Imide-containing Reactant Patents (Class 528/170)
  • Patent number: 6770733
    Abstract: A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: August 3, 2004
    Assignee: Nippon Mektron, Limited
    Inventors: Min Zuo, Jenq-Tain Lin
  • Patent number: 6767988
    Abstract: Polyamide elastomer comprising a hard segment derived from polyamide having no divalent aromatic group and a soft segment derived from polycarbonate diol having no divalent aromatic group has high flexibility and high heat resistance in addition to good physical characteristics of the known polyamide elastomers.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: July 27, 2004
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroshi Okushita, Tadao Muramatsu
  • Patent number: 6762277
    Abstract: A method of manufacturing a new N-carboxyamino acid anhydride and polyamino acid using a simple process operation. The method for manufacturing N-carboxyamino acid anhydride comprising reacting &agr;-amino acid with di-tert-butyltricarbonate. The method for manufacturing polyamino acid comprising decarboxylating the N-carboxyamino acid anhydride obtained by reacting &agr;-amino acid with di-tert-butyltricarbonate.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: July 13, 2004
    Assignee: JSR Corporation
    Inventors: Hiroto Kudoh, Takeshi Endoh
  • Patent number: 6759505
    Abstract: There is provided a process for the continuous polymerization of polyamides which is carried out under conditions of pressure, temperature and polymer concentration in water that will ultimately yield multiple phases (including a second liquid polymer phase or a polymer precipitate). However, a single phase operation is achieved under these conditions by appropriate management of residence time and using a well-mixed reaction environment in early stages of the polymerization.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: July 6, 2004
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Jocelyn Willis-Papi, Turget Mutel
  • Patent number: 6750312
    Abstract: A method for preparing a solid support material for carrying out a chemical reaction, said method comprising the following steps: (i) reacting an amino functionalised solid material with a carboxylic acid having at least two similarly protected amino groups to form amide bonds between them, (ii) removing protecting groups in a single step, (iii) optionally repeating steps (i) and (ii) one or more times using the product of the preceding step as the amino functionalised solid material, and (iv) connecting a linkage agent to at least some of the free NH2 groups of the product. The method increases the loading capacity of the solid support material. It is particularly useful in connection with peptide synthesis.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: June 15, 2004
    Assignee: Avecia Limited
    Inventors: Craig Stephen Harris, Donald Alfred Wellings, Francis Joseph Montgomery, Richard John Brown
  • Patent number: 6750318
    Abstract: The polyamide resin of the present invention is produced by the polycondensation of a dicarboxylic acid component and a diamine component containing xylylenediamine and bisaminomethylcyclohexane in a total amount of 70 mol % or higher. The polyamide resin contains impurities having a boiling point of from 150 to 300° C. at ordinary pressure and a solubility parameter of from 8 to 16 in a total amount of 0.3% by weight or lower based on the weight of the polyamide resin. The polyamide resin is free from various inconveniences due to inclusion of the impurities, and suitably used in applications for molding materials, bottles, sheets, films and fibers.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: June 15, 2004
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kazumi Tanaka, Takatoshi Shida, Hideyuki Kurose
  • Patent number: 6750320
    Abstract: A process for producing a polyimide platy object includes (a) providing a solution containing a solvent and a solute (i.e., a polyimide precursor or polyimide); (b) pouring the solution onto a supporting member; (c) removing a portion of the solvent from the solution at a first temperature lower than boiling point of the solvent, thereby forming a precursory platy object thereon, the precursory platy object having a self-supporting property and a first surface in contact with the supporting member and a second surface away therefrom and a first content of the solvent at the first surface and a second content (less than the first content by 2-10 wt %) of the solvent at the second surface; and (d) detaching the precursory platy object therefrom; and (e) heating the precursory platy object at a second temperature higher than boiling point of the solvent and is lower than decomposition temperature of the polyimide.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: June 15, 2004
    Assignee: Central Glass Company, Limited
    Inventors: Yoshihiro Moroi, Hidehisa Nanai, Yuji Yamamoto, Shigeki Sakaguchi
  • Patent number: 6747120
    Abstract: The invention relates to a semi-aromatic polyamide containing at least tetramethylene terephthalamide units and also hexamethylene terephthalamide units. The copolyamide has a melting point higher than approximately 290° C., a high crystallinity and a good stability. Preferably the copolyamide according to the invention contains approximately 30-75 mol % hexamethylene terephthalamide units and also approximately 0.01-20 mol % other units. The invention also relates to a process for the preparation of a semi-aromatic copolyamide containing at least tetramethylene terephthalamide units and hexamethylene terephthalamide units, characterized in that, successively, a first polymerization is effected in the melt phase, followed by an post-polymerization of the low molar mass polymer thus obtained in the solid phase; and to compositions and products that contain said copolyamide.
    Type: Grant
    Filed: March 29, 2002
    Date of Patent: June 8, 2004
    Assignee: DSM IP Assets B.V.
    Inventors: Rudy Rulkens, Robert C. B. Crombach
  • Patent number: 6743851
    Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: June 1, 2004
    Assignees: Nippon Zeon Co., Ltd., Fujitsu Limited
    Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
  • Patent number: 6740371
    Abstract: An alkyldiamine having excellent polymerization reactivity, a polyimide comprising it as a constituting element, and a liquid crystal alignment film excellent in uniformity of liquid crystal alignment, are presented. Namely, the present invention relates to a diaminobenzene derivative represented by the following general formula (1) and to a polyimide obtained by reacting a diamine containing at least 1 mol % of the diaminobenzene derivative represented by the general formula (1), with at least one compound selected from a tetracarboxylic. dianhydride and its derivatives, to obtain a polyimide. precursor having a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl) and ring-closing it, and having a repeating unit represented by the general formula (2). Further, the present invention relates to a liquid crystal alignment film containing at least 1 mol % of the above repeating unit.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: May 25, 2004
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuyoshi Hosaka, Hideyuki Nawata, Takayasu Nihira, Hideyuki Isogai, Hideyuki Endou, Hiroyoshi Fukuro
  • Patent number: 6737502
    Abstract: A solvent-free, catalyst-free and contamination-free method of synthesis of polyimides is disclosed. The method includes polymerizing a diamine with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) at a pressure of 0.1-760 mm Hg, preferably a reduced pressure at about 36 mm Hg, and a temperature of 90-400° C., preferably 10-240° C.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: May 18, 2004
    Assignee: Chung-Shan Institute of Science & Technology
    Inventor: Shean-Jeng Jong
  • Patent number: 6734248
    Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: May 11, 2004
    Assignees: Nippon Zeon Co., Ltd., Fujitsu Limited
    Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
  • Patent number: 6734276
    Abstract: The invention is a polyimide, random copolymer having repeating units of the formula (1): wherein R1 and R2 each represent a divalent group selected from and R1 and R2 may be the same or different; and x=0.60 to 0.80, y+z=0.40 to 0.20, and x+y+z=1.00, and a linear expansion coefficient at 100 to 200° C. is in the range of from 10 to 20 ppm/K. This is a useful polyimide that can be a polyimide circuit substrate material capable of keeping flat, neither shrinking nor expanding in its laminate.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: May 11, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Katsuji Watanabe, Takahisa Oguchi
  • Publication number: 20040063897
    Abstract: A method for the synthesis of poly(etherimide)s comprises the reaction of 4-halotetrahydrophthalic anhydride with an activating primary amine to yield an activated 4-halotetrahydrophthalimide. Activated 4-halotetrahydrophthalimide may then be aromatized and treated with the disodium salt of a bis(phenol) to yield an activated bisimide. The activated bisimide may then be directly treated with a diamine to yield poly(etherimide)s.
    Type: Application
    Filed: September 25, 2002
    Publication date: April 1, 2004
    Inventors: Roy Ray Odle, Thomas Link Guggenheim
  • Patent number: 6713597
    Abstract: A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solution under imidization conditions to form an insoluble reactive polyimide and to effect substantially complete distillation of the water of reaction out of the reaction solution; and separating the insoluble reactive polyimide from the reaction solution to form a reactive friable polyimide powder.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: March 30, 2004
    Assignee: General Electric Company
    Inventor: Martin John Lindway
  • Patent number: 6713590
    Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.
    Type: Grant
    Filed: December 3, 2001
    Date of Patent: March 30, 2004
    Assignee: Honeywell International Inc.
    Inventors: Kreisler S. Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
  • Patent number: 6709714
    Abstract: The present invention relates to a method of producing high-density polyidimide (HPI) films and its production equipment. The production equipment comprises a raw material supplying means, a vacuum cavity, an energy supplier, a clad laminator, and a baked solidified polymer. The foregoing components constitutes the production equipment, using the monomer with the CONH bond or copolymer as raw materials to extract the unsaturated C═N bond by heat, electrons, light, radiation rays or ions as energy under low-pressure environment, so that the H in vacuum can extract the non-solidified HPI film from the electronic radical covalent polymers and via heat or light to rearrange the structure into a solidified HPI film. By means of the method according to the present invention, the original HPI that is not easily to produce as a film can be easily made in form of a film of HPI polymer on the clad laminator.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: March 23, 2004
    Inventor: Tien Tsai Lin
  • Patent number: 6710160
    Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimide
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: March 23, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
  • Patent number: 6703476
    Abstract: Polyamides are prepared from aminonitriles and water by (1) reacting the aminonitriles with water at from 180 to 350° C. and such a pressure in the range from 30 to 120 bar that a gaseous phase is present as well as a liquid phase, in a first reaction stage, (2) expanding the reaction mixture obtained in the first reaction stage via an evaporator zone or adiabatically with removal of water and ammonia into a second reaction stage, and (3) postcondensing in the second reaction stage at from 0.1 mbar to 5 bar and from 230 to 320° C.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: March 9, 2004
    Assignee: BASF Aktiengesellschaft
    Inventors: Ralf Mohrschladt, Helmut Winterling, Dieter Krauss
  • Publication number: 20040039150
    Abstract: Triazine ring based polymers for photoinduced liquid crystal alignment introduces photoactive groups for inducing, reinforcing, improving and preserving liquid crystal alignment, for example photoreactor such as cinnamate, coumarin, chalcone and maleimide, as a chain to have at least one photoactive group. One of the photoactive groups can experience Fries rearrangement which induces liquid crystal alignment, and other groups can experience photodimerization, photoisomerization, photocrosslinking or photodegradation to reinforce, change or preserve the generated alignment.
    Type: Application
    Filed: May 1, 2003
    Publication date: February 26, 2004
    Inventors: Dongcheon Shin, Jinyool Kim, Kyusoon Park, Taemin Kim
  • Patent number: 6693162
    Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: February 17, 2004
    Assignee: Kaneka Japan Corporation
    Inventors: Hiroyuki Tsuji, Hiroyuki Furutani, Koichiro Tanaka, Takeshi Kikuchi
  • Patent number: 6692825
    Abstract: A nonwoven web and method of preparing a novel nonwoven web of synthetic fiber are disclosed. An aqueous solution amide crosslinked synthetic precursor polymer is extruded under defined conditions through a plurality of die orifices to form a plurality of threadlines. The threadlines are attenuated with a defined primary gaseous source to form fiber under conditions of controlled macro scale turbulence and under conditions sufficient to permit the viscosity of each threadline, as it leaves a die orifice and for a distance of no more than about 8 cm, to increase incrementally with increasing distance from the die, while substantially maintaining uniformity of viscosity in the radial direction, at a rate sufficient to provide fiber having the desired attenuation and mean fiber diameter without significant fiber breakage. The attenuated threadlines are dried with a defined secondary gaseous source. The resulting fibers are deposited randomly on a moving foraminous surface to form a substantially uniform web.
    Type: Grant
    Filed: March 6, 2002
    Date of Patent: February 17, 2004
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Jian Qin, Yong Li, Wendy Lynn Van Dyke, Anthony John Wisneski, Palani Raj Ramaswami Wallajapet, Hannong Rhim
  • Patent number: 6686437
    Abstract: A medical implant having at least a portion thereof made of a formable, pyromellitic, dianhydride (PMDA)-free, non-halogenated, aromatic polyimide is disclosed. Further disclosed are a process of manufacturing the implant and a method of implanting the implant in a subject in need thereof.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: February 3, 2004
    Assignee: M.M.A. Tech Ltd.
    Inventors: Alisa Buchman, Raymond G. Payne, David G. Mendes, Simha Sibony, Robert G. Bryant
  • Patent number: 6680363
    Abstract: An acid dianhydride, together with a diamine, is heated in an organic polar solvent in the presence of &ggr;-caprolactone or &bgr;-butyrolactone as an acid catalyst to prepare a polyimide having an average molecular weight of 10,000 to 300,000. This production process can realize the production of a polyimide which is soluble in a solvent and has high processability and stability.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: January 20, 2004
    Assignee: Hitachi Cable, Ltd.
    Inventors: Katsumoto Hosokawa, Yuuki Honda, Seiji Kamimura, Yoshiyuki Ando, Kenji Asano
  • Patent number: 6677427
    Abstract: A polyamide, the enzymatic reaction product of at least one polyamine and diester, and processes for preparing and using the same. In addition, processes for preparing and using the enzymatic reaction product as creping adhesives and wet strength resins to make cellulose products.
    Type: Grant
    Filed: June 13, 2000
    Date of Patent: January 13, 2004
    Assignee: Hercules Incorporated
    Inventors: Huai N. Cheng, Qu-Ming Gu, William W. Maslanka
  • Patent number: 6657037
    Abstract: In the process for producing polyamide of the present invention, a diamine and a dicarboxylic acid are melt-polycondensed in a batch-wise fist polymerizer in the absence of a solvent to produce a middle-stage polyamide. The diamine has a boiling point higher than a melting point of the middle-stage polyamide being produced under inner pressures of the first polymerizer. The middle-stage polyamide is fed into a continuous second polymerizer while controlling the change of relative viscosity within ±0.2, and further polycondensed there to produce the objective polyamide. With such a process, the change of polymerization degree of the middle-stage polyamide during the switching of the polymerization step from a batch-wise manner to a continuous manner is avoided, thereby preventing the variation in quality of the final product.
    Type: Grant
    Filed: January 8, 2002
    Date of Patent: December 2, 2003
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kazumi Tanaka, Takatoshi Shida, Hideyuki Kurose
  • Patent number: 6653433
    Abstract: A polyimide film that exhibits improved peel strength when clad with a metal layer is prepared by reacting a polyamic acid polymer and an esterified polyamic acid oligomer. The esterified oligomer has from two to twenty repeating units and at least two crosslinkable groups selected from the group consisting of carbonyl, cyano, hydroxy, alkyne, maleimide, norbornene and sulfonyl groups. The polyamic acid is dissolved in a solvent to form a polyamic acid solution, which has a minimum gel-film forming temperature, or a minimum green film forming temperature, associated therewith. The esterified polyamic acid oligomer has an imidization temperature, which is higher than the minimum gel-film forming temperature, or the minimum green film forming temperature, of the polyamic acid solution.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: November 25, 2003
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: James Richard Edman, Meredith Lynn White
  • Patent number: 6642348
    Abstract: The present invention provides PMR-type polyimides that exhibit lower melt viscosities than PMR-type polyimides of the prior art. These PMR-type polyimides are created by incorporating flexible linkages, such as kinked structures and twisted or non-coplanar moietes into the backbone structure of the PMR. Specifically, the present invention provides for the production of PMR-type polyimides having 2,2′-disubstituted biaryls in the polymer backbone.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: November 4, 2003
    Assignee: The University of Akron
    Inventors: Ronald Eby, Michael Meador, Christopher Gariepy
  • Patent number: 6642347
    Abstract: Amine-terminated hyperbranched quinoxaline-amide polymers having repeating units of the formula: are useful to initiate bismaleimide polymerization and to increase the toughness of thermosets such as BMI and epoxies.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: November 4, 2003
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Jong-Beom Baek, Loon-Seng Tan, John B. Ferguson
  • Patent number: 6639042
    Abstract: New hyperbranched polymers having repeating units of the formula The polymer is prepared by the polymerization of the AB2 monomer N-{3,5-bis(4-hydroxybenzoyl)benzene}-4-fluoroisophthalimide.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: October 28, 2003
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Jong-Beom Baek, Loon-Seng Tan
  • Publication number: 20030199664
    Abstract: A process for producing alkali metal polymaleimide salts by alkaline hydrolysis of maleimide polyners prepared by polymerization of maleimide monomers in the presence of a metal oxide and alcohol initiator or a base. In particular, the process produces alkali metal polymaleimide salts with particular ratios of C—N and C—C connected maleimide-derived monomer units which are dependent on the particular initiator used to synthesize the maleimide polymer. The alkali metal polymaleimide salts, which have chelating and anti-scaling properties, are useful as chelating agents and detergent builders and as such are suitable biodegradable replacements for synthetic polymers and sodium polyaspartate.
    Type: Application
    Filed: April 19, 2002
    Publication date: October 23, 2003
    Applicants: Board of Trustees of Michigan State University, Applied CarboChemicals
    Inventors: Kris A. Berglund, Parminder Agarwal, Qiuyue Yu, Adam Harant
  • Publication number: 20030187179
    Abstract: A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.
    Type: Application
    Filed: January 3, 2003
    Publication date: October 2, 2003
    Inventors: Min Zou, Jenq-Tain Lin
  • Publication number: 20030181626
    Abstract: A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solution under imidization conditions to form an insoluble reactive polyimide and to effect substantially complete distillation of the water of reaction out of the reaction solution; and separating the insoluble reactive polyimide from the reaction solution to form a reactive friable polyimide powder.
    Type: Application
    Filed: March 19, 2002
    Publication date: September 25, 2003
    Inventor: Martin John Lindway
  • Publication number: 20030176602
    Abstract: A process which allows for the preparation of a substantially uniform hydrogel, such as a polyacrylamide hydrogel, wherein the uniformity of the hydrogel, in terms of the rheological properties, is established by limiting the temperature differential in the reaction process to a very narrow range, such as no more than 5° C. This process allows for polymers novel in their uniformity also by means of being suitably a continuous process. A continuous process for the preparation of a substantially uniform hydrogel, such as a polyacrylamide hydrogel, led to high uniformity by preventing unreacted monomers, such as acrylamide, from surpassing the gel front in the pipe reactor. This was achieved by use of a static mixer. Polymer hydrogels are rendered biocompatible by means of a novel washing process wherein the polymer specific surface area is appropriately set.
    Type: Application
    Filed: August 26, 2002
    Publication date: September 18, 2003
    Inventors: Richard Schmidt, Robert Lessel, Jens-Erik Sorensen
  • Patent number: 6620503
    Abstract: A nonwoven web and method of preparing a novel nonwoven web of synthetic fiber are disclosed. An aqueous solution amide crosslinked synthetic precursor polymer is extruded under defined conditions through a plurality of die orifices to form a plurality of threadlines. The threadlines are attenuated with a defined primary gaseous source to form fiber under conditions of controlled macro scale turbulence and under conditions sufficient to permit the viscosity of each threadline, as it leaves a die orifice and for a distance of no more than about 8 cm, to increase incrementally with increasing distance from the die, while substantially maintaining uniformity of viscosity in the radial direction, at a rate sufficient to provide fiber having the desired attenuation and mean fiber diameter without significant fiber breakage. The attenuated threadlines are dried with a defined secondary gaseous source. The resulting fibers are deposited randomly on a moving foraminous surface to form a substantially uniform web.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: September 16, 2003
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Jian Qin, Yong Li, Wendy Lynn Van Dyke, Anthony John Wisneski, Palani Raj Ramaswami Wallajapet, Hannong Rhim
  • Patent number: 6610815
    Abstract: Disclosed is a polyamide ester which comprises a plurality of specific amide ester recurring units including, in a specific ratio, recurring units containing a tetravalent benzene group and recurring units containing a tetravalent diphenyl ether group, and which is adapted to be converted to a polyimide in a coating form by heat-curing, wherein the polyimide coating exhibits a residual stress of 33 MPa or less as measured with respect to a 10 &mgr;m-thick polyimide coating formed on a silicon substrate. Also disclosed is a polyamide ester composition comprising a plurality of different polyamide esters, wherein the plurality of different polyamide esters collectively contain, in a specific ratio, the recurring units containing a tetravalent benzene group and the recurring units containing a tetravalent diphenyl ether group.
    Type: Grant
    Filed: June 21, 2001
    Date of Patent: August 26, 2003
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Keiko Hata, Yoko Tanizaki, Yoshio Matsuoka
  • Publication number: 20030158370
    Abstract: A process of preparing a polyimide of the present invention comprises effecting an imidization reaction of a diamine and a tetracarboxylic dianhydride in a solvent containing 50 to 100% by weight of an equimolar composition of a nitrogen-containing cyclic compound indicated by chemical formula (1) below and a phenol indicated by chemical formula (2) below: 1
    Type: Application
    Filed: September 13, 2002
    Publication date: August 21, 2003
    Inventors: Takashi Kuroki, Atsushi Shibuya, Shoji Tamai
  • Patent number: 6608169
    Abstract: An antistatic molded resin article based on polyesteramide has a low resistivity even when a substantive amount of electrically conductive additive is not used. The molded article is prepared by copolymerizing (a) a cyclic amide and (b1) cyclic ester or a mixture of cyclic ester (b1) and at least one linear ester (b2) selected from polyesterpolyol, polyesteretherpolyol or polycabonatepolyol. The surface resistivity is less than 1013&OHgr;.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: August 19, 2003
    Assignee: DSM N.V.
    Inventor: Motoji Abe
  • Publication number: 20030153719
    Abstract: Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide.
    Type: Application
    Filed: October 29, 2002
    Publication date: August 14, 2003
    Inventor: Takashi Kato
  • Publication number: 20030149222
    Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).
    Type: Application
    Filed: January 23, 2003
    Publication date: August 7, 2003
    Applicant: DAINIPPON INK AND CHEMICALS, INC
    Inventors: Eiju Ichinose, Yohzoh Yamashina, Hidenobu Ishikawa
  • Publication number: 20030149221
    Abstract: An optically active poly(N-&agr;-methylbenzylmaleimide) represented by the following formula (1): 1
    Type: Application
    Filed: November 13, 2002
    Publication date: August 7, 2003
    Applicant: TOSOH CORPORATION
    Inventor: Tsutomu Oishi
  • Patent number: 6600006
    Abstract: A polyamic ester prepared by partially substituting hydrogen atoms of carboxylic groups of a polyamic acid with acid labile groups, the polyamic ester comprising one or more repeating units represented by Formula 1, and each of at least one terminal of the polyamic ester molecule terminates with the same or different reactive end-capping monomer: wherein in Formula 1, R1 and R2 are independently a hydrogen atom, or an acid labile group; X is a tetravalent, an aromatic or an aliphatic organic group; Y is a divalent, an aromatic or an aliphatic organic group; and m is an integer equal to or greater than 1.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: July 29, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung Sup Jung, Sung Kyung Jung, Yong Young Park, Bong Seok Moon, Bong Kyu Kim
  • Patent number: 6596838
    Abstract: The invention relates to a semi-permeable membrane separation process and device in which the said membranes comprise sulphonated polyimides. The present invention also relates to the use of sulphonated polyimide membranes in separation processes and devices using semi-permeable membranes.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: July 22, 2003
    Assignees: Commissariat A l'Energie Atomique, Centre National de la Recherche
    Inventors: Michel Pinery, Gérald Pourcelly, Régis Mercier
  • Patent number: 6589662
    Abstract: A composite film having an excellent heat resistance is disclosed. The composite film according to the present invention comprises a substrate film and polyimide membrane(s) formed on at least one surface of the substrate film, which polyimide membrane(s) is(are) prepared by applying a solution of a solvent-soluble polyimide whose main chain is formed by polycondensation of one or more tetracarboxylic dianhydrides and one or more diamines and by drying the solution. The solvent-soluble polyimide comprises bicyclo(2,2,2)oct-7-ene-2,3,5,6-tetracarboxylic dianhydride as at least a part of the tetracarboxylic dianhydride(s) and/or at least one of 3,5-diaminobenzoic acid and a diaminosiloxane derivative as at least a part the diamine(s).
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: July 8, 2003
    Assignee: Pi R&D Co., Ltd.
    Inventors: Hiroshi Itatani, Shunichi Matsumoto
  • Patent number: 6586555
    Abstract: This invention provides processes of the preparation of polyamides, polyimides, and polyamideimides, which are easy to purify after reactions, from polycarboxylic acids and polyamines in high yield without side reactions such as a change of color to black by direct polycondensation reaction with heat, especially processes of preparing aromatic polyamides (aramids), aromatic polyimides, and aromatic polyamideimides, which are difficult to synthesize in direct polycondensation reaction. Polyamides, polymides, and polyamideimides are prepared in high yield by the polycondensation of aromatic dicarboxylic acids, aromatic tetracarboxylic acids or aromatic tricarboxylic acids and aromatic diamines, using arylboric acids such as 3,4,5-trifluorophenylboric acids as polycondensation catalysts, in a mixed solvent of pentamethylbenzene and N-methylpyrrolidinone or a mixed solvent of m-terphenyl and N-butylpyrrolidinone.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: July 1, 2003
    Assignee: Japan Science and Technology Corporation
    Inventors: Kazuaki Ishihara, Hisashi Yamamoto
  • Patent number: 6586559
    Abstract: The present invention relates to new polyamide oligomers. These oligomers can be conjugated to lipids, nucleic acids, peptides, proteins, etc. The oligomer-lipid conjugates can be used to form liposomes, virusomes, micelles, etc., optionally containing drugs or biological agents. The polyamide oligomers are heterobifunctional allowing the attachment of other suitable ligand compounds (e.g., a targeting moiety). In addition, methods of use for the liposomes, virusomes, micelles, etc., are provided.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: July 1, 2003
    Assignee: Inex Pharmaceuticals Corporation
    Inventor: Steven Michial Ansell
  • Patent number: 6586561
    Abstract: Sulfonated polyimide polymers incorporating bulky monomers are disclosed. The polymers have a liquid crystalline structure and exhibit high conductivity, high water uptake and water stability over a range of relative humidities and temperatures. The polymers are particularly adapted for use as a polymer electrolyte membrane in fuel cells.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: July 1, 2003
    Assignee: Case Western Reserve University
    Inventors: Morton H. Litt, Robert F. Savinell, Jesse S. Wainright, Yue Zhang
  • Patent number: 6583255
    Abstract: High performance polyester sulfone oligomers are prepared for aerospace applications by condensing mono- or difunctional crosslinkable end caps (i.e. unsaturated hydrocarbons having one or two crosslinking sites) with dicarboxylic acid halides and dialcohols (i.e. diols). Multidimensional oligomers have an aromatic hub from which the polyester chains radiate. Blends of the linear and multidimensional oligomers can be made using compatible, non-crosslinking polymers. Prepregs and composites are formed from the oligomers or blends.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: June 24, 2003
    Assignee: The Boeing Company
    Inventors: Hyman R. Lubowitz, Clyde H. Sheppard
  • Publication number: 20030109669
    Abstract: An oriented polyimide film of high strength and a production process therefor. The process basically comprises stretching a gelled film and then imidating the film. The gelled film is formed by introducing a polyamic acid solution into a condensation agent solution. The gelled film is swollen with a solvent at the time of stretching.
    Type: Application
    Filed: October 17, 2002
    Publication date: June 12, 2003
    Inventors: Jiro Sadanobu, Rei Nishio, Susumu Honda, Tsutomu Nakamura
  • Publication number: 20030109666
    Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
    Type: Application
    Filed: August 1, 2002
    Publication date: June 12, 2003
    Applicant: Loctite Corporation
    Inventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna