Non-1,2-epoxy Or Nonphenolic Reactant Contains One Or More Nitrogen Atoms Patents (Class 528/119)
- Nitrogen reactant having at least one amino-nitrogen atom contains a cycloaliphatic ring (Class 528/122)
- Nitrogen reactant having at least one amino-nitrogen atom contains three or more nitrogen atoms (Class 528/123)
- Nitrogen reactant having at least one amino-nitrogen atom contains at least one aryl group (Class 528/124)
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Patent number: 6492437Abstract: Solvent-based processes for producing latent curing catalysts without causing an extreme exotherm. The process of the present invention includes combining an amine compound curing agent with a solvent, heating the mixture, adding an epoxy/solvent mixture via slow addition, removing the solvent and then heating the remaining composition. Following the heating, a phenolic resin is added to produce the final catalyst. The final catalyst comprises an amine compound, an epoxy, phenolic resin and a solvent. Catalysts having differing properties may be produced by varying the elements of the catalyst.Type: GrantFiled: June 21, 2001Date of Patent: December 10, 2002Assignee: National Starch and Chemical Investment Holding CorporationInventors: Osama M. Musa, Michael J. Cipullo
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Patent number: 6476101Abstract: To provide a method for producing a pigment dispersing resin varnish for cationic electrodeposition paint, wherein the flow properties and appearance of the resulting electrodeposition coating film are not compromised when using as a solvent a compound that is not volatilized into the atmosphere but remains in the electrodeposition coating film during the onium conversion of a pigment dispersing resin, as well as a cationic electrodeposition resin composition allowing HAPs to be eliminated and volatile organic carbon compounds to be reduced (VOC reduction). A method for producing a pigment dispersing resin varnish for use with cationic electrodeposition paint, wherein a solvent comprising a polyalkylene oxide compound represented by the following formula is used to produce a resin varnish which has been obtained from a cationic epoxy resin composition having amino groups, phosphonium groups, or sulfonium groups.Type: GrantFiled: November 30, 2000Date of Patent: November 5, 2002Assignee: Nippon Paint Co., Ltd.Inventors: Masahiro Takegawa, Makoto Ando, Keisuke Tsutsui, Shinsuke Shirakawa, Mitsuo Yamada
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Patent number: 6458993Abstract: The present invention relates to novel aromatic cyanate ester compounds containing at least two rings linked by a group containing an unsaturated group. The present invention further relates to compositions and prepolymers of said novel aromatic cyanate ester compounds. The present invention further relates to a process for preparing said compounds and cured articles resulting from curable mixtures thereof.Type: GrantFiled: January 31, 2001Date of Patent: October 1, 2002Assignee: Vantico Inc.Inventors: Bor-Sheng Lin, Michael James Amone
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Publication number: 20020132955Abstract: A curing agent composition for an epoxy resin which comprises (B) a reaction product obtained from (a) a monoamine compound comprising an amine compound represented by formula (I): 1Type: ApplicationFiled: December 29, 2000Publication date: September 19, 2002Applicant: Asahi Denka Kogyo Kabushiki KaishaInventors: Akio Ogawa, Manabu Abe
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Patent number: 6444272Abstract: The present invention relates to a single-packaged epoxy resin coating composition comprising: (A) an epoxy resin having at least one epoxy group in a molecule and capable of being dissolved in the following organic solvent (D), (B) a ketimines compound having at least two primary amino groups blocked with a carbonyl compound and having no other amino groups than the above blocked amino groups, (C) a dehydrating agent and (D) an organic solvent, wherein the above organic solvent (D) comprises a hydrocarbon base solvent selected from the group consisting of an aliphatic hydrocarbon base solvent and an aromatic hydrocarbon base solvent having a boiling point of 148° C. or higher in a proportion of at least 95% by weight based on the above organic solvent (D).Type: GrantFiled: May 26, 2000Date of Patent: September 3, 2002Assignee: Kansai Paint Co., Ltd.Inventors: Koji Matsuda, Yoshimitsu Adachi, Tadashi Nakano, Shinji Iida
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Patent number: 6433042Abstract: A curing agent for epoxy resin which comprises at least one selected from the compound of the formula (1) and its salt, as an effective component wherein X is —(CH2)n- or —(CH2)1-Y—(CH2)m- , Y is —N(R1)—, —O— or —S—, R1 is alkyl having 1 to 8 carbon atoms or amino. n is a number of 2, 3, 5 to 11, 1 and m are each a number of 1 to 8.Type: GrantFiled: February 5, 2001Date of Patent: August 13, 2002Assignee: Otsuka Kagaku Kabushiki KaishaInventors: Yoshihisa Tomotaki, Takashi Kitajima, Keiichiro Ishikawa, Akihiro Nabeshima, Tomohiro Furuichi
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Patent number: 6410617Abstract: Self-dispersing, hardenable epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyhydroxy compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.Type: GrantFiled: April 26, 2001Date of Patent: June 25, 2002Assignee: Cognis Deutschland GmbHInventors: Horst Sulzbach, Thomas Huver, Hans-Josef Thomas, Vincenzo Foglianisi
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Patent number: 6388044Abstract: The present invention provides a thermosetting polyether resin obtained by polycondensing a dihalogen compound with a bisphenol compound to obtain a polyether resin having a repeating unit represented by the formula (1), and introducing a functional group which causes a cross-linking reaction by heating into the resulted polyether resin; The present invention also provides a polyether resin having a low dielectric constant represented by the formula (3):Type: GrantFiled: September 7, 2000Date of Patent: May 14, 2002Assignee: Sumitomo Chemical Company, LimitedInventors: Yuji Yoshida, Akira Yokota, Sadanobu Iwase, Hyuncheol Choi
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Patent number: 6376579Abstract: This invention relates to an epoxy composition especially designed for use as a primer for sealing and filling small pores in concrete. Advantageously, the composition is a low temperature curing, sag-resistant epoxy primer, which provides good adhesion to concrete and to a polyurea coating applied to the primed concrete. Advantageously the epoxy primer is curable at a temperature below 40° F. and comprises an admixture of two parts, Component A and Component B; wherein Component A comprises a crystallization resistant reactive epoxy resin and Component B comprises an amine curing agent. The resulting primer bonds to concrete at 200 psi or greater, when measured by ASTM D 4541.Type: GrantFiled: July 18, 2000Date of Patent: April 23, 2002Assignee: Illnois Tool WorksInventors: Vinay Mishra, Noredin Morgan
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Patent number: 6362359Abstract: The present invention relates to compounds containing modified hydrazide groups and corresponding to formula I wherein R represents the residue obtained by removing the isocyanate groups from a monomeric polyisocyanate, a polyisocyanate adduct or an NCO prepolymer, X represents OR′ or NHR′ and R′ represents a group which is inert to isocyanate groups under the conditions used to form the compound of formula I, R″ represents a divalent, linear or branched aliphatic group containing 2 to 10 carbon atoms, provided that there are at least two carbons between the oxygen atoms wherein the aliphatic group may optionally be substituted by heteroatoms to form ether or ester groups, and n is 2 to 6.Type: GrantFiled: December 1, 2000Date of Patent: March 26, 2002Assignee: Bayer CorporationInventors: Sze-Ming Lee, Karen M. Henderson, Patricia B. Jacobs, Robert A. Sylvester, Douglas A. Wicks
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Patent number: 6353081Abstract: Metal compounds of pseudohalogenides and their use as curing agents for epoxy compounds which curing agents can be produced by mixing the reactants in aqueous solution and are distinguished by a long processibility time at temperatures up to 100° C. as well as by very short curing times at temperatures in the range of 120 to 160° C.Type: GrantFiled: October 6, 1999Date of Patent: March 5, 2002Assignee: Bakelite AGInventors: Andreas Palinsky, Manfred Doring, Holger Dey, Jorg Wuckelt
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Patent number: 6329473Abstract: Epoxy resin compositions comprising polyepoxides having at least two 1,2-epoxide groups, which can be obtained by reaction of diepoxides or polyepoxides or mixtures thereof with monoepoxides, and one or more amines sterically hindered amines, such as disecondary polyoxyalkylenediamines, and/or diprimary diamines, if desired with the addition of further 1,2-epoxide compounds and also hardeners, and use thereof as a coating for crack bridging, as an adhesive and in powder surface coatings.Type: GrantFiled: March 23, 1995Date of Patent: December 11, 2001Assignee: Solutia Germany GmbH & Co., KGInventors: Manfred Marten, Claus Godau
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Patent number: 6291626Abstract: Flame-retardant advanced epoxy resins and cured epoxy resins contain a rigid phosphorus group emanating from a dihydric phenol or naphthol which provides thermal and flame retardant properties. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications.Type: GrantFiled: March 3, 1999Date of Patent: September 18, 2001Assignee: National Science CouncilInventors: Chun-Shan Wang, Jeng-Yueh Shieh
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Publication number: 20010007003Abstract: Thermosettable PSA compositions of the invention comprise a major proportion of the adhesive component of at least one acidic polymer and at least one amine-containing compound capable of reacting with acidic functional groups on the acidic polymer to cure the thermosettable PSA composition into a thermoset adhesive. The thermosettable PSA compositions are particularly useful for forming semi-structural or structural bonds. Thermoset adhesives therefrom and methods of forming the thermoset adhesives are also disclosed.Type: ApplicationFiled: December 20, 2000Publication date: July 5, 2001Applicant: 3M Innovative Properties CompanyInventors: Naimul Karim, Ashish Kumar Khandpur, Dmitriy Salnikov
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Patent number: 6133403Abstract: Disclosed are acid hardenable phenolic resin compositions and novolac compositions modified with about 5 to about 15% by weight of at least one reactive diluent selected from the group consisting of benzylic alcohol, benzylic ether, ethylene glycol, 1,3-butylene glycol, monoallyl or methylallyl ethers of poly(methylol) alkanes, monoallyl ether of glycerine, allyl or methallyl glycidyl ether, N-acylated arylamine, N-acylated naphthylamine, N-substituted arylsulfonamide, and N-substituted arylamine. The reactive diluent can be used to improve impact resistance and flexibility of the acid hardenable phenolic resin. Preferably, the methods for modifying mix life of acid hardenable phenolic resin by use of aryl phosphite and benzylic alcohol, and methods for modifying novolac resins, as well as methods for making the present compositions and products, such as coiled filament pipe and laminate panels, employing the compositions are also disclosed.Type: GrantFiled: October 7, 1998Date of Patent: October 17, 2000Assignee: Borden Chemical, Inc.Inventor: Arthur H. Gerber
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Patent number: 6077929Abstract: The present invention pertains to coating compositions including a particular class of internally blocked polyamines as replacement for traditional blocked and unblocked polyamine crosslinkers. The use of these internally blocked polyamines results in better appearance characteristics and a lower VOC than are generally available with the traditional blocked varieties.Type: GrantFiled: April 7, 1998Date of Patent: June 20, 2000Assignee: Akzo Nobel N.V.Inventors: Johannes Adrianus Pardoen, Wincenty Lambertus Stanislaw Pilaszek, Jan Wilhelm Ernst Moos, Keimpe Jan Van Den Berg
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Patent number: 6077886Abstract: A curable epoxy resin composition comprising (A) an epoxy resin, (B) a thixotropic agent in an amount sufficient to induce thixotropic properties, and a hardener comprising (C) at least one polyethyleneimine and (D) at least one other amine having at least 2 amino hydrogen atoms, the combined amounts of (C) and (D) being sufficient to effect cure of the epoxy resin.Type: GrantFiled: October 9, 1997Date of Patent: June 20, 2000Assignee: Ciba Specialty Chemicals CorpationInventors: Barry James Hayes, Kevin Brian Hatton
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Patent number: 6051632Abstract: Free-flowing compression molding compositions made up of from about 40 to about 80 wt. % of organic filler, from about 20 to about 60 wt. % of an organic reactive resin, and optionally further auxiliary substances and additives. The reactive resin contains an epoxide which may be liquid, a latent catalyst and a powdered polyisocyanate which is solid at room temperature.Type: GrantFiled: August 4, 1994Date of Patent: April 18, 2000Assignee: Bayer AktiengesellschaftInventors: Lutz Schrader, Hanns-Peter Muller, Richard Kopp
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Patent number: 6037435Abstract: The present application to an underwater curable coating composition which is used for protecting or imparting an aesthetic appearance to various structures. An underwater curable coating composition consisting essentially of an epoxy resin component and its curing agent, wherein the epoxy resin component is a mixture comprising a liquid hydrophobic epoxy resin and a self-emulsifiable liquid epoxy resin. The curing agent is composed partly or solely of a ketimine.Type: GrantFiled: September 25, 1998Date of Patent: March 14, 2000Assignee: Dai Nippon Toryo Co., Ltd.Inventors: Toshiharu Hayashi, Toshimoto Tsuji
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Patent number: 5969036Abstract: In accordance with the present invention, there are provided novel compositions for attaching semiconductor devices to substrates. Invention compositions comprise liquid monomer vehicle comprising hydrophobic cyanate ester monomer(s) and epoxy monomer(s), electrically and/or thermally conductive filler, a metal catalyst, and an imidazole, preferably in the substantial absence of non-reactive diluents.Type: GrantFiled: June 20, 1997Date of Patent: October 19, 1999Assignee: The Dexter CorporationInventor: Stephen M. Dershem
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Patent number: 5959061Abstract: Water-dispersible curing agents for epoxy resins are disclosed which, as a mixture with epoxy resins, have a potlife indication by showing the end of the processing time by a clear increase in viscosity, and which comprise reaction products (ABC) of adducts of aliphatic polyols (A) with a weight-average molar mass of from 200 to 20, 000 g/mol, comprising at least one polyol (A1) having a molar mass of less than 4000 g/mol, and at least one polyol (A2) having a molar mass of more than 4000 g/mol, and at least one epoxide compound (B) having at least two epoxide groups per molecule, and a specific epoxide group content of from 500 to 10 000 mmol/kg, (A1) and (A2) being reacted separately or as a mixture with (B), and then reacting this adduct with one or more polyamines (C) having at least three amine hydrogen atoms and at least one primary amino group per molecule, the ratio of the number of hydroxyl groups of component (A) to the number of epoxide groups of component (B) being 1:3 to 1:10, and the ratio of thType: GrantFiled: July 25, 1997Date of Patent: September 28, 1999Assignee: Vianova Resins GmbHInventors: Uwe Neumann, Martin Gerlitz
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Patent number: 5864002Abstract: A method of providing for manufacturing a colored polymer resin having the steps of:(a) blending a disazo colorant into a mixture of monomers, the colorant having a poly(oxyalkylene) substituent comprising from 2 to 200 alkylene oxide residues, bonded to each end of the disazo chromophore, the poly(oxyalkylene) substituent having a nucleophilic terminal group which is capable of reacting with at least a portion of the monomers;(b) providing conditions under which the monomers and disazo colorant polymerize to form a colored polymer resin.Type: GrantFiled: October 18, 1996Date of Patent: January 26, 1999Assignee: Milliken Research CorporationInventors: Eric B. Stephens, Mark E. Ragsdale, David J. Moody
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Patent number: 5734003Abstract: A charge transporting polymer represented by formula ##STR1## wherein R represents a hydrogen atom, an alkyl group, an acyl group or --CONH--R, wherein R' represents an alkyl group or a substituted or unsubstituted aryl group; R.sub.1 and R.sub.2, which may be the same or different, each represent a hydrogen atom, an alkyl group, an alkoxy group, a substituted amino group, a halogen atom, or a substituted or unsubstituted aryl group; X represents a substituted or unsubstituted divalent aromatic group; y represents 0 or 1; m represents 0 or 1; n represents an integer of 1 to 5; and p represents an integer of 5 to 5000,a process for producing the same, and an organic electron device containing the same, such as an electrophotographic photoreceptor are disclosed. The charge transporting polymer is excellent in solubility, film-forming properties, mechanical strength, positive hole mobility, and stability to repeated use.Type: GrantFiled: December 11, 1996Date of Patent: March 31, 1998Assignee: Fuji Xerox Co., Ltd.Inventors: Masahiro Iwasaki, Akira Imai, Katsumi Nukada, Katsuhiro Sato
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Patent number: 5668226Abstract: A polyhydroxystyrene having a 2,4-diamino-s-triazinyl group substituted for 1-50 mol % of its hydroxyl group and a weight average molecular weight of 3,000-50,000 is provided. A negative radiation-sensitive resist composition comprising the polymer, preferably along with a photo-acid generator and a crosslinking agent has high resolution and developability, affords a resist pattern of rectangular profile, and is shelf stable. The composition is thus very useful as resist material for LSI manufacture.Type: GrantFiled: October 29, 1996Date of Patent: September 16, 1997Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tomoyoshi Furihata, Motoyuki Yamada
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Patent number: 5650477Abstract: Liquid reactive thermosetting compositions comprising:A) At least one polyepoxide or a mixture of one or more polyepoxides with at least one monoepoxide, of an aliphatic, cycloaliphatic or mixed nature;B) at least one anhydride of a di- or polycarboxylic acid of an aliphatic, cycloaliphatic or mixed nature;C) at least one catalyst capable of promoting the rapid polymerization of the mixture A+B under microwave irradiation and having general formula (I):N.tbd.C--CH.sub.2 --CH(Z)--(O).sub.r --Y.sup.+ NR.sub.1 R.sub.2 R.sub.3 X.sup.-.Type: GrantFiled: December 11, 1995Date of Patent: July 22, 1997Assignee: Enichem S.p.A.Inventors: Fabrizio Parodi, Renata Gerbelli, Mark DeMeuse
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Patent number: 5610209Abstract: A newly-blended one part system heat-resistant epoxy resin composition which exhibits excellent stability at room temperature, quickly undergoes the curing reaction, molded within short periods of time, and, after cured, exhibits excellent Tg, resistance against the water, resistance against degradation by heat, and a variety of excellent properties in combination. The heat-resistant epoxy resin composition having excellent stability at room temperature comprises an epoxy compound having two or more epoxy groups, a curing agent which comprises a naphthalenedicarboxylic dihydrazide as a main component, and a ceramic whisker as a filler.Type: GrantFiled: June 2, 1995Date of Patent: March 11, 1997Assignee: Japan Hydrazine Co., Ltd.Inventor: Shigeo Kiyono
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Patent number: 5599629Abstract: Described herein is a composition comprising an epoxy resin containing at least one glycidyl amine group wherein the resin contains three or more epoxide groups per molecule and a particular aromatic amine hardener. These compositions possess the necessary balance of properties required for making prepreg and afford unreinforced castings with high moduli and strength.Type: GrantFiled: March 1, 1984Date of Patent: February 4, 1997Assignee: Amoco CorporationInventors: Hugh C. Gardner, Shahid P. Qureshi
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Patent number: 5556937Abstract: The invention relates to salts of pyromellitic acid which comprise 1 mol of pyromellitic acid and 0.5. to 2 mol of a guanidine of the following composition: ##STR1## in which R, R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are identical or different radicals from the group consisting of hydrogen, alkyl, cycloalkyl and aromatic hydrocarbon residues having 1 to 8 carbon atoms, and R.sup.1 and R.sup.2 and R.sup.3 and R.sup.4 may form a joint ring which may contain an oxygen atom as heteroatom. Also claimed are the preparation of the salts and their use for matt epoxide and hybrid powder coatings.Type: GrantFiled: December 28, 1994Date of Patent: September 17, 1996Assignee: Huels AktiengesellschaftInventors: Rainer Gras, Elmar Wolf
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Patent number: 5548058Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.Type: GrantFiled: June 7, 1995Date of Patent: August 20, 1996Assignee: W. R. Grace & Co.-Conn.Inventors: Souichi Muroi, Hsi-Chuan Tsai
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Patent number: 5539024Abstract: This invention relates to resins which contain perfluoroalkyl groups and which are soluble, emulsifiable or dispersible in water, and to their use as treatment-, protective- and impregnating media for mineral materials, textile materials and paper, and as emulsifying, crosslinking and auxiliary processing materials for the production of aqueous preparations containing perfluoroalkyl compounds.Type: GrantFiled: May 19, 1995Date of Patent: July 23, 1996Assignee: Bayer AktiengesellschaftInventors: Stephan Kirchmeyer, Klaus Pohmer
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Patent number: 5494994Abstract: The invention relates to new salts of pyromellitic acid, to a process for their preparation and to their use for the production of matt epoxide and hybrid powder coatings.Type: GrantFiled: December 28, 1994Date of Patent: February 27, 1996Assignee: Huels AktiengesellschaftInventors: Rainer Gras, Elmar Wolf
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Patent number: 5492998Abstract: Novel polymers of general formula: ##STR1## wherein R is an alkyl or aryl group that contains an active hydrogen atom (as determined by the Zerewitinoff test); A is a spacing group having at least one carbon atom; B is a spacing group having at least two carbon atoms; and R and R' are alkyl or aryl groups. The polymer is synthesized via the Mannich pathway, involving formation of an imine intermediate.Type: GrantFiled: January 20, 1995Date of Patent: February 20, 1996Assignees: Lifesource International, Ltd., Jojani Inc.Inventor: Nicholas M. Irving
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Patent number: 5472998Abstract: An improved aqueous cathodic electrocoating composition having a binder of an epoxy-amine adduct which is of an epoxy resin that has been reacted with an amine, and a blocked polyisocyanate crosslinking agent; wherein the improvement is the use of a water soluble electrically conductive polymeric additive of a polyepoxy hydroxy ether resin reacted with a ketimine and optionally up to 60% of the epoxy end groups of the resin reacted with another amine and the resin has an epoxy equivalent weight of about 500-900, a weight average molecular weight of about 1,000-5,000 and an electrical conductivity of about 4,000-8,000 microsiemens to provide an electrocoating composition having improved throw power.Type: GrantFiled: September 16, 1994Date of Patent: December 5, 1995Assignee: E. I. Du Pont de Nemours and CompanyInventors: Robert A. Tessmer, Peter W. Uhlianuk, Ding Y. Chung
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Patent number: 5442039Abstract: Novel polycyanate and polycyanamide compositions containing one or more rodlike mesogenic moieties, when cured, result in products having improved properties.Type: GrantFiled: July 13, 1993Date of Patent: August 15, 1995Assignee: The Dow Chemical CompanyInventors: Robert E. Hefner, Jr., Jimmy D. Earls, Paul M. Puckett
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Patent number: 5428125Abstract: Novel polycyanate and polycyanamide compositions containing one or more rodlike mesogenic moieties, when cured, result in products having improved properties.Type: GrantFiled: June 17, 1994Date of Patent: June 27, 1995Assignee: The Dow Chemical CompanyInventors: Robert E. Hefner, Jr., Jimmy D. Earls, Paul M. Puckett
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Patent number: 5395911Abstract: A thermally curable mixture contains 10-70% by weight of reactive compounds, 0.05-2% by weight of at least one basic catalyst, and at least one solvent. The reactive compounds are consisting essentially of a first reactive compound and a second reactive compound at a molar ratio between 1:1 and 1:10. The first reactive compound is a formamide selected from the group consisting of hydroxyformamides, di-formamides and polyformamides, and the second reactive compound is at least one compound having an epoxy equivalent between 100 and 800 g KOH per mole epoxy group, selected from a group of aromatic di-glycidylethers and aromatic poly-glycidylethers. The basic catalyst is at least one chemical agent selected from the group consisting of tertiary ammonium salts, tertiary aromatic amines, and tertiary heterocyclic amines. The solvent is at least one chemical compound selected from the group consisting of aliphatic alcohols, ether alcohols, diether, and tertiary amides.Type: GrantFiled: July 19, 1993Date of Patent: March 7, 1995Assignee: Dainippon Ink and Chemicals, Inc.Inventors: Rainer B. Frings, Gerwald F. Grahe
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Patent number: 5374769Abstract: Novel polycyanate compositions containing one or more mesogenic moieties as lateral substituents are disclosed which provide improved processability relative to polycyanates containing one or more mesogenic moieties in the main chain of the molecule. Molecular level ordering of the resulting thermosets is maintained much similar to that found thermosets of polycyanates which have one or more mesogenic moieties in the main chain.Type: GrantFiled: December 24, 1992Date of Patent: December 20, 1994Assignee: The Dow Chemical CompanyInventors: Robert E. Hefner, Jr., Jimmy D. Earls
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Patent number: 5364923Abstract: The present invention relates to an organopolysiloxane graft epoxy resin comprising a reaction product of (A) an epoxy resin having at least two epoxy groups in its molecule and (B) an amino modified polyorganosiloxane. The compositions of the present invention are characterized by superior surface lubricity after curing, superior release properties, and superior water repellency. The present invention also relates to a method of making an organopolysiloxane graft epoxy resin.Type: GrantFiled: September 28, 1993Date of Patent: November 15, 1994Assignee: Dow Corning Toray Silicone Co., Ltd.Inventor: Ryozo Mikami
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Patent number: 5362822Abstract: An adduct is prepared by reacting (A) a compound containing at least one epoxy group per molecule, with (B) a compound containing at least one epoxide reactive group per molecule selected from the group consisting of phenolic, thiol, secondary amine and carboxyl; wherein (i) when compound (A) is a polyepoxide, compound (B) contains a single epoxide reactive group per molecule; (ii) when compound (A) is a monoepoxide it is a monoglycidyl ether and compound (B) contains at least two epoxide reactive groups per molecule; and (iii) at least one of components (A) and (B) contains a rodlike mesogenic moiety. These adducts are useful in the preparation of polyurethanes.Type: GrantFiled: January 3, 1994Date of Patent: November 8, 1994Assignee: The Dow Chemical CompanyInventor: Robert E. Hefner, Jr.
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Patent number: 5360887Abstract: A flame-retarded thermosetting resin composition is provided by blending about 5 to 45 mole % of a phenylcyanate having at least one halogen substituent at the ortho or para position relative to the cyanato group, and about 55 to 95 mole % of a halogen-free bis-4-phenylcyanate. A flame retardancy of V-O grade of UL94 is achieved in the thermoset resin of the composition without compromising dielectric, heat resistance, moisture absorption and other properties.Type: GrantFiled: July 28, 1993Date of Patent: November 1, 1994Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaishaInventors: Hidenari Tsunemi, Toshinobu Nakata, Koyoyuki Namura
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Patent number: 5358992Abstract: In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.Type: GrantFiled: February 26, 1993Date of Patent: October 25, 1994Assignee: Quantum Materials, Inc.Inventors: Stephen M. Dershem, Deborah L. Derfelt, Dennis B. Patterson
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Patent number: 5352762Abstract: A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.Type: GrantFiled: March 28, 1991Date of Patent: October 4, 1994Assignee: Hitachi, Ltd.Inventors: Akira Nagai, Shin Nishimura, Masahiro Suzuki, Masao Suzuki, Junichi Katagiri, Akio Takahashi, Akio Mukoh
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Patent number: 5344897Abstract: Liquid coating agent based on a polymer containing acetoacetate groups and a polyamine in the form of the corresponding aldimine or ketimine, the polymer containing acetoacetate groups being obtained by reaction of a polyepoxide with water, an amine or a hydroxycarboxylic acid and subsequent esterification or transesterification with acetoacetic acid. These liquid coating agents are particularly suitable as binders in two-component automobile repair fillers or as two-component primers.Type: GrantFiled: October 29, 1993Date of Patent: September 6, 1994Assignee: Hoechst AGInventors: Gerhard Brindoepke, Uwe Kubillus, Helmut Plum
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Patent number: 5334654Abstract: This invention relates to improved polyepoxide resins having enhanced physical and elastic properties. The polyepoxide resins comprise an polyepoxide resin based on a polyglycidyl ether of a phenolic type compound and an acrylate terminated urethane prepolymer. The improvement in the polyepoxide resin formulation comprises incorporating an aliphatic, aliphatic ether or ester component having monofunctional reactivity with an amine hydrogen and an amine curative having from 3 to 10, and preferably 3 to 5 epoxide reactive hydrogen atoms into the epoxy resin. The presence of the monofunctional and aliphatic amine reactive component along with the acrylate terminated urethane prepolymer results in an epoxy resin having the enhanced properties.Type: GrantFiled: May 3, 1993Date of Patent: August 2, 1994Assignee: Air Products and Chemicals, Inc.Inventors: William E. Starner, Susan G. Musselman
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Patent number: 5332785Abstract: A liquid coating composition based on a polymer containing acetoacetate groups and a polyamine in the form of the corresponding aldimine or ketimine, the polymer containing acetoacetate groups being obtained by reacting a polyepoxide containing hydroxyl groups, or a polyepoxide which is partially or completely reacted with monocarboxylic acids, with acetoacetic acid derivatives. These liquid coating compositions are suitable in particular as binders in two-component fillers for automotive refinishing or as two-component primers.Type: GrantFiled: March 29, 1993Date of Patent: July 26, 1994Assignee: Hoechst AktiengesellschaftInventor: Gerhard Brindoepke
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Patent number: 5296557Abstract: This invention relates to two-component curable hot-melt compositions comprising thermoplastic polyamide resins that are substantially free of piperazine-containing polyamines. In one preferred embodiment the polyamide resins are the reaction product of an acid component with an amine component, wherein the amine component consists essentially of about (i) 20 to 100 equivalent percent of one or more acyclic diamines selected from the group consisting of 2-methyl-1,5-pentanediamine, 1,3-pentanediamine, 1,3-propanediamine, 1,5-pentanediamine, 1,7-heptanediamine, 1,9-nonanediamine, methyl-1,9-nonanediamine, 1,2-propanediamine, and 2-methyl-1,2-diaminopropane, and (ii) about 0 to 80 equivalent percent of one or more polyamines selected from the group consisting of cyclic and acyclic polyamines other than those amines of (i). The compositions possess excellent heat resistance, flexibility, elasticity and resistance to solvents, including organic solvents and water.Type: GrantFiled: July 2, 1992Date of Patent: March 22, 1994Assignee: Union Camp CorporationInventor: Charles R. Frihart
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Patent number: 5248757Abstract: Compounds containing at least one cyanate group, at least one maleimide group and at least one rodlike mesogenic moiety are prepared by reacting one or more aminophenols containing one or more rodlike mesogenic moieties with a stoichiometric quantity of a maleic anhydride per amine group of said aminophenol and then cyanating the resulting phenolic functional maleimide.Type: GrantFiled: July 7, 1992Date of Patent: September 28, 1993Assignee: The Dow Chemical CompanyInventors: Robert E. Hefner, Jr., Jimmy D. Earls
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Patent number: 5248758Abstract: Compounds containing at least one cyanate group, at least one maleimide group and at least one rodlike mesogenic moiety are prepared by reacting one or more aminophenols containing one or more rodlike mesogenic moieties with a stoichiometric quantity of a maleic anhydride per amine group of said aminophenol and then cyanating the resulting phenolic functional maleimide.Type: GrantFiled: July 7, 1992Date of Patent: September 28, 1993Assignee: The Dow Chemical CompanyInventors: Robert E. Hefner, Jr., Jimmy D. Earls
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Patent number: 5235008Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more rodlike mesogenic moieties. These adducts are useful as epoxy resin curing agents.Type: GrantFiled: August 3, 1990Date of Patent: August 10, 1993Assignee: The Dow Chemical CompanyInventors: Robert E. Hefner, Jr., Jimmy D. Earls
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Patent number: 5212261Abstract: Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T.sub.g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.Type: GrantFiled: December 17, 1990Date of Patent: May 18, 1993Assignee: Henkel Research CorporationInventor: Thomas J. Stierman