Polymerizing In The Presence Of A Specified Material Other Than A Reactant And Other Than Group Ia Or Group Iia Material As Sole Metal Atom Patents (Class 528/179)
  • Patent number: 8974903
    Abstract: Porous cross-linked polyimide-urea networks are provided. The networks comprise a subunit comprising two anhydride end-capped polyamic acid oligomers in direct connection via a urea linkage. The oligomers (a) each comprise a repeating unit of a dianhydride and a diamine and a terminal anhydride group and (b) are formulated with 2 to 15 of the repeating units. The subunit was formed by reaction of the diamine and a diisocyanate to form a diamine-urea linkage-diamine group, followed by reaction of the diamine-urea linkage-diamine group with the dianhydride and the diamine to form the subunit. The subunit has been cross-linked via a cross-linking agent, comprising three or more amine groups, at a balanced stoichiometry of the amine groups to the terminal anhydride groups. The subunit has been chemically imidized to yield the porous cross-linked polyimide-urea network. Also provided are wet gels, aerogels, and thin films comprising the networks, and methods of making the networks.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: March 10, 2015
    Assignees: Ohio Aerospace Institute, The United States of America, represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Mary Ann B. Meador, Baochau N. Nguyen
  • Patent number: 8907042
    Abstract: A polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound of the formula MO—Z—OM wherein M is an alkali metal salt and Z is an aromatic C6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof, with a bis(halophthalimide) composition comprising, based on the weight of the bis(halophthalimide) composition, from more than 45 to less than 75 weight percent of a 3,3?-bis(halophthalimide) of the formula less than 10 weight percent of a 3,4?-bis(halophthalimide) of the formula and from more than 45 to less than 75 weight percent of a (4,4?-bis(halophthalimide) of the formula
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: December 9, 2014
    Assignee: Sabic Global Technologies B.V.
    Inventors: Matthew L. Kuhlman, Gurulingamurthy M. Haralur
  • Publication number: 20140224124
    Abstract: Provided are cardo copolybenzimidazoles, a gas separation membrane using the same and a method for preparing the same. More particularly, provided are cardo copolybenzimidazoles obtained by introducing cardo groups and aromatic ether groups to a polybenzimidazole backbone, a gas separation membrane having significantly improved oxygen permeability by using the same, and a method for preparing the same. The cardo copolybenzimidazoles have improved solubility as compared to the polybenzimidazole polymers according to the related art, show excellent mechanical properties while maintaining thermal stability so as to be formed into a film shape, and provide a gas separation membrane having significantly improved gas permeability, particularly, oxygen permeability.
    Type: Application
    Filed: May 13, 2013
    Publication date: August 14, 2014
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyoung-Juhn KIM, Jun Young HAN, Jong Hyun JANG, Eun Ae CHO, Jonghee HAN, Suk Woo NAM, Tae-Hoon LIM, Sung Pil YOON, Sung Jong YOO, Dirk HENKENSMEIER
  • Patent number: 8778815
    Abstract: A method of forming a polyimide film on a surface of a substrate by dehydration condensation of a first monomer including a bifunctional acid anhydride and a second monomer including a bifunctional amine is disclosed. The method includes loading the substrate into a processing chamber, heating the substrate at a temperature at which a polyimide film is formed, and performing a cycle a predetermined number of times. The cycle comprises supplying a first processing gas containing the first monomer to the substrate, supplying a second processing gas containing the second monomer to the substrate. The method further includes supplying a replacement gas in the processing chamber between supplying the first processing gas and supplying the second processing gas thereby replacing atmosphere in the processing chamber by the replacement gas, and evacuating the first and/or the second processing gas out of the processing chamber.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: July 15, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Tatsuya Yamaguchi, Reiji Niino
  • Publication number: 20140088247
    Abstract: A crosslinkable aromatic polyester that is formed by polymerizing certain precursor monomers in the presence of a biaromatic crosslinking agent is provided. The crosslinkable aromatic polyester can have a relatively high melting temperature. For example, the melting temperature of the crosslinkable polyester may be from about 200° C. to about 370° C. While having a relatively high melting temperature, the crosslinkable polyester can maintain a relatively low melt viscosity so that it can be readily removed from the polymerization reactor without solidifying therein.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 27, 2014
    Applicant: Ticona LLC
    Inventor: Kamlesh P. Nair
  • Patent number: 8618245
    Abstract: The present invention relates to an obtainment process of biodegradable polymers from a citric residue resulting from the processing of orange juice. The polymers obtained are polyesters classified as polyhydroxyalkanoates including, among them the poly(3-hydroxybutyrate) and poly(3-hydroxybutyrate-co-3-hydroxyvalerate). The biodegradable polymer is obtained from the batch culture process or fed batch culture process with or without recirculation of the cells, using as a carbon source the pre-treated pressing liquor and/or the citric molasses. The polyhydroxyalkanoates, herein described, can be used as substitutes of the synthetic polyesters in different areas, including the food, pharmaceutical, medical, agricultural and other areas.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: December 31, 2013
    Assignees: Citrosuco S/A Agroindustria, Universidade Federal de Santa Catarina
    Inventors: Glaucia Maria Falcão de Aragão, Willibaldo Schimidell Netto, Jaciane Lutz Ienczak, Mônica Lady Fiorese, Francieli Dalcaton, Franciny Schmidt, Ricardo Deucher, Cinthia Vecchi, Rafael Costa Rodrigues
  • Patent number: 8445627
    Abstract: The invention provides new aliphatic diester-di-acid-containing PEA polymer compositions with significant improvement in hydrolytic degradation rates as compared to aliphatic di-acid-containing PEA polymers. The di-acids used in the invention PEA compositions include non-toxic fatty aliphatic homologs. These molecules inherently contain two-ester groups, which easily can be cleaved by biotic (enzymatic) and abiotic hydrolysis. Additional di-acid-type compounds useful for active polycondensation are ?,?-alkylene dicarboxylates composed of short aliphatic non toxic diols and di-acids. In addition, the invention PEA polymer compositions optionally can include a second monomer, such as a C-protected L-lysine-based monomer, to introduce additional chain flexibility into the polymer. The invention PEA polymer compositions are useful for delivery of bioactive agents when administered internally.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: May 21, 2013
    Assignee: Medivas, LLC
    Inventors: Ramaz Katsarava, Natia Mazanashvili, Zaza D. Gomurashvili, Turner Daniel Jenkins, Nino Mchedlishvili
  • Patent number: 8357753
    Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: January 22, 2013
    Assignee: CDA Processing Limited Liability Company
    Inventors: John D. Summers, Thomas Eugene Dueber
  • Patent number: 8030437
    Abstract: A method for forming a polyimide composite article utilizes a polyimide resin system including at least a first prepolymer component and a second prepolymer component. A preform structure is tackified with the first prepolymer component. Using resin infusion or resin transfer molding techniques, the tackified preform structure is contacted with the second prepolymer component. The polyimide resin system is cured under suitable cure conditions so that the first and second prepolymer components mix and react to produce the polyimide composite structure.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: October 4, 2011
    Assignee: General Electric Company
    Inventors: Stephen Mark Whiteker, Lisa Vinciguerra Shafer, Warren Rosal Ronk
  • Patent number: 7964698
    Abstract: The benefits of liquid crystal polymers and polyetherimides are combined in an all-aromatic thermoplastic liquid crystalline polyetherimide. Because of the unique molecular structure, all-aromatic thermotropic liquid crystal polymers exhibit outstanding processing properties, excellent barrier properties, low solubilities and low coefficients of thermal expansion in the processing direction. These characteristics are combined with the strength, thermal, and radiation stability of polyetherimides.
    Type: Grant
    Filed: November 5, 2007
    Date of Patent: June 21, 2011
    Assignee: United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Erik S. Weiser, Theodorus J. Dingemans, Terry L. St. Clair, Jeffrey A. Hinkley
  • Patent number: 7923525
    Abstract: A polyester resin and a fabrication method thereof are provided. The fabrication method includes providing a diphenol monomer and a diacid monomer. The diphenol monomer is acetylated and then melt pre-polymerized with diacid monomer to form a pre-polymer. Then, the pre-polymer is polymerized by solid state polymerization to form a heat-resistant and transparent polyester resin.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: April 12, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Hsiang Lin, Hsin-Ching Kao
  • Patent number: 7794706
    Abstract: The present invention provides wound dressings, optionally surgically implantable, containing biodegradable, polymers and hydrogels having allogenic or autologous precursor cells, such as stem cells and progenitor cells dispersed within. Alternatively, the wound dressings can have conditioned medium obtained from the precursor cells dispersed within. The wound dressings promote tissue restoration processes at a site of application or implantation. Additional bioactive agents can also be dispersed within the polymer/hydrogel matrix, which can be formulated to biodegrade at a controlled rate by adjusting the composition. Methods are also provided for using such biodegradable wound dressings as a delivery device or carrier for the precursor cells, conditioned medium and bioactive agents, or as coatings on implantable medical devices, to promote tissue restoration at a lesion site.
    Type: Grant
    Filed: April 26, 2007
    Date of Patent: September 14, 2010
    Assignee: Medivas, LLC
    Inventors: Kenneth W. Carpenter, William G. Turnell, Kristin M. DeFife, Kathryn A. Grako, Ramaz Katsarava
  • Publication number: 20100197883
    Abstract: A polyester resin and a fabrication method thereof are provided. The fabrication method includes providing a diphenol monomer and a diacid monomer. The diphenol monomer is acetylated and then melt pre-polymerized with diacid monomer to form a pre-polymer. Then, the pre-polymer is polymerized by solid state polymerization to form a heat-resistant and transparent polyester resin.
    Type: Application
    Filed: May 18, 2009
    Publication date: August 5, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Hsiang Lin, Hsin-Ching Kao
  • Patent number: 7737244
    Abstract: The present invention relates to a process for preparing polyarylate, and more specifically, to a process for preparing polyarylate by interfacial polymerization of a bivalent phenol compound and an aromatic dicarboxylic acid or a halide thereof, which comprises mixing a cationic catalyst for the phase transition and a nonionic surfactant in a predetermined ratio, to further increase the yield of polyarylate, as compared with the case of using each of the nonionic surfactant and the cationic catalyst for the phase transition alone.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: June 15, 2010
    Assignee: LG Chem, Ltd.
    Inventors: Dae-Woo Nam, Dong-Ryul Kim, Hyo-Sun Lee, Boong-Goon Jeong, Sang-Uk Ryu, Hee-Jung Kim, Ju-Eun Cha
  • Patent number: 7605222
    Abstract: Copolyetherimides compositions having high glass transition temperatures and outstanding ductility are presented. The copolyetherimides having Mw of at least 40,000 comprising isomeric bis(phthalimide) structural units within a relatively narrow range of isomer proportions exhibited Tgs of at least 240° C. and outstanding Notched Izod values. The copolyetherimides comprise oxydianiline residues and structural units of the formulas (I) and (II) (III).
    Type: Grant
    Filed: August 22, 2005
    Date of Patent: October 20, 2009
    Assignee: SABIC Innovative Plastics IP B.V.
    Inventors: Qing Ye, David Bruce Hall, William David Richards, Daniel Joseph Brunelle, Havva Yagci Acar
  • Patent number: 7544445
    Abstract: A polymer electrolyte membrane comprising a microporous polymer membrane having pores penetrating through the opposite sides thereof. The microporous polymer membrane holds a mixture of a polymer and a molten salt at a weight ratio of 1/99 to 99/1 and/or a molten salt. The polymer electrolyte membrane is inexpensive, durable, excellent in mechanical strength, excellent in structural retention in high temperatures, and capable of stably holding a molten salt in its porous polymer membrane structure, shows high heat resistance, and secures high ionic conductivity in the absence of water or a solvent and is therefore useful in fuel cells, secondary batteries, electric double layer capacitors, electrolytic capacitors, and the like.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: June 9, 2009
    Assignee: Ube Industries, Ltd.
    Inventors: Masayuki Kinouchi, Tetsuji Hirano, Nobuharu Hisano
  • Publication number: 20090081466
    Abstract: Provided herein are a phenolic hydroxyl group-containing aromatic polyamide resin and a resin composition containing the resin, such as an epoxy resin composition containing an epoxy resin. The phenolic hydroxyl group-containing aromatic polyamide resin has a structure represented by the following formula (1): wherein m and n are average values satisfying the following formula: 0.005?n/(m+n)<0.05, m+n is a positive value of 2 to 200, Ar1 is a bivalent aromatic group, Ar2 is a phenolic hydroxyl group-containing bivalent aromatic group, and Ar3 is a bivalent aromatic group. Such a phenolic hydroxyl group-containing aromatic polyamide resin has a low ionic impurity content and improved adhesive properties as well as excellent properties inherent in conventional phenolic hydroxyl group-containing aromatic polyamide resins, such as the ability to allow a cured epoxy resin composition to have excellent flexibility, electrical properties, flame retardancy, and the like.
    Type: Application
    Filed: July 19, 2006
    Publication date: March 26, 2009
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Kazunori Ishikawa, Makoto Uchida, Yasumasa Akatsuka
  • Publication number: 20090036635
    Abstract: A promoter for a polycondensation reaction used together with a catalyst in a polycondensation reaction, the promoter for a polycondensation reaction comprising a pyrogallol compound having a benzene ring of which three hydrogen atoms adjacent to each other are substituted by hydroxyl groups; and a polycondensation resin obtained by polycondensing raw material monomers using the promoter as defined above and the catalyst. A polycondensation resin can be produced using the promoter of the present invention together with a catalyst in a polycondensation reaction, and the polycondensation resin can be used in various applications including, for example, films, sheets, fibers, toner materials for electrophotography, and the like.
    Type: Application
    Filed: July 3, 2008
    Publication date: February 5, 2009
    Applicant: KAO CORPORATION
    Inventors: Eiji SHIRAI, Yoshitomo Kimura, Yasunori Inagaki, Takashi Kubo, Naoki Morita, Ryo Koike, Hiromi Iida
  • Patent number: 7408018
    Abstract: The invention provides elastomeric copolyester amides, elastomeric copolyester urethanes, and methods for making the same. The polymers are based on ?-amino acids and possess physical, chemical and biodegradation properties that render them suitable for use in the human body. The polymers are useful as carriers of drugs or other bioactive substances. The polymers can also be linked, intermixed, or a combination thereof, to one or more drugs. Additionally, the polymers can be used to coat stents, for example, to suppress restenosis. Furthermore, the biodegradation of the copolyester amides and copolyester urethanes allows for the delivery of essential ?-amino acids to sites in the body, for example, to facilitate wound repair of injured tissues.
    Type: Grant
    Filed: October 5, 2006
    Date of Patent: August 5, 2008
    Assignee: Cornell Research Foundation, Inc.
    Inventors: Chih-Chang Chu, Ramaz Katsarava
  • Patent number: 7402650
    Abstract: A process for preparing polyarylate wherein a bivalent phenol compound having the structure of Formula 1 and an aromatic dicarboxylic acid halogen compound react to prepare a polyarylate, and wherein a nonionic surface-active agent is added. This decreases residual salts and improves the transmittance and the heat-resistance. In Formula 1, R1, R2, R3 and R4 denote the same as illustrated in the description.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: July 22, 2008
    Assignee: LG Chem, Ltd.
    Inventors: Hee-jung Kim, Dong-ryul Kim, Sang-uk Ryu, Sang-hyun Park
  • Publication number: 20080076902
    Abstract: A method is provided for reducing the color generated during production of copolycarbonate that includes quinone-type residues. The method includes the steps preparing a reaction mixture containing precursors of monomer residues, selecting a catalyst, introduction strategy and adding catalysts according to the strategy. The strategy is sufficient to result in a product copolycarbonate with improved color. The method further includes the steps of introducing the reaction mixture to a series of process units and allowing the reaction mixture to polymerize thereby forming a copolycarbonate. The resulting copolycarbonate has improved color as compared to a copolycarbonate formed in a process without the steps of selecting a catalyst introduction strategy and introducing catalysts according to the selected strategy.
    Type: Application
    Filed: January 20, 2005
    Publication date: March 27, 2008
    Inventors: Jan Henk Kamps, Jan Pleun Lens
  • Patent number: 7304122
    Abstract: The present invention provides elastomeric copolyester amides, elastomeric copolyester urethanes, and methods for making the same. The polymers that are based on ?-amino acids and possess suitable physical, chemical and biodegradation properties. The polymers are useful as carriers of drugs or other bioactive substances. The polymers can be linked, intermixed, or a combination thereof, to one or more drugs.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: December 4, 2007
    Assignee: Cornell Research Foundation, Inc.
    Inventors: Chih-Chang Chu, Ramaz Katsarava
  • Patent number: 7211639
    Abstract: A thermoplastic composition includes a functionalized poly(arylene ether) and a copolymer of (a) ethylene or an ?-olefin, and (b) an alkyl(meth)acrylate. Optional components in the composition include an impact modifier and a flame retardant. The composition is useful for fabricating wire and cable insulation.
    Type: Grant
    Filed: October 3, 2003
    Date of Patent: May 1, 2007
    Assignee: General Electric Company
    Inventors: Gary William Yeager, Bryan Duffey
  • Patent number: 7169878
    Abstract: A diamine compound represented by the formula (1): wherein R1 is a trivalent organic group, each of X1 and X2 is a bivalent organic group, X3 is an alkyl or fluoroalkyl group having from 1 to 22 carbon atoms, or a cyclic substituent selected from aromatic rings, aliphatic rings, heterocyclic rings and their substituted groups, and n is an integer of from 2 to 5. And, a polyimide precursor and a polyimide synthesized by using the diamine compound; and a treating agent for liquid crystal alignment containing the polyimide precursor and/or the polyimide.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: January 30, 2007
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuyoshi Hosaka, Hideyuki Nawata
  • Patent number: 7148314
    Abstract: A method for preparation of a sulfonic and or sulfonic acid salt containing polyimide resins comprising melt reaction of a polyimide resin with an organic compound, wherein the organic compound contains at least one aliphatic primary amine functionality and at least one other functionality selected from the group consisting of sulfonic acids, sulfonic acid salts or mixtures thereof.
    Type: Grant
    Filed: July 7, 2004
    Date of Patent: December 12, 2006
    Assignee: General Electric Company
    Inventors: Robert R. Gallucci, Tara J. Smith
  • Patent number: 7135540
    Abstract: The invention provides a polyhydroxyalkanoate having a bromo group in a unit and being thermally stable and capable of arbitrarily controlling physical properties, and a producing method thereof. According to the invention, there are provided a polyhydroxyalkanoate copolymer including a 3-hydroxy-?-bromoalkanoic acid unit represented by a formula—[OCH((CH2)nBr)CH2C(O)]— (n=1 to 8) (1) and a unit represented by a formula —[OCH((CH2)mR)CH2C(O)]— (2) within a same molecule, and a method for producing a polyhydroxyalkanoate copolymer by microorganisms, utilizing a ?-bromoalkanoic acid represented by a formula Br(CH2)pCH2CH2COOH (p=1 to 8) (20) and a compound represented by a formula R(CH2)qCH2CH2COOH (21) as raw materials.
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: November 14, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tsutomu Honma, Shinya Kozaki, Takeshi Imamura, Takashi Kenmoku, Tatsuki Fukui, Etsuko Sugawa, Tetsuya Yano
  • Patent number: 7129318
    Abstract: Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than about 200° C. and melt viscosities at 200° C. of less than about 3000 centipoise. A process for synthesizing the inventive resins is also provided, as is a fiber-reinforced composite material. The fiber-reinforced composite material employs the inventive polyimide resin as its resin matrix and demonstrates good heat resistance and mechanical properties.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: October 31, 2006
    Assignee: I.S.T. (MA) Corporation
    Inventors: Gary L. Deets, Jianming Xiong
  • Patent number: 7090925
    Abstract: A material for dielectric films is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1): wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y1, Y2, Y3 and Y4 are the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; an aromatic polyamine represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R1 and R2 are each a substituent bound to Ring Z, are the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, in which the adamantanepolycarboxylic acid and aromatic polyamine are dissolved in the solvent
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: August 15, 2006
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Shinya Nagano, Jiichiro Hashimoto, Kiyoharu Tsutsumi, Yoshinori Funaki
  • Patent number: 7078477
    Abstract: In the process of the present invention, a solvent-soluble polyimide is produced by polycondensing at least one tetracarboxylic acid component with at least one diamine component in a solvent in the presence of a tertiary amine. The tetracarboxylic acid component is selected from the group consisting of tetracarboxylic dianhydrides represented by the following formula 1: wherein R is as defined in the specification, and tetracarboxylic acids and their derivatives represented by the following formula 2: wherein R and Y1 to Y4 are as defined in the specification. Unlike the conventional techniques using an excessively large amount of a chemical imidation agent such as acetic anhydride and a chemical imidation catalyst such as triethylamine, in the process of the present invention, the solvent-soluble polyimide having a high polymerization degree is easily produced in a solvent with good productivity by using only a catalytic amount of the tertiary amine.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: July 18, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Hiroki Oguro, Shuta Kihara, Tsuyoshi Bito
  • Patent number: 7074880
    Abstract: A preparation process of polyimide aerogels that composed of aromatic dianhydrides and aromatic diamines or a combined aromatic and aliphatic diamines is described. Also descried is a process to produce carbon aerogels derived from polyimide aerogel composed of a rigid aromatic diamine and an aromatic dianhydride. Finally, the processes to produce carbon aerogels or xerogel-aerogel hybrid, both of which impregnated with highly dispersed transition metal clusters, and metal carbide aerogels, deriving from the polyimide aerogels composed of a rigid aromatic diamine and an aromatic dianhydride, are described. The polyimide aerogels and the polyimide aerogel derivatives consist of interconnecting mesopores with average pore size at 10 to 30 nm and a mono-dispersed pore size distribution. The gel density could be as low as 0.008 g/cc and accessible surface area as high as 1300 m2/g.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: July 11, 2006
    Assignee: Aspen Aerogels, Inc.
    Inventors: Wendell Rhine, Jing Wang, Redouane Begag
  • Patent number: 7074882
    Abstract: The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represents a bivalent organic group.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: July 11, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Takami Hikita, Hisae Sugihara, Amane Mochizuki
  • Patent number: 7070966
    Abstract: The invention relates to an enzymatic-chemical method for obtaining polyhydroxyalkanoates (PHA), especially polyhydroxybutyrate (PHB), or the copolymers thereof, from biomass. The inventive method comprises chemically treating the biomass with a reducing agent that reduces the non-PHA cell components of the biomass. The chemical treatment is carried out before and/or after enzymatic cell disruption. The inventive method allows, unlike other cell disruption techniques, for obtaining polyhydroxyalkanoates from biomass with a relatively low PHA content (for example <60%) without drastically changing or deteriorating the polymer properties or polymer purity.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: July 4, 2006
    Assignee: UFZ Umweltforschungszentrum Leipzig-Halle GmbH
    Inventors: Dirk Schumann, Roland Arno Müller
  • Patent number: 7071282
    Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected from hydrogen and C1–C6 alkyl groups; “A” comprises structural units of the formulae: or mixtures of the foregoing structural units; wherein “D” is a divalent aromatic group, R3 and R10–R12 are independently selected from hydrogen, halogen, and C1–C6 alkyl groups; “q” is an integer having a value of 1 up to the number of positions available on the aromatic ring for substitution; and “W” is a linking group; and “B” comprises substituted and unsubstituted arylene groups having from about 6 to about 25 carbon atoms. Methods for producing the polyetherimide compositions are also disclosed herein.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: July 4, 2006
    Assignee: General Electric Company
    Inventors: Havva Acar, Daniel Joseph Brunelle
  • Patent number: 7026436
    Abstract: The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C. The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: April 11, 2006
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: Kuppusamy Kanakarajan
  • Patent number: 7022810
    Abstract: A new class of hybrid organic-inorganic materials, and methods of synthesis, that can be used as a proton exchange membrane in a direct methanol fuel cell. In contrast with Nafion® PEM materials, which have random sulfonation, the new class of materials have ordered sulfonation achieved through self-assembly of alternating polyimide segments of different molecular weights comprising, for example, highly sulfonated hydrophilic PDA-DASA polyimide segment alternating with an unsulfonated hydrophobic 6FDA-DAS polyimide segment. An inorganic phase, e.g., 0.5–5 wt % TEOS, can be incorporated in the sulfonated polyimide copolymer to further improve its properties. The new materials exhibit reduced swelling when exposed to water, increased thermal stability, and decreased O2 and H2 gas permeability, while retaining proton conductivities similar to Nafion®. These improved properties may allow direct methanol fuel cells to operate at higher temperatures and with higher efficiencies due to reduced methanol crossover.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: April 4, 2006
    Assignee: Sandia Corporation
    Inventor: Christopher J. Cornelius
  • Patent number: 7019103
    Abstract: A terminal-crosslinkable polyamic acid oligomer having 1) heat resistance indicated by Tg of 300° C. or more and a pyrolysis temperature of 500° C. or more, 2) toughness, and 3) capability of allowing an increase in concentration. The polyamic acid oligomer is obtained by reacting an aromatic tetracarboxylic dianhydride including 2,2?,3,3?-biphenyltetracarboxylic dianhydride, an aromatic diamine compound, and a reactive crosslinking agent including an amino group or acid anhydride group and a crosslinkable group in the molecule, and includes a crosslinkable group at the molecular terminal.
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: March 28, 2006
    Assignees: JSR Corporation, Ube Industries, Ltd.
    Inventors: Rikio Yokota, Kohei Goto, Hideki Ozawa
  • Patent number: 7015304
    Abstract: This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3?,4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1–60 poise at 260–280° C. When the imide oligomer melt is cured at about 371° C. in a press or autoclave under 100–500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (Tg) equal to and above 310° C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232–280° C. (450–535° F.) without any solvent.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: March 21, 2006
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Chun-Hua Chuang
  • Patent number: 6979721
    Abstract: This invention relates to polyimides having improved thermal-oxidative stability, to the process of preparing said polyimides, and the use of polyimide prepolymers in the preparation of prepregs and composites. The polyimides are particularly useful in the preparation of fiber-reinforced, high-temperature composites for use in various engine parts including inlets, fan ducts, exit flaps and other parts of high speed aircraft.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: December 27, 2005
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Mary Ann B. Meador, Aryeh A. Frimer
  • Patent number: 6956098
    Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: October 18, 2005
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: John Donald Summers, Richard Frederich Sutton, Jr., Brian Carl Auman
  • Patent number: 6927274
    Abstract: Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: wherein chemical structure A2 includes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.
    Type: Grant
    Filed: October 24, 2003
    Date of Patent: August 9, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Mamiko Nomura, Masatoshi Hasegawa, Junichi Ishii, Tadashi Akamatsu
  • Patent number: 6924348
    Abstract: A polyimide excelling in heat resistance, chemical resistance, water repellency, dielectric characteristics, electrical characteristics, and optical characteristics and a polyamide acid useful as the raw material therefor are provided. Specifically, a polyamide acid containing a chlorine atom and a fluorine atom and comprising a repeating unit represented by the following formula (1): (wherein X and X? independently denote a divalent organic group; Y and Y? independently denote a chlorine, bromine, or iodine atom; p and p? denote independently denote the number of fluorine atom {F in the formula (1)} bonded to the relevant benzene ring, representing an integer of 0-3; q and q? independently denote an integer of 0-3; and p+q total 3, and p?+q? total 3).
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: August 2, 2005
    Assignees: Nippon Shokubai Co., Ltd., NTT Advanced Technology Corporation
    Inventors: Kozo Tajiri, Masayoshi Kuwabara, Yasunori Okumura, Tohru Matsuura, Noriyoshi Yamada
  • Patent number: 6919422
    Abstract: A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: July 19, 2005
    Assignee: General Electric Company
    Inventors: Robert R Gallucci, Roy Ray Odle, William A. Kernick, III, Mark Alan Sanner
  • Patent number: 6919418
    Abstract: Methods of reducing the amount of undesirable cyclic oligomer by-products in the production of polyetherimides are disclosed. The resulting polyetherimides have enhanced thermomechanical properties.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: July 19, 2005
    Inventors: Farid Fouad Khouri, Daniel Joseph Brunelle, Donald Scott Johnson
  • Patent number: 6916898
    Abstract: A process of preparing a polyimide of the present invention comprises effecting an imidization reaction of a diamine and a tetracarboxylic dianhydride in a solvent containing 50 to 100% by weight of an equimolar composition of a nitrogen-containing cyclic compound indicated by chemical formula (1) below and a phenol indicated by chemical formula (2) below: in formula (1), X represents —CH2— or —N(CH3)—, and in formula (2), R1 and R2 may be the same as, or different from, each other and represent each any one of —H, —OH, —CH3, —C2H5, —C3H7, —C4H9, —C5H11, —C6H13, —C7H15, —C8H17, —C9H19, —C10H21, —OCH3, —O(C6H5), —NO2, —Cl, —Br and —F.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: July 12, 2005
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Takashi Kuroki, Atsushi Shibuya, Shoji Tamai
  • Patent number: 6911519
    Abstract: A series of low melting and low viscosity phenylethynyl end-capped polyimides (PETIs) possessed of long term thermal and mechanical stability useful as films, melt coatings, adhesives, matrix and RTM resins and particular as coatings for optical fibers and phenylethynyl end-capped bismides blended with PETIs are disclosed. Processes for their production including: 1) modification of PETI-5 oligomer by molecular weight adjustments by blending with reactive low melting phenylethynyl end-capped imide monomers, 2) modification of the PETI-5 backbone structure with other diamine components, and 3) modification of the PETI-5 backbone with bulky fluorinated groups are also disclosed.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: June 28, 2005
    Assignee: University of Connecticut
    Inventors: Daniel A. Scola, Christopher D. Simone
  • Patent number: 6908685
    Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: June 21, 2005
    Assignees: E. I. du Pont de Nemours and Company, DuPont-Toray Co. Ltd.
    Inventors: Kenji Uhara, Kouichi Sawasaki, Naofumi Yasuda, Brian C. Auman, John D. Summers
  • Patent number: 6890626
    Abstract: A polyimide-based polycondensate which may be used as an insulation film by coating a copper foil with the polycondensate and by heating the coated copper foil, which insulation film does not warp the foil, as well as a production process thereof, is disclosed. The polycondensate according to the invention is a solvent-soluble polycondensate containing a benzoxazole component having a carboxylic group and an imide component having a phenolic hydroxyl group, which is obtained by dehydration-condensing one or more tetracarboxylic dianhydrides with one or more aromatic diamines having an amino group and a phenolic hydroxyl group, the amino group and the phenolic hydroxyl group being located at ortho positions with respect to each other, by heating the one or more tetracarboxylic dianhydrides and the one or more aromatic diamines at 150° C. to 220° C. in the presence of an acid catalyst.
    Type: Grant
    Filed: November 8, 2000
    Date of Patent: May 10, 2005
    Assignee: PI R&D Co., Ltd.
    Inventors: Hiroshi Itatani, Shunichi Matsumoto
  • Patent number: 6891067
    Abstract: The present invention provides an optical polyimide precursor for use in making a polyimide. The precursor is defined by the following formula: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl, and A is a divalent aromatic or halogenated aromatic moiety. The present invention provides a method of preparing a diamine compound for use as an optical polyimide precursor. The method includes the steps of dissolving 2-chloro-5-nitrobenzotrifluoride and a diol in N,N-dimethylacetamide to form a solution, adding potassium carbonate, tert-butylammonium chloride and copper powder to said solution and heating the resulting mixture, removing the copper, precipitating and recrystallizing a dinitro-compound resulting from heating the mixture, and dissolving the dinitro-compound and reducing the dinitro-compound to yield a diamine compound.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: May 10, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee, Eun-Ji Kim, Jung-Hee Kim, Woo-Hyeuk Jang
  • Patent number: 6887580
    Abstract: An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250?C and a Young's modulus (storage modulus) at 250?C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270?C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: May 3, 2005
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Kiwamu Tokuhisa, Akira Tokumitsu, Kazuaki Kaneko
  • Patent number: RE43880
    Abstract: This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3?,4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1-60 poise at 260-280° C. When the imide oligomer melt is cured at about 371° C. in a press or autoclave under 100-500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (Tg) equal to and above 310° C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232-280° C. (450-535° F.) without any solvent.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: December 25, 2012
    Assignee: The United States of America as Represented by the Administrator of National Aeronautics and Space Administration
    Inventor: Chun-Hua Chuang