Abstract: Disclosed herein are a polyamic acid dope solution composition, a method for preparing a hollow fiber using the composition and a hollow fiber prepared by the method. More specifically, disclosed are a method for preparing a hollow fiber, comprising preparing a polyamic acid dope solution composition comprising polyhydroxyamic acid, polythiolamic acid or polyaminoamic acid, spinning the composition to prepare a hollow fiber, and imidizing and thermally rearranging the hollow fiber, and the hollow fiber prepared by the method. In accordance with the method, a hollow fiber made of a high free volume polymer membrane can be prepared by spinning the dope solution composition to prepare a hollow fiber and thermally rearranging the hollow fiber via thermal treatment. The hollow fiber thus prepared exhibits excellent gas permeability and selectivity, thus being suitable for use as a gas separation membrane.

Abstract: A novel polyimide as a high molecular weight material having a low dielectric constant, a low dielectric loss tangent and low water absorptivity, a polyamic acid capable of generating the above polyimide, the above polyimide and the polyamic acid being obtained by reacting an aromatic diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with an acid anhydride, a process for the production of the polyimide, a process for the production of the polyimide, a film of the polyimide, and a laminate comprising the above film.

Abstract: A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.

Abstract: Copolyetherimides compositions having high glass transition temperatures and outstanding ductility are presented. The copolyetherimides having Mw of at least 40,000 comprising isomeric bis(phthalimide) structural units within a relatively narrow range of isomer proportions exhibited Tgs of at least 240° C. and outstanding Notched Izod values. The copolyetherimides comprise oxydianiline residues and structural units of the formulas (I) and (II) (III).

Abstract: The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: A method for the purification of aromatic polyether polymers prepared by a halide displacement polymerization process comprises adsorbing the catalyst with an alkali metal halide to form an adsorbent component and then removing the adsorbent component. Mixtures resulting from this method are also discussed.

Abstract: A method of forming a polymeric material includes forming a solution including at least two solvents and at least two diamines. The at least two diamines include oxydianiline (ODA) in an amount of about 50% to about 90% based on the total moles of the at least two diamines and include m-phenylenediamine (MPD) in an amount of about 10% to about 50% based on the total moles of the at least two diamines. The at least two solvents include a high polarity solvent in an amount of about 40% to about 90% based on the total weight of the at least two solvents and include a low polarity solvent in an amount of about 10% to about 60% based on the total weight of the at least two solvents. The method further includes adding pyromellitic dianhydride (PMDA) to the solution in a ratio of about 0.9 to about 1.05 based on the total moles of the at least two diamines to form a polyamic acid solution. In addition, the method includes imidizing the polyamic acid solution to form a polyimide material.

Abstract: Main chain thermotropic liquid crystal esters, ester-imides, and ester-amides were prepared from AA, BB, and AB type monomeric materials and end-capped with phenylacetylene, phenylmaleimide, or nadimide reactive end-groups. The end-capped liquid crystal oligomers are thermotropic and have, preferably, molecular weights in the range of approximately 1000-15,000 grams per mole. The end-capped liquid crystal oligomers have broad liquid crystalline melting ranges and exhibit high melt stability and very low melt viscosities at accessible temperatures. The end-capped liquid crystal oligomers are stable for up to an hour in the melt phase. They are highly processable by a variety of melt process shape forming and blending techniques. Once processed and shaped, the end-capped liquid crystal oligomers were heated to further polymerize and form liquid crystalline thermosets (LCT). The fully cured products are rubbers above their glass transition temperatures.

Abstract: Disclosed is a planographic printing plate material comprising an aluminum support and provided thereon, an image formation layer containing a cyclic ureide moiety-containing phenolic resin in which a phenolic resin has a cyclic ureide moiety through a linkage group, the cyclic ureide moiety being derived from a cyclic ureide and the linkage group being derived from a linkage compound having both a monohalogenated alkyl group and one selected from a vinyl group, a carbonyl group, an ester group and a sulfonic acid ester group.

Abstract: The present disclosure provides novel methods of producing a composition, such as, but not limited to, a polyimide composition. The methods in their most general form comprise providing a workpiece, suspending the workpiece and subjecting the suspended workpiece to processing such that the workpiece undergoes a transformation from a first state to a second state. By maintaining the workpiece in a suspended state during processing, processing-related defects are reduced or eliminated. Using such methods, the present disclosure provides compositions that are have no or reduced processing-related defects. In addition, the compositions are more consistent in chemical and physical properties and are cheaper and more economical to produce (since less product is rejected as unsuitable).

Abstract: Photoreactive dendrimers comprising a core portion, branching units and terminal groups, wherein at least one terminal group and/or branching unit is a photoreactive group and wherein the photo reactive groups include preferably cinnamates, coumarins, benzylidenephthalimidines, benzylideneacetophenones, diphenylacetylenes stilbazoles, uracyl, quinolinone, maleinimides, or cinnamylidene acetic acid derivatives and are able to undergo photocyclization, in particular [2+2]-photocyclization.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: A composition is described, which comprises a crystallizable polyetherimide derived from the polymerization of: (a) a dianhydride component, comprising more than 96.8 mole % of 4,4?-bisphenol A dianhydride or a chemical equivalent thereof; and (b) a diamine component comprising a diamine or a chemical equivalent thereof, wherein the crystallizable polyetherimide has a Tm ranging from 250° C. to 400° C. and the difference between the Tm and Tg of the composition is more than 50° C. Further described are articles, such as fibers, made from the composition, methods for making the composition, methods for making the articles, and methods for using the articles.

Abstract: A process for preparing a polyamide by reacting a mixture which comprises a monomer which has a nitrile group and has at least one other functional group capable of forming a carboxamide group, and comprises water, in the presence of titanium dioxide as catalyst, which comprises using titanium dioxide whose BET surface area, determined to the German standard DIN 66 131 volumetrically by the multipoint method, is in the range from 5 to 35 m2/g.

Abstract: According to an aspect of the invention, medical devices are provided which include (a) a substrate and (b) a coating that includes an antifouling copolymer, an adhesive copolymer, or both. Antifouling copolymers for use in conjunction with the present invention contain (i) at least one antifouling polymer block having multiple pendant alkoxy functional groups along the polymer backbone and (ii) at least one additional polymer block. Adhesive copolymers for use in conjunction with the present invention contain (i) at least one adhesive polymer block having multiple pendant ring-hydroxyl-substituted aromatic groups along the polymer backbone and (ii) at least one additional polymer block.

Abstract: Degradable polyimides are prepared in high yield by polymerizing a monomer containing at least two anhydride groups, and a monomer containing at least two primary amine groups and at least one acidic group, in bulk or in a solvent. The polyimides are very strong in terms of their mechanical properties, yet degradable under standard physiological conditions.

Abstract: 2,5-dihydroxyterephthalic acid is produced in high yields and high purity from 2,5-dihaloterephthalic acid by contact with a copper source and a ligand that coordinates to copper under basic conditions.

Abstract: An encapsulant fluid is provided comprising a mixture of a diene-containing compound and a dienophilic compound. At least one of the diene-containing and the dienophilic compounds is protected so that the compounds do not substantially react with each other at room temperature. The diene-containing and the dienophilic compounds undergo a reversible Diels-Alder polymerization reaction at a polymerization temperature above room temperature to form a solid debondable polymeric encapsulant. Also provided are methods for forming slider assemblies and methods for patterning a slider surface using the encapsulant.

Abstract: The present invention is directed to a non-gelled, curable composition including at least one compound having a plurality of imide functional groups. The compound in particular contains a reaction product of at least one secondary monoamine and at least one maleimide, and is suitable for use in coatings and castings.

Abstract: Polyamides and polyimides containing flexible isopropylidene, trifluoromethyl and tetramethyl substituents and their synthetic method are disclosed. Polyamide containing flexible isopropylidene, trifluoromethyl and tetramethyl substituents is synthesized by reacting diamine compound (2,2-bis[4-(2-trifluoromethyl-4-aminophenoxy)-3,5-dimethylphenyl]propane) with an equimolar diacid via a polycondensation reaction. Polyimide containing flexible isopropylidene, trifluoromethyl and tetramethyl substituents is synthesized by reacting diamine compound with an equimolar dianhydride via a polycondensation reaction.

Abstract: An optical waveguide has a core layer made by a film containing a cross-linked polyamide based on a repeating unit of general formula (I) and a method for the production thereof.

Abstract: A polyimide film of the present invention is a polyimide film having a dynamic viscoelasticity whose tan ? peak is located in a range of not less than 310° C. but not more than 410° C., and whose tan ? value at 300° C. is not more than 0.05, or a polyimide film prepared by copolymerizing (a) an acid dianhydride component including a biphenyltetracarboxylic dianhydride and a pyromellitic dianhydride, and (b) a diamine component, and the polyimide film having such an etching speed that one side thereof is etched with a 1N potassium hydroxide solution at an etching speed of 0.1 ?m/minute (one side) or higher. The polyimide film of the present invention possesses film properties that are necessary for use in an electronic raw material for flexible printed circuit boards and the like, and is suitable as an electronic raw material.

Abstract: The present invention provides novel block copolycarbonates comprising residues from a hydroxy terminated polyetherimide or polyimide, residues from a dihydroxy compound, and residues from an activated carbonate. In a preferred embodiment of the present invention the polyetherimide or polyimide blocks exhibit high Mw while the resulting block copolycarbonate exhibits a single Tg. The novel block copolycarbonates of the present invention are produced under melt polymerization conditions in the presence an activated carbonate source.

Abstract: Disclosed are a polymer electrolyte having improved hot water resistance and radical resistance, a proton conductive membrane comprising the polymer electrolyte, and a membrane-electrode assembly including the proton conductive membrane. The polymer electrolyte comprises at least one polymer selected from polyether, polyketone, polyetherketone, polysulfone, polyethersulfone, polyimide, polyetherimide, polybenzimidazole, polybenzothiazole, polybenzoxazole and the like. The polymer comprises a repeating structural unit with either or both of an aromatic ring and a heterocyclic ring, and a repeating structural unit represented by the formula (1): wherein X is a single bond, an electron-withdrawing group or an electron-donating group; R is a single bond, —(CH2)q— or —(CF2)q— where q ranges from 1 to 10; m is from 0 to 10; k is from 0 to 5; l is from 0 to 4; and k+1?1.

Abstract: The present invention relates to bisphenyl-2,3,5,6-tetrafluoro-4-trifluoromethylphenylphosphine oxide compounds and synthesis thereof, more particularly to novel bisphenyl-2,3,5,6-tetrafluoro-4-trifluoromethylphenylphosphine oxide compounds having both a perfluorinated benzene substituent and a phosphine oxide moiety. Compounds of the invention can be useful as a monomer for preparing polyimides having a low dielectric constant and a superior adhesion while maintaining the superior thermal and mechanical properties of polyimides themselves, and their synthesis thereof.

Abstract: A diamine compound represented by the formula (1): wherein R1 is a trivalent organic group, each of X1 and X2 is a bivalent organic group, X3 is an alkyl or fluoroalkyl group having from 1 to 22 carbon atoms, or a cyclic substituent selected from aromatic rings, aliphatic rings, heterocyclic rings and their substituted groups, and n is an integer of from 2 to 5. And, a polyimide precursor and a polyimide synthesized by using the diamine compound; and a treating agent for liquid crystal alignment containing the polyimide precursor and/or the polyimide.

Abstract: A method for improving the cohesive strength at elevated temperature of a die attach adhesive formulation of a liquid curable resin, initiator, and filler, comprises adding to the adhesive formulation an aromatic bismaleimide resin powder that does not dissolve in the curable resin.

Abstract: In one aspect the present invention provides a storage medium for data, the storage medium comprising: a) a substrate, a physical portion of which comprises at least one polyimide, and b) at least one data layer on the substrate. The substrate comprising a polyimide exhibits low axial displacement and beneficial damping characteristics.

Abstract: A method for preparation of a sulfonic and or sulfonic acid salt containing polyimide resins comprising melt reaction of a polyimide resin with an organic compound, wherein the organic compound contains at least one aliphatic primary amine functionality and at least one other functionality selected from the group consisting of sulfonic acids, sulfonic acid salts or mixtures thereof.

Abstract: The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170° C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.

Abstract: A liquid crystal alignment treating agent for optical alignment treatment, whereby it is possible to obtain a liquid crystal alignment film which presents a high and stable tilt angle of liquid crystal and which is excellent in an accumulated charge property by a DC voltage, is provided.

Abstract: The present invention relates to a maleimide group-containing polymer particle containing a crosslinked polymer particle containing a group represented by the following formula (1) and to a method of producing the maleimide group-containing crosslinked polymer particle by reacting hydroxymethylmaleimide with a hydroxyl group-containing polymer particle obtained by introducing a polyethylene glycol into a crosslinked polymer particle: wherein n denotes an integer of 1 or more.

Abstract: A liquid crystal alignment treating agent containing a polyamic acid which is represented by the following formula (I) and exhibits a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methyl-2-pyrrolidone at 30° C. at a concentration of 0.5 g/dl) or a polyimide obtained by cyclodehydration thereof: wherein R1 represents a tetravalent organic group, at least 20 mol % of which has a fused alicyclic structure composed of two to five rings, and all of the carbonyl groups are directly bonded to the alicyclic structure and that any two carbonyl groups are not bonded to adjacent carbon atoms of the alicyclic structure; R2 is a bivalent organic group, from 20 to 100 mol % of which has in the side-chain structure at least one structural unit selected from the group consisting of C5-20 long-chain alkyl, C5-20 fluoroalkyl, alicyclic structures and aromatic ring structures; and L is a positive integer.

Abstract: Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).

Abstract: An aromatic polyamide photoalignment material prepared by a reaction from a diamine compound with a side branch and a photosensitive dicarboxylic acid. Furthermore, liquid crystal display devices using such photoalignment materials in an alignment film on at least one substrate.

Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected from hydrogen and C1–C6 alkyl groups; “A” comprises structural units of the formulae: or mixtures of the foregoing structural units; wherein “D” is a divalent aromatic group, R3 and R10–R12 are independently selected from hydrogen, halogen, and C1–C6 alkyl groups; “q” is an integer having a value of 1 up to the number of positions available on the aromatic ring for substitution; and “W” is a linking group; and “B” comprises substituted and unsubstituted arylene groups having from about 6 to about 25 carbon atoms. Methods for producing the polyetherimide compositions are also disclosed herein.

Abstract: A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a rigid aromatic diamine and an aromatic dianhydride. Finally, the processes to produce carbon aerogels or xerogel-aerogel hybrid, both of which impregnated with highly dispersed transition metal clusters, and metal carbide aerogels, deriving from the polyimide aerogels composed of a rigid aromatic diamine and an aromatic dianhydride, are described. The polyimide aerogels and the polyimide aerogel derivatives consist of interconnecting mesopores with average pore size at 10 to 30 nm and a mono-dispersed pore size distribution. The gel density could be as low as 0.008 g/cc and accessible surface area as high as 1300 m2/g.

Abstract: A polyimide precursor resin solution composition sheet having a solvent content of 1–50% by weight and a thickness of 1–10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.

Abstract: A method for preparing a polyimide includes introducing a mixture of an oligomer and a solvent to an extruder, removing solvent via at least one extruder vent, and melt kneading the oligomer to form a polyimide. The polyimide has a low residual solvent content. The method is faster than solution polymerization of polyimides, and it avoids the stoichiometric inaccuracies associated with reactive extrusion processes that use monomers as starting materials.

Abstract: This invention is related to heteroatom containing diamondoids (i.e., “heterodiamondoids”) which are compounds having a diamondoid nucleus in which one or more of the diamondoid nucleus carbons has been substitutionally replaced with a noncarbon atom. These heteroatom substituents impart desirable properties to the diamondoid. In addition, the heterodiamondoids are functionalized affording compounds carrying one or more functional groups covalently pendant therefrom. This invention is further related to polymerizable functionalized heterodiamondoids. In a preferred aspect of this invention the diamondoid nuclei are triamantane and higher diamondoid nuclei. In another preferred aspect, the heteroatoms are selected to give rise to diamondoid materials which can serve as n- and p-type materials in electronic devices can serve as optically active materials.

Abstract: Polyimide sulfone resins are provided with a glass transition temperature of from 200–350° C., residual volatile species concentration of less than 500 ppm and a total reactive end group concentration of less than about 120 milliequivalents/kilogram resin. The resins have high heat capability and good melt stability. Methods to prepare the said resins and articles made from the resins are also provided.

Abstract: A polycarbodiimide copolymer which comprises at least one structural unit selected from rubber residues represented by the following formulae (1) and (2) in a number “m”: and a structural unit represented by the following formula (3) in a number “n”: and which comprises on both termini a terminal structural unit derived from a monoisocyanate, wherein m is an integer of 2 or more, n is an integer of 1 or more, m+n is from 3 to 1,500 and m/(m+n) is from 1/1,500 to ?. The polycarbodiimide is capable of keeping the inherent heat resistance and also showing excellent flexibility. Films and molding materials having high heat resistance and flexibility can be obtained.

Abstract: A photoactive side-chain polymer from the class of polyimides, polyamide acids and esters thereof, comprising as a side-chain a dendritic block incorporating photoactive groups at its surface. The dendritic block preferably represents a unit of formulae Ia, Ib or a combination of them, for example formulae Ic, wherein the broken line symbolizes the linkage to the polyimide main chain. The polymer may be used as an orientation layer for liquid crystals and in the construction of unstructured and structured optical elements and multi-layer systems.

Abstract: To provide a sulfonic acid group-containing polymer having improved hot water resistance and radical resistance (durability), a solid polymer electrolyte including the polymer, and a proton-conducting membrane including the electrolyte, the polymer electrolyte includes a sulfonated product of a polymer shown by the following general formula (I): wherein X, Y, and Z are bonded randomly, alternately, or in blocks, y represents an integer of two or more, and each of x and z represents an integer of zero or more, where x+z>2.

Abstract: A new class of hybrid organic-inorganic materials, and methods of synthesis, that can be used as a proton exchange membrane in a direct methanol fuel cell. In contrast with Nafion® PEM materials, which have random sulfonation, the new class of materials have ordered sulfonation achieved through self-assembly of alternating polyimide segments of different molecular weights comprising, for example, highly sulfonated hydrophilic PDA-DASA polyimide segment alternating with an unsulfonated hydrophobic 6FDA-DAS polyimide segment. An inorganic phase, e.g., 0.5–5 wt % TEOS, can be incorporated in the sulfonated polyimide copolymer to further improve its properties. The new materials exhibit reduced swelling when exposed to water, increased thermal stability, and decreased O2 and H2 gas permeability, while retaining proton conductivities similar to Nafion®. These improved properties may allow direct methanol fuel cells to operate at higher temperatures and with higher efficiencies due to reduced methanol crossover.

Abstract: An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and the wiring circuit board.

Abstract: A terminal-crosslinkable polyamic acid oligomer having 1) heat resistance indicated by Tg of 300° C. or more and a pyrolysis temperature of 500° C. or more, 2) toughness, and 3) capability of allowing an increase in concentration. The polyamic acid oligomer is obtained by reacting an aromatic tetracarboxylic dianhydride including 2,2?,3,3?-biphenyltetracarboxylic dianhydride, an aromatic diamine compound, and a reactive crosslinking agent including an amino group or acid anhydride group and a crosslinkable group in the molecule, and includes a crosslinkable group at the molecular terminal.

Abstract: The present invention relates to a method of producing high-density polyidimide (HPI) films and its production equipment. The production equipment comprises a raw material supplying means, a vacuum cavity, an energy supplier, a clad laminator, and a baked solidified polymer. The foregoing components constitutes the production equipment, using the monomer with the CONH bond or copolymer as raw materials to extract the unsaturated C?N bond by heat, electrons, light, radiation rays or ions as energy under low-pressure environment, so that the H in vacuum can extract the non-solidified HPI film from the electronic radical covalent polymers and via heat or light to rearrange the structure into a solidified HPI film. By means of the method according to the present invention, the original HPI that is not easily to produce as a film can be easily made in form of a film of HPI polymer on the clad laminator.

Abstract: The invention relates to a modified polybenzimidazole (PBI), membranes that are fabricated from these polymers, and their use in electrochemical applications. These membranes have high ionic conductivity and are suitable for solid polymer electrolytes in electrochemical applications, especially for high temperature polymer electrolyte membrane (PEM) fuel cells.

Abstract: This invention relates to polyimides having improved thermal-oxidative stability, to the process of preparing said polyimides, and the use of polyimide prepolymers in the preparation of prepregs and composites. The polyimides are particularly useful in the preparation of fiber-reinforced, high-temperature composites for use in various engine parts including inlets, fan ducts, exit flaps and other parts of high speed aircraft.