component (1) or (2) is the reaction product of a compound containing at least one primary or secondary amino group and at least one aliphatic hydroxyl group with an epoxy resin and optionally a component reactive therewith. This reaction product contains terminal aliphatic hydroxyl groups and epoxy groups or groups reactive with epoxy groups. The components (1) and (2) are preferably normally solid materials and the coating composition is a powder coating composition.

Abstract: The invention relates to polyepoxides which are obtainable by reacting compounds of formula I ##STR1## wherein n is 1 or 2, and X, if n is 1, is a group R.sub.3, or, if n is 2, X is a group of the formula ##STR2## each of R.sub.1 and R.sub.3 independently of the other is C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, allyl, a halogen atom or C.sub.6 -C.sub.10 aryl and R.sub.2 is allyl, 1-propenyl or 2-propenyl, with compounds containing phenolic OH groups, and subsequently epoxidizing the resultant adducts in the presence of a peracid. Said polyepoxides can be used, together with customary epoxy resin hardeners, for the preparation of cured products, in particular for coating electronic components, or as adhesives.

Abstract: A substantially linear polyhydroxy polyether, which (1) is composed substantially of aromatic units and aliphatic units, the proportion of the aromatic units being 50 to 98 mole % based on the total amount of the aromatic units and the aliphatic units, (2) has an intrinsic viscosity, measured at 25.degree. C. in o-chlorophenol, of from 0.3 to 2 dl/g, and (3) has a glass transition, temperature of from 30.degree. to 120.degree. C. Two processes for preparing the polyhydroxy polyether are proposed. The polyhydroxy polyether is useful in applications which require gas-barrier property.

Abstract: Polyhydroxy ethers containing spirobiinadanols are tough, soluble thermoplastics with high heat distortion temperatures relative to bisphenol A based materials. These materials could function as surface coating resins.

Abstract: Aromatic amines and their alkyl, amide, imide or amide-imide substituted derivatives in the presence of catalytic quantities of phenols, cresols, xylenols, bisphenols, and their like cause epoxide resins to thermoset at ambient temperatures. The resulting crosslinked polymers are useful for two component solution systems which provide corrosion and temperature resistant clear coatings or paints, and can also be used as solventless, liquid, two component systems for casting clear, pigmented or filled parts.

Abstract: In a process of polymerizing ethylenically unsaturated compounds by polymerization of ethylenically unsaturated monomers in the presence of a free radical-forming initiator system and optionally customary protective colloids and/or emulsifiers and optional known additives in a reactor whose surfaces contact the reaction components, the improvement comprising providing the reactor surfaces with a coating that at least suppresses polymer deposit formation without effecting the color and quality of the polymer.

Abstract: Vinyl ester resins are prepared by reacting a polyepoxide of a co-oligomerization product of a mixed cyanate of a polyphenol and a polymaleimide with a monounsaturated monocarboxylic acid.

Abstract: Poly(hydroxy ether) having a repeat unit of the formula, ##STR1## wherein R is a dihydric mononuclear phenol residue, R' is a dihydric polynuclear phenol residue, n is a positive number and n' is 0 or a positive number, provided that n and n' satisfy 35.ltoreq.n+n'.ltoreq.400. The poly(hydroxy ether) is useful for the production of paints for metal, wood, glass and plastics as well as varnishes, primers, films, fibers, resin-modifying agents, and molding materials and it is particularly useful for zinc dust paints.

Abstract: The disclosure is directed to thermoset resinous compositions having utility in the area of surface coating and molding applications, the latter including the preparation of high performance composites and the use in reaction injection molding processes. The contemplated compositions are obtained by polymerizing a reaction mixture comprising a polyfunctional 2-oxazoline compound, a compound or oligomer containing a plurality of aromatic hydroxyl groups and a polyfunctional epoxide.

Abstract: An epoxy resin composition which comprises:(a) an epoxy resin having an epoxy equivalent of at most 200;(b) a condensation mixture of 1 mol of a polybasic carboxylic acid anhydride, from 0.07 to 0.3 mol of a bisphenol A having the formula: ##STR1## and from 0.07 to 0.3 mol of a monohydric phenol having the formula: ##STR2## wherein R is an alkyl group, as a curing agent; and (c) an inorganic powder, as a filler.

Abstract: Polyhydroxyethers formed by reacting a diglycidyl ether of biphenol, such as diglycidyl ethers of bisphenol-A, and a dihydroxybiphenyl, such as dihydroxybiphenyl, tetramethyldihydroxybiphenyl, and tetrabromotetramethyldihydroxybiphenyl, exhibit high heat distortion temperatures. These compositions could find utility in extruded films, packaging and coatings.

Abstract: A thermosetting resin composition having an improved crack resistance comprising 100 weight parts of a curable epoxy resin and 30 to 300 weight parts of a phenol compound-added conjugated diolefin polymer, which is prepared in the presence of aluminum phenoxide as the catalyst. The composition is suitable for resin encapsulation of electronic components.

Abstract: An epoxy resin composition which comprises a mixture (a) obtained by mixing 100 parts by weight of a polybasic carboxylic acid anhydride with from 10 to 70 parts by weight of a compound having at least two phenol groups, an epoxy resin having at least two epoxy groups in the molecule, a catalyst, and an inorganic powder as a filler.

Abstract: Imide functional polyphenols are prepared by reacting an excess of a phenol with an unsaturated diimide which is prepared by reacting an unsaturated polycycloaliphatic dicarboxylic acid anhydride with a diamine.These materials are useful in the preparation of castings, coatings, laminates and the like.

Abstract: A process for reacting an acidic compound or anhydride with an epoxy-containing compound is disclosed. In a preferred embodiment this process comprises reacting a polyepoxide having more than one vic-epoxy group with a phenol in the presence of a methylene bis(triphenylphosphonium)halide catalyst.

Abstract: This invention is directed to hydroxyl terminated azomethines formed by reacting aromatic hydroxyl aldehydes or ketone compounds with diamines. These azomethines may be reacted with epoxy resin to produce polymeric material having high glass transition temperatures.

Abstract: The invention relates to water-dispersible binders for cationic electro-dip paints with a base of modified epoxy resins. The binders are produced by reaction of(A) epoxy resins having a molecular weight of at least 350 with(B) elasticized polyphenols having a molecular weight of over 350 with addition to the epoxide groups and further reaction of the reaction product of (A) and (B) with(C) primary and/or secondary amines or ammonium salts to obtain the required water-dispersibility.

Abstract: This invention is directed to hydroxyl terminated azomethines formed by reacting aromatic dialdehydes or aromatic diketones with hdyroxyl-amino compounds. These azomethines may be reacted with epoxy resin to produce polymeric material having high glass transition temperatures.

Abstract: Advanced epoxy resins are prepared from a liquid diglycidyl ether of bisphenol A and bisphenol A which advanced epoxy resins have an equivalent weight in the range of 3,000 to 3,900 and a weight average molecualr weight of 13,000 to 17,000. When these advanced epoxy resins are formulated into can coating compositions they result in coatings having good wet and dry adhesion.

Abstract: Relatively high molecular weight epoxy resins cured with conventional curing agents are disclosed wherein the relatively high molecular weight epoxy resin is prepared in the presence of the curing agents. The resultant cured epoxy resin has an improvement in Tg or toughness and the mixture prior to reaction and curing is much easier to apply as a coating or in the preparation of castings, laminates and the like as compared to applications of mixtures of relatively high molecular weight epoxy resins and the curing agents.

Abstract: Curable thermosetting resin compositions comprising an epoxy resin having at least two 1,2-epoxy groups per molecule, an aromatic diamine hardener, and as a cure accelerator an aromatic trihydroxy compound are disclosed. The aromatic trihydroxy compound, such as for example, phloroglucinol, n-propyl gallate, or pyrogallol, improves the cure speed of the epoxy/aromatic diamine resin system, while at the same time producing cured compositions having excellent mechanical and thermal properties. The disclosed compositions find particular application in the preparation of composites by, e.g., filament winding procedures.

Abstract: An epoxy resin composition comprising an epoxy resin, either 2-vinyl-4,6-diamino-s-triazine or 2-vinyl-4,6-diamino-s-triazine/isocyanuric acid adduct, and at least one compound selected from dicyandiamide, polyvinyl-p-phenol and specific imidazole compounds. The composition is useful, for example, in inks, insulating paints and adhesives for printed circuit base boards and in copper-clad laminated boards.

Abstract: A two component adhesive formulation comprising a mixture of A. an epoxy component comprising an epoxy resin and an additive selected from the group consisting of (a) a polyisocyanate, (b) a carboxylic anhydride and (c) a compound having unsaturated carbon-carbon bonds capable of undergoing Michael addition reaction with amines, and B. a hardener component for curing component A comprising a mixture of amido amines, primary and secondary amines having tertiary amine groups or ether groups in their backbone, and bisphenol-A is described.

Abstract: A process for preparing polyepoxides having a wide molecular weight distribution comprises reacting a liquid polyepoxide and polyhydric phenol in a first step, and reacting the resulting intermediate with additional polyhydric phenol and polyepoxide in one or more additional steps.

Abstract: A coating composition comprising the reaction product obtained by reacting an epoxy resin with a polynuclear polyhydroxy phenol having adjacent hydroxy groups, polyol esters of polyhydroxy phenolic carboxylic acids having adjacent hydroxy groups or a phosphorus compound.

Abstract: Epoxy resins are prepared by reacting a mixture of (A) a diglycidyl ether of a dihydric aliphatic material, (B) a polyglycidyl ether of a polyhydric phenol having an average of at least about 2.6 glycidyl ether groups per molecule and optionally (C) a diglycidyl ether of a dihydric phenol with a dihydric phenol in the presence of a catalyst.Coating compositions containing the aforementioned epoxy resins have improved chip resistance, chemical resistance or pencil hardness when cured.

Abstract: Novel solvent-based thermosetting composition comprising (a) hydroxy functional epoxy ester resin of number average molecular weight (Mn) between about 1,000 and about 5,000, comprising the reaction product of diepoxide with diphenol, dicarboxylic acid and acid component comprising hydroxy functional acid and optionally further comprising fatty acid; and (b) polyfunctional, hydroxy-reactive crosslinking agent, for example, aminoplast crosslinking agent or blocked polyisocyanate crosslinking agent comprising isocyanate groups blocked by reaction with an active hydrogen bearing blocking agent. Coating composition may be formulated as primer sprayable with conventional spraying equipment.

Abstract: The increase in hydrolyzable halide content in the preparation of advanced epoxy resins is decreased by conducting the advancement in the presence of an unsaturated organic compound.

Abstract: Novel solvent-based thermosetting composition comprising (a) hydroxy functional epoxy ester resin of number average molecular weight (Mn) between about 1,000 and about 5,000, comprising the reaction product of diepoxide with dicarboxylic acid and acid component comprising hydroxy functional acid and optionally further comprising fatty acid; and (b) polyfunctional, hydroxy-reactive crosslinking agent, for example, aminoplast crosslinking agent or blocked polyisocyanate crosslinking agent comprising isocyanate groups blocked by reaction with an active hydrogen bearing blocking agent. Coating composition may be formulated as primer sprayable with conventional spraying equipment.

Abstract: A process for producing an epoxy-type lacquer, which comprises reacting a liquid epoxy resin having about one bisphenol A skeleton on an average in the molecular chain and derived from bisphenol A and an epihalohydrin, with bisphenol A in the presence of a catalyst in an inert organic solvent to prepare a concentrated solution of an epoxy resin having a number average molecular weight of from 2,000 to 10,000, adding an organic solvent to the concentrated solution to dilute it and maintain it at a temperature lower than that at which the catalyst is active, and mixing the resulting diluted solution with a solution of a resin acting as a curing agent for the epoxy resin. The resulting lacquer is especially useful for coating metallic containers.