Silicon Reactant Contains A Silicon-to-hydrogen Bond Patents (Class 528/31)
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Patent number: 8487061Abstract: Provided is a process for making a saturated star hydrocarbon polymer. The process has the following steps: (A) hydrosilylating tetraethylene silicon with methyldichlorosilane in the presence of a hydrosilylating catalyst to form a chlorosilane dendrimer; (B) reacting the chlorosilane dendrimer with vinylmagnesium bromide in the presence of a lithium and/or organolithium initiator stepwise to build a higher generation chlorosilane dendrimer; (C) anionically polymerizing polybutadiene in the presence of a lithium and/or organolithium initiator to form living poly(butadienyl)lithium; (D) attaching the living poly(butadienyl)lithium to the higher generation dendrimer to form a star polybutadiene; and (E) hydrogenating the star polybutadiene to form the saturated star hydrocarbon polymer. There is also provided a saturated star hydrocarbon polymer made according to the above process and a polymer composition of a matrix ethylene polymer and the saturated star hydrocarbon polymer.Type: GrantFiled: May 17, 2011Date of Patent: July 16, 2013Assignee: ExxonMobil Research and Engineering CompanyInventors: Andy H. Tsou, Nikos Hadjichristidis, Pamela J. Wright, Johannes M. Soulages
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Patent number: 8481656Abstract: A silicone resin composition that exhibits low gas permeability and is suitable for encapsulating optical semiconductors. The composition includes: (A) an organopolysiloxane having a specific structure containing two or more alkenyl groups, (B) an organohydrogenpolysiloxane composed of two organohydrogenpolysiloxanes having specific structures, in which the mass ratio between the two organohydrogenpolysiloxanes is within a range from 10:90 to 90:10, in an amount that provides 0.4 to 4.0 mols of silicon atom-bonded hydrogen atoms within the component (B) per 1 mol of alkenyl groups within the component (A), and (C) an addition reaction catalyst.Type: GrantFiled: April 6, 2012Date of Patent: July 9, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tsutomu Kashiwagi, Yoshihira Hamamoto
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CURABLE SILICONE RESIN COMPOSITION WITH HIGH RELIABILITY AND OPTICAL SEMICONDUCTOR DEVICE USING SAME
Publication number: 20130161683Abstract: An optical semiconductor device that combines low gas permeability and high reliability. A curable silicone resin composition comprising: (A) an alkenyl group-containing organopolysiloxane comprising an organopolysiloxane represented by an average composition formula (1) and containing at least two alkenyl groups per molecule: (R1SiO3/2)a(R22SiO)b(R3R42SiO1/2)c ??(1) wherein R1 represents an alkyl group, R2 represents an aryl group, R3 represents an alkenyl group, and R4 represents an alkyl group or an aryl group, (B) an organohydrogenpolysiloxane represented by an average composition formula (2) and containing at least two silicon atom-bonded hydrogen atoms per molecule: R1dR2eHfSiO(4-d-e-f)/2 ??(2) wherein R1 and R2 are as defined above, and (C) an addition reaction catalyst.Type: ApplicationFiled: November 20, 2012Publication date: June 27, 2013Applicant: Shin-Etsu Chemical Co., Ltd.Inventor: Shin-Etsu Chemical Co., Ltd. -
Patent number: 8470937Abstract: Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst.Type: GrantFiled: May 26, 2011Date of Patent: June 25, 2013Assignee: Adeka CorporationInventors: Ken-ichiro Hiwatari, Isamu Yumoto
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Patent number: 8470952Abstract: The present invention relates to a composition for a thermosetting silicone resin, the composition including: (1) a dual-end silanol type silicone oil; (2) an alkenyl group-containing dialkoxyalkylsilane; (3) an organohydrogensiloxane; (4) a condensation catalyst; and (5) a hydrosilylation catalyst.Type: GrantFiled: December 22, 2010Date of Patent: June 25, 2013Assignee: Nitto Denko CorporationInventor: Mizuki Yamamoto
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Patent number: 8466248Abstract: The invention relates to emulsifier systems comprising organomodified siloxane block copolymers, their use, in particular the preparation of cosmetic, dermatological or pharmaceutical formulations, and of care and cleaning compositions, and also the products themselves prepared with the help of emulsifier systems.Type: GrantFiled: April 15, 2009Date of Patent: June 18, 2013Assignee: Evonik Goldschmidt GmbHInventors: Juergen Meyer, Frank Unger, Michael Ferenz, Sascha Herrwerth, Christian Hartung, Andrea Lohse
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Patent number: 8461284Abstract: Compositions and methods for controlled polymerization and/or oligomerization of hydrosilanes compounds including those of the general formulae SinH2n and SinH2n+2 as well as alkyl- and arylsilanes, to produce soluble silicon polymers as a precursor to silicon films having low carbon content.Type: GrantFiled: November 17, 2011Date of Patent: June 11, 2013Assignee: Kovio, Inc.Inventors: Dmitry Karshtedt, Joerg Rockenberger, Fabio Zürcher, Brent Ridley, Erik Scher
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Patent number: 8455604Abstract: Polysilanes, inks containing the same, and methods for their preparation are disclosed. The polysilane may have the formula H-[(AHR)n(c-AmHpm-2)q]—H, where A is independently Si or Ge; R is H, -AaHa+1Ra, halogen, aryl or substituted aryl; (n+a)?10 if q=0, q?3 if n=0, and (n+q)?6 if both n and q?0; p is 1 or 2; and m is from 3 to 12. The method may include combining a silane compound of the formula AHaR14-a, AkHgR1?h and/or c-AmHpmR1rm with a catalyst of the formula R4xR5yMXz (or an immobilized derivative thereof) to form a poly(aryl)silane; then washing the poly(aryl)silane with an aqueous washing composition and contacting the poly(aryl)silane with an adsorbent to remove the metal M. Alternatively, the method may include halogenating a polyarylsilane and reducing the halopolysilane with a metal hydride to form the polysilane.Type: GrantFiled: July 6, 2012Date of Patent: June 4, 2013Assignee: Kovio, Inc.Inventors: Wenzhuo Guo, Vladimir K. Dioumaev, Joerg Rockenberger, Brent Ridley
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Patent number: 8450442Abstract: A borosiloxane composition comprising a borosiloxane having an average of at least two alkenyl groups per molecule, an organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule, and a hydrosilylation catalyst; a borosiloxane adhesive comprising a cured product of at least one borosiloxane; and a coated substrate and a laminated substrate, each comprising the borosiloxane adhesive.Type: GrantFiled: February 23, 2009Date of Patent: May 28, 2013Assignee: Dow Corning CorporationInventor: Bizhong Zhu
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Publication number: 20130131265Abstract: Disclosed is a curable resin composition which includes a ladder-type silsesquioxane (A) having an aliphatic carbon-carbon double bond in the molecule; a ladder-type silsesquioxane (B) having a Si—H bond in the molecule; and a hydrosilylation catalyst. The curable resin composition is useful as sealants typically for optical semiconductor elements. Also disclosed is a cured article which is obtained by curing the curable resin composition. The curable resin composition can give such a cured article having properties including resistance to elevated temperatures, flexibility, transparency, resistance to thermal yellowing, and resistance to photoyellowing.Type: ApplicationFiled: October 31, 2011Publication date: May 23, 2013Applicant: DAICEL CORPORATIONInventors: Keizo Inoue, Shigeaki Kamuro
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Patent number: 8440312Abstract: A curable composition contains (A) a polyorganosiloxane base polymer having an average per molecule of at least two aliphatically unsaturated organic groups, optionally (B) a crosslinker having an average per molecule of at least two silicon bonded hydrogen atoms, (C) a catalyst, (D) a thermally conductive filler, and (E) an organic plasticizer. The composition can cure to form a thermally conductive silicone gel or rubber. The thermally conductive silicone rubber is useful as a thermal interface material, in both TIM1 and TIM2 applications. The curable composition may be wet dispensed and then cured in situ in an (opto)electronic device, or the curable composition may be cured to form a pad with or without a support before installation in an (opto)electronic device.Type: GrantFiled: December 1, 2009Date of Patent: May 14, 2013Assignee: Dow Corning CorporationInventor: G. M. Fazley Elahee
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Patent number: 8440777Abstract: A fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane containing at least two SiH groups, but not alkoxy and epoxy groups, (C) a platinum group metal-based catalyst, (D) an organosilicon compound having at least one silicon-bonded alkoxy group, and (E) a hydrolytic catalyst can be cured to metal and plastic substrates through addition reaction.Type: GrantFiled: January 14, 2011Date of Patent: May 14, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Hidenori Koshikawa, Mikio Shiono
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Patent number: 8440775Abstract: A curable liquid composition obtained by subjecting hydrogen halosiloxane or hydrogen alkoxysilane to condensation or to hydrolysis and condensation in an organic solvent in which fine polyvalent metal oxide particles with hydroxyl groups are dispersed; a method of forming a hard silica-type layer by applying onto an inorganic substrate the aforementioned composition and then curing the composition; an inorganic substrate with the aforementioned hard silica-type layer; and a semiconductor device comprising the aforementioned inorganic substrate on which a semiconductor layer is formed.Type: GrantFiled: February 1, 2008Date of Patent: May 14, 2013Assignees: Dow Corning Corporation, Dow Corning Toray Company, Ltd.Inventors: Yukinari Harimoto, Maki Itoh, Dimitris Elias Katsoulis
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Patent number: 8440776Abstract: Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO—, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.Type: GrantFiled: April 13, 2010Date of Patent: May 14, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tsutomu Kashiwagi, Toshio Shiobara, Katsuyuki Imazawa
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Patent number: 8440311Abstract: The general field of the invention is that of airbags. The invention relates to a process for improving the tear strength and the combing strength of coated fabrics intended for uses in the field of inflatable bags using a silicone composition comprising an additive containing a polyorganosiloxane resin (V) and a calcium carbonate. After coating the composition onto the fabric supports and curing, the coated supports not only have optimum adhesion and crease resistance properties, but also have good properties in terms of combing strength and tear strength.Type: GrantFiled: October 2, 2008Date of Patent: May 14, 2013Assignee: Bluestar Silicones France SASInventors: Laurent Dumont, Alain Pouchelon
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Patent number: 8436064Abstract: There is provided a predominantly open-cell polyurethane foam obtained from a predominantly open-cell polyurethane foam-forming reaction medium which comprises: a) at least one polyol; b) at least one polyisocyanate; c) at least one catalyst; d) water; e) a predominantly open-cell polyurethane foam-forming amount of at least one surfactant which is a balanced, substantially linear polyether-polysiloxane ABA? block copolymer; and, f) optionally, at least one additional component selected from the group consisting of other polymer and/or copolymer, chain extender, crosslinker, non-aqueous blowing agent, filler, reinforcement, pigment, tint, dye, colorant, flame retardant, antioxidant, antiozonant, UV stabilizer, anti-static agent, biocide and biostat.Type: GrantFiled: September 11, 2007Date of Patent: May 7, 2013Assignee: Momentive Performance Materials Inc.Inventors: William L. Brown, Paul L. Matlock, Louis Muller, Fabrice Ponthet
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Patent number: 8436121Abstract: The present invention relates to a two-component sealant comprising a first part and a second part wherein a) the first part (X) comprises: (i) a polyalkyleneoxide polymer having one or more unsaturated end groups (ii) an addition reaction catalyst b) the second part (Y) comprises: (i) an organosiloxane comprising one or more Si—H groups. The present invention also relates to medical devices used in connection with the sealant, mixing devices for delivering and mixing the first part and the second part of the sealant, and methods for applying the sealant.Type: GrantFiled: March 22, 2012Date of Patent: May 7, 2013Assignee: Coloplast A/SInventors: Peter Kwok Hing Lam, Henrik Edvardsen
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Publication number: 20130099228Abstract: A passivation layer solution composition is provided. A passivation layer solution composition according to an exemplary embodiment of the present invention includes an organic siloxane resin represented by Chemical Formula 1 below. In Chemical Formula 1, R is at least one substituent selected from a saturated hydrocarbon or an unsaturated hydrocarbon having from 1 to about 25 carbon atoms, and x and y may each independently be from 1 to about 200, and wherein each wavy line indicates a bond to an H atom or to an x siloxane unit or a y siloxane unit, or a bond to an x siloxane unit or a y siloxane unit of another siloxane chain comprising x siloxane units or y siloxane units or a combination thereof.Type: ApplicationFiled: June 27, 2012Publication date: April 25, 2013Inventors: Byung Du Ahn, Seung Ho Yeon, Sei-Yong Park, Mi-Hyae Park, Bu Sop Song, Tae Gweon Lee, Jun Hyun Park, Je Hun Lee, Jae Woo Park
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Patent number: 8425711Abstract: To provide a glass substrate with protective glass which suppresses formation of microscopic scratches on the back surface of the glass substrate in the production process for a display device, and which prevents a strength decrease in the process or formation of etch pits after a chemical etching treatment; a process for producing a display device by using the glass substrate with protective glass; and a double-sided removable resin sheet for the glass substrate with protective glass. A glass substrate with protective glass, which comprises a glass substrate and a protective glass plate laminated on each other, and which is characterized in that the glass substrate and the protective glass plate are laminated by a double-sided removal resin sheet.Type: GrantFiled: September 1, 2009Date of Patent: April 23, 2013Assignee: Asahi Glass Company, LimitedInventors: Toshihiko Higuchi, Satoru Takaki
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Patent number: 8426506Abstract: Addition-crosslinkable silicone compositions having high adhesion, rapid curing, and reduced odor and extractables contain a silylated citric acid.Type: GrantFiled: February 16, 2011Date of Patent: April 23, 2013Assignee: Wacker Chemie AGInventors: Johann Mueller, Markus Merget, Klaus Schnitzer
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Patent number: 8426614Abstract: An object of the present invention is to provide an epoxy compound which has a quick curing rate and is excellent in an etching durability and a selectivity and which is liquid at room temperature and a process for producing the above epoxy compound. The epoxy compound of the present application is represented by Formula (I): (YSiO3/2)n??(I) (in Formula (I), p (p is a natural number equal to n or less) groups of Y out of n groups thereof represent specific groups, and (n?p) groups of Y represent a hydrogen atom or —OSiR12H; and n represents an integer of 2 to 500).Type: GrantFiled: March 23, 2009Date of Patent: April 23, 2013Assignee: Showa Denko K.K.Inventors: Yoshikazu Arai, Hiroshi Uchida
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Patent number: 8420735Abstract: A modified microfibrillated cellulose, a resin composition and a resin composite material that contain the modified microfibrillated cellulose are provided. In a modified microfibrillated cellulose according to the present invention, a hydrolyzable-silyl-group-containing resin (A) bonds to or adheres to a cellulose surface and a silicon atom content is 0.01 to 0.5 atomic percent. A resin composition containing 0.1% to 10% by weight of the modified microfibrillated cellulose is also provided.Type: GrantFiled: December 21, 2010Date of Patent: April 16, 2013Assignee: DIC CorporationInventors: Kenichi Hamada, Tetsuya Harada
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Patent number: 8420762Abstract: The present invention provides a silicone resin composition comprising (A) an organopolysiloxane having at least two alkenyl groups, (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom, (C) a catalyst comprising a platinum group metal, (D) fine silicone particles, and (E) a (meth)acrylate compound. The present silicone resin composition cures in a short time to form a cured product having excellent adhesion strength with solder resists and copper substrates.Type: GrantFiled: December 20, 2010Date of Patent: April 16, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Tsutomu Kashiwagi
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Patent number: 8420712Abstract: To provide a silicone impression material having high viscosity of a kneaded material before curing and low hardness after curing. A dental silicone impression material composition includes: A) an organopolysiloxane mixture comprising a) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbons in one molecule and having viscosity of 1,000,000 mPa·s or more at 25° C., and b) an organopolysiloxane having at least one aliphatic unsaturated hydrocarbon in one molecule and having viscosity of 100 to 5,000 mPa·s at 25° C., wherein a ratio of a):b) is 1:0.5 to 10; B) an organohydrogenpolysiloxane having at least three hydrogen atoms directly bonded to a silicon atom in one molecule; C) a silicone-soluble platinum compound; D) an organopolysiloxane not having a functional group; and E) an inorganic filler.Type: GrantFiled: September 29, 2011Date of Patent: April 16, 2013Assignee: GC CorporationInventors: Hiroshi Kamohara, Shouichi Fukushima
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Publication number: 20130090448Abstract: Silicone elastomer spherical particles having a volume mean particle size of 0.1-100 ?m are coated with a polyorganosilsesquioxane and washed with alcohol or a mixture of alcohol and water. The coated fine particles are water repellent so that they are non-dispersible in water and float on water.Type: ApplicationFiled: November 29, 2012Publication date: April 11, 2013Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventor: SHIN-ETSU CHEMICAL CO., LTD.
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Patent number: 8415446Abstract: Cardanol based dimers are provided. The cardanol dimers are formed by hydrosylylation with silanes. Cardanol based dimers may be further reacted to form epoxy curing agents and epoxies which can be used as anti-fouling coatings on ship hulls and marine structures. The cardanol dimers may also be used to produce friction particles or phenolic resins. Methods of synthesizing the cardanol based dimers, the epoxy curing agents and the epoxies are also provided.Type: GrantFiled: November 17, 2010Date of Patent: April 9, 2013Assignee: Carolite CorporationInventors: Zhisheng Dai, Adarsh Dalal, Donald C. Lawson, III, Jinbao He
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Patent number: 8415445Abstract: Novel polysiloxanes grafted with at least one polyhydroxylated amino compound, method for preparing same and uses thereof.Type: GrantFiled: March 24, 2009Date of Patent: April 9, 2013Assignees: Centre National de la Recherche Scientifique (C.N.R.S.), Universite Paul Sabatier Toulouse IIIInventors: Juliette Fitremann, Waêl Moukarzel, Monique Mauzac
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Patent number: 8415443Abstract: Disclosed herein are metal-terpyridine complexes and their use in hydrosilylation reactions.Type: GrantFiled: July 8, 2010Date of Patent: April 9, 2013Assignees: Momentive Performance Materials Inc., Cornell UniversityInventors: Johannes G. P. Delis, Paul J. Chirik, Aaron M. Tondreau
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Patent number: 8410238Abstract: Disclosed is a bishydroxyarylsiloxane compound. The bishydroxyarylsiloxane compound has a novel structure in which a particular moiety is introduced between siloxane blocks. Due to this structure, the physical properties of a copolymer of the bishydroxyarylsiloxane compound and a polymer can be tuned. Further disclosed is a method for preparing the bishydroxyarylsiloxane compound.Type: GrantFiled: December 29, 2010Date of Patent: April 2, 2013Assignee: Cheil Industries Inc.Inventors: Chang Hong Ko, Min Soo Lee, Sang Hyun Hong, Beom Jun Joo, Won Gi Lee
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Patent number: 8408276Abstract: An organo-modified silicone obtained by an addition reaction of (I) a chain silicone represented by formula (1): wherein the formula (1), R1s represent hydrocarbon groups having 1 to 3 carbon atoms, and a and b are numbers satisfying conditions represented by the following formulae (i) to (iii): 0?a?195??(i) 5?b??(ii) 10?a+b?200??(iii), with (II) a hydrocarbon such as monoolefins and aromatic hydrocarbons, and (III) a di(meth)acrylic acid ester, at a molar ratio satisfying conditions represented by the following formula (iv): {the chain silicone}:{the hydrocarbon}:{the di(meth)acrylic acid ester}=A:B:C??(iv) wherein the formula (iv), A represents a number of moles of the chain silicone, and B and C are numbers satisfying conditions represented by the following formulae (v) and (vi): 0.05A?C?A??(v) A×b?2C=B??(vi) in the presence of a hydrosilylation catalyst.Type: GrantFiled: December 15, 2011Date of Patent: April 2, 2013Assignee: Nicca Chemical Co., Ltd.Inventor: Takahiro Kondou
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Patent number: 8410237Abstract: Cardanol based dimers are provided. The cardanol dimers are formed by hydrosylylation with silanes. Cardanol based dimers may be further reacted to form epoxy curing agents and epoxies which can be used as anti-fouling coatings on ship hulls and marine structures. The cardanol dimers may also be used to produce friction particles or phenolic resins. Methods of synthesizing the cardanol based dimers, the epoxy curing agents and the epoxies are also provided.Type: GrantFiled: November 17, 2010Date of Patent: April 2, 2013Assignee: Cardolite CorporationInventors: Zhisheng Dai, Adarsh Dalal, Donald C. Lawson, III, Jinbao He
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Patent number: 8410239Abstract: Novel organopolysiloxane compositions crosslinkable into elastomeric foams (or “silicone foams”) have a low density, that is, less than 0.20 g/cm3 and also have good mechanical properties.Type: GrantFiled: June 5, 2007Date of Patent: April 2, 2013Assignee: Bluestar Silicones FranceInventors: Delphine Blanc, Roser Casas, Christian Pusineri
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Patent number: 8399592Abstract: The present invention has its object to provide a liquid-form modified product of polyhedral polysiloxane which is excellent in moldability and transparency, and a composition produced using the modified product. In addition, the present invention can provide an easy-to-handle modified product and composition. The present invention provides a modified product of polyhedral polysiloxane which is obtainable by modifying a polyhedral polysiloxane compound (a) with a compound (b), and a composition containing the modified product. The polyhedral polysiloxane compound (a) has an alkenyl group and/or a hydrosilyl group, and the compound (b) has a hydrosilyl group and/or an alkenyl group each capable of hydrosilylation with the component (a).Type: GrantFiled: April 16, 2008Date of Patent: March 19, 2013Assignee: Kaneka CorporationInventors: Takao Manabe, Makoto Seino, Shinya Mizuta
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Patent number: 8389650Abstract: A curable polyorganosiloxane composition for use in an LED or optical lens, including: (A) an alkenyl group-containing polyorganosiloxane which contains a (A1) branched polyorganosiloxane including an SiO4/2 unit and an R3SiO1/2 unit, and optionally an R2SiO unit and/or an RSiO3/2 unit, wherein at least three R per molecule are vinyl groups, and optionally (A2) a linear polyorganosiloxane having R bonded to a silicon atom, wherein at least two R per molecule are vinyl groups, wherein 100 mol % or more of the R present in components (A1) and (A2), excluding alkenyl groups, are methyl groups; (B) a polyalkylhydrogensiloxane including an SiO4/2 unit and an R3(CH3)2SiO1/2 unit, the polyalkylhydrogensiloxane having the formula [R3(CH3)2SiO1/2]8[SiO4/2]4 or [R3(CH3)2SiO1/2]10[SiO4/2]5, wherein each R3 represents a hydrogen atom, and (C) a platinum-vinylsiloxane complex. The composition having desirable light transmission properties, and is unlikely to suffer yellowing due to exposure to heat.Type: GrantFiled: September 22, 2011Date of Patent: March 5, 2013Assignee: Momentive Performance Materials Japan LLCInventors: Masanori Takanashi, Hideki Kobayashi
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Patent number: 8383737Abstract: A compound for filling small gaps in a semiconductor device and a composition comprising the compound are provided. The composition can completely fill holes having a diameter of 70 nm or less and an aspect ratio (i.e. height/diameter ratio) of 1 or more in a semiconductor substrate without any defects, e.g., air voids, by a general spin coating technique. In addition, the composition can be completely removed from holes at a controllable rate without leaving any residue by the treatment with a hydrofluoric acid solution after being cured by baking. Furthermore, the composition is highly stable during storage.Type: GrantFiled: December 31, 2007Date of Patent: February 26, 2013Assignee: Cheil Industries, Inc.Inventors: Chang Soo Woo, Hyun Hoo Sung, Jin Hee Bae, Dong Seon Uh, Jong Seob Kim
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Patent number: 8383005Abstract: A thermally conductive silicone grease composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a kinetic viscosity of 5,000 to 100,000 mm2/s at 25° C.; (B) a hydrolyzable methylpolysiloxane having a trifunctional termination at one end and represented by the following general formula (2): wherein R2 represents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100; (C) a thermally conductive filler having a thermal conductivity of at least 10 W/m·° C.; (D) an organohydrogenpolysiloxane containing from 2 to 5 hydrogen atoms in one molecule directly bound to silicon atoms (Si—H groups); (E) a bonding aid having a triazine ring and at least one alkenyl group in one molecule; and (F) a catalyst selected from the group consisting of platinum and platinum compounds.Type: GrantFiled: October 27, 2011Date of Patent: February 26, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kenichi Tsuji, Kunihiro Yamada, Hiroaki Kizaki, Nobuaki Matsumoto
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Patent number: 8378050Abstract: Methods are disclosed for making crosslinked polysilanes and polygermanes, preferably having either hydrogen or halogen substituent groups. These crosslinked polymers are prepared by catalytic polymerization such as the dehalogenative coupling or dehydrocoupling. The crosslinked polymers having no more than 10% of the chain atoms involved in crosslinking. Also disclosed are compositions containing these crosslinked polymers in a solvent to enable the composition to be deposited on a substrate using a liquid deposition technique.Type: GrantFiled: April 12, 2011Date of Patent: February 19, 2013Assignee: Kovio, Inc.Inventor: Vladimir K. Dioumaev
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Patent number: 8378489Abstract: A semiconductor device of this invention has a copper wiring layer, of which a layer, to which a composition including at least one substance selected from the group consisting of ammonia and organic bases is applied, and a silicon-containing insulating film are sequentially superimposed on the copper wiring layer. Accordingly, semiconductor devices having insulating layers which adheres well to the copper serving as the wiring material can be obtained.Type: GrantFiled: August 20, 2009Date of Patent: February 19, 2013Assignee: Fujitsu LimitedInventors: Shiro Ozaki, Yoshihiro Nakata, Yasushi Kobayashi, Ei Yano
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Patent number: 8378051Abstract: The present invention provides a silicone resin lens obtained by molding and curing a silicon resin composition into a lens, wherein the lens has a refractive index at 400 nm of 1.5 or more, a ratio of a refractive index at 400 nm to a refractive index at 596 nm of 1.01 or more, an Abbe's number of 45 or more, and an absolute value of a differential of refractive indexes against temperatures, dn/dT, of 250×10?6/degrees C. or less. Further, the present invention provides a method for preparing the silicone resin lens according to any one of claims 1 to 3, wherein the silicone resin lens is prepared in conditions where a ratio of a molding shrinkage ratio found after subjecting the silicone resin composition to post-cure to a molding shrinkage ratio found after subjecting the silicone resin composition to molding is 0.8 to 1.2.Type: GrantFiled: June 21, 2011Date of Patent: February 19, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Tsutomu Kashiwagi
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Patent number: 8372936Abstract: A silicone-type pressure-sensitive adhesive composition comprising (A) 100 weight parts of organopolysiloxane condensation reaction product that has at least two alkenyl groups and that is yielded by a condensation reaction between (a) hydroxyl-functional diorganopolysiloxane and (b) organopolysiloxane resin, (B) organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in the molecule, in an amount sufficient to provide from 1 to 200 silicon-bonded hydrogen atoms with reference to all the alkenyl groups in the composition, (C) an organotitanium compound, at from 0.1 to 20 weight parts, and (D) a platinum catalyst in a catalytic quantity.Type: GrantFiled: December 25, 2008Date of Patent: February 12, 2013Assignee: Dow Corning Toray Company, Ltd.Inventors: Haruna Mizuno, Seiji Hori, Takateru Yamada
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Patent number: 8373286Abstract: A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition.Type: GrantFiled: September 4, 2009Date of Patent: February 12, 2013Assignee: Dow Corning Toray Co., Ltd.Inventors: Makoto Yoshitake, Hiroji Enami, Tomoko Kato, Masayoshi Terada
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Patent number: 8372515Abstract: A silane coating composition containing a silicon-based copolymer, a method for treating the surfaces of a metal such as steel, zinc-coated steels, or aluminum, to provide for the formation of a uniform conversion and/or passivation coating which increases the corrosion resistance of bare or painted metal and/or the adhesion properties of the metal, along with a metal having a conversion and/or passivation coating applied thereto are disclosed. Methods of the invention include contacting the requisite metal surface with an aqueous solution of a silane compound and a silicon-based polyether copolymer.Type: GrantFiled: January 8, 2010Date of Patent: February 12, 2013Assignee: Momentive Performance Materials Inc.Inventors: Christopher M. Byrne, George Policello, Suresh Rajaraman
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Publication number: 20130032852Abstract: A silicone resin composition contains a silicon-containing component including a silicon atom to which a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group is bonded and a silicon atom to which an alkenyl group is bonded. The number of moles of alkenyl group per 1 g of the silicon-containing component is 200 to 2000 ?mol/g.Type: ApplicationFiled: August 2, 2012Publication date: February 7, 2013Applicant: NITTO DENKO CORPORATIONInventors: Ryuichi KIMURA, Munehisa MITANI
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Patent number: 8361489Abstract: The present invention generally relates to implantable devices for producing insulin in diabetic animals. Some embodiments include amphiphilic biomembranes for use in biological applications (e.g., as an alternative and/or supplemental insulin source). Some embodiments also include live insulin-producing cells contained within one or more amphiphilic membranes so as to prevent or diminish an immuno-response and/or rejection by the host.Type: GrantFiled: August 29, 2007Date of Patent: January 29, 2013Assignee: The University of AkronInventors: Joseph P. Kennedy, Gabor Erdodi
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Patent number: 8362199Abstract: Interlayer insulating films 5,7 (insulating films) provided in a memory capacitor cell 8 are formed between a gate electrode 3 and a counter electrode 8C formed on a silicon wafer 1. The interlayer insulating films 5,7 comprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1×10?8 A/cm2.Type: GrantFiled: June 1, 2009Date of Patent: January 29, 2013Assignee: Hitachi Chemical Co., Ltd.Inventors: Hiroshi Matsutani, Makoto Kaji, Koichi Abe, Yuko Uchimaru
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Publication number: 20130009201Abstract: A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well as showing excellent processability and workability is provided. Also, surface stickiness may be prevented in the cured product without causing turbidity etc.Type: ApplicationFiled: July 25, 2012Publication date: January 10, 2013Applicant: LG CHEM, LTD.Inventors: Min Jin KO, Myung Sun MOON, Jae Ho JUNG, Bum Gyu CHOI, Dae Ho KANG, Min Kyoun KIM
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Patent number: 8349985Abstract: A composition includes a boron-containing hydrogen silsesquioxane polymer having a structure that includes: silicon-oxygen-silicon units, and oxygen-boron-oxygen linkages in which the boron is trivalent, wherein two silicon-oxygen-silicon units are covalently bound by an oxygen-boron-oxygen linkage therebetween.Type: GrantFiled: July 28, 2009Date of Patent: January 8, 2013Assignee: Cheil Industries, Inc.Inventors: Sina Maghsoodi, Shahrokh Motallebi, SangHak Lim, Do-Hyeon Kim
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Patent number: 8344075Abstract: A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure:Type: GrantFiled: July 14, 2011Date of Patent: January 1, 2013Assignee: Cheil Industries, Inc.Inventors: Woo-Han Kim, June-Ho Shin, Sang-Ran Koh, Sung-Hwan Cha, Hyun-Jung Ahn
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Patent number: 8344089Abstract: The present invention relates to branched polydimethylsiloxane-polyoxyalkylene copolymers, to a process for preparing them and to their use as anti-misting additives in silicone release coatings.Type: GrantFiled: May 20, 2010Date of Patent: January 1, 2013Assignee: Evonik Goldschmidt GmbHInventors: Julia Frey, Rene Haensel, Ingrid Eissmann
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Patent number: 8344088Abstract: Anti-reflective coating materials for ultraviolet photolithography include at least one absorbing compounds and at least one pH tuning agent that are incorporated into spin-on materials. Suitable absorbing compounds are those that absorb around wavelengths such as 365 nm, 248 nm, 193 nm and 157 nm that may be used in photolithography. Suitable pH tuning agents not only adjust the pH of the final spin-on composition, but also influence the chemical performance and characteristics, mechanical performance and structural makeup of the final spin-on composition that is part of the layered material, electronic component or semiconductor component, such that the final spin-on composition is more compatible with the resist material that is coupled to it. A method of making absorbing and pH tuned spin-on materials includes combining at least one organic absorbing compound and at least one pH tuning agent with at least one silane reactant during synthesis of the spin-on materials and compositions.Type: GrantFiled: November 15, 2001Date of Patent: January 1, 2013Assignee: Honeywell International Inc.Inventors: Joseph T. Kennedy, Teresa Baldwin-Hendricks