Polymerizing In The Presence Of A Specified Material Other Than A Reactant Patents (Class 528/137)
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Patent number: 12084549Abstract: The present application is directed to methods for preparation of carbon materials. The carbon materials comprise enhanced electrochemical properties and find utility in any number of electrical devices, for example, as electrode material in ultracapacitors or batteries.Type: GrantFiled: August 25, 2023Date of Patent: September 10, 2024Assignee: Group 14 Technologies, Inc.Inventors: Katharine Geramita, Benjamin E. Kron, Henry R. Costantino, Aaron M. Feaver, Avery J. Sakshaug, Leah A. Thompkins, Alan Tzu-Yang Chang
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Patent number: 12006400Abstract: The present application is directed to methods for preparation of carbon materials. The carbon materials comprise enhanced electrochemical properties and find utility in any number of electrical devices, for example, as electrode material in ultracapacitors or batteries.Type: GrantFiled: April 18, 2023Date of Patent: June 11, 2024Assignee: GROUP14 TECHNOLOGIES, INC.Inventors: Katharine Geramita, Benjamin E. Kron, Henry R. Costantino, Aaron M. Feaver, Avery J. Sakshaug, Leah A. Thompkins, Alan Tzu-Yang Chang
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Patent number: 11390708Abstract: The present invention has an object to provide a resin composition for fiber-reinforced composite materials that excels in rapid curability without impairing low viscosity and heat resistance. A two-component curable resin for fiber-reinforced composite materials is provided, which is configured of a base material including an epoxy resin (A) and a curing agent including an amine compound (B) selected from either norbornane diamine or triethylenetetramine and a phenol compound (C), and in which a mass ratio of the base material to the curing agent is within the range of from 90:10 to 70:30, and the phenol compound (C) includes a phenol compound including two or more phenolic hydroxyl groups and is contained at 5% by weight to 35% by weight in the curing agent. A fiber-reinforced composite material is obtained by mixing reinforcing fibers in the resin composition for fiber-reinforced composite materials.Type: GrantFiled: February 25, 2019Date of Patent: July 19, 2022Assignee: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.Inventors: Kyohei Kano, Yuichi Taniguchi
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Patent number: 9425596Abstract: An improved wire connector is provided that allows for securing one, two, or more cables in an electrical box knockout hole. The wire connector body interior includes a central tab with a hinge for exerting pressure against at least a first/tab cable. The central tab also has a gripping portion for gripping the tab cable without cutting its sheathing. In preferred embodiments, the central tab further includes a multifunction tab member, such as a multifunction knob or multifunction bumpers, which provides inter alia a secondary spring function for applying added pressure on an inserted tab cable, especially when a second/wall cable is inserted. The wire connector body contains ribs on the inner wall facing the central tab gripping portion for gripping a wall cable without cutting its insulation. The wire connector body also contains a longitudinal slot for easy installation or removal from an electrical box.Type: GrantFiled: September 30, 2014Date of Patent: August 23, 2016Assignee: Thomas & Betts International Inc.Inventors: Alain Laverdiere, Yves Boucher
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Patent number: 8557381Abstract: Resol beads are disclosed that are prepared in high yield by reaction of a phenol with an aldehyde, with a base as catalyst, a colloidal stabilizer, and optionally a surfactant. The resol beads have a variety of uses, and may be thermally treated and carbonized to obtain activated carbon beads.Type: GrantFiled: July 3, 2012Date of Patent: October 15, 2013Assignee: Eastman Chemical CompanyInventors: Charles Edwan Sumner, Ramesh Chand Munjal, Ruairi Seosamh O'Meadhra, Chester Wayne Sink, Jerry Steven Fauver, Robert Melvin Schisla, Shriram Bagrodia, Spencer Erich Hochstetler, Tera Jill Hardin
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Patent number: 8519083Abstract: The present invention relates to a process for producing an MEK-modified resorcinol-formalin resin, in which recovery and reuse of the specific raw materials (water, calcium chloride, and methyl ethyl ketone (MEK)), and methanol contained in formalin, are carried out in parallel. Using this closed-system recycle production method, a resorcinol-formalin resin aqueous solution can be obtained, wherein the resin aqueous solution has a reaction product concentration of from 30 to 80%, moderate flowability with a pH of 6 to 10, a calcium chloride concentration of 100 ppm or less, a peak area corresponding to a resorcinol monomer of from 3 to 9% to the entire peak area obtained by gel permeation chromatography analysis, and a peak area corresponding to resorcinol pentanuclear or higher nuclear bodies of from 30 to 55% to the entire peak.Type: GrantFiled: September 27, 2007Date of Patent: August 27, 2013Assignee: Hodogaya Chemical Co., Ltd.Inventors: Nobuo Kaifu, Hiroshi Nakaoka, Kaoru Abe
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Publication number: 20130012678Abstract: Provided is a method for producing a porous material, wherein porosity can be controlled to 50% or higher by means of a freezing method, pore size can be controlled to 10 ?m to 300 ?m, and pore diameter distribution is uniform. The method is a method for producing a porous material, comprising freezing a mixture of water and a raw material comprising at least any of a ceramic material, a resin, a metal, and precursors thereof from a specific portion of the mixture to use ice crystals produced at the time as a pore source and then heat-treating a dry material obtained by removing the ice from the frozen material, wherein the mixture of a raw material and water or the frozen material comprises an antifreeze protein.Type: ApplicationFiled: March 16, 2011Publication date: January 10, 2013Applicant: Nichirei Foods Inc.Inventors: Manabu Fukushima, Yuichi Yoshizawa, Norimitsu Murayama, Sakae Tsuda, Takeshi Koizumi, Toshifumi Inoue
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Patent number: 8247072Abstract: Resol beads are disclosed that are prepared in high yield by reaction of a phenol with an aldehyde, with a base as catalyst, a colloidal stabilizer, and optionally a surfactant. The resol beads have a variety of uses, and may be thermally treated and carbonized to obtain activated carbon beads.Type: GrantFiled: November 8, 2006Date of Patent: August 21, 2012Assignee: Eastman Chemical CompanyInventors: Charles Edwan Sumner, Jr., Ramesh Chand Munjal, Ruairi Seosamh O'Meadhra, Chester Wayne Sink, Jerry Steven Fauver, Robert Melvin Schisla, Jr., Shriram Bagrodia, Spencer Erich Hochstetler, Tera Jill Hardin
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Patent number: 7994270Abstract: The present invention provides a method for producing a thermosetting resin having a benzoxazine ring, comprising the step of: reacting a bifunctional phenol compound, a diamine compound, and an aldehyde compound in a mixed solvent of an aromatic nonpolar solvent and an alcohol.Type: GrantFiled: August 1, 2008Date of Patent: August 9, 2011Assignee: Sekisui Chemical Co., LtdInventors: Tomoaki Katagiri, Yuji Eguchi
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Publication number: 20110015341Abstract: A phenol-formaldehyde resin, which can be obtained by alkalinically catalyzed condensation of phenol and formaldehyde in the presence of at least one salt of inorganic acids and by neutralization by means of an inorganic or organic acid following the condensation, wherein the production takes place with the addition of at least one compound of the formula R1—(CH2)n—R2, in which R1 and R2, independently of one another, stand for —C(O)R, —COOR, —CN, or —NO2, and R represents H or CH3, and n has the value of 1 or 2. Also disclosed are the production of such resins and their use as binders for mineral-fiber-based insulating products.Type: ApplicationFiled: January 21, 2008Publication date: January 20, 2011Applicant: Dynea OyInventors: Stefan Kowatsch, Karl Loidolt, Christoph Prock
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Patent number: 7872088Abstract: Disclosed are binders including urea-extended phenol-formaldehyde alkaline resole resins to which melamine-containing resin has been added, and non-woven fiber compositions made therewith. The disclosed binders may be cured to low formaldehyde-emission and low trimethylamine-emission, water-resistant thermoset binders.Type: GrantFiled: February 15, 2007Date of Patent: January 18, 2011Assignee: Knauf Insulation GmbHInventors: William S. Miller, Brian L. Swift, Scott L. Stillabower
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Patent number: 7807748Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.Type: GrantFiled: July 27, 2007Date of Patent: October 5, 2010Assignee: Georgia-Pacific Chemicals LLCInventors: Ramji Srinivasan, Kim Tutin, James Knight, Paul Baxter
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Publication number: 20100210810Abstract: The present invention provides a method for producing a thermosetting resin having a benzoxazine ring, comprising the step of: reacting a bifunctional phenol compound, a diamine compound, and an aldehyde compound in a mixed solvent of an aromatic nonpolar solvent and an alcohol.Type: ApplicationFiled: August 1, 2008Publication date: August 19, 2010Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Tomoaki Katagiri, Yuji Eguchi
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Patent number: 7759448Abstract: Process including steps (a.) through (c.). Step (a.) involves providing a mixture of 41-47 parts by weight phenol component and 54-58 parts by weight formaldehyde. The phenol component in this step is approximately ? by weight para-phenylphenol and ? by weight phenol. Step (b.) involves adding 2-12 parts by weight previously manufactured phenolic resole resin to the mixture formed in step (a.). Step (c.) involves allowing the resulting mixture of phenol, formaldehyde, and phenolic resole resin to react, thereby producing a phenolic resin having a high molecular weight fraction of at least 10 weight-percent. Also, phenolic resole resin made by the process of described herein. Such phenolic resole resin has an average molecular weight that is at least 10% lower and a viscosity that is at least 10% lower than a comparable phenolic resole resin made by carrying out steps (a.) and (c.) in the absence of step (b.) as described herein.Type: GrantFiled: October 6, 2006Date of Patent: July 20, 2010Assignee: Honeywell International Inc.Inventor: Terence B. Walker
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Patent number: 7741406Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.Type: GrantFiled: September 13, 2006Date of Patent: June 22, 2010Assignee: Georgia-Pacific Chemicals LLCInventors: Ramji Srinivasan, Kim Tutin, James Knight, Paul Baxter
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Patent number: 7718751Abstract: The present invention concerns a pre-mix for a syntactic phenolic foam composition; a syntactic phenolic foam composition; and a process for preparing the syntactic phenolic foam composition. The pre-mix comprises thermally expandable and/or expanded thermoplastic microspheres, the microspheres comprising a thermoplastic polymer shell made of a homopolymer or copolymer of 100 to 25, for example 93 to 40, parts by weight of a nitrile-containing, ethylenically unsaturated monomer, or a mixture thereof; and 0 to 75, for example 7 to 60, parts by weight of a non-nitrile-containing, ethylenically unsaturated monomer, or a mixture thereof; and a propellant, or a mixture thereof, trapped within the thermoplastic polymer shell; and one of either a highly reactive phenolic resole resin capable of fully crosslinking at temperatures between 15° C. and 60° C.Type: GrantFiled: March 15, 2006Date of Patent: May 18, 2010Assignee: Pyro Technologies LimitedInventor: Murray Orpin
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Patent number: 7718752Abstract: A process for producing a resorcinol-formalin resin containing no salts, having a moderate flowability when transformed into an aqueous solution, and having a reduced content of resorcinol monomer and a reduced content of resorcinol-formalin resin of resorcinol pentanuclear or higher nuclear bodies, the whole steps including an one-stage reaction and liquid-liquid distribution being conducted in the same reactor, which comprises adding resorcinol, an inorganic salt, and an organic solvent having a solubility parameter of 7.0 to 12.Type: GrantFiled: October 6, 2004Date of Patent: May 18, 2010Assignee: Hodogaya Chemical Co., Ltd.Inventors: Nobuo Kaifu, Hiroshi Nakaoka, Hisatoshi Koinuma
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Patent number: 7713315Abstract: The invention provides mineral oil distillates having a water content of less than 150 ppm and a conductivity of at least 50 pS/m, which comprise from 0.1 to 200 ppm of at least one alkylphenol-aldehyde resin and from 0.1 to 200 ppm of at least one nitrogen-containing polymer.Type: GrantFiled: July 28, 2006Date of Patent: May 11, 2010Assignee: Clariant Produkte (Deutschland) GmbHInventors: Matthias Krull, Werner Reimann
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Publication number: 20100086782Abstract: Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 ?m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.Type: ApplicationFiled: October 12, 2007Publication date: April 8, 2010Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage
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Publication number: 20100004356Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.Type: ApplicationFiled: October 12, 2007Publication date: January 7, 2010Inventors: Naoto Yoshinaga, Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimormura, Yoshimi Murage, Niro Shiomi, Yoshinobu Kodani, Takaomi Ikeda
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Patent number: 7589164Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.Type: GrantFiled: December 6, 2006Date of Patent: September 15, 2009Inventors: Raj B. Durairaj, Mark A. Lawrence
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Patent number: 7378484Abstract: A phenolic resin that increases its toughness by polydimethylsiloxane and a process of preparing the same is provided. Polydimethylsiloxane is added as a coupling agent in a ?-glycidoxypropyltrimethoxysilane-modified phenolic resin to improve the compatibility between polydimethylsiloxane and the phenolic resin. Then, tetraethoxysilane is added to conduct hydrolysis condensation and obtain tougher and thermally stable phenolic resin.Type: GrantFiled: March 31, 2005Date of Patent: May 27, 2008Assignee: Chung Shan Institute of Science and TechnologyInventors: Jeng-Chang Yang, Chen-Chi Martin Ma, Hon-Bin Chen, Chin-Yih Chen
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Patent number: 7345136Abstract: Water-resistant, protein-based adhesive dispersion compositions and methods for preparing them are provided. The adhesive dispersions are prepared by copolymerizing a denatured vegetable protein, such as soy flour, that has been functionalized with methylol groups with one or more reactive comonomers, and preparing an acidic dispersion of the adhesive. The adhesive dispersions exhibit superior water resistance, and can be used to bond wood substrates, such as panels or laminate, or in the preparation of composite materials.Type: GrantFiled: April 4, 2005Date of Patent: March 18, 2008Assignees: Heartland Resource Technologies LLC, USDAInventors: James M. Wescott, Charles R. Frihart
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Publication number: 20080064284Abstract: A phenol-formaldehyde resin, having a low concentration of tetradimer, making the resin suitable for preparing a binder composition for making non-woven fiber products, such as fiberglass insulation, prepared by reacting phenol and formaldehyde in the presence of a sulfite source.Type: ApplicationFiled: July 27, 2007Publication date: March 13, 2008Applicant: Georgia-Pacific Chemicals LLCInventors: Ramji Srinivasan, Kim Tutin, James Knight, Paul Baxter
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Patent number: 7321020Abstract: The invention relates to the polycondensation products produced by reaction of bisphenol residues from bisphenol production with an aldehyde in an acidic medium useful for the production of refractory molded bodies, of unmolded substances used in the refractory industry and, together with coating powder residues, as binding agents or binding agent components for the production of molded nonwoven fabric parts.Type: GrantFiled: July 10, 2003Date of Patent: January 22, 2008Assignee: Bakelite AGInventor: Josef Suren
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Patent number: 7196156Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.Type: GrantFiled: December 12, 2003Date of Patent: March 27, 2007Assignee: Indspec Chemical CorporationInventors: Raj B. Durairaj, Mark A. Lawrence
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Patent number: 7135539Abstract: The present invention relates to novel novolac resins obtained by coupling at least one aromatic compound (A) comprising at least two hydroxyl groups and at least one aldehyde (B) in the presence of an acid catalyst and in the presence of water and/or an organic solvent, followed by a step of alkylating the coupling resin thus obtained with at least one unconjugated diene (C), preferably containing no indene. These novolac resins are advantageously used in vulcanized and crosslinked elastomeric compositions since their viscosity, which is lower than that of the resins of the prior art, allows them to be handled easily. They are also used as adhesion promoters for improving the adhesion of rubber to reinforcing materials such as organic fibres made in particular of rayon, polyesters, polyamides or aramids, and metal cords made of steel, in particular brass steel or galvanized steel.Type: GrantFiled: March 7, 2003Date of Patent: November 14, 2006Assignee: Schenectady International Inc.Inventors: Martine Cerf, Stéphane Fouquay, Isabelle Silberzan, Bonnie Stuck, Jean-Jacques Troslard
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Patent number: 7041772Abstract: The present invention discloses a process for producing a benzoxazine resin which comprises the steps of reacting a phenol compound, an aldehyde compound and a primary amine in the presence of an organic solvent to synthesize a benzoxazine resin and removing generated condensation water and the organic solvent from a system under heating and a reduced pressure, wherein a pressure in the reaction system at the time of removal is set to 260 mmHg or higher.Type: GrantFiled: March 12, 2002Date of Patent: May 9, 2006Assignee: Hitachi Chemical Co., Ltd.Inventors: Teruki Aizawa, Yasuyuki Hirai, Syunichi Numata
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Patent number: 6831146Abstract: A resin composition for wet friction materials contains as a main component a phenolic resin formed as a result of the reaction between phenols and aldehydes in the presence of a basic catalyst, and a particulate filler having a specific surface area of 35 to 410 m2/g as an additive. A wet friction material is formed using the resin composition for wet friction materials described above as a binder. The thus formed wet friction material exhibits a small initial rate of change in friction coefficient, a large positive gradient of &Dgr;&mgr;-V characteristic, and excellent durability.Type: GrantFiled: March 31, 2003Date of Patent: December 14, 2004Assignees: Sumitomo Bakelite Company Limited, NSK-Warner K.K.Inventors: Hiroshi Aiba, Masahiro Mori
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Patent number: 6821530Abstract: The invention relates to methods of treating mixtures containing polymeric materials, e.g., collagen, to form a polymer that intercalates into the polymeric material. The treatment provides greater tensile strength to the mixture, among other advantages. The polymer is formed of a monomeric unit having at least one catechol group that is oxidized to a quinone upon polymerization.Type: GrantFiled: May 19, 2003Date of Patent: November 23, 2004Assignee: Shriners Hospitals for ChildrenInventors: Thomas J. Koob, Daniel J. Hernandez
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Patent number: 6806343Abstract: A phenol-formaldehyde resole resin for use as a binder for glass fibers is acidified to a pH of 3 or less after base-catalyzed resinification. An increase in actual solids is observed compared with neutralized resin. Phenol-formaldehyde-urea-ammonia resins are surprisingly stable at pH 3 with desirable cure profiles.Type: GrantFiled: May 31, 2002Date of Patent: October 19, 2004Assignee: CertainTeed CorporationInventor: Kathleen H. Coventry-Saylor
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Patent number: 6770107Abstract: A curable resin composition comprises a poly(arylene ether), an acryloyl monomer, an allylic monomer, and an abrasive filler. The composition tolerates high filler contents, cures rapidly, and exhibits excellent toughness after curing. Useful articles prepared from the composition include grinding wheels and cut-off wheels having good wear characteristics.Type: GrantFiled: January 30, 2003Date of Patent: August 3, 2004Assignee: General Electric CompanyInventors: Erich Otto Teutsch, Gary William Yeager, Kenneth Paul Zarnoch, Steven William Webb, Hua Guo
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Patent number: 6749765Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.Type: GrantFiled: March 27, 2002Date of Patent: June 15, 2004Assignee: Shipley Company, L.L.C.Inventors: Edward W. Rutter, Jr., Peter Trefonas, III, Edward K. Pavelchek
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Patent number: 6730770Abstract: A phenol-formaldehyde resole resin for use as a binder for glass fibers is acidified with sulfamic acid to a pH of 3 or less after base-catalyzed resinification. An increase in actual solids observed compared with neutralized resin, reflecting a desired improvement in efficiency.Type: GrantFiled: May 31, 2002Date of Patent: May 4, 2004Assignee: CertainTeed CorporationInventor: Kathleen H. Coventry-Saylor
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Patent number: 6713591Abstract: This invention relates to an aromatic oligomer represented by the following formula (1): (A—F)n—A (1) wherein A is a unit comprising (a) 30-90 wt % of a bicyclic or tricyclic aromatic compound and (b) 10-70 wt % of a phenol, F is methylene or a mixture of methylene and —CH2OCH2— and n is a number of 1-100. The aromatic oligomer is obtained by and reaction of a polycyclic aromatic compound such as naphthalene and benzothiophene, a phenol and formaldehyde compound in the presence of an acid catalyst. The aromatic oligomer is odorless and useful for various applications. In particular, when incorporated in rubber or resin, the aromatic oligomer can perform execellently as a tackifier in a wide temperature range or perform excellently as a vibration damping agent.Type: GrantFiled: March 5, 2002Date of Patent: March 30, 2004Assignee: Nippon Steel Chemicals Co., Ltd.Inventors: Toshihide Senzaki, Takahiro Imamura
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Patent number: 6706845Abstract: Phenol formaldehyde resins that have low free formaldehyde when produced, that maintain their low free formaldehyde levels during storage, and that demonstrate low levels of formaldehyde emissions during processing, curing, and thereafter.Type: GrantFiled: November 21, 2001Date of Patent: March 16, 2004Assignee: Georgia-Pacific Resins, Inc.Inventors: W. Hayes Ingram, Ted M. McVay, Mary Letchas
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Patent number: 6699958Abstract: The present invention is directed to compositions and a process leading to colorless or light colored aqueous phicinol-formaldelhyde resoles. Unlike previous technologies, these compositions lead to clear storage stable fast curing, high molecular weight resins. These materials are also capable of producing composite wood panels with superior water absorption and thickness swell test results when soaked in water. The invention essentially consists of an aqueous copolymer of phenol, formaldehyde, and a phenolic carboxylate (e.g. salicylic acid). Methylol phenols are formed under alkaline conditions in the presence of metal chelating agents. These are then condensed into a polymer under alkaline, neutral or acidic conditions. The finished aqueous polymer solution is then acidified to the desired pH using a benzoic acid or a phelnol-carboxylic acid.Type: GrantFiled: February 13, 2003Date of Patent: March 2, 2004Assignee: Borden Chemical, Inc.Inventor: William D. Detlefsen
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Patent number: 6646094Abstract: A phenol-formaldehyde resole resin is prepared using a high level of catalyst at a polymerization temperature of about 63° C. The endpoint, measured by salt water tolerance, is selected so that the resulting resin has a water dilutability of 20:1 at neutral pH after storage for three weeks at a temperature of about 13° C., with a free phenol level of no more than 0.50 percent.Type: GrantFiled: December 17, 2001Date of Patent: November 11, 2003Assignees: CertainTeed Corporation, Borden Chemical, Inc.Inventors: Vinay Malhotra, Wayne Walliser, Susan G. Watson, Pierre C. Herault, Domenic Tessari, Philippe Espiard, Serge Tetart, Bruno Malhieuxe
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Patent number: 6642345Abstract: Preparation process for a novolak aralkyl resin having excellent heat resistance and curing property by reacting 0.4 to 0.8 mol of an aralkyl compound based on one mol of the low molecular weight novolak containing 90% by weight or more of bi-nuclear novolak in the presence of an acidic catalyst, the process comprising at first melting the low molecular weight novolak, heating it up to a reaction temperature, then adding 0.001 to 0.05% by weight of the acidic catalyst to the total amount of the low molecular weight novolak and the aralkyl compound, then continuously adding the aralkyl compound for reaction, neutralizing the residual acidic catalyst after the completion of the reaction, a novolak aralkyl resin obtained by the preparation process and a novolak aralkyl resin composition containing said resin.Type: GrantFiled: January 2, 2002Date of Patent: November 4, 2003Assignee: Mitsui Chemicals, Inc.Inventors: Teruo Yuasa, Hiroaki Narisawa, Masahiro Kaneko
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Patent number: 6620901Abstract: A high-carbon-yield resole by reacting formaldehyde and excess phenol to an endpoint and then cross-linking with HMTA. Similar high-carbon-yield resoles result with addition of DBE-2, furfuryl alchol and furfural.Type: GrantFiled: December 14, 2001Date of Patent: September 16, 2003Assignee: Borden Chemical, Inc.Inventor: Jimmy Pingao Chen
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Patent number: 6608162Abstract: The invention relates to formulations and methods of manufacturing spray-dried phenol-formaldehyde resin that contain highly reactive phenolic compounds that include resorcinol, alkyl resorcinols, meta-amino phenol or/and phloroglucinol. The powder resin contains 0.02 to 0.09 moles of the free (unreacted) highly reactive phenolic compound per 100 parts of the solids of the dried phenol-formaldehyde resin. The powder resin composition has fast curing property and desirable shelf life for manufacturing wood composite products.Type: GrantFiled: March 15, 2002Date of Patent: August 19, 2003Assignee: Borden Chemical, Inc.Inventors: Shui-Tung Chiu, Curtis Michael Shelast, Eric Kenneth Lam
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Patent number: 6593391Abstract: A curable resin composition comprises a poly(arylene ether), an acryloyl monomer, an allylic monomer, and an abrasive filler. The composition tolerates high filler contents, cures rapidly, and exhibits excellent toughness after curing. Useful articles prepared from the composition include grinding wheels and cut-off wheels having good wear characteristics.Type: GrantFiled: March 27, 2001Date of Patent: July 15, 2003Assignee: General Electric CompanyInventors: Erich Otto Teutsch, Gary William Yeager, Kenneth Paul Zarnoch, Steven William Webb, Hua Guo
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Patent number: 6565960Abstract: The invention relates to methods of treating mixtures containing polymeric materials, e.g., collagen, to form a polymer that intercalates into the polymeric material. The treatment provides greater tensile strength to the mixture, among other advantages. The polymer is formed of a monomeric unit having at least one catechol group that is oxidized to a quinone upon polymerization.Type: GrantFiled: June 1, 2001Date of Patent: May 20, 2003Assignee: Shriners Hospital of ChildrenInventors: Thomas J. Koob, Daniel J. Hernandez
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Patent number: 6541576Abstract: A catalyst curing system or hardener for resorcinolic resins, such as resorcinol-formaldehyde or phenol-resorcinol-formaldehyde resins including methylolurea. The methylolurea may be used in combination with oxazolidine in ratios ranging from 5:95 to 95:, by molar basis. The hardener crosslinks the resins which permits reduction or “fuming” of formaldehyde as well as control of gel times of the resulting adhesive. The hardener of the present invention if of particular utility in adhesives for use in the forest products industry.Type: GrantFiled: August 11, 1998Date of Patent: April 1, 2003Assignee: Borden Chemical, Inc.Inventors: Earl K. Phillips, Arthur J. Garwood, William D. Detlefsen
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Patent number: 6482946Abstract: A high char yield polybenzoxazine is formed by mixing (i) a benzoxazine compound, (ii) a furan compound, (iii) a benzoxazine-furan compound or combinations thereof, wherein the mixture has a benzoxazine ring to furan ring ratio from about 0.001 to about 10 and then heating the mixture for a sufficient time to form the polybenzoxazine.Type: GrantFiled: November 3, 2000Date of Patent: November 19, 2002Assignee: Dow Global Technologies Inc.Inventors: Marvin L. Dettloff, Jerry E. White, Marty J. Null
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Patent number: 6461717Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.Type: GrantFiled: April 24, 2000Date of Patent: October 8, 2002Assignee: Shipley Company, L.L.C.Inventors: Edward W. Rutter, Jr., Peter Trefonas, III, Edward K. Pavelchek
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Publication number: 20020128423Abstract: Preparation process for a novolak aralkyl resin having excellent heat resistance and curing property by reacting 0.4 to 0.8 mol of an aralkyl compound based on one mol of the low molecular weight novolak containing 90% by weight or more of bi-nuclear novolak in the presence of an acidic catalyst, the process comprising at first melting the low molecular weight novolak, heating it up to a reaction temperature, then adding 0.001 to 0.05% by weight of the acidic catalyst to the total amount of the low molecular weight novolak and the aralkyl compound, then continuously adding the aralkyl compound for reaction, neutralizing the residual acidic catalyst after the completion of the reaction, a novolak aralkyl resin obtained by the preparation process and a novolak aralkyl resin composition containing said resin.Type: ApplicationFiled: January 2, 2002Publication date: September 12, 2002Inventors: Teruo Yuasa, Hiroaki Narisawa, Masahiro Kaneko
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Patent number: 6441122Abstract: Urea-extended phenol/formaldehyde alkaline resole binders suitable for fiberglass and having a high binding efficiency are disclosed. These binders are prepared by adding a minor quantity of melamine in an amount such that the binder solution contains no solid melamine particulates at room temperature. The resulting binders, when applied to fiberglass and cured, have a binding efficiency close to 100%, and further increase the recovery and physical properties of the binder-containing fiberglass product.Type: GrantFiled: January 5, 1995Date of Patent: August 27, 2002Assignee: Johns Manville International, Inc.Inventors: Gerard J. DeMott, Thomas John Taylor, Glenn S. Aspholm
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Patent number: 6372878Abstract: Resols modified with organic phosphonic acids and/or phosphinic acids or their alkali and/or alkaline-earth metal salts obtained by reacting phenolic compounds and aldehyde in an alkaline medium in a molar ratio of the phenolic compounds to the aldehyde in a range from 1:0.3 to 1:6, with the reaction mixture comprising 0.1 to 10 percent by weight of at least one organic phosphonic acids and/or phosphinic acids or their alkali and/or alkaline-earth metal salts.Type: GrantFiled: July 17, 2000Date of Patent: April 16, 2002Assignee: Bakelite AGInventors: Sonja Wernik, H. Juergen Dern, Athina Kerkaidou, Stephan Schroeter
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Publication number: 20020007038Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values, improved etch rates, and can be formulated for both conformal and planar applications.Type: ApplicationFiled: May 30, 2001Publication date: January 17, 2002Inventors: Rama Puligadda, Runhui Huang