Halogen-containing Material Is A Reactant Patents (Class 528/174)
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Patent number: 5354839Abstract: A polyimide comprising a requisite structural unit having one or more recurring structural units of the formula: ##STR1## such as the structural units of the formula ##STR2## The polyimide can have an extremely low dielectric constant and is colorless, transparent and excellent in processability and heat resistance, and also provides an aromatic diamine which is useful as a raw material monomer of the polyimide or a raw material of other various engineering plastics.Type: GrantFiled: March 31, 1993Date of Patent: October 11, 1994Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Wataru Yamashita, Yoshihiro Sakata, Toshiyuki Kataoka, Yuichi Okawa, Hideaki Oikawa, Tadashi Asanuma, Mitsunori Matsuo, Tsutomu Ishida, Keizaburo Yamaguchi, Akihiro Yamaguchi
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Patent number: 5344910Abstract: Polycarbonate resins containing repeating or recurring polymer chain units of the formula: ##STR1## wherein R represents alkyl are useful in high temperature applications, when thermoplastically molded into articles.Type: GrantFiled: March 23, 1993Date of Patent: September 6, 1994Assignee: General Electric CompanyInventor: Paul D. Sybert
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Patent number: 5342905Abstract: A two step process for the preparation of an ester group-containing polyether sulfone is disclosed. In the first step a dihalogenodiphenyl sulfone is reacted with excess amount of an aromatic dihydroxy compound and in a second step the reaction product is reacted with a dicarboxylic acid derivative. The excess amount of the aromatic dihydroxy compound is that amount which is sufficient to react with said derivative to form the corresponding ester. The process of the invention is characterized by its economics and good yield and by the high purity of the product. The thus produced polyether sulfone is useful as a thermoplastic resin and as a reactant in the melt blending process for the preparation of block copolymers.Type: GrantFiled: January 29, 1993Date of Patent: August 30, 1994Assignee: Miles Inc.Inventors: Robert J. Kumpf, Aaron D. Meltzer, Harald Pielartzik
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Patent number: 5340904Abstract: A compound or polymer having a bis(phenoxy)naphthalene structure, a high molecular weight, and very good mechanical performance and heat-resistivity is provided. The polymer can be polyamides, polyimides or poly(amide-imide)s and can have a basic structure of ##STR1## wherein R1 is a naphthalene ring.Type: GrantFiled: December 29, 1992Date of Patent: August 23, 1994Assignee: National Science CouncilInventors: Chin-Ping Yang, Wen-Tung Chen
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Patent number: 5338821Abstract: Benzofuran-ether-sulphone monomers of formula ##STR1## and ether ketone polymers derived therefrom of formula ##STR2##Type: GrantFiled: April 26, 1993Date of Patent: August 16, 1994Assignee: Raychem LimitedInventor: Ian D. H. Towle
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Patent number: 5326834Abstract: An autoclavable container comprising a poly(aryl ether) resin capable of withstanding at least 1000 cycles of steam sterilization at a stress level of 500 psi without stress-crack failure, said steam sterilization cycle conducted for 30 min. at 270.degree. F. and 27 psi using aqueous morpholine at a concentration of 50 ppm.Type: GrantFiled: May 27, 1993Date of Patent: July 5, 1994Assignee: Amoco CorporationInventors: Marvin E. Sauers, Barry L. Dickinson
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Patent number: 5324813Abstract: Low dielectric constant polyimides formed from an optionally fluorinated dianhydride and a fluorinated diamine are described. The fluorine containing constituents are sterically disposed so that the dipole moment of the constituents tend to cancel out. Since fluorine containing diamines are generally nonreactive, to achieve a polyimide of high enough molecular weight to be practically useful, a method of fabrication of a high molecular weight polymer from monomers of low reactivity is provided. The monomers, such as a diamine and dianhydride are provided in a solution within which a low molecular weight polyamic acid is formed. The solution is dried. The polyamic acid used is cured to a low molecular weight polyimide. The polyimide is redisolved, redryed and recured enough times to build up the molecular weight to a useful level. The method is applicable to fabricating other polymers of high molecular weight, such as polyamides, polyesters and polyurethanes.Type: GrantFiled: July 22, 1992Date of Patent: June 28, 1994Assignee: International Business Machines CorporationInventors: Gareth G. Hougham, Jane M. Shaw, Alfred Viehbeck
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Patent number: 5322919Abstract: A process for producing polycarbonates which comprises transesterifying by reacting (A) at least one compound selected from the group consisting of aromatic dihydroxy compounds, aliphatic dihydroxy compounds, bisesters of aromatic dihydroxy compounds, bisesters of aliphatic dihydroxy compounds, carbonates of aromatic dihydroxy compounds and carbonates of aliphatic dihydroxy compounds, with (B) at least one compound selected from the group of diaryl carbonates, dialkyl carbonates, and alkylaryl carbonates, at a transesterification temperature of 100.degree. C. to 330.degree. C. in the presence of an inert solvent in an amount of 1 to 60% by weight based on the total of the theoretical amount of polycarbonate produced from the said compounds (A) and (B) and the amount of the inert solvent. According to the present invention, a polycarbonate which is excellent in color tone (transparency), heat resistance, and water resistance can be efficiently and simply produced at a low cost.Type: GrantFiled: November 20, 1991Date of Patent: June 21, 1994Assignee: Idemitsu Petrochemical Co., Ltd.Inventors: Kouichi Kurosawa, Shigeki Kuze, Noriyuki Kunishi, Masaya Okamoto
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Patent number: 5322924Abstract: Addition polyimide resins having improved thermo-oxidative stability and enhanced processability are prepared by the reaction of a mixture of monomers comprising a non-planar polyphenyl diamine (a), a diester of tetracarboxylic acid or the corresponding dianhydride (b) and an end-capping agent (c), or a diamine (d), a non-planar polyphenyl diester or dianhydride of a tetracarboxylic acid (e) and an end-capping agent (c).Type: GrantFiled: October 7, 1991Date of Patent: June 21, 1994Assignee: The United States of America as represented by the United States National Aeronautics and Space AdministrationInventors: Chun-Hua K. Chuang, Raymond D. Vannucci
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Patent number: 5321115Abstract: A process for preparing a halogenated polycarbonate wherein phenolic-terminated, halogenated carbonate oligomers are prepared in the presence of a coupling catalyst, and are then condensed by contact with a carbonate precursor.Type: GrantFiled: June 7, 1993Date of Patent: June 14, 1994Assignee: The Dow Chemical CompanyInventors: Maurice J. Marks, John K. Sekinger
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Patent number: 5321116Abstract: A process for preparation of a random copolycarbonate from an ortho-substituted dihydric phenol and a non-ortho-substituted dihydric phenol.Type: GrantFiled: April 5, 1993Date of Patent: June 14, 1994Assignee: The Dow Chemical CompanyInventors: Maurice J. Marks, Thoi H. Ho
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Patent number: 5319065Abstract: There is provided a process for producing a polycarbonate resin containing less amounts of a terminal OH group and a residual monomer and having excellent heat resistance efficiently with a simple equipment. Said process comprises emulsifying an oligomer-containing reaction mixture obtained by the reaction of an alkaline aqueous solution of an aromatic dihydroxy compound with phosgene in the presence of an organic solvent, after adding a molecular weight modifier thereto, and performing polymerization while the reaction mixture is allowed to stand still in the emulsified state.Type: GrantFiled: April 19, 1993Date of Patent: June 7, 1994Assignee: Teijin Chemicals, Ltd.Inventors: Shinji Kikumoto, Hiroki Okuyama, Akiyoshi Manabe, Hidekazu Ito
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Patent number: 5317078Abstract: Di(hydroxyphenyl)benzimidazole monomers were prepared from phenyl-4-hydroxybenzoate and aromatic bis(o-diamine)s. These monomers were used in the synthesis of soluble polybenzimidazoles. The reaction involved the aromatic nucleophilic displacement of various di(hydroxyphenyl)benzimidazole monomers with activated aromatic dihalides or activated aromatic dinitro compounds in the presence of an alkali metal base. These polymers exhibited lower glass transition temperatures, improved solubility, and better compression moldability over their commercial counterparts.Type: GrantFiled: October 30, 1991Date of Patent: May 31, 1994Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: John W. Connell, Paul M. Hergenrother, Joseph G. Smith
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Patent number: 5310863Abstract: Copolyamic acids carrying -CF3 group functionalized aromatic segments in the polymer chain derived from aromatic diamines and dianhydrides with linear-rigid-planar structure interrupted by linear-rigid-noncoplanar segments structure and the corresponding copolyimides films are provided. These copolyimides have low in-plane thermal coefficient of expansion, reduced anisotropy in the optical and dielectric properties, low moisture uptake, and improved polyimide-to-polyimide adhesion.Type: GrantFiled: January 8, 1993Date of Patent: May 10, 1994Assignee: International Business Machines CorporationInventor: Krishna G. Sachdev
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Patent number: 5310856Abstract: A heat-resistant and high-transparence polyesterimide composition is disclosed which is prepared from the reaction of: (a) an imidihydroxycarboxylic acid represented by the following formula: ##STR1## (b) at least one dicarboxylic, such as terephthalic acid or isophthalic acid, or mixture thereof, and (c) at least one dihydroxy compound represented by the following formula: ##STR2## Wherein Y can be --C(CH.sub.3).sub.2 --, --SO.sub.2 --, --CH(CH.sub.3)--, --(CH.sub.2).sub.m --, where m in an integer of 1 to 10, --O--, or --S--; X can be H, Cl, or Br; and n is an integer of 0 to 4. The polyesterimide resins disclosed in this invention also exhibit improved fabricability due to their improved solubility in organic solvents, and improved mechanical strength.Type: GrantFiled: January 11, 1993Date of Patent: May 10, 1994Assignee: Industrial Technology Research InstituteInventor: Chien-Hui Li
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Patent number: 5306789Abstract: Amorphous polymers which are soluble in organic solvents and can thus be cast as films have high glass transition temperatures which make them suitable for numerous high temperature applications; the polymers comprise ortho aromatic polyketones, polyphthalazines and polyisoquinolines, the polyphthalazines and polyisoquinolines being readily formed from the polyketones.Type: GrantFiled: October 31, 1990Date of Patent: April 26, 1994Inventors: Allan S. Hay, Rina Singh
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Patent number: 5306802Abstract: Disclosed herein is a polycarbonate copolymer comprising repeating units respectively made of a bisphenol A and a tetrahalogenobisphenol A and having a trihalogenophenoxy group as an end group at the terminal, particularly both terminals thereof and a method for efficiently producing said polycarbonate copolymer. This polycarbonate copolymer is superior in impact resistance, flame retardance, molding thermostability and the like, is good in hydrolytic resistance, is much less liable to cause a mold rust and has high quality. Therefore, this polycarbonate copolymer will be extensively used in various industrial materials, for example as the flame retardant parts for household electric appliances, office automation apparatuses and the like.Type: GrantFiled: March 15, 1993Date of Patent: April 26, 1994Assignee: Idemitsu Petrochemical Co., Ltd.Inventors: Ryozo Okumura, Shigeki Kuze, Noriyuki Kunishi
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Patent number: 5304626Abstract: A chemical resistant copolymer useful in electronic applications, said copolymer is a polyimide containing a 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moiety, at least one other dianhydride moiety, and at least one diamine.Type: GrantFiled: September 13, 1991Date of Patent: April 19, 1994Assignee: Amoco CorporationInventors: Marvin J. Burgess, Douglas E. Fjare, Herbert J. Neuhaus
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Patent number: 5304627Abstract: Novel polyimides containing pendent siloxane groups (PISOX) were prepared by the reaction of functionalized siloxane compounds with hydroxy containing polyimides (PIOH). The pendent siloxane groups on the polyimide backbone offer distinct advantages such as lowering the dielectric constant and moisture resistance and enhanced atomic oxygen resistance. The siloxane containing polyimides are potentially useful as protective silicon oxide coatings and are useful for a variety of applications where atomic oxygen resistance is needed.Type: GrantFiled: November 2, 1992Date of Patent: April 19, 1994Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: John W. Connell, Terry L. St. Clair, Paul M. Hergenrother
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Patent number: 5302692Abstract: The diamine, 1,3-diamino-5-pentafluorosulfanylbenzene (DASP), was reacted with various dianhydrides to form polyimides containing an SF.sub.5 moiety. These polyimides exhibit high glass transition temperatures, high density, low solubility, and low dielectric properties. These polymers were used to prepare semi-permeable membranes, wire coatings, and films and are useful for electronic, space and piezoelectric applications.Type: GrantFiled: May 27, 1993Date of Patent: April 12, 1994Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdminstrationInventors: Anna K. St. Clair, Terry L. St. Clair
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Patent number: 5300623Abstract: A method is provided for making polycarbonate by phosgenating a mixture of bisphenol and phenolic chain-stopper under interfacial reaction conditions in the presence of a phase transfer catalyst. A polycarbonate is obtained which is substantially free of diarylcarbonate.Type: GrantFiled: May 24, 1993Date of Patent: April 5, 1994Assignee: General Electric CompanyInventors: Eugene P. Boden, Peter D. Phelps
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Patent number: 5300622Abstract: Heterocyclic bis(4-hydroxyphenyl)cycloalkanes, as illustrated by 4,4-bis(4-hydroxyphenyl)thiopyran and the corresponding acetylated piperidine, may be prepared by the reaction of bisphenol A or a similar compound with the corresponding thiopyranone or piperidone. The thio compound may be oxidized to the corresponding sulfone. Polycarbonates prepared from said heterocyclic bis(4-hydroxyphenyl)cycloalkanes have high glass transition temperatures and are expected to be ductile.Type: GrantFiled: December 11, 1992Date of Patent: April 5, 1994Assignee: General Electric CompanyInventor: John C. Schmidhauser
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Patent number: 5300625Abstract: Polyethers which contain recurring units of the formula I ##STR1## in which A is a divalent aryl or heteroaryl radical,X is O, S or NR,Z is a divalent aryl or heteroaryl radical or an alkynyl, azo or (CF.sub.2) group, andR is arylare synthesized. The polyethers can be used as thermoplastics for the production of injection-molded articles, extrudates, polymer blends and coatings and for the production of films and membranes from solution.Type: GrantFiled: January 10, 1992Date of Patent: April 5, 1994Assignee: Hoechst AktiengesellschaftInventors: Brigitte Helmreich, Klaus Burger, Gerhard Maier, Reinhold Hecht, Oskar Nuyken
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Patent number: 5300624Abstract: A method is provided for making flame retardant polycarbonates by phosgenating a mixture of bisphenols having up to about 50 mole % of tetrahalobisphenols, such as tetrabromobisphenols. There is employed a mixture of a phase transfer catalyst and a tertiary organic amine to provide high molecular weight copolymer without excessive phosgene usage.Type: GrantFiled: May 24, 1993Date of Patent: April 5, 1994Assignee: General Electric CompanyInventors: Eugene P. Boden, Peter D. Phelps
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Patent number: 5298590Abstract: The present invention relates to a liquid crystal alignment treating agent which comprises a polyimide resin prepared from a diamine including an aromatic diamine having at least one linear alkyl group of at least 6 carbon atoms per benzene ring as the essential component and a tetracarboxylic acid and its derivative.The liquid crystal alignment treating agent obtained in accordance with the present invention comprises a polyimide resin having an alkyl group on a side chain, and accordingly provides a liquid crystal-aligned film containing liquid crystal molecules stably having an enhanced inclined alignment angle (tilt angle) to a substrate.Type: GrantFiled: August 13, 1992Date of Patent: March 29, 1994Assignee: Nissan Chemical Industries Ltd.Inventors: Hideyuki Isogai, Toyohiko Abe, Yoshihiro Tsuruoka, Hiroyoshi Fukuro
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Patent number: 5298592Abstract: A process for preparing polyaryl ethers of the formula I or Ia ##STR1## by condensation of at least one appropriate bisphenol with at least one appropriate aromatic dichloride in the presence of an alkali metal carbonate in a dipolar aprotic solvent, is carried out in the presence of a catalyst selected from the alkali metal nitrites and the group of compounds of the formula II ##STR2## where r.sup.1 and r.sup.3 are each hydrogen, C.sub.7 -C.sub.16 -phenylalkyl, C.sub.1 -C.sub.12 -alkoxy, fluorine, chlorine, bromine, iodine or nitro, and R.sup.2 is nitro or nitroso, or ##STR3## where R.sup.4 is hydrogen, C.sub.1 -C.sub.4 alkyl, fluorine, chlorine, bromine or iodine.Type: GrantFiled: August 20, 1992Date of Patent: March 29, 1994Assignee: BASF AktiengesellschaftInventors: Alexander Aumueller, Wolfgang Eberle, Gerhard Heinz, Bernd Hupfeld, Christiane Husemann, Juergen Koch, Helmut Reichelt
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Patent number: 5290906Abstract: A poly(arylene ether ketone) of this invention principally comprises recurring units represented by formula ##STR1## wherein Ar.sup.1 denotes a 1,5-naphthalene ring, a 2,6-naphthalene ring, a 2,7-naphthalene ring or a combination of them, and Ar.sup.2 denotes p-phenylene, p,p'-biphenylene, a 1,5-naphthalene ring, a 2,6-naphthalene ring, a 2,7-naphthalene ring or a combination of them.The poly(arylene ether ketone) is high in second-order transition temperature and excellent in solvent resistance and moldability, and can be molded into heat-resistant fibers and electric insulating films.Type: GrantFiled: January 23, 1991Date of Patent: March 1, 1994Assignee: Teijin LimitedInventors: Shunichi Matsumura, Seiji Itoh, Hiroo Inata, Jiro Sadanobu
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Patent number: 5290908Abstract: Aromatic polyimides with acetylenic end groups are cured by coupling together thermally or catalytically using cuprous salts as catalysts to increase molecular weight with little or no by-product formation. These polyimides can be shaped and formed prior to the coupling.The acetylenic end-capped aromatic polyimides are formed by the reaction of an aromatic dianhydride, an acetylenic organic monoamine compound which will provide the reactive end groups and optionally an aromatic diamine.Type: GrantFiled: January 24, 1975Date of Patent: March 1, 1994Assignee: The University of Notre Dame du LacInventor: Gaetano F. D'Alelio
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Patent number: 5288834Abstract: Bromomethyl derivatives of polyaryl ether ketones are obtained by brominating methyl derivatives of the ketones preferably with elemental bromine, optionally under UV light. The bromomethyl derivatives are useful as intermediates for further functionalization of the aromatic polyether ketones. The functionalized derivatives, depending on the substituent, exhibit different properties than the basic polymer, for example increased hydrophilicity and solubility.Type: GrantFiled: March 25, 1993Date of Patent: February 22, 1994Assignee: National Research Council of CanadaInventors: Jacques Roovers, Fei Wang, Michael Guiver
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Patent number: 5286841Abstract: This invention concerns novel fluorine-containing diamines, polyamides and polyimides. The compounds are useful in the formation of moisture resistant films, fibers and shaped articles.Type: GrantFiled: September 14, 1992Date of Patent: February 15, 1994Assignee: E. I. Du Pont de Nemours and CompanyInventors: Brian C. Auman, Andrew E. Feiring
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Patent number: 5283314Abstract: A process for producing a branched polycarbonate comprising reacting a dihydric phenol, such as 2,2-bis(4-hydroxyphenyl) propane, a polyfunctional organic compound, such as 1,1,1-tris-(4-hydroxyphenyl)ethane, and phosgene to produce a polycarbonate oligomer, and then polycondensing with stirring the polycarbonate oligomer with a dihydric phenol, such as 2,2-bis(4-hydroxyphenyl) propane, and a monohydric phenol, such as p-tert butylphenol, whereby the interfacial area of the resultant emulsion is not less than 40 m.sup.2 /L.Type: GrantFiled: March 12, 1993Date of Patent: February 1, 1994Assignee: Idemitsu Petrochemical Co., Ltd.Inventors: Shigeki Kuze, Hideo Kusuyama, Masayuki Shinohara, Masaya Okamoto
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Patent number: 5281690Abstract: Base-soluble release layer compositions for microlithographic processing, comprising nonamic acid functionalized polyamic acid/imide resins are disclosed. These materials permit concurrent lithographic development of photoresist and release layers. They also afford effective lift-off, by alkaline media, even after high imidization.Type: GrantFiled: March 30, 1989Date of Patent: January 25, 1994Assignee: Brewer Science, Inc.Inventors: Tony Flaim, James E. Lamb, III, Gregg Barnes, Terry Brewer
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Patent number: 5276129Abstract: Disclosed herein are processes for the production of polycarbonates by melt polycondensation of an aromatic dihydroxy compound and a carbonic acid diester or a diphenyl carbonate compound wherein said polycondensation is carried out in the presence of from 0.05 to 15 mol %, based on 1 mole of the aromatic dihydroxy compound, of a phenol having from 10 to 40 carbon atoms, a carbonic acid diester having from 17 to 50 carbon atoms or a carbonic acid diester having from 13 to 16 carbon atoms, using a catalyst comprising (a) a nitrogen containing basic compound, (b) from 10.sup.-8 to 10.sup.-3 mole, based on 1 mole of the aromatic dihydroxy compound, of an alkali metal or alkaline earth metal compound, and (c) boric acid or boric ester. Also disclosed is a polycarbonate in which from 5 to 30% of its terminal groups are hydroxy groups and it has a sodium content of not more than 1 ppm and a chlorine content of not more than 20 ppm.Type: GrantFiled: June 19, 1992Date of Patent: January 4, 1994Assignee: GE Plastics Japan, Ltd.Inventors: Takeshi Sakashita, Tomoaki Shimoda
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Patent number: 5272248Abstract: A process for preparing polyamides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15% by weight of additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.Type: GrantFiled: May 22, 1992Date of Patent: December 21, 1993Assignee: The United States of America as Represented by the United States National Aeronautics and Space AdministrationInventors: J. Richard Pratt, Terry L. St. Clair, Diane M. Stoakley, Harold D. Burks
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Patent number: 5270435Abstract: Polyarylene ethers which, based on the total amount of the structural units present in the polyether resin, contain 2-100 mol % of a recurring structural unit of formula I ##STR1## and 0-98 mol % of a recurring structural unit of formula II wherein each a is 1 or 2, 10 to 100% of X, based on the total number of the bonds X present in the structural units of formulae I and II, are --SO.sub.2 --, and 0 to 90% of X are --CO--, and A is a group of formula IIIa-IIIg: ##STR2## wherein Y is --CH.sub.2 --, --C(CH.sub.3).sub.2 --, --C(CF.sub.3).sub.2 --, --S--, --SO--, --SO.sub.2 --, --O-- or --CO--, and the aromatic rings in the structural units of formulae I and II are unsubstituted or substituted by one or more alkyl groups of 1 to 4 carbon atoms, have good solubility in organic solvents and are suitable preferably for modifying other plastics materials or for use as matrix resins for the production of fibrous composite structures.Type: GrantFiled: January 9, 1992Date of Patent: December 14, 1993Assignee: Ciba-Geigy CorporationInventors: Rudolf Pfaendner, Thomas Kainmuller, Kurt Hoffmann, Andreas Kramer, Friedrich Stockinger
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Patent number: 5270432Abstract: Polybenzoxazoles (PBO) are prepared by the aromatic nucleophilic displacement reaction of novel di(hydroxyphenyl)benzoxazole monomers with activated aromatic dihalides or activated aromatic dinitro compounds. The polymerizations are carried out in polar aprotic solvents, such as N-methylpyrrolidine or N,N-dimethylacetamide, using alkali metal bases, such as potassium carbonate, at elevated temperatures under nitrogen. The novel di(hydroxyphenyl)benzoxazole monomers are synthesized by reacting phenyl-4-hydroxybenzoate with aromatic bis(o-aminophenol)s in the melt. High molecular weight PBO of new chemical structures are prepared that exhibit a favorable combination of physical and mechanical properties. The use of the novel di(hydroxyphenyl)benzoxazoles permits a more economical and easier way to prepare PBO than previous routes.Type: GrantFiled: April 10, 1992Date of Patent: December 14, 1993Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Paul M. Hergenrother, John W. Connell, Joseph G. Smith, Jr.
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Patent number: 5270438Abstract: A fluorine-containing polyimide having a low dielectric constant, low water absorption and excellent heat resistance and moisture resistance and a precursor thereof such as a fluorine-containing polyamide-acid, can be prepared by reacting an acid anhydride with an aromatic diamine having perfluoroalkyl group.Type: GrantFiled: April 3, 1991Date of Patent: December 14, 1993Assignee: Hitachi Chemical Company, Ltd.Inventors: Masami Yusa, Shinji Takeda, Yasuo Miyadera
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Patent number: 5264538Abstract: Cyclic poly(aryl ether) oligomers and mixtures thereof, and methods for the preparation thereof in a highly dilute reaction medium under reaction conditions favorable for ring closure at low degrees of polymerization. These oligomers are represented by the general formula ##STR1## where each Y is divalent oxygen or divalent sulfur, each Ar is an aromatic diradical which comprises one or more C.sub.6 to C.sub.20 arylene groups and has at least one electron withdrawing group attached to an aromatic ring, and n is an integer from 1 to about 20 with the proviso that for integer values of n equal to 1 or 2 all linkages between independent aromatic rings comprise at least one atom.Type: GrantFiled: June 27, 1990Date of Patent: November 23, 1993Assignee: The Dow Chemical CompanyInventors: Michael J. Mullins, Edmund P. Woo, Kimberly E. Balon, Daniel J. Murray, Cheng-Cheng C. Chen
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Patent number: 5264520Abstract: This invention is a process for the preparation of poly(aryl ethers) from cyclic poly(aryl ether) oligomers. These low melt viscosity cyclic oligomers undergo ring opening and chain extension upon heating in the presence of a catalyst, forming high molecular weight linear polymers with no coproduct formation. Finished thermoplastic parts and composites may be prepared using this technology with processing techniques normally restricted to thermosetting monomers.Type: GrantFiled: July 3, 1990Date of Patent: November 23, 1993Assignee: The Dow Chemical CompanyInventors: Michael J. Mullins, Edmund P. Woo
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Patent number: 5264537Abstract: Novel polyiminocarbonates having molecular weights exceeding 70,000 daltons. Novel solution polymerization and interfacial polymerization processes for the preparation of polyiminocarbonates in which cyanate compounds are reacted with diphenol compounds in the presence of a strong base catalyst.Type: GrantFiled: March 5, 1992Date of Patent: November 23, 1993Assignee: Rutgers, The State UniversityInventors: Joachim B. Kohn, Chun Li
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Patent number: 5262515Abstract: A curable fluorine-containing polyimide of the formula: ##STR1## wherein R.sup.1 is a group derived from an aromatic tetracarboxylic acid dianhydride by the removal of two acid anhydride groups,R.sup.2 is a group derived from an aromatic diamine by the removal of two amino groups,A.sup.1 is a residue of the formula: ##STR2## (wherein R.sup.2 is the same as defined above, and Z is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms),A.sup.2 is a residue of the formula: ##STR3## (wherein R.sup.1 and Z are the same as defined above), and n is a number of 0 to 90, and at least one of the groups R.sup.1 and R.sup.Type: GrantFiled: July 10, 1990Date of Patent: November 16, 1993Assignee: Daikin Industries, Ltd.Inventors: Motonobu Kubo, Tsutomu Kobayashi
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Patent number: 5260388Abstract: A heat-resistant and thermoplastic polyimide which has low dielectric characteristics and recurring structural units of the following formula ##STR1## wherein R is a tetravalent radical having from 2 to 27 carbon atoms and selected from the group consisting of an aliphatic radical, alicyclic radical, monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member; aromatic diamines which are useful for the raw material monomers of the polyimide and have following formulas: ##STR2## and ##STR3## and a process for preparing the polyimide of the above formula by reacting these aromatic diamines with a tetracarboxylic dianhydride in the presence of an aromatic dicarboxylic anhydride or aromatic monoamine, and successively thermally or chemically imidizing the resultant polyamic acid.Type: GrantFiled: June 8, 1992Date of Patent: November 9, 1993Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Shoji Tamai, Wataru Yamashita, Yuichi Okawa, Yuko Ishihara, Keizaburo Yamaguchi, Akihiro Yamaguchi
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Patent number: 5260410Abstract: Radiation-sensitive polymers contain, in the polymer main chain, both acid-labile groups and onium salt groups with nonnucleophilic counterions and are suitable for the production of semiconductor structural elements.Type: GrantFiled: March 2, 1992Date of Patent: November 9, 1993Inventor: Reinhold Schwalm
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Patent number: 5260408Abstract: Polyimide compositions, films, and electronic devices using polyimides, based on 9,9-bis(perfluoroalkyl)xanthene-2,3,6,7-tetracarboxylic dianhydride or 9-aryl-9(perfluoroalkyl)xanthene-2,3,6,7-tetracarboxylic dianhydride and 3,3',4,4'-biphenyl tetracarboxylic dianhydride or 2,2-bis(3,4-carboxyphenyl)hexafluoropropane dianhydride and benzidine derivatives which offer a combination of desirable properties including, low linear coefficient of thermal expansion, low moisture absorption, high glass transition temperature, low dielectric constant, and improved tensile elongation.Type: GrantFiled: October 29, 1991Date of Patent: November 9, 1993Assignee: E. I. Du Pont de Nemours and CompanyInventor: Brian C. Auman
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Patent number: 5258485Abstract: New and useful aromatic polyethers, which are high in glass transition temperatures, possess excellent mechanical properties, thermal resistance, solvent resistance, and generate fluorescence, are described. Also described are fluorescent resin compositions containing the aromatic polyethers. Processes for preparing the aromatic polyethers and the fluorescent resin compositions are also described.Type: GrantFiled: June 2, 1992Date of Patent: November 2, 1993Assignee: Idemitsu Kosan Company LimitedInventors: Shigeru Matsuo, Naoto Yakoh, Shinji Chino
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Patent number: 5247050Abstract: A new class of polymers is provided as well as the monomers used for their preparation. The polymers provided in accordance with practice of the present invention include repeating units comprising one or more quinoline groups, wherein at least a portion of the repeating units includes a hexafluoroisopropylidene (6F) group or a 1-aryl-2,2,2-trifluoroethylidene (3F) group, or both.The hexafluoroisopropylidene group is referred to herein as a "6F" group and has the following structure: ##STR1## The "6F" group includes a tetravalent carbon atom bound to two trifluoromethyl moieties with its other two bonds forming linkages in the polymer chain.the 1-aryl-2,2,2-trifluoroethylidene group is referred to herein as "3F" group and has the following structure: ##STR2## wherein Ar' is an aryl group. The "3F" group comprises a tetravalent carbon atom bound to one trifluoromethyl moiety and one aryl group with its other two bonds forming linkages in the polymer chain.Type: GrantFiled: August 13, 1991Date of Patent: September 21, 1993Assignee: Maxdem IncorporatedInventor: Neil H. Hendricks
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Patent number: 5245001Abstract: The present invention relates to aminoarylsulfonic acid-phenol-formaldehyde condensate useful for incorporation into cementing compositions, for example, mortar, cement paste and the like, for improving slumping characteristics.Type: GrantFiled: October 9, 1991Date of Patent: September 14, 1993Assignee: Fujisawa Pharmaceutical Co., Ltd.Inventors: Takahiro Furuhashi, Kazushige Kawada, Susumu Tahara, Toru Takeuchi, Yuji Takahashi, Toshikazu Adachi, Tsutomu Teraji
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Patent number: 5243024Abstract: Improved imide-containing copolymers comprising, in the aromatic diamine component, p-phenylene diamine and at least one additional aromatic diamine have increased rigidity and useful processability. The copolymers of this invention also may exhibit improved resistance to the detrimental effects of humid environments and retain mechanical properties at elevated temperatures after exposure to humid environments.Type: GrantFiled: December 21, 1990Date of Patent: September 7, 1993Assignee: Amoco CorporationInventors: Ronald E. Bockrath, Edward J. Gordon
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Patent number: RE34464Abstract: A two-step process to make a poly(arylene sulfide sulfone) polymer exhibiting improved high temperature properties is described. In the first step a prepolymer characterized as dihalo-terminated polyethersulfone oligomers is prepared by reacting an aromatic diphenol with an excess of a dihalo aromatic sulfone. In the second step the excess dihalo aromatic sulfone and the oligomers are copolymerized in the presence of a sulfur source to form a poly(arylene sulfide sulfone)polymer. An alkali metal carboxylate is present in the second step. The polymers exhibit improved softening temperature and glass transition temperature and are useful in high temperature applications.Type: GrantFiled: December 17, 1992Date of Patent: November 30, 1993Assignee: Phillips Petroleum CompanyInventors: James T. Edmonds, Jr., Jon Geibel, Rex L. Bobsein, Jim J. Straw
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Patent number: RE34563Abstract: Copolycondensate molding materials are obtainable by polycondensation offrom 2 to 98 mol % of 2,2-di-(4'-hydroxyphenyl)-propane (A),from 2 to 98 mole % of 4,4'-dihydroxydiphenyl sulfone (B) andfrom 0 to 96 mole % of (C) ##STR1## where R.sup.1 and R.sup.2 are each H, C.sub.1 -C.sub.6 -alkyl or C.sub.1 -C.sub.6 -alkoxy, X is a chemical bond, --S--, --O--, --CO--, CR.sup.3 R.sup.4 (where R.sup.3 and R.sup.4 are different when n and p are each 0), or SO.sub.2 -- only when n or p is .Iadd.not .Iaddend.0), R.sup.3 and R.sup.4 are each H, C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, aryl or halogen-substituted alkyl of 1 to 4 carbon atoms, m is 0 or 1, and n and p are each 0, 1, 2, 3, or 4,with from 1 to 100 mole % of (D) ##STR2## where R.sup.5 and R.sup.6 have the same meaning as R.sup.1 and R.sup.2, and v and w are each 0, 1, 2, 3 or 4, and from 0 to 99 mol % of (E) ##STR3## where R.sup.7 -R.sup.10 are each Cl or F or have the same meanings as R.sup.1 and R.sup.Type: GrantFiled: May 15, 1992Date of Patent: March 15, 1994Assignee: BASF AktiengesellschaftInventor: Gerhard Heinz