Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.

Abstract: A method for increasing density of a region of a porous, phenolic bonded (“PPB”) body adjacent to a selected surface to increase failure tensile strength of the adjacent region and/or to decrease surface recession at elevated temperatures. When the surface-densified PPB body is brought together with a substrate, having a higher failure tensile strength, to form a composite body with a PPB body/substrate interface, the location of tensile failure is moved to a location spaced apart from the interface, the failure tensile strength of the PPB body is increased, and surface recession of the material at elevated temperature is reduced. The method deposits and allows diffusion of a phenolic substance on the selected surface. The PPB body and the substrate may be heated and brought together to form the composite body. The phenolic substance is allowed to diffuse into the PPB body, to volatilize and to cure, to provide a processed body with an increased surface density.

Abstract: Cyclic carbamate functional compounds, which are the reaction product of a cyclic carbamate having an acrylate functional group, such as N-(2-acryloyloxyethyl)oxazolidinone, with aliphatic amine compounds, said cyclic carbamate functional compounds being useful as oxygen scavengers in energy-curable compositions, such as inks, coatings and adhesives, that comprise (a) the cyclic carbamate functional compound, (b) reactive monomers and/or oligomers and, optionally, (c) a photoinitiator.

Abstract: The present invention provides a building material in which a coating is applied to a front surface and a side surface is sufficiently adhered to a sealing and method for manufacturing thereof. In a building material in which a coating is applied to a front surface, a coating film on a side surface is removed or reduced by laser irradiation. The part of the side surface in which the coating film has been removed or reduced by laser irradiation has a width of at least 5 mm from a front surface side toward a rear surface side of the building material, or extends over the entire side surface from the front surface side toward the rear surface side of the building material, or is formed more than a part in which coating film is formed.

Abstract: An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.

Abstract: Process for the continuous preparation of prepolymers based on phenolic resin, an oxazoline component and an epoxide in the presence of a catalyst, including supplying the phenolic resin and the oxazoline component to an extruder in a stream A; a Lewis adduct of boron trifluoride or of aluminum trichloride, or arylsulphonic acids or alkylsulphonic acids, or latent arylsulphonic acids or latent alkylsulphonic acids, in a stream B, and the epoxide in a stream C, the infeed of stream A being situated, as seen in extrusion direction, before the infeed of stream C, these reactants are mixed at a reaction temperature of 120 to 200° C. with a residence time in the extruder of 3 seconds to 15 minutes, and then the product discharge of the extruder is cooled to a temperature of less than 45° C. within from 30 to 60 seconds.

Abstract: Compounds VB of the formula (I) or (II), said compounds being particularly suitable as curing agents for epoxide resins. The compounds can be produced easily and rapidly. They can be used in the form of aqueous curing agents and form stabile aqueous emulsions in particular. This facilitates the formulation of ECC compounds for use primarily as coatings.

Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

Abstract: A coating composition is provided for use in laminate substrates useful in packaging of liquids and solids where the coating provides and increased resistance to the permeability of gases such as oxygen and carbon dioxide. In one embodiment the coating composition is a dispersion or a solution that comprises at least one hydroxyl functional polyetheramine, phosphoric acid and a defoamer. The backbone of the polyetheramine has diglycidyl ether linkages that comprise about 5 to about 70 mole percent resorcinol diglycidyl ether. The coating composition can be applied to substrates by coating applications such as spraying, rolling reverse and direct, rolling direct and reverse gravure, kiss coat, flow coating, brushing, dipping and curtain-wall coating, for example.

Abstract: A fluorine-containing curable composition containing (A) A fluorine-containing amino compound having primary or secondary amino groups at both ends, said compound being represented by the formula (1): Y-Q-Rf—(X—Rf)n-Q-Y??(1) wherein Rf is a divalent perfluorooxyalkylene group, each Q is independently a divalent organic group having 1 to 20 carbon atoms and, optionally, containing an oxygen atom and/or a nitrogen atom, X is a divalent organic group having 1 to 20 carbon atoms and, optionally, containing an oxygen atom and/or a nitrogen atom, Y is an organic group having a primary or secondary amino group and 1 to 20 carbon atoms and, optionally, containing an oxygen atom, and n is an integer of from 1 to 20, (B) An epoxy compound having at least two epoxy groups in a molecule, in an amount such that the amount of the epoxy groups is 0.

Abstract: Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly suitable as one-component heat-curable adhesives, and as structural foams which have a high impact resistance and high mechanical stability.

Abstract: The present invention provides epoxy curing agent compositions comprising alkylated aminopropylated methylene-di-(cyclohexylamine) compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: A PVC-free plastisol composition is provided. The sealer comprises a one-component, PVC-free plastisol embodied in a hybrid epoxy-urethane composition. Alternatively, the sealer may be embodied in a hybrid epoxy-urethane-acrylic composition. The composition comprises a urethane component, an epoxy component, a curing agent and a catalyst. The composition my further comprise a solvent and a filler. An acrylic additive may also be used. The compositions may find broad use in any system that is baked at an elevated temperature.

Abstract: A water soluble polymer comprising a copolyhydroxyaminoether having side-chains of polyalkylene oxides, an aqueous solution of said polymer and process for preparing the copolyhydroxyaminoether.

Abstract: An amine hardener for epoxy resins which comprises an amine adduct (A) and a low-molecular amine compound (B) as major components, wherein the molecular weight distribution of the amine adduct (A), which is defined by the ratio of the weight-average molecular weight to the number-average molecular weight, is 3 or lower and the low-molecular amine compound (B) is contained in an amount of 0.001 to 1 part by mass per 100 parts by mass of the amine adduct (A).

Abstract: An adhesive composition comprising: 100 parts by weight of (A) a phenoxy resin having, per molecule, at least one alkoxy silane residue represented by the following formula (I) wherein R1 may be the same with or different from each other and is a substituted or unsubstituted C1-4 alkyl group, and R2 is a substituted or unsubstituted C1-9 monovalent group comprising a moiety selected from the group consisting of amino, cyanato, glycidoxy and thiol groups; 5 to 200 parts by weight of (B) an epoxy resin; a catalytic amount of (C) catalyst for curing the epoxy resin; and (D) an inorganic filler in an amount of from 33 to 300 parts by weight per total 100 parts by weight of the components (A), (B) and (C).

Abstract: A water soluble polymer comprising a copolyhydroxyaminoether having side-chains of polyalkylene oxides, an aqueous solution of said polymer and process for preparing the copolyhydroxyaminoether.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: The present invention provides a comb-shaped epoxy resin represented by the following formula (1): in the formula (1), X1 and X2 represent a divalent group having a residue selected from xanthene residue, biphenylene residue, hydrogenated bisphenol residue, alkylene residue and polyoxyalkylene residue, each may having a methyl group or a ethyl group as a substituent, and at least one of them is an aromatic residue, Y represents a polymer chain such as linear polymer chain, a number average polymerization degree being 5 to 2000, and n (number average polymerization degree) represents an integer within a range of 3 to 200, and to a method for preparing the comb-shaped epoxy resin.

Abstract: The present invention provides a film-forming composition. The composition includes a reaction product of: a) a polyamine containing a primary amino group and a secondary amino group; and b) an acyclic carbonate. Also provided is a method of preparing a film-forming composition and an article coated with such compositions.

Abstract: The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Abstract: The invention relates to addition compounds suitable for use as wetting agents and dispersants and obtainable by reacting monofunctional or polyfunctional aromatic epoxides with polyoxyalkylenemonoamines having a number-average molecular weight of >400 g/mol, one primary or secondary amino group and at least 4 ether oxygen atoms per molecule, from 90 to 100% of the epoxide groups of the starting material having undergone reaction, the weight fraction of aromatic groups in the addition compounds being not more than 50% and the addition compounds containing per molecule at least one amino group on which salts can be formed, or being present as a salt. The invention also relates to a process for preparing the addition compounds, to their use as wetting agents and/or dispersants and to pigments or fillers coated with the addition compounds and to pigment pastes which comprise pigments, binders and the addition compounds of the invention.

Abstract: A polyol monomer comprising the formula: R1 is aliphatic or aromatic, R2 is aliphatic, aromatic, ester, ether, or acrylic, and R1 contains a hydroxyl group, R2 contains —O—CH2—CH(OH)—, or both. R1 is not a C4 or larger linear, unsubstituted aliphatic when R2 is a residue of a bisphenol. The polyol monomer may be made by reacting an epoxy and an alcohol. Either the epoxy contains more than one epoxide groups, the alcohol is a polyol, or both. A thermoset made by reacting the polyol monomer with a polyisocyanate.

Abstract: An epoxy resin curing agent composition containing a ketimine compound prepared by the reaction between a polyoxypropylenediamine component and a ketone compound, wherein (1) the polyoxypropylenediamine component is a 9/1 to 6/4 (by weight) mixture of polyoxypropylenediamine having a molecular weight of 200 and 500 and polyoxypropylenediamine having a molecular weight of 1000 to 3000, (2) the ketimine compound has a degree of ketimination of 90% or higher, or (3) the reaction is carried out in the presence of a catalyst selected from (i) a combination of a tertiary amine and a sulfonic acid and (ii) a salt between a tertiary amine and a sulfonic acid.

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: The invention relates to addition compounds of formula (1): in which: n is a number from 1 to 10; R1 and R2 are identical or different and are each a hydrogen atom or a saturated or unsaturated aliphatic radical having 1 to 4 carbon atoms; R3 and R4 are identical or different and are each a hydrogen atom or alkyl having 1 to 3 carbon atoms, and the bridge member (R3+R4) is in each case positioned ortho or meta in relation to the phenolic oxygen atom; Z represents a group —CH2—CH2—, —CH2—CH(CH3)—, —CH(CH3)—CH2— or a combination thereof; s is number from 1 to 200; B represents hydrogen, —CO—CH?CH—COOM, —COCH(SO3M)CH2COOM, —CO—CH2—CH(SO3M)—COOM, —SO3M, —SO2M and/or —PO3MM, whereby M is preferably a cation selected from the group Li+, Na+, K+, NH4+, HO—CH2—CH2—NH3+, (HO—CH2—CH2—)2NH2+ or (HO—CH2—CH2—)3NH+; and Y is a radical of an amine. The inventive addition compounds are used as dispersing agents of solids, for example, pigments, particularly in aqueous media.

Abstract: An epoxy composition includes an epoxy resin, a latent curing agent, and a catalyst. The composition includes two epoxide groups per molecule, and the latent curing agent is preferably a dicyanopolyamide, and most preferably dicyandiamide. The catalyst includes 2,4-toluene bis dimethyl urea, preferably in a concentration exceeding 70% by weight. The composition can be used in prepregs. The relative concentrations of the epoxy resin, curing agent, and catalyst are selected to achieve desired properties, including specific curing times and temperatures, and glass transition temperatures that enable a cured resin composition to be removed from a mold after being heated to its curing temperature, without being cooled. Exemplary formulations have reduced cure times, at both high and low curing temperatures, as compared to prior art formulations.

Abstract: The present invention relates to adducts obtainable by reaction of: A) an amine compound containing 2 or more than 2 amino groups: with B) a polyalkylene glycol monoglycidyl ether of general formula (I), in which R independently of one another (for n>1), is an —H or —CH, radical, and n=1 to 50, characterized in that the reaction ratio of components A) and B) is selected in such a way that the resultant adduct contains 2 or more than 2 amine hydrogen groups: to curable compositions based on these adducts with epoxy resins, and to the use of these curable compositions as casting resin, adhesive, matrix resin, tooling resin or as coating composition, in particular for self-flowing coatings.

Abstract: Provided herein are amine blends which may be used in place of N-aminoethyl piperazine as accelerator in the curing reaction of epoxy resins.

Abstract: An object of the present invention is to provide an amino composition which provides, when used as a curing agent for epoxy resin, a long pot life and an excellent appearance of a coating film to an epoxy resin composition without deteriorating the reactivity of the composition. The amino composition is obtained by addition reaction of diamine such as metaxylylenediamine and 1,3-bis(aminomethyl) cyclohexane and styrene, wherein the content of the diamine is less than 15% by weight based upon the total weight of the amino composition and the content of 1-addition product of having one phenethyl group is 50 to 100% by weight based upon the total weight of amino compound(s) obtained by the addition reaction.

Abstract: Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.

Abstract: A curable mixture which includes at least (a) 10 to 100 percent by weight, in relation to the sum of the components (a) and (b), of at least one bi- or polyfunctional aromatic cyanate or a prepolymer formed from at least one bi- or polyfunctional aromatic cyanate or a mixture formed from the abovementioned cyanates and/or prepolymers; (b) 0 to 90 percent by weight, in relation to the sum of the components (a) and (b), of at least one mono-, bi- or polyfunctional epoxy resin; (c) 0.5 to 30 percent by weight, in relation to the sum of the components (a) and (b), of at least one mono-, bi- or polyfunctional aromatic amine; and (d) 0 to 5 percent by weight, in relation to the sum of the components (a) and (b), of at least one catalyst from the group consisting of transition metal compounds and boron trihalides.

Abstract: The present invention is directed to fast dry ambient temperature curable coating compositions especially suited for use in automotive refinish applications. A binder component of the two pack coating composition includes an epoxy resin having at least one acetoacetate functionality and at least one epoxy group, and one or more reactive components provided with at least two acetoacetate functionalities. Some of the suitable reactive components include structured reactive diluent, an acrylic polymer, a polyester, or a combination thereof. A crosslinking component of the coating composition includes polyamine, a blocked polyamine or a mixture thereof. The present invention is further directed to a method of producing a coating on a substrate from the coating composition.

Abstract: Compounds of formula (I) or (II), wherein R1 is C1-C18alkyl; C5-C12cycloalkyl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C22alkoxy groups; C5-C22aryl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups; or C7-C30aralkyl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups, and the radicals R2 to R13 are each independently of the others hydrogen; —NO2; dialkylamino; alkylthio; alkylsulfonyl; halogen; C1-C18alkyl; C1-C18alkoxy; C1-C18alkoxyalkyl; C5-C12cycloalkyl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups; C5-C22aryl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups; or C7-C10alkyl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups, are suitable as flame-proofing agents for thermoplastic or thermosetting polymers.

Abstract: Gel formation is prevented in the reaction between a sulfonyl-chloride-containing resin and a polyamine by first forming an adduct between the resin with an aminophenol. The prevention of gel formation enables sulfonyl-chloride containing resin to be used in admixture with acrylates and epoxy resin to form a polyamine-curable adhesive composition having excellent adhesive properties and chemical resistance.

Abstract: A primer for flame sprayed polyolefin comprises an epoxy resin, preferably of low molecular weight and/or low viscosity; and an amine hardener, part of which becomes highly reactive on exposure to open flame, providing near instant cure of the composition under flame spray conditions. The invention is unique that it provides strong adhesion to steel, even where the surface preparation is less than ideal, as well as to concrete and other substrates. The primer eliminates the need to preheat the substrate. The primer has strong adhesion to the topcoat polyolefinic material, especially to a functionalized topcoat. The composition withstands open flame and does not char under polyolefin flame spray conditions, nor does it run or sag, and it is not prone to failure as it cools after the application of the polyolefin.

Abstract: Water-dilutable, cationically stabilized epoxy resins ZYX are obtained by reacting, in the first stage, aromatic or aliphatic epoxide compounds Z with aliphatic amines Y to form epoxy-amine adducts ZY which are neutralized and then in aqueous dispersion are reacted in a second stage with a further epoxy resin X. The resins ZYX may be formulated without additional curatives to give aqueous coating materials which exhibit a good corrosion protection effect.

Abstract: A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is more stable than previously known ones. The single component epoxy coating precursor includes an epoxy resin, a first solvent, and a blocked amine. The single component epoxy coating precursor has a viscosity after 30 days at a temperature of 55° C. of less than 16 stokes.

Abstract: A method for imparting flame retardance to an epoxy resin comprises reacting an epoxy resin with a phosphorus-containing dihydric phenol or naphthol derived from the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (i.e., DOPO) with a benzoquinone or naphthoquinone.

Abstract: The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.

Abstract: Novel coating compositions containing a polymer, a hydrazide and a silane, methods of making and using such compositions and a substrate coated with such coating compositions.

Abstract: Pigment pastes suitable for the production of cathodically depositable electrodeposition lacquers (CEC) obtainable by dispersion of pigments and/or fillers in an aqueous paste resin containing tertiary-bonded amino nitrogen, whereby epoxy compounds and, if not already present, acid are added to the aqueous paste resin in the presence of pigments and/or fillers, process for their production and CEC coating compounds containing the same.

Abstract: Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic cation and of a non-nucleophilic anion; (C) at least one 1,1,2,2-substituted-1,2-ethane-diol and/or a derivative thereof, and (D) optionally further additives; and wherein said component (C) is a compound of formula (I), wherein each of R1, R2, and R3 independently of the other is unsubstituted phenyl or has one of the meanings of R4; R4 is substituted phenyl optionally substituted &agr;-naphthyl or &bgr;-naphthyl, or an optionally substituted aromatic heterocyclic ring system or each of R1 and R2 and/or R3 and R4 independently of the other form a residue of formula (II), wherein each of R5 and R6 independently of the other is hydrogen or (C1-C4)alkyl; R7 is —(CH2)n— or —S— or —O—; and n is 0, 1, 2, or 3.

Abstract: An adhesive-coated copper foil which comprises a copper foil and disposed on one side thereof a layer of an adhesive composition comprising (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as an optional ingredient, and (d) a compound having a triazine ring or isocyanuric ring. The adhesive layer has low hygroscopicity, excellent heat resistance, and satisfactory adhesion to copper foils. By using the adhesive-coated copper foil, a copper-clad laminate and a printed circuit board both having excellent properties can be obtained.

Abstract: A controlled conversion resin having an epoxy functionality of greater than 2 and comprising moieties derived from epoxy resin, dihydric phenol, acid anhydride, or amine. The resin is prepared by reacting an epoxy resin with a dihydric phenol, an acid anhydride, or amine or other branching agent in the presence of a catalyst and terminating the reaction at a point such that the reaction product contains both epoxy and terminal hydroxyl groups.

Abstract: A curable underfill composition comprising an epoxy containing a curing agent component and a latent accelerator component. The accelerator component comprises a material which produces a resin with an exotherm below 300 J/g. Further, the combination may be utilized in an unfilled state which allows the epoxy to remain very viscous and thus increases the speed of the underfill process in comparison to filled epoxy compositions and epoxy compositions containing different accelerator components.

Abstract: Disclosed are a cyanate ester based resin-containing insulating composition, an insulating film made therefrom and a multilayer printed board having the insulating film. The insulating composition comprises 1-75% by weight of epoxy resin, 1-60% by weight of cyanate ester resin, up to 20% by weight of a filler, a curing agent and a metal catalyst, from which the insulating film can be prepared, and the film-applied multilayer printed board can be manufactured. Use of epoxy resins having excellent electrical properties and cyanate ester based resins having high heat resistance causes the reaction of hydroxy groups in some epoxy resins with cyanate ester, thus forming such net structures as to increase the heat resistance of the insulating composition, the insulating film and the multilayer printed circuit board.

Abstract: A curable epoxy composition comprises an epoxy resin having at least 1.5 epoxy groups per molecule and an amine-terminated polyamide. The liquid amine-terminated polyamide is prepared by reacting a long-chain, C20-C60 dicarboxylic acid or derivative with an amine having a general formula of R1—NH—R2—NH—R3.

Abstract: Nitrogen compounds represented by formula (XXIa) or (XXIb); an epoxy resin hardening accelerator and a resin composition each containing any of the compounds; and an electronic part device containing an element encapsulated with the composition. In the formulae, R1 and R2 each represents hydrogen or a C1-20 monovalent organic group; R3 and R4 each represents a C1-20 divalnt organic group; R5 represents hydrogen or a C1-6 monovalent organic group; k is an integer of 0 to 2; and p is 0 or 1.