Abstract: In one embodiment, a tool, comprising: a tool stationary portion comprising a nozzle and a film gate; and a tool movable portion comprising a shut off pin opposite the nozzle and the film gate; wherein the shut off pin prevents polymer melt in the nozzle from leaking into a cavity of the tool after injection of polymer into the tool.

Abstract: The polyimide precursor composition of the present invention is characterized in comprising a polyimide precursor having a structure formed by reacting a diamine component (A) containing a fluorine-containing aromatic diamine (a1) represented by the following chemical formula (I) (in the formula (I), R1 and R2 are each independently selected from —H, —(CF2)n—CF3, and —O(CF2)n—CF3 (n is an integer of 0 or more and 7 or less), and at least one of R1 and R2 is a fluorine-containing group) and trans-1,4-cyclohexyldiamine (a2) with an acid dianhydride component (B) containing an aliphatic tetracarboxylic dianhydride (b1) and an aromatic tetracarboxylic dianhydride (b2). Use of the composition of the present invention provides a polyimide film and a transparent flexible film having high transparency, low thermal expansion properties, low birefringent properties, and high heat resistance.

Abstract: Disclosed herein are methods and compositions of polycarbonate compositions having, among other characteristics, improved thermal dimensional stability, hydrolytic stability and high refractive index. The resulting polycarbonate copolymer composition, comprising a polycarbonate and a polysulfone, can be used in the manufacture of articles for optical applications. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Abstract: A modified maleimide oligomer is disclosed. The modified maleimide oligomer is made by performing a reaction of a compound having a barbituric acid structure, a free radical capture, and a compound having a maleimide structure. A composition for a battery is also disclosed. The composition includes the modified maleimide oligomer.

Abstract: A polyamide-imide resin insulating paint according to the present invention includes polyamide-imide resin containing no halogen element in its molecular chain which is dissolved in a polar solvent, in which the polyamide-imide resin contains an aromatic diisocyanate component (A) having three or more benzene rings or an aromatic diamine component (E) having three or more benzene rings in a monomer, and a ratio M/N between a molecular weight (M) of the polyamide-imide resin per repeat unit and an average number (N) of amide groups and imide groups is equal to or more than 200.

Abstract: An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250° C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure.

Abstract: The present invention relates generally to mercaptofunctional high ?? EO chromophores and EO polymers, and particularly to mercaptofunctional high ?? EO chromophores and EO polymers useful for making electro-optical devices and systems. Mercaptofunctional high ?? EO chromophores are covalently bonded to poly(imido sulfide) polymers producing high Tg, low optical loss, covalently bonded, high ?? EO chromophore containing polymers. Methods of synthesizing these EO materials using mild polymerization conditions are also described.

Abstract: A polyimide film is effectively formed on a complicated surface. The polyimide film is formed by reacting, on the surface, diamine monomer and tetracarboxylic acid dianhydride monomer both of which are dissolved within carbon dioxide in a supercritical states, together with a polyamic acid resulting from a reaction between the diamine monomer and the tetracarboxylic acid dianhydride reached to the surface.

Abstract: A method for making polyamide is described. More particularly, a method for making a polyamide from at least one diacid and one diamine, that includes a step of concentrating an aqueous solution of diacid and diamine salt up to a salt weight concentration higher than 85%, and a polymerization step up to a desired polymerization degree is described.

Abstract: A method for the purification of aromatic polyether polymers prepared by a halide displacement polymerization process comprises adsorbing the catalyst with an alkali metal halide to form an adsorbent component and then removing the adsorbent component. Mixtures resulting from this method are also discussed.

Abstract: The present invention provides an optical film exhibiting wavelength dispersion such that a retardation value is smaller on the shorter wavelength side, and capable of being also formed comparatively thinly. The optical film of the present invention is an optical film including a polyimide-based polymer represented by the following general formula (I). In the formula (I), m is 40% by mol or more and 100% by mol or less. R1 and R2 each independently denote a substituent having a carbon-carbon double bond or a triple bond. A, A?, B, B?, E, G, and H each denote a substituent, and small letters corresponding to these alphabets denote substitution number thereof. X and Y each independently denote bond part such as a covalent bond. The substituents having a carbon-carbon double bond or a triple bond represented by R1 and R2 are a substituted or unsubstituted aryl group, a substituted or unsubstituted vinyl group, and a substituted or unsubstituted ethynyl group.

Abstract: The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices.

Abstract: A method of manufacture of a bis(phthalimide) composition includes reacting, in the presence of a solvent and a catalytically active amount of an imidization catalyst selected from quaternary ammonium salts, quaternary phosphonium salts, and combinations thereof, a substituted phthalic anhydride with an organic diamine, wherein conversion to the bis(phthalimide) is 99% complete in less than 6 hours.

Abstract: The present invention provides a carbon black-dispersed polyamic acid solution composition having a high solids content and a high carbon black content. The invention further provides an intermediate transfer belt using the polyamic acid solution composition. The carbon black-dispersed polyamic acid solution composition is obtained by uniformly dispersing carbon black in a polyamic acid solution obtained by reacting biphenyltetracarboxylic dianhydride and an aromatic diamine in an organic polar solvent. The biphenyltetracarboxylic dianhydride includes 2,3,3?,4?-biphenyltetracarboxylic dianhydride and 3,3?,4,4?-biphenyltetracarboxylic dianhydride. The aromatic diamine includes 4,4?-diaminodiphenyl ether and p-phenylenediamine. The polyamic acid solution has a solids content of 25 weight % or more.

Abstract: A method of removing a residual catalyst metal compound from a polymer solution comprises the steps of: a) mixing a solution in which at least one organic nitrogen compound is dissolved in a polar solvent and the polymer solution to precipitate a chelate compound of the organic nitrogen compounds and the residual catalyst metal compound, b) adding the polar solvent to the solution mixture to dissolve a chelate compound and to precipitate a polymer, and c) filtering the precipitated polymer. After the polymer polymerization is completed, an organic nitrogen compound solution is added to perform a chelate reaction with the residual catalyst metal compound in a solution phase, and the polar solvent is added to precipitate the polymer so that only polymer precipitates are filtered while an additional filtration process in respect to the chelate compound is not performed to easily remove the residual catalyst metal compound.

Abstract: The present invention discloses a series of cardo-polybenzoxazole copolymer membranes, methods for preparing the cardo-polybenzoxazole copolymer membrane from thermal rearrangement of cardo-copolyimide membranes, and methods of methods for the separation of a fluid from a mixture of fluids by utilizing the cardo-polybenzoxazole copolymer membrane.

Abstract: A positive displacement pump and methods of making a positive displacement pump having a component, the component having a density ranging from more than 0 to 3 g/cm3, a glass transition temperature (Tg) greater than or equal to 150° C., and a yield strength retention greater than 90% after soaking in engine oil for 7 days at 150° C.

Abstract: Polyetherimide compositions are described wherein the polyetherimide composition comprises a polyetherimide comprising a reacted combination of alkali metal salts comprising an alkali metal salt of a dihydroxy aromatic compound and an alkali metal salt of a monohydroxy aromatic compound with a bis(halophthalimide), wherein the alkali metal salt of the monohydroxy aromatic compound is included in an amount of greater or equal to 5 mole percent based on the total moles of the alkali metal salts, and the polyetherimide has a weight average molecular weight less than 43,000 Daltons. The polyetherimide exhibits lower levels of chlorine and chlorine end groups, lower levels of bis(halophthalimide) and bis(phthalimide), and low plate-out during manufacturing.

Abstract: A water-soluble or water-dispersible carbodiimide compound is hydrophilicized by incorporating methyl glycolate or methyl lactate, which serves a moiety similar to the moiety which aqueous urethane resin, aqueous acrylic resin, or the like possesses, into an end of a starting carbodiimide compound. The invention provides a carbodiimide compound and a carbodiimide composition, which, when added as a cross-linking agent to aqueous resin, can enhance water resistance, solvent resistance, and adhesion of the resin, while maintaining the conventionally attained pot life, and an aqueous coating composition containing the carbodiimide compound or composition.

Abstract: Bis(halophthalimides) are prepared in mixture in an organic liquid such as ortho-dichlorobenzene or anisole, by a reaction at a temperature of at least 150° C. between at least one diamine compound and at least one halophthalic anhydride in the presence of imidization catalyst. The reaction mixture is maintained at about 15% by weight solids content and rich in the halophthalic anhydride by constantly monitoring the reaction mixture using analytical methods such as high performance liquid chromatography. The product mixture may be directly employed in the direct preparation of polyetherimides, and similar slurries may be employed to prepare other polyether polymers.

Abstract: A polyetherimide having an OH content that is greater than 0 and equal or less than 100 ppm; and a chlorine content that is greater than 0 ppm is disclosed herein. A method for preparing the polyetherimide is also disclosed.

Abstract: Phosphorus free polycarbonate compositions having flame retardant properties and a desirable balance of flow, impact resistance, and heat deflection properties are disclosed.

Abstract: A thermosetting resin including at least one repeating unit represented by the following Chemical Formula 1: wherein, in Chemical Formula 1, A is derived from a phenolic moiety, an anilinic moiety, or a combination thereof, L is C(O)O, C(O)NR? wherein R? is hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C6 to C30 aryl group, or a substituted or unsubstituted C6 to C30 aryloxy group, an aromatic ester, an aromatic ester-imide, an aromatic ester-amide, an aromatic amide, or a combination thereof, Z is a substituted or unsubstituted aliphatic group including a double bond or a triple bond, a substituted or unsubstituted alicyclic group including a double bond or a triple bond, a substituted or unsubstituted aryl group including a double bond or a triple bond, (iso)cyanate, a derivative thereof, or a combination thereof, and n is an integer ranging from 1 to about 4.

Abstract: Polyetherimide compositions of formula (1) are described wherein the polyetherimide compositions comprise a polyetherimide comprising a reacted combination of alkali metal salts comprising an alkali metal salt of a dihydroxy aromatic compound and an alkali metal salt of a monohydroxy aromatic compound with a bis(halophthalimide), wherein the alkali metal salt of the monohydroxy aromatic compound is included in an amount of more than 0 and less than 5 mole percent, based on the total moles of the alkali metal salts, and the polyetherimide has a weight average molecular weight greater than or equal to 43,000 Daltons. The polyetherimide exhibits lower levels of chlorine and chlorine end groups, lower levels of bis(halophthalimide) and bis(phthalimide), and low plate-out during manufacturing.

Abstract: There is provided a thermosetting resin composition having excellent flowability, low temperature moldability, curability, and heat resistance after curing or the like in the absence of a solvent. The thermosetting resin composition of the present invention contains, as essential components, a maleimide compound (A), a compound (B) having two or more polymerizable unsaturated hydrocarbon groups in its molecule, and a cyanate ester compound (C).

Abstract: A process for preparing polyimide resins comprises stirring a diamine and a dianhydride in a solvent to form a slurry; heating the slurry to a temperature sufficient for the diamine and dianhydride to react wherein the temperature is below the melting point of the dianhydride, below the melting point of the diamine, or below the melting points of the dianhydride and diamine; and reacting the diamine and dianhydride to form a polyimide having sufficient molecular weight to precipitate from the solvent.

Abstract: A polyetherimide having an OH content that is greater than 0 and equal or less than 100 ppm; a Relative Thermal Index that is greater than or equal to 170° C.; and a chlorine content that is greater than 0 ppm is disclosed herein. A method for preparing the polyetherimide is also disclosed.

Abstract: A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process for the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid dianhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can give

Abstract: The present invention relates to polycarbonates comprising imide-containing aryl mono- or dihydroxy compounds as chain terminators and, respectively, monomer units, and also to compositions comprising the said polycarbonates, to their use for the production of mouldings, and to mouldings obtainable therefrom.

Abstract: Exemplary embodiments provide an intermediate transfer belt, materials and processes for producing an intermediate transfer belt, and an image transfer apparatus used in electrophotographic printing devices, wherein the intermediate transfer belt can comprise a thermosetting polyimide comprising the reaction product of a polyamic acid and a hydroxyl-terminated polybutadiene.

Abstract: A novel polyimide as a high molecular weight material having a low dielectric constant, a low dielectric loss tangent and low water absorptivity, a polyamic acid capable of generating the above polyimide, the above polyimide and the polyamic acid being obtained by reacting an aromatic diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with an acid anhydride, a process for the production of the polyimide, a process for the production of the polyimide, a film of the polyimide, and a laminate comprising the above film.

Abstract: The present invention relates generally to mercaptofunctional high ?? EO chromophores and EO polymers, and particularly to mercaptofunctional high ?? EO chromophores and EO polymers useful for making electro-optical devices and systems. Mercaptofunctional high ?? EO chromophores are covalently bonded to poly(imido sulfide) polymers producing high Tg, low optical loss, covalently bonded, high ?? EO chromophore containing polymers. Methods of synthesizing these EO materials using mild polymerization conditions are also described.

Abstract: A polyamide-imide resin insulating paint according to the present invention includes polyamide-imide resin containing no halogen element in its molecular chain which is dissolved in a polar solvent, in which the polyamide-imide resin contains an aromatic diisocyanate component (A) having three or more benzene rings or an aromatic diamine component (E) having three or more benzene rings in a monomer, and a ratio M/N between a molecular weight (M) of the polyamide-imide resin per repeat unit and an average number (N) of amide groups and imide groups is equal to or more than 200.

Abstract: An optical film that is excellent not only in transparency and heat resistance but also in solubility in an organic solvent and linear thermal expansion coefficient. Also, a product or a member which meets high demands for heat resistance and low linear thermal expansion coefficient with the use of the optical film, more specifically a transparent substrate using the optical film, and an image display device and a solar cell including the optical film or the transparent substrate. The optical film contains a polyimide having a specific structure in which a repeating unit of a chain of a polymer has both an amide group and an imide group and the polymer has a fluorine atom. The polyimide is obtained by mixing a dehydrating agent and an imidizing agent with a polyamic acid solution so as to imidize the polyamic acid.

Abstract: A liquid crystalline thermoset oligomer or polymer including a structural unit of Chemical Formulae 1 and 2; and a functional group of Chemical Formula A,

Abstract: A polyetherimide composition comprising a polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, at least 15 wt. % of a 3,3?-bis(halophthalimide) of the formula from more than 17 wt. % to less than 85 wt. % of a 4,3?-bis(halophthalimide) of the formula from more than 0 to less than 27 wt.

Abstract: The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.

Abstract: A polyimide film which, especially when superposed on a metal layer by the laminating method, has the function of diminishing the thermal distortion to be imposed on the material; an adhesive film and a flexible metal-clad laminate each comprising or obtained with the polyimide film. the polyimide film is obtained by reacting an aromatic diamine with an aromatic acid dianhydride and imidiating the polyamic acid obtained, and has a storage elastic modulus in a specific range.

Abstract: Higher diamondoid derivatives capable of taking part in polymerization reactions are disclosed as well as intermediates to these derivatives, polymers formed from these derivatives and methods for preparing the polymers.

Abstract: Polymers for photoresists and monomers for incorporation into those polymers are disclosed. The polymers comprise a photoacid generator (PAG) component and at least a second component that is photolytically stable and acid-stable. The polymers may also contain a third, acid-labile component. The photoacid generator is based on N-sulfoxyimides and related moieties that contain photolabile oxygen-heteroatom and oxygen-aromatic carbon bonds.

Abstract: Sulfonated polymers are made by the direct polymerization of a sulfonated monomer to form the sulfonated polymers. The types of sulfonated polymers may include polysulfones or polyimides. The sulfonated polymers can be formed into membranes that may be used in proton exchange membrane fuel cells or as ion exchange membranes. The membranes formed from the sulfonated polymers exhibit improved properties over that of Nafion®. A heteropoly acid may be added to the sulfonated polymer to form a nanocomposite membrane in which the heteropoly acid is highly dispersed. The addition of a heteropoly acid to the sulfonated polymer increases the thermal stability of the membrane, enhances the conductivity above 100° C., and reduces the water uptake of the membrane.

Abstract: A method for the purification of aromatic polyether polymers prepared by a halide displacement polymerization process comprises adsorbing the catalyst with an alkali metal halide to form an adsorbent component and then removing the adsorbent component. Mixtures resulting from this method are also discussed.

Abstract: A polyimide copolymer represented by formula (I) or formula (II) is provided. In formula (I) or formula (II), B is a cycloaliphatic group or aromatic group, A is an aromatic group, R is hydrogen or phenyl, and m and n are 20-50. The invention also provides a method for fabricating a patterned metal oxide layer.

Abstract: Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group.

Abstract: Polymers for extreme ultraviolet and 193 nm photoresists are disclosed. The polymers comprise a photoacid generator (PAG) residue, an acid cleavable residue and a diacid joined by ester linkages. The polymers include a photoacid generating diol, a diacid and an acid table diol.

Abstract: Polyamide having a melting point between 330° C. and 370° C., said polyamide comprising: a diamine component (a) comprising between 0 and 55 mole %, based on the total number of moles of the diamine component (a), of at least one aliphatic diamine having more than 6 carbon atoms, and between 45 and 100 mole %, based on the total number of moles of the diamine component (a), of at least one aliphatic diamine having at most 6 carbon atoms, and a dicarboxylic acid component (b) comprising more than 50 mole %, based on the total number of moles of the dicarboxylic acid component (b), of terephthalic acid, with the exception of a certain specific polyamide (P*).

Abstract: The present invention provides a polyimide film and its usage. The polyimide film according to the present invention does not cause dimensional change due to thermal stress. The present invention particularly relates to a polyimide film and its usage, which polyimide film has a characteristic of suppressing thermal deformation of the material in lamination of a polyimide film and a metal layer by a laminate method. The polyimide film according to the present invention has the following characteristics: (1) an inflexion point of storage modulus ranges from 270° C. to 340° C.; (2) tan ?, which is a value obtained by dividing a loss elastic modulus by a storage modulus, has a peak-top in a range of 320° C. to 410° C.; (3) a storage modulus at 380° C. ranges from 0.4 GPa to 2.0 GPa; and (4) a storage modulus ?1 at the inflexion point (GPa) and a storage modulus ?2 at 380° C. (GPa) satisfy: 85?{(?1??2)/?1}×100?65.

Abstract: A sterilized article comprising a sterilized or hydrogen peroxide vapor-sterilized polymer composition, the polymer composition comprising a polyetherimide, wherein after exposure to 100 cycles of the hydrogen peroxide plasma sterilization using a mixture of hydrogen peroxide vapor and hydrogen peroxide plasma for 30 minutes at 20 to 55° C., the color of the polymer composition of the article exhibits a color shift of delta E of 10 units or less relative to the color of the polymer composition color before the first hydrogen peroxide plasma sterilization cycle, wherein delta E is measured in accordance with ASTM D2244.

Abstract: A carbon black-dispersed polyamic acid solution composition that utilizes carbon black excelling in safety and environmental adaptability and excels in the dispersion stability and fluidity of carbon black dispersed in polyamic acid solution, and that realizes high solid content and high carbon black content. An intermediate transfer belt of polyimide, which produces a transfer image of high quality in a color image-forming apparatus, produced from the polyamic acid solution composition. In particular, a carbon black-dispersed polyamic acid solution composition containing a polyamic acid solution obtained by reaction of approximately equimolar amounts of biphenyltetracarboxylic acid dianhydride and an aromatic diamine, and containing a carbon black of 2 to 6% volatile content produced by oil furnace process, wherein the solid content of the solution composition is 23 wt. % or more and wherein the carbon black content of the solid is in the range of 20 to 30 wt. %.