Abstract: Defoamer compositions of high effectiveness containing at least one siloxane-based antifoam and polysiloxane copolymers obtained by coupling a polysiloxane bearing active-hydrogen-containing hydrophilic polymer moieties by means of a di- or polyisocyanate.

Abstract: A multi-functional (meth)acrylate compound containing at least three F atoms and at least three Si atoms per molecule is provided. A photocurable resin composition comprising the compound can endow support substrates with antifouling properties with respect to organic stains such as oil mist and fingerprints, without detracting from surface mar resistance.

Abstract: A novel multi-functional linear siloxane compound, a siloxane polymer prepared from the siloxane compound, and a process for forming a dielectric film by using the siloxane polymer. The linear siloxane polymer has enhanced mechanical properties (e.g., modulus), superior thermal stability, a low carbon content and a low hygroscopicity and is prepared by the homopolymerization of the linear siloxane compound or the copolymerization of the linear siloxane compound with another monomer. A dielectric film can be produced by heat-curing a coating solution containing the siloxane polymer which is highly reactive. The siloxane polymer prepared from the siloxane compound not only has satisfactory mechanical properties, thermal stability and crack resistance, but also exhibits a low hygroscopicity and excellent compatibility with pore-forming materials, which leads to a low dielectric constant.

Abstract: Provided is a silicone composition, including: (A) an organopolysiloxane represented by an average composition formula R1nSiZ[(4?n)/2] (in which, R1 represents a monovalent hydrocarbon group, an alkoxy group or a hydroxyl group, provided that from 5 to 50 mol % of all R1 groups are alkenyl groups, and from 10 to 80 mol % of all R1 groups are aryl groups, Z represents an oxygen atom or a bivalent hydrocarbon group, provided at least 80 mol % of all Z groups are oxygen atoms, and n is a number that satisfies 1=n<2), in which from 5 to 50 mol % of all silicon atoms exist within structures represented by an average formula: —SiR22—X—(SiR22O)1SiR22—X—SiR22O— (in which, R2 represents a monovalent hydrocarbon group, provided that from 10 to 80 mol % of all R2 groups are aryl groups, X represents an oxygen atom or a bivalent hydrocarbon group, and l represents an integer of 3 or greater), (B) an organohydrogenpolysiloxane having at least 2 SiH groups within each molecule, and (C) an addition reaction catalyst.

Abstract: Semiconductor devices, structures and systems that utilize a polysilazane-based silicon oxide layer or fill, and methods of making the oxide layer are disclosed. In one embodiment, a polysilazane solution is deposited on a substrate and processed with ozone in a wet oxidation at low temperature to chemically modify the polysilazane material to a silicon oxide layer.

Abstract: This invention discloses a process for manufacturing an elastomeric article by liquid injection molding, said process comprising the steps of: (I) heating a curable composition comprised of (1) a liquid polymer comprised of repeat units that are derived from a conjugated diolefin monomer, wherein said liquid polymer has a weight average molecular weight which is within the range of 5,000 to 100,000, and wherein the liquid polymer is functionalized with an amine moiety, (2) a carbonyl inhibited platinum catalyst, and (3) a tetrakis(dialkyl siloxy) silane crosslinking agent, to a temperature which is within the range of 30° C. to 100° C.; (II) injecting the heated curable composition into a mold at a temperature which is within the range of 100° C. to 210° C. to produce the elastomeric article; and (III) removing the elastomeric article from the mold.

Abstract: A thermosetting resin compositing having an essential component (A) organopolysiloxane containing a compound represented by following general formula (1) or (2) and optical semiconductor peripheral material using the composition. [Herein, in the formulas, R1 independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, R2 represents an epoxy group-containing organic group, R3 represents R1 or R2, a independently represents an integer of 2 or more, b independently represents an integer of 0 or more, X represents general formula (3) , Y represents a bivalent hydrocarbon radical with the carbon number of 1 to 6, Z represents following formula (4), R1 in the formula independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, and c represents an integer of 0 or more.

Abstract: Radiation-curable silsesquioxane resin materials are employed for micro- and nanolithography. The resin materials can include a radiation-curable silsesquioxane resin and a photo-initiator having low viscosity. The low viscosity of the liquid system allows imprinting with low pressure and low temperature; e.g. room temperature. The resist's dry etching resistance is increased and the cured film is more easily separated from the mask. Due to its high modulus after cure, the material allows the fabrication of micro- and nano-features having high aspect ratios while providing a high throughput. Various pattern sizes, for example, ranging from tens of microns to as small as a few nanometers, may be achieved with the UV-curable material system.

Abstract: The present invention has for its object to provide a curable composition which, despite its low viscosity, gives a cured product with a high gel fraction, low residual tack, low modulus, high elongation and good flexibility. The present invention relates to a curable composition comprising the following two components: (A) a vinyl polymer having at least one crosslinking silyl group on the average per molecule: and (B) a photocurable substance, (C) an air oxidation-curable substance, (D) a high molecular plasticizer, (E) a reactive plasticizer or (F) a compound having one silanol group in its molecule and/or a compound capable of reacting with moisture to give a compound having one silanol group in the molecule.

Abstract: Provided is a room temperature-curable, heat-conductive silicone rubber composition, including: (A) a diorganopolysiloxane with both molecular chain terminals blocked with hydroxyl groups and/or organooxy groups, (B) a heat-conductive filler other than a palladium powder, (C) an organosilane containing two or more hydrolyzable groups, and/or a partial hydrolysis-condensation product thereof, and (D) a palladium powder. The composition improves on the drawbacks of the conventional technology, is able to suppress the quantity of hydrogen gas produced from the heat-conductive filler, exhibits superior storage properties, and yields a low-hardness cured product upon curing. The cured product is useful as a heat-conductive material for a heat-generating electronic component.

Abstract: The invention relates to organosilane-modified polysiloxanes of the following formula: The invention additionally relates to the use of the organo-modified polysiloxanes for surface coating, and to their preparation.

Abstract: An organopolysiloxane having triazinethiol and alkenyl radicals in a molecule and a primer composition comprising the same are provided. The primer composition assists in establishing a high bond strength between metal and silicone rubber by the mechanism that the triazinethiol moieties form strong chemical bonds with a difficult-to-bond metal such as gold, silver or copper, and the alkenyl moieties are involved in silicone rubber vulcanization.

Abstract: Polyhedral silsesquioxane anions are economically prepared by reaction of a silica source derived from combusted organic material with a quaternary ammonium hydroxide compound. Reaction of the resulting anions with chlorosilanes may be effected in near stoichiometric fashion in organic solvent containing reactive quantities of organic acids such as formic acid. The functional groups on the resulting functionalized silsesquioxanes may be substituted for other functional groups by reaction with di- or polysiloxanes in the presence of a synthetic ion exchange resin.

Abstract: Cyclic siloxanes that contain releasable active ingredients are described. The active ingredient can be an alcohol or enolizable carbonyl-containing compound such as a ketone, aldehyde, or ester. The product siloxanes are useful in a variety of personal and household care products where slow or controlled release of active ingredient is desired. A preferred embodiment utilizes substituents that when released as active ingredients are fragrant.

Abstract: A multi-functional cyclic siloxane compound (A), a siloxane-based (co)polymer prepared from the compound (A), or compound (A) and at least one of a Si monomer having organic bridges (B), an acyclic alkoxy silane monomer (C), and a linear siloxane monomer (D); and a process for preparing a dielectric film using the polymer. The siloxane compound of the present invention is highly reactive, so the polymer prepared from the compound is excellent in mechanical properties, thermal stability and crack resistance, and has a low dielectric constant resulting from compatibility with conventional pore-generating materials. Furthermore, a low content of carbon and high content of SiO2 enhance its applicability to the process of producing a semiconductor, wherein it finds great use as a dielectric film.

Abstract: An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each R1 represents, independently, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R2 is a group represented by formula (2) shown below, X is a group represented by formula (3) shown below, a represents an integer of 0 to 100 and b represents an integer of 0 to 30, provided that 1?a+b, and c represents an integer of 0 to 10. wherein, R3 represents an alkylene group of 2 to 12 carbon atoms. wherein, R1 and R2 are as defined above, d represents an integer of 0 to 30, and e represents an integer of 0 to 30.

Abstract: A process for production of an assembly including several silicone elements crosslinked by polyaddition of ?Si—H units onto ?Si-alkenyl (preferably ?Si-vinyl) units, the elements adhering to one another without detracting from their mechanical properties. The process includes: (I) forming (1st coating) a silicone element (i) with a liquid silicone preparation (i) containing polyorganosiloxanes (POS) A with ?Si-vinyl units, (POS) B with ?Si—H units, a platinum catalyst C; (II) crosslinking so that (i) has a surface density SD of unreacted, residual vinyl, per nm2, of 0.0100?SD?0.0040; (III) optionally repeating steps (I) and (II) n times to give n elements (i) that adhere to one another; (IV) forming (2nd coating) a silicone element (ii) with a liquid silicone preparation (ii) of the same type as described above; (v) crosslinking to give crosslinked (ii) that adheres to (i).

Abstract: This invention provides an ink composition capable of forming an image which has favorable curing sensitivity, is excellent in rubbing resistance and blocking properties, and has controlled surface stickiness and improved surface curing properties, an inkjet recording method using the ink composition, and a printed material; and the ink composition containing a polymer (a) including a partial structure selected from the group consisting of fluorine-substituted hydrocarbon group, a siloxane skeleton group, and a long-chain alkyl group; a radical polymerizable group, and a tertiary amine structure.

Abstract: This invention provides a process for making a polyfunctional starburst-shaped fullerene derivative for use as a matrix-reinforcing agent for mesoporous and other porous materials. This invention can include the formation of a highly soluble example of such a derivative from a fullerene and a bifunctional coupling agent. A solution of said agent can be delivered to the surface of a porous solid during, or after, the solids formation. Porous films and bodies containing such a matrix-reinforcing agent can exhibit improved mechanical properties, and can be produced using equipment and techniques common and available to those skilled in the art of porous materials preparations.

Abstract: The invention relates to a polymerizable composition which is characterized in that it contains at least one filler that is surface-functionalized with groups of formula (I), wherein groups of formula (I) (A)a-Z-Y—R2—SiR13?m—(O—)m ??(I), are bonded to the filler via at least one oxygen atom that is bound to the silicon atom of the group of formula (I). The invention also relates to a process for the preparation of the composition according to the invention and its use in particular as a dental material.

Abstract: The present invention relates to silicone compositions that can be used to control the interface at which release occurs when a bi-layer or multi-layer structure comprising compositions as separate layers, and a pattern of a different material sandwiched in between, is separated. The present invention further relates to a process that utilizes these compositions to control the transfer or release of patterns deposited on a substrate.

Abstract: The present invention provides a novel organosilicon compound and polysiloxane which are useful as electronic materials, optical materials, coating materials, sealing materials and catalyst carriers and which can be used as additives for improving various physical properties such as flame retardancy, heat resistance, weatherability, light resistance, electric insulating property, a surface characteristic, hardness, a mechanical strength and a chemical resistance of a polymer material.

Abstract: The present invention relates to compounds according to formula (1) and/or according to formulae (4) to (10) and their use in organic electroluminescent devices, in particular as a matrix material in phosphorescent devices.

Abstract: Aqueous dispersions preparable using (A) an organic compound selected from the group consisting of organosilicon compounds, polyurethanes and their precursor compounds such as polyols and polyisocyanates, crosslinked (poly)epoxides and their precursor compounds such as noncrosslinked and partly crosslinked (poly)epoxides, (poly)amines, (poly)amidoamines, (poly)mercaptans, (poly)carboxylic acids, (poly)carboxylic anhydrides, acrylates and their precursor compounds, and polysulfide-forming polymers, (B) particles partially wettable with water, (C) water and further substances if desired.

Abstract: A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone composition on the other side. The silicone-based adhesive sheet may be used in a method for bonding semiconductor chip and a chip attachment component. A semiconductor device may be prepared by the method.

Abstract: The present invention relates to polymeric compositions useful in the manufacture of biocompatible medical devices. More particularly, the present invention relates to certain cationic random copolymers capable of polymerization to form polymeric compositions having desirable physical characteristics useful in the manufacture of ophthalmic devices. Such properties include the ability to extract the polymerized medical devices with water. This avoids the use of organic solvents as is typical in the art. The polymer compositions comprise siloxane prepolymer containing pendant and end-capping cationic and polymerizable groups.

Abstract: Phosphono-substituted siloxanes suitable as interlayer material in lithographic substrates and for post-treating developed lithographic printing plates, obtainable by reacting (a) a first organosilicon compound of the general formula (I) and (b) a second organosilicon compound of the general formula (II).

Abstract: The present invention provides a novel organosilicon compound and polysiloxane which are useful as electronic materials, optical materials, coating materials, sealing materials and catalyst carriers and which can be used as additives for improving various physical properties such as flame retardancy, heat resistance, weatherability, light resistance, electric insulating property, a surface characteristic, hardness, a mechanical strength and a chemical resistance of a polymer material.

Abstract: The invention relates to novel crosslinkable copolymers of formula wherein the variables are as defined in the claims. The copolymers of the invention are especially useful for the manufacture of biomedical molding, for example ophthalmic moldings such as in particular contact lenses.

Abstract: A fiber reinforced composite including layers of fibers, each layer being impregnated with a resin. The layers include in combination a layer of an addition cured silicone resin and a layer of an organic resin. The layers form a hybrid composite having a higher modulus retention at elevated temperatures than the addition cured silicone resin alone. The hybrid composite's mechanical properties are similar to the organic resin composite, but demonstrate enhanced thermal resistance and reduced flammability.

Abstract: A varnish for forming a liquid crystal alignment layer is prepared by formulating a polymer obtained by using a silsesquioxane derivative represented by the formula (1), and a solvent. In the formula (1), R independently represents an unsubstituted phenyl, cyclopentyl, cyclohexyl, or t-butyl group, and Y1 independently represents a group selected from the following formulae (a-1) to (a-6).

Abstract: A process for preparing organopolysiloxanes bearing triorganosiloxy groups of defined structure involves reacting, in a first step, organopolysiloxanes having SiH groups with water in the presence of a metal of transition group VIII or compounds thereof as a catalyst, optionally in the presence of cocatalysts, to provide Si—OH group-containing intermediates, and, in a second step, reacting the intermediates bearing SiOH groups with silanes which have a group reactive toward SiOH groups. The reaction proceeds rapidly in high yield and with few byproducts.

Abstract: Polysilanes, inks containing the same, and methods for their preparation are disclosed. The polysilane generally has the formula H—[(AHR)n(c-AmHpm?2)q]—H, where each instance of A is independently Si or Ge; R is H, —AaHa+1Ra, halogen, aryl or substituted aryl; (n+a)?10 if q=0, q?3 if n=0, and (n+q)?6 if both n and q?0; p is 1 or 2; and m is from 3 to 12. In one aspect, the method generally includes the steps of combining a silane compound of the formula AHaR14?a, the formula AkHgR1?h and/or the formula c-AmHpmR1rm with a catalyst of the formula R4xR5yMXz (or an immobilized derivative thereof) to form a poly(aryl)silane; then washing the poly(aryl)silane with an aqueous washing composition and contacting the poly(aryl)silane with an adsorbent to remove the metal M. In another aspect, the method includes the steps of halogenating a polyarylsilane to form a halopolysilane; and reducing the halopolysilane with a metal hydride to form the polysilane.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: Polysilanes, inks containing the same, and methods for their preparation are disclosed. The polysilane generally has the formula H—[(AHR)n(c-AmHpm?2)q]—H, where each instance of A is independently Si or Ge; R is H, —AaHa+1Ra, halogen, aryl or substituted aryl; (n+a)?10 if q=0, q?3 if n=0, and (n+q)?6 if both n and q?0; p is 1 or 2; and m is from 3 to 12. In one aspect, the method generally includes the steps of combining a silane compound of the formula AHaR14?a, the formula AkHgR1?h and/or the formula c-AmHpmR1rm with a catalyst of the formula R4xR5yMXz (or an immobilized derivative thereof) to form a poly(aryl)silane; then washing the poly(aryl)silane with an aqueous washing composition and contacting the poly(aryl)silane with an adsorbent to remove the metal M. In another aspect, the method includes the steps of halogenating a polyarylsilane to form a halopolysilane; and reducing the halopolysilane with a metal hydride to form the polysilane.

Abstract: A silane-terminated polyurethane composition is the reaction product of a silane-terminated polyurethane prepolymer component, a silane-terminated monomeric diisocyanate, and optionally at least one multifunctional trisilane or tetrasilane component. A method for making a composition includes (a) providing a silane-terminated polyurethane prepolymer component, a silane-terminated monomeric diisocyanate component, and optionally at least one multifunctional trisilane or tetrasilane component, and (b) combining the prepolymer component, monomeric component, and optional multifunctional silane component to form a silane-terminated polyurethane reaction product with a tensile strength of about 4 MPa or greater and an elongation of about 200% or greater.

Abstract: A silane film that can be used in a wide range of environments, on metals of engineering interest, as a standalone process or as a primer for a top-coating by common paint systems. The film generally comprises: a) at least one bis-silane; b) a water soluble or dispersible polymer; c) nanoparticles; and, d) a water soluble solvent. It is also within the scope of the present invention to include a leachable inhibitor into the silane film. In sum, the present invention teaches a silane composition that may be applied by dipping, wiping, spraying, brushing, or other conventional techniques, whereby the film composition provides a metal treatment that is water soluble and may provide the availability of the coating to “heal” by utilizing a leachable inhibitor whenever damage occurs from scrapes or scratches.

Abstract: The present invention relates to low-viscosity oligocarbonate polyols, their preparation and use. The oligocarbonate polyols are based on diols of formula I below, which are used in combination with a further aliphatic polyol.

Abstract: The invention concerns novel cytosine based modules and in particular their application in linear multiple hydrogen bonded arrays to form supramolecular polymers of the formula (II): and the use of these in supramolecular materials.

Abstract: The present invention relates to low a dielectric material essential for a next generation semiconductor with high density and high performance, and more particularly to a low dielectric material that is thermally stable and has good film-forming properties and excellent mechanical properties, a dielectric film comprising the low dielectric material, and a semiconductor device manufactured using the dielectric film.

Abstract: A material for forming an antireflective film that enables a large difference in etching rates to be obtained between a resist pattern and an antireflective film. A composition for forming an antireflective film includes a siloxane polymer containing a light-absorbing compound group.

Abstract: A method of making a diluted organopolysiloxane polymer comprising the steps of:— (i) preparing an organopolysiloxane polymer by polymerising cyclic organopolysiloxane monomer(s) in the presence of an organic diluent material, a suitable catalyst and an end-blocking agent; and (ii) Where required quenching the polymerisation process; wherein the diluent material is substantially retained within the resulting diluted organopolysiloxane.

Abstract: Prepolymers comprising at least one block of Formula II and terminated with a polymerizable ethylenically unsaturated radical are useful in hydrogel materials are disclosed: wherein n, R, R1, R2 and X+ are as defined herein.

Abstract: The present invention relates to a method of preparing fast curing silicone RTV compositions by reacting an amino endcapped silicone with an isocyanato functionalized silane, and to compositions formed thereby. In particular, the present invention provides compositions which include silicones endcapped with silanes which contain ?-ureas.

Abstract: A process for the preparation of organosilicon compounds bearing silanol groups, in particular linear polyorganosiloxanes bearing lateral silanol groups, in a predictable manner and high yield, comprising reacting a similarly constructed Si—H functional organosilicon compound with water in the presence of a Group VIII metal catalyst, optionally in the presence of a cocatalyst. Predictable product structure and very few byproducts are particularly advantageous.

Abstract: Disclosed herein is a composition for preparing a nanoporous material. The composition comprises i) a cyclodextrin derivative, ii) a thermostable matrix precursor, and iii) a solvent for dissolving the components i) and ii). The composition enables the preparation of a low dielectric constant film in which nanopores with a size of 20 ? or less are uniformly distributed.

Abstract: The present invention provide a covered heteroaromatic ring compound whose hetero ring effectively is covered and that is suitable for electronic materials and the like. For example, following Scheme 1 below, first, a thiophene monomer unit (1T) is synthesized, and then oligomers (2T) to (16T) are synthesized by repeating oxidative polymerization. The hetero ring is not limited to thiophene, and may be furan or pyrrole, for example. Also, substituents on silicon are not limited to those in Scheme 1, and any substituents may be used. The degree of polymerization and the synthesis method are not limited to those in Scheme 1. In the compound of the present invention, ? electronic conjugation effectively is kept as shown in the ultraviolet and visible absorption spectrum in FIG. 1, for example.

Abstract: The invention relates to ophthalmic molding formulations and to tinted, high Dk ophthalmic moldings. This invention also relates to a method for making a tinted ophthalmic molding. The method comprises: (a) providing a polymer precursor having cross-linkable or polymerizable groups; (b) providing a pigment dispersion comprising an inorganic or organic pigment and a dispersing agent; (c) mixing the pigment dispersion with the polymer precursor to form a tinted prepolymer mixture; (d) dispensing the tinted prepolymer mixture into a mold; and (e) forming a tinted ophthalmic molding from the tinted prepolymer mixture, the molding comprising a polymer matrix having the pigment entrapped therein. With this method, tinted ophthalmic moldings, particularly edge-to-edge soft, tinted contact lenses having improved properties, are prepared with an improved efficiency.

Abstract: Methods of sealing a semiconductor element are provided. The methods includes the steps of coating a semiconductor element mounted on a gold-plated printed circuit board with a curable silicone resin, and then curing the curable silicone resin. In a method, the gold-plated printed circuit board is subjected to preliminary treatment with a treatment agent including an acid anhydride group-containing alkoxysilane and/or a partial hydrolysis-condensation product thereof In another method, the curable silicone resin includes the treatment agent. The methods yield favorable adhesion upon sealing.

Abstract: The present invention relates to a composition comprising at least one fluorosilane and at least one aminosilane, a condensation product of said fluorosilane and said aminosilane, and a surface protective agent made thereof.