Polymerizing In The Presence Of A Specified Material Other Than A Reactant Patents (Class 528/137)
  • Patent number: 11390708
    Abstract: The present invention has an object to provide a resin composition for fiber-reinforced composite materials that excels in rapid curability without impairing low viscosity and heat resistance. A two-component curable resin for fiber-reinforced composite materials is provided, which is configured of a base material including an epoxy resin (A) and a curing agent including an amine compound (B) selected from either norbornane diamine or triethylenetetramine and a phenol compound (C), and in which a mass ratio of the base material to the curing agent is within the range of from 90:10 to 70:30, and the phenol compound (C) includes a phenol compound including two or more phenolic hydroxyl groups and is contained at 5% by weight to 35% by weight in the curing agent. A fiber-reinforced composite material is obtained by mixing reinforcing fibers in the resin composition for fiber-reinforced composite materials.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: July 19, 2022
    Assignee: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Kyohei Kano, Yuichi Taniguchi
  • Patent number: 9425596
    Abstract: An improved wire connector is provided that allows for securing one, two, or more cables in an electrical box knockout hole. The wire connector body interior includes a central tab with a hinge for exerting pressure against at least a first/tab cable. The central tab also has a gripping portion for gripping the tab cable without cutting its sheathing. In preferred embodiments, the central tab further includes a multifunction tab member, such as a multifunction knob or multifunction bumpers, which provides inter alia a secondary spring function for applying added pressure on an inserted tab cable, especially when a second/wall cable is inserted. The wire connector body contains ribs on the inner wall facing the central tab gripping portion for gripping a wall cable without cutting its insulation. The wire connector body also contains a longitudinal slot for easy installation or removal from an electrical box.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: August 23, 2016
    Assignee: Thomas & Betts International Inc.
    Inventors: Alain Laverdiere, Yves Boucher
  • Patent number: 8557381
    Abstract: Resol beads are disclosed that are prepared in high yield by reaction of a phenol with an aldehyde, with a base as catalyst, a colloidal stabilizer, and optionally a surfactant. The resol beads have a variety of uses, and may be thermally treated and carbonized to obtain activated carbon beads.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: October 15, 2013
    Assignee: Eastman Chemical Company
    Inventors: Charles Edwan Sumner, Ramesh Chand Munjal, Ruairi Seosamh O'Meadhra, Chester Wayne Sink, Jerry Steven Fauver, Robert Melvin Schisla, Shriram Bagrodia, Spencer Erich Hochstetler, Tera Jill Hardin
  • Patent number: 8519083
    Abstract: The present invention relates to a process for producing an MEK-modified resorcinol-formalin resin, in which recovery and reuse of the specific raw materials (water, calcium chloride, and methyl ethyl ketone (MEK)), and methanol contained in formalin, are carried out in parallel. Using this closed-system recycle production method, a resorcinol-formalin resin aqueous solution can be obtained, wherein the resin aqueous solution has a reaction product concentration of from 30 to 80%, moderate flowability with a pH of 6 to 10, a calcium chloride concentration of 100 ppm or less, a peak area corresponding to a resorcinol monomer of from 3 to 9% to the entire peak area obtained by gel permeation chromatography analysis, and a peak area corresponding to resorcinol pentanuclear or higher nuclear bodies of from 30 to 55% to the entire peak.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: August 27, 2013
    Assignee: Hodogaya Chemical Co., Ltd.
    Inventors: Nobuo Kaifu, Hiroshi Nakaoka, Kaoru Abe
  • Publication number: 20130012678
    Abstract: Provided is a method for producing a porous material, wherein porosity can be controlled to 50% or higher by means of a freezing method, pore size can be controlled to 10 ?m to 300 ?m, and pore diameter distribution is uniform. The method is a method for producing a porous material, comprising freezing a mixture of water and a raw material comprising at least any of a ceramic material, a resin, a metal, and precursors thereof from a specific portion of the mixture to use ice crystals produced at the time as a pore source and then heat-treating a dry material obtained by removing the ice from the frozen material, wherein the mixture of a raw material and water or the frozen material comprises an antifreeze protein.
    Type: Application
    Filed: March 16, 2011
    Publication date: January 10, 2013
    Applicant: Nichirei Foods Inc.
    Inventors: Manabu Fukushima, Yuichi Yoshizawa, Norimitsu Murayama, Sakae Tsuda, Takeshi Koizumi, Toshifumi Inoue
  • Patent number: 8247072
    Abstract: Resol beads are disclosed that are prepared in high yield by reaction of a phenol with an aldehyde, with a base as catalyst, a colloidal stabilizer, and optionally a surfactant. The resol beads have a variety of uses, and may be thermally treated and carbonized to obtain activated carbon beads.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: August 21, 2012
    Assignee: Eastman Chemical Company
    Inventors: Charles Edwan Sumner, Jr., Ramesh Chand Munjal, Ruairi Seosamh O'Meadhra, Chester Wayne Sink, Jerry Steven Fauver, Robert Melvin Schisla, Jr., Shriram Bagrodia, Spencer Erich Hochstetler, Tera Jill Hardin
  • Patent number: 7994270
    Abstract: The present invention provides a method for producing a thermosetting resin having a benzoxazine ring, comprising the step of: reacting a bifunctional phenol compound, a diamine compound, and an aldehyde compound in a mixed solvent of an aromatic nonpolar solvent and an alcohol.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: August 9, 2011
    Assignee: Sekisui Chemical Co., Ltd
    Inventors: Tomoaki Katagiri, Yuji Eguchi
  • Publication number: 20110015341
    Abstract: A phenol-formaldehyde resin, which can be obtained by alkalinically catalyzed condensation of phenol and formaldehyde in the presence of at least one salt of inorganic acids and by neutralization by means of an inorganic or organic acid following the condensation, wherein the production takes place with the addition of at least one compound of the formula R1—(CH2)n—R2, in which R1 and R2, independently of one another, stand for —C(O)R, —COOR, —CN, or —NO2, and R represents H or CH3, and n has the value of 1 or 2. Also disclosed are the production of such resins and their use as binders for mineral-fiber-based insulating products.
    Type: Application
    Filed: January 21, 2008
    Publication date: January 20, 2011
    Applicant: Dynea Oy
    Inventors: Stefan Kowatsch, Karl Loidolt, Christoph Prock
  • Patent number: 7872088
    Abstract: Disclosed are binders including urea-extended phenol-formaldehyde alkaline resole resins to which melamine-containing resin has been added, and non-woven fiber compositions made therewith. The disclosed binders may be cured to low formaldehyde-emission and low trimethylamine-emission, water-resistant thermoset binders.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: January 18, 2011
    Assignee: Knauf Insulation GmbH
    Inventors: William S. Miller, Brian L. Swift, Scott L. Stillabower
  • Patent number: 7807748
    Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: October 5, 2010
    Assignee: Georgia-Pacific Chemicals LLC
    Inventors: Ramji Srinivasan, Kim Tutin, James Knight, Paul Baxter
  • Publication number: 20100210810
    Abstract: The present invention provides a method for producing a thermosetting resin having a benzoxazine ring, comprising the step of: reacting a bifunctional phenol compound, a diamine compound, and an aldehyde compound in a mixed solvent of an aromatic nonpolar solvent and an alcohol.
    Type: Application
    Filed: August 1, 2008
    Publication date: August 19, 2010
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Tomoaki Katagiri, Yuji Eguchi
  • Patent number: 7759448
    Abstract: Process including steps (a.) through (c.). Step (a.) involves providing a mixture of 41-47 parts by weight phenol component and 54-58 parts by weight formaldehyde. The phenol component in this step is approximately ? by weight para-phenylphenol and ? by weight phenol. Step (b.) involves adding 2-12 parts by weight previously manufactured phenolic resole resin to the mixture formed in step (a.). Step (c.) involves allowing the resulting mixture of phenol, formaldehyde, and phenolic resole resin to react, thereby producing a phenolic resin having a high molecular weight fraction of at least 10 weight-percent. Also, phenolic resole resin made by the process of described herein. Such phenolic resole resin has an average molecular weight that is at least 10% lower and a viscosity that is at least 10% lower than a comparable phenolic resole resin made by carrying out steps (a.) and (c.) in the absence of step (b.) as described herein.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: July 20, 2010
    Assignee: Honeywell International Inc.
    Inventor: Terence B. Walker
  • Patent number: 7741406
    Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: June 22, 2010
    Assignee: Georgia-Pacific Chemicals LLC
    Inventors: Ramji Srinivasan, Kim Tutin, James Knight, Paul Baxter
  • Patent number: 7718752
    Abstract: A process for producing a resorcinol-formalin resin containing no salts, having a moderate flowability when transformed into an aqueous solution, and having a reduced content of resorcinol monomer and a reduced content of resorcinol-formalin resin of resorcinol pentanuclear or higher nuclear bodies, the whole steps including an one-stage reaction and liquid-liquid distribution being conducted in the same reactor, which comprises adding resorcinol, an inorganic salt, and an organic solvent having a solubility parameter of 7.0 to 12.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: May 18, 2010
    Assignee: Hodogaya Chemical Co., Ltd.
    Inventors: Nobuo Kaifu, Hiroshi Nakaoka, Hisatoshi Koinuma
  • Patent number: 7718751
    Abstract: The present invention concerns a pre-mix for a syntactic phenolic foam composition; a syntactic phenolic foam composition; and a process for preparing the syntactic phenolic foam composition. The pre-mix comprises thermally expandable and/or expanded thermoplastic microspheres, the microspheres comprising a thermoplastic polymer shell made of a homopolymer or copolymer of 100 to 25, for example 93 to 40, parts by weight of a nitrile-containing, ethylenically unsaturated monomer, or a mixture thereof; and 0 to 75, for example 7 to 60, parts by weight of a non-nitrile-containing, ethylenically unsaturated monomer, or a mixture thereof; and a propellant, or a mixture thereof, trapped within the thermoplastic polymer shell; and one of either a highly reactive phenolic resole resin capable of fully crosslinking at temperatures between 15° C. and 60° C.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: May 18, 2010
    Assignee: Pyro Technologies Limited
    Inventor: Murray Orpin
  • Patent number: 7713315
    Abstract: The invention provides mineral oil distillates having a water content of less than 150 ppm and a conductivity of at least 50 pS/m, which comprise from 0.1 to 200 ppm of at least one alkylphenol-aldehyde resin and from 0.1 to 200 ppm of at least one nitrogen-containing polymer.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: May 11, 2010
    Assignee: Clariant Produkte (Deutschland) GmbH
    Inventors: Matthias Krull, Werner Reimann
  • Publication number: 20100086782
    Abstract: Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 ?m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.
    Type: Application
    Filed: October 12, 2007
    Publication date: April 8, 2010
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage
  • Publication number: 20100004356
    Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.
    Type: Application
    Filed: October 12, 2007
    Publication date: January 7, 2010
    Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimormura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
  • Patent number: 7589164
    Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.
    Type: Grant
    Filed: December 6, 2006
    Date of Patent: September 15, 2009
    Inventors: Raj B. Durairaj, Mark A. Lawrence
  • Patent number: 7378484
    Abstract: A phenolic resin that increases its toughness by polydimethylsiloxane and a process of preparing the same is provided. Polydimethylsiloxane is added as a coupling agent in a ?-glycidoxypropyltrimethoxysilane-modified phenolic resin to improve the compatibility between polydimethylsiloxane and the phenolic resin. Then, tetraethoxysilane is added to conduct hydrolysis condensation and obtain tougher and thermally stable phenolic resin.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: May 27, 2008
    Assignee: Chung Shan Institute of Science and Technology
    Inventors: Jeng-Chang Yang, Chen-Chi Martin Ma, Hon-Bin Chen, Chin-Yih Chen
  • Patent number: 7345136
    Abstract: Water-resistant, protein-based adhesive dispersion compositions and methods for preparing them are provided. The adhesive dispersions are prepared by copolymerizing a denatured vegetable protein, such as soy flour, that has been functionalized with methylol groups with one or more reactive comonomers, and preparing an acidic dispersion of the adhesive. The adhesive dispersions exhibit superior water resistance, and can be used to bond wood substrates, such as panels or laminate, or in the preparation of composite materials.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: March 18, 2008
    Assignees: Heartland Resource Technologies LLC, USDA
    Inventors: James M. Wescott, Charles R. Frihart
  • Publication number: 20080064284
    Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.
    Type: Application
    Filed: July 27, 2007
    Publication date: March 13, 2008
    Applicant: Georgia-Pacific Chemicals LLC
    Inventors: Ramji Srinivasan, Kim Tutin, James Knight, Paul Baxter
  • Patent number: 7321020
    Abstract: The invention relates to the polycondensation products produced by reaction of bisphenol residues from bisphenol production with an aldehyde in an acidic medium useful for the production of refractory molded bodies, of unmolded substances used in the refractory industry and, together with coating powder residues, as binding agents or binding agent components for the production of molded nonwoven fabric parts.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: January 22, 2008
    Assignee: Bakelite AG
    Inventor: Josef Suren
  • Patent number: 7196156
    Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: March 27, 2007
    Assignee: Indspec Chemical Corporation
    Inventors: Raj B. Durairaj, Mark A. Lawrence
  • Patent number: 7135539
    Abstract: The present invention relates to novel novolac resins obtained by coupling at least one aromatic compound (A) comprising at least two hydroxyl groups and at least one aldehyde (B) in the presence of an acid catalyst and in the presence of water and/or an organic solvent, followed by a step of alkylating the coupling resin thus obtained with at least one unconjugated diene (C), preferably containing no indene. These novolac resins are advantageously used in vulcanized and crosslinked elastomeric compositions since their viscosity, which is lower than that of the resins of the prior art, allows them to be handled easily. They are also used as adhesion promoters for improving the adhesion of rubber to reinforcing materials such as organic fibres made in particular of rayon, polyesters, polyamides or aramids, and metal cords made of steel, in particular brass steel or galvanized steel.
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: November 14, 2006
    Assignee: Schenectady International Inc.
    Inventors: Martine Cerf, Stéphane Fouquay, Isabelle Silberzan, Bonnie Stuck, Jean-Jacques Troslard
  • Patent number: 7041772
    Abstract: The present invention discloses a process for producing a benzoxazine resin which comprises the steps of reacting a phenol compound, an aldehyde compound and a primary amine in the presence of an organic solvent to synthesize a benzoxazine resin and removing generated condensation water and the organic solvent from a system under heating and a reduced pressure, wherein a pressure in the reaction system at the time of removal is set to 260 mmHg or higher.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: May 9, 2006
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teruki Aizawa, Yasuyuki Hirai, Syunichi Numata
  • Patent number: 6831146
    Abstract: A resin composition for wet friction materials contains as a main component a phenolic resin formed as a result of the reaction between phenols and aldehydes in the presence of a basic catalyst, and a particulate filler having a specific surface area of 35 to 410 m2/g as an additive. A wet friction material is formed using the resin composition for wet friction materials described above as a binder. The thus formed wet friction material exhibits a small initial rate of change in friction coefficient, a large positive gradient of &Dgr;&mgr;-V characteristic, and excellent durability.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: December 14, 2004
    Assignees: Sumitomo Bakelite Company Limited, NSK-Warner K.K.
    Inventors: Hiroshi Aiba, Masahiro Mori
  • Patent number: 6821530
    Abstract: The invention relates to methods of treating mixtures containing polymeric materials, e.g., collagen, to form a polymer that intercalates into the polymeric material. The treatment provides greater tensile strength to the mixture, among other advantages. The polymer is formed of a monomeric unit having at least one catechol group that is oxidized to a quinone upon polymerization.
    Type: Grant
    Filed: May 19, 2003
    Date of Patent: November 23, 2004
    Assignee: Shriners Hospitals for Children
    Inventors: Thomas J. Koob, Daniel J. Hernandez
  • Patent number: 6806343
    Abstract: A phenol-formaldehyde resole resin for use as a binder for glass fibers is acidified to a pH of 3 or less after base-catalyzed resinification. An increase in actual solids is observed compared with neutralized resin. Phenol-formaldehyde-urea-ammonia resins are surprisingly stable at pH 3 with desirable cure profiles.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: October 19, 2004
    Assignee: CertainTeed Corporation
    Inventor: Kathleen H. Coventry-Saylor
  • Patent number: 6770107
    Abstract: A curable resin composition comprises a poly(arylene ether), an acryloyl monomer, an allylic monomer, and an abrasive filler. The composition tolerates high filler contents, cures rapidly, and exhibits excellent toughness after curing. Useful articles prepared from the composition include grinding wheels and cut-off wheels having good wear characteristics.
    Type: Grant
    Filed: January 30, 2003
    Date of Patent: August 3, 2004
    Assignee: General Electric Company
    Inventors: Erich Otto Teutsch, Gary William Yeager, Kenneth Paul Zarnoch, Steven William Webb, Hua Guo
  • Patent number: 6749765
    Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: June 15, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Edward W. Rutter, Jr., Peter Trefonas, III, Edward K. Pavelchek
  • Patent number: 6730770
    Abstract: A phenol-formaldehyde resole resin for use as a binder for glass fibers is acidified with sulfamic acid to a pH of 3 or less after base-catalyzed resinification. An increase in actual solids observed compared with neutralized resin, reflecting a desired improvement in efficiency.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: May 4, 2004
    Assignee: CertainTeed Corporation
    Inventor: Kathleen H. Coventry-Saylor
  • Patent number: 6713591
    Abstract: This invention relates to an aromatic oligomer represented by the following formula (1): (A—F)n—A   (1) wherein A is a unit comprising (a) 30-90 wt % of a bicyclic or tricyclic aromatic compound and (b) 10-70 wt % of a phenol, F is methylene or a mixture of methylene and —CH2OCH2— and n is a number of 1-100. The aromatic oligomer is obtained by and reaction of a polycyclic aromatic compound such as naphthalene and benzothiophene, a phenol and formaldehyde compound in the presence of an acid catalyst. The aromatic oligomer is odorless and useful for various applications. In particular, when incorporated in rubber or resin, the aromatic oligomer can perform execellently as a tackifier in a wide temperature range or perform excellently as a vibration damping agent.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: March 30, 2004
    Assignee: Nippon Steel Chemicals Co., Ltd.
    Inventors: Toshihide Senzaki, Takahiro Imamura
  • Patent number: 6706845
    Abstract: Phenol formaldehyde resins that have low free formaldehyde when produced, that maintain their low free formaldehyde levels during storage, and that demonstrate low levels of formaldehyde emissions during processing, curing, and thereafter.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: March 16, 2004
    Assignee: Georgia-Pacific Resins, Inc.
    Inventors: W. Hayes Ingram, Ted M. McVay, Mary Letchas
  • Patent number: 6699958
    Abstract: The present invention is directed to compositions and a process leading to colorless or light colored aqueous phicinol-formaldelhyde resoles. Unlike previous technologies, these compositions lead to clear storage stable fast curing, high molecular weight resins. These materials are also capable of producing composite wood panels with superior water absorption and thickness swell test results when soaked in water. The invention essentially consists of an aqueous copolymer of phenol, formaldehyde, and a phenolic carboxylate (e.g. salicylic acid). Methylol phenols are formed under alkaline conditions in the presence of metal chelating agents. These are then condensed into a polymer under alkaline, neutral or acidic conditions. The finished aqueous polymer solution is then acidified to the desired pH using a benzoic acid or a phelnol-carboxylic acid.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: March 2, 2004
    Assignee: Borden Chemical, Inc.
    Inventor: William D. Detlefsen
  • Patent number: 6646094
    Abstract: A phenol-formaldehyde resole resin is prepared using a high level of catalyst at a polymerization temperature of about 63° C. The endpoint, measured by salt water tolerance, is selected so that the resulting resin has a water dilutability of 20:1 at neutral pH after storage for three weeks at a temperature of about 13° C., with a free phenol level of no more than 0.50 percent.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: November 11, 2003
    Assignees: CertainTeed Corporation, Borden Chemical, Inc.
    Inventors: Vinay Malhotra, Wayne Walliser, Susan G. Watson, Pierre C. Herault, Domenic Tessari, Philippe Espiard, Serge Tetart, Bruno Malhieuxe
  • Patent number: 6642345
    Abstract: Preparation process for a novolak aralkyl resin having excellent heat resistance and curing property by reacting 0.4 to 0.8 mol of an aralkyl compound based on one mol of the low molecular weight novolak containing 90% by weight or more of bi-nuclear novolak in the presence of an acidic catalyst, the process comprising at first melting the low molecular weight novolak, heating it up to a reaction temperature, then adding 0.001 to 0.05% by weight of the acidic catalyst to the total amount of the low molecular weight novolak and the aralkyl compound, then continuously adding the aralkyl compound for reaction, neutralizing the residual acidic catalyst after the completion of the reaction, a novolak aralkyl resin obtained by the preparation process and a novolak aralkyl resin composition containing said resin.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: November 4, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Teruo Yuasa, Hiroaki Narisawa, Masahiro Kaneko
  • Patent number: 6620901
    Abstract: A high-carbon-yield resole by reacting formaldehyde and excess phenol to an endpoint and then cross-linking with HMTA. Similar high-carbon-yield resoles result with addition of DBE-2, furfuryl alchol and furfural.
    Type: Grant
    Filed: December 14, 2001
    Date of Patent: September 16, 2003
    Assignee: Borden Chemical, Inc.
    Inventor: Jimmy Pingao Chen
  • Patent number: 6608162
    Abstract: The invention relates to formulations and methods of manufacturing spray-dried phenol-formaldehyde resin that contain highly reactive phenolic compounds that include resorcinol, alkyl resorcinols, meta-amino phenol or/and phloroglucinol. The powder resin contains 0.02 to 0.09 moles of the free (unreacted) highly reactive phenolic compound per 100 parts of the solids of the dried phenol-formaldehyde resin. The powder resin composition has fast curing property and desirable shelf life for manufacturing wood composite products.
    Type: Grant
    Filed: March 15, 2002
    Date of Patent: August 19, 2003
    Assignee: Borden Chemical, Inc.
    Inventors: Shui-Tung Chiu, Curtis Michael Shelast, Eric Kenneth Lam
  • Patent number: 6593391
    Abstract: A curable resin composition comprises a poly(arylene ether), an acryloyl monomer, an allylic monomer, and an abrasive filler. The composition tolerates high filler contents, cures rapidly, and exhibits excellent toughness after curing. Useful articles prepared from the composition include grinding wheels and cut-off wheels having good wear characteristics.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: July 15, 2003
    Assignee: General Electric Company
    Inventors: Erich Otto Teutsch, Gary William Yeager, Kenneth Paul Zarnoch, Steven William Webb, Hua Guo
  • Patent number: 6565960
    Abstract: The invention relates to methods of treating mixtures containing polymeric materials, e.g., collagen, to form a polymer that intercalates into the polymeric material. The treatment provides greater tensile strength to the mixture, among other advantages. The polymer is formed of a monomeric unit having at least one catechol group that is oxidized to a quinone upon polymerization.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: May 20, 2003
    Assignee: Shriners Hospital of Children
    Inventors: Thomas J. Koob, Daniel J. Hernandez
  • Patent number: 6541576
    Abstract: A catalyst curing system or hardener for resorcinolic resins, such as resorcinol-formaldehyde or phenol-resorcinol-formaldehyde resins including methylolurea. The methylolurea may be used in combination with oxazolidine in ratios ranging from 5:95 to 95:, by molar basis. The hardener crosslinks the resins which permits reduction or “fuming” of formaldehyde as well as control of gel times of the resulting adhesive. The hardener of the present invention if of particular utility in adhesives for use in the forest products industry.
    Type: Grant
    Filed: August 11, 1998
    Date of Patent: April 1, 2003
    Assignee: Borden Chemical, Inc.
    Inventors: Earl K. Phillips, Arthur J. Garwood, William D. Detlefsen
  • Patent number: 6482946
    Abstract: A high char yield polybenzoxazine is formed by mixing (i) a benzoxazine compound, (ii) a furan compound, (iii) a benzoxazine-furan compound or combinations thereof, wherein the mixture has a benzoxazine ring to furan ring ratio from about 0.001 to about 10 and then heating the mixture for a sufficient time to form the polybenzoxazine.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: November 19, 2002
    Assignee: Dow Global Technologies Inc.
    Inventors: Marvin L. Dettloff, Jerry E. White, Marty J. Null
  • Patent number: 6461717
    Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.
    Type: Grant
    Filed: April 24, 2000
    Date of Patent: October 8, 2002
    Assignee: Shipley Company, L.L.C.
    Inventors: Edward W. Rutter, Jr., Peter Trefonas, III, Edward K. Pavelchek
  • Publication number: 20020128423
    Abstract: Preparation process for a novolak aralkyl resin having excellent heat resistance and curing property by reacting 0.4 to 0.8 mol of an aralkyl compound based on one mol of the low molecular weight novolak containing 90% by weight or more of bi-nuclear novolak in the presence of an acidic catalyst, the process comprising at first melting the low molecular weight novolak, heating it up to a reaction temperature, then adding 0.001 to 0.05% by weight of the acidic catalyst to the total amount of the low molecular weight novolak and the aralkyl compound, then continuously adding the aralkyl compound for reaction, neutralizing the residual acidic catalyst after the completion of the reaction, a novolak aralkyl resin obtained by the preparation process and a novolak aralkyl resin composition containing said resin.
    Type: Application
    Filed: January 2, 2002
    Publication date: September 12, 2002
    Inventors: Teruo Yuasa, Hiroaki Narisawa, Masahiro Kaneko
  • Patent number: 6441122
    Abstract: Urea-extended phenol/formaldehyde alkaline resole binders suitable for fiberglass and having a high binding efficiency are disclosed. These binders are prepared by adding a minor quantity of melamine in an amount such that the binder solution contains no solid melamine particulates at room temperature. The resulting binders, when applied to fiberglass and cured, have a binding efficiency close to 100%, and further increase the recovery and physical properties of the binder-containing fiberglass product.
    Type: Grant
    Filed: January 5, 1995
    Date of Patent: August 27, 2002
    Assignee: Johns Manville International, Inc.
    Inventors: Gerard J. DeMott, Thomas John Taylor, Glenn S. Aspholm
  • Patent number: 6372878
    Abstract: Resols modified with organic phosphonic acids and/or phosphinic acids or their alkali and/or alkaline-earth metal salts obtained by reacting phenolic compounds and aldehyde in an alkaline medium in a molar ratio of the phenolic compounds to the aldehyde in a range from 1:0.3 to 1:6, with the reaction mixture comprising 0.1 to 10 percent by weight of at least one organic phosphonic acids and/or phosphinic acids or their alkali and/or alkaline-earth metal salts.
    Type: Grant
    Filed: July 17, 2000
    Date of Patent: April 16, 2002
    Assignee: Bakelite AG
    Inventors: Sonja Wernik, H. Juergen Dern, Athina Kerkaidou, Stephan Schroeter
  • Publication number: 20020007038
    Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values, improved etch rates, and can be formulated for both conformal and planar applications.
    Type: Application
    Filed: May 30, 2001
    Publication date: January 17, 2002
    Inventors: Rama Puligadda, Runhui Huang
  • Patent number: 6320013
    Abstract: A process for producing a modified phenolic resin, comprising heating a heavy oil or pitch of given average molecular weight and, per mol, calculated from the average molecular weight, of the heavy oil or pitch; 0.3 to 25 mol, in terms of formaldehyde, a formaldehyde compound and 0.5 to 50 mol of a phenol of the formula (I) (wherein R1 represents a linear or branched unsaturated hydrocarbon group having 1 to 2 unsaturated bonds and having 2 to 10 carbon atoms, p is 1 or 2, X represents an alkyl group having 1 to 5 carbon atoms, and q is 0 or 1) under stirring in the presence of an acid catalyst to thereby effect a polycondensation. The modified phenolic resin obtained by this process, as compared with the conventional modified phenolic resin produced from a heavy oil or pitch as a feedstock, has an extremely low softening point so as to be flowable at about room temperature and has also a low melt viscosity, thereby ensuring very excellent moldability.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: November 20, 2001
    Assignee: Kashima Oil Co., Ltd.
    Inventors: Mitsunori Takeda, Masamichi Sato
  • Patent number: 6268459
    Abstract: Method for preparing melamine from urea via a high-pressure process in which solid melamine is obtained by transferring the melamine melt coming from the reactor to a vessel where the melamine melt is cooled with an evaporating cooling medium. The melamine melt comes from the melamine reactor at a temperature between the melting point of melamine and 450° C. and is sprayed into a cooling vessel, via spraying means, and cooled by means of an evaporating cooling medium to form melamine powder. The cooling vessel has an ammonia environment with an increased ammonia pressure. The melamine melt is thereby converted into melamine powder having a temperature of between 200° C. and the solidification point of melamine. The melamine powder is then cooled to a temperature below 200° C. with the powder mechanically agitated and being cooled directly or indirectly, after which the ammonia pressure is released and, if necessary, the melamine powder is cooled further.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: July 31, 2001
    Assignee: DSM N.V.
    Inventors: Tjay T. Tjioe, Hubertus J. M. Slangen