From Carboxylic Acid Having Three Or More Carboxylic Acid Groups Or Derivatives Thereof, And An Organic Amine, Or From An Organic Amine Salt Of A Tri-or Higher Carboxylic Acid Patents (Class 528/350)
  • Patent number: 5120825
    Abstract: The present invention provides for hybrid polybenzimidazole and polybenzimidazolone polymers which are characterized as containing both imidazole and imidazolone structural units in the polymer chain. These polymers are characterized as containing at least one recurring monomer unit containing the structure of the formula: ##STR1## wherein Ar is a tetravalent aromatic moiety derived from an aromatic tetraamine and Ar.sub.1 is a trivalent aromatic moiety derived from a trifunctional acid, an acid anhydride or amine-reactive derivatives thereof, said polymers further characterized by an inherent viscosity of at least about 0.01 dl/g measured as a 0.5% solution in N-methyl pyrrolidone at 25.degree. C.The polymers of this invention exhibit many of the advantageous properties of both polybenzimidazole and polybenzimidazolone polymers. They are characterized as being extremely resistant to chemical attack such as by solvents, acids and bases.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: June 9, 1992
    Assignee: Hoechst Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr.
  • Patent number: 5112942
    Abstract: Copolyimides and their precursors are disclosed comprising units represented by the formula ##STR1## where R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are the same or different and are hydrogen or C.sub.1 to C.sub.6 linear or branched alkyl, with the proviso that R.sub.1, R.sub.2, R.sub.3 and R.sub.4 cannot simultaneously be hydrogen and where Z is a chemical bond, ##STR2## Ar is the tetravalent residue of a tetracarboxylic acid or acid dianhydride or di- or tetraester thereof, where x and y are integers from about 100 to about 1,000, and the ratio of x to y is from about 1:99 to about 49:51, and z is 0-5.These copolymers have improved resistance to stress cracking. They may also be used in applications such as coatings, or adhesives.
    Type: Grant
    Filed: September 26, 1990
    Date of Patent: May 12, 1992
    Assignee: Ethyl Corporation
    Inventor: Wesley C. Blocker
  • Patent number: 5109107
    Abstract: The present invention provides for a novel heat stable class of polyamide-imide polymers having excellent flow properties and hydrolytic stability which are prepared by forming the polycondensation product of one or more aromatic or aliphatic diamines, one or more additional comonomers selected from the group consisting of a tetrafunctional aromatic dianhydride, an aromatic or aliphatic dicarboxylic acid (or acid derivative thereof) and mixtures thereof, and a comonomer comprising a tri- or hexafluoro-substituted tricarboxylic acid anhydride (or acid derivative thereof) having the structure: ##STR1## wherein Z is CF.sub.3 or a phenyl radical.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: April 28, 1992
    Assignee: Hoecht Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr.
  • Patent number: 5104967
    Abstract: The solvent-resistance and thermal stability of polyamideimides of the general formulae: ##STR1## is improved by capping the amideimides with a crosslinking functionality (Y) containing a residue selected from the group of: ##STR2## wherein R.sub.1 =lower alkyl, lower alkoxy, aryl, aryloxy, substituted alkyl, substituted aryl (either including hydroxyl or halo-substituents), halogen, or mixtures thereof;j=0, 1, or 2;G=--CH.sub.2 --, --O--, --S--, --SO.sub.2 --, --SO--, --CO--, --CHR--, or --CR.sub.2 --;R=hydrogen, lower alkyl, or phenyl;T=methallyl or allyl;Me=methyl;R.sub.2 =a trivalent organic radical; andR.sub.3 =a divalent organic radical.The amideimide oligomers may be linear or multidimensional, and can be processed into blends, prepregs, or composites. Methods of making these amideimides and intermediates useful in the syntheses are also described.
    Type: Grant
    Filed: April 13, 1988
    Date of Patent: April 14, 1992
    Assignee: The Boeing Company
    Inventors: Clyde H. Sheppard, Hyman R. Lubowitz
  • Patent number: 5104946
    Abstract: Disclosed is a solution in butyrolactone of a diglyme-insoluble polyimidesiloxane. The polyimidesiloxane is the reaction product of a dianhydride selected from the group consisting of 3,3',4,4'-benzophenone tetracarboxylic acid dianhydride, 3,3',4,4'-oxydiphthalic anhydride, and mixtures thereof, with a mixture of a non-siloxane diamine and a siloxane diamine in a molar ratio of about 0.1 to about 16, where said non-siloxane diamine is selected from the group consisting of 2,4-diaminotoluene, 3,5-diamino-tert-butylbenzene, 2,5-diamino-trifluoromethyl benzene, 2,6-diamino-4-trifluoromethyl pyridine, and mixtures thereof.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: April 14, 1992
    Assignee: Occidental Chemical Corporation
    Inventor: Chung J. Lee
  • Patent number: 5104966
    Abstract: Novel polyimide based films are disclosed that are resistant to arc tracking and that include aromatic dianhydrides together with aromatic diamines and aliphatic diamines. The compositions contain from 5 to 20 percent by weight of the aliphatic diamine. These compositions maximize the thermal aging capability of the polyimide. The compositions are useful as films and laminates for wire and cable.
    Type: Grant
    Filed: June 13, 1989
    Date of Patent: April 14, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Harris B. David
  • Patent number: 5101006
    Abstract: Novel halogenated polyimides and co-polyimides comprise recurring imide structural units of the formula ##STR1## where X is F, Cl, Br or I; Y is H, F, Cl, Br or I; and R is a divalent organic radical.
    Type: Grant
    Filed: March 25, 1991
    Date of Patent: March 31, 1992
    Assignee: Occidental Chemical Corporation
    Inventors: Jeffrey S. Stults, Willis T. Schwartz
  • Patent number: 5098991
    Abstract: A process is disclosed for preparation of anhydrides containing additional carboxylic acid moieties and dianhydrides of disubstituted maleic anhydride compounds wherein the acid anhydrides and dianhydrides retain their alkene character. The resulting alkene compounds are useful as precursors for polyesters, thermally stable polyamide-imides and polyimides which are also disclosed, as well as a process for their preparation.
    Type: Grant
    Filed: January 8, 1990
    Date of Patent: March 24, 1992
    Assignee: Amoco Corporation
    Inventors: Steven J. Behrend, David A. Young, Ellis K. Fields
  • Patent number: 5097000
    Abstract: Disclosed are rigid fluorinated monomers, their preparation, and polymers derived therefrom based on two novel tricyclic xanthene core systems, 9,9-bis-(perfluoroalkyl)xanthene (I) and 9-phenyl-9-perfluoroalkylxanthene (II). The monomers have utility in the preparation of advanced high-performance polymers, particularly polyimides.
    Type: Grant
    Filed: June 21, 1991
    Date of Patent: March 17, 1992
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Swiatoslaw Trofimenko
  • Patent number: 5091505
    Abstract: Polyimides having a high thermal and oxidative stability are prepared by reacting a mixture of monomers comprising (a) a dialkyl, trialkyl, or tetraalkylester of an aromatic tetracarboxylic acid, (b) an aromatic diamine, and (c) an end cap compound. The ratio of (a), (b), and (c) is chosen so that upon heating the mixtures, low molecular weight prepolymers are formed, the prepolymers having only one end cap radical and being suitable for chain extension and crosslinking to form high molecular weight, thermally stable polyimides. Upon heating, the prepolymers form polyimide resins, which can have T.sub.g in excess of 600.degree. F. and superior physical properties.
    Type: Grant
    Filed: January 30, 1990
    Date of Patent: February 25, 1992
    Assignee: TRW Inc.
    Inventors: Tito T. Serafini, Paul G. Cheng, Kenneth K. Ueda, Ward F. Wright
  • Patent number: 5089593
    Abstract: Polyimides useful in multilayer electronic devices containing the 4,4'-bis(4-amino-2-trifluoromethylphenoxy) biphenyl moiety have low dielectric constants, low moisture uptake, high thermal degradation stability, low glass transition temperature.
    Type: Grant
    Filed: December 22, 1989
    Date of Patent: February 18, 1992
    Assignee: Amoco Corporation
    Inventors: Douglas E. Fjare, Neal R. Nowicki
  • Patent number: 5087691
    Abstract: New polyphenylated polynuclear aromatic diamines, such as 1,3-bis[4-aminophenyl]-2,3,5-triphenylbenzene, a process for their manufacture and their use as polycondensation components for the manufacture of polyamide, polyamide-imide and polyimide polymers are described. The polymers obtained with the aromatic diamines according to the invention are readily soluble, rigid-rod polymers and are distinguished by outstanding modulus, tensile compression strength, energy absorption, coefficient of expansion and electrical properties.
    Type: Grant
    Filed: September 1, 1989
    Date of Patent: February 11, 1992
    Assignee: University of Akron
    Inventor: Frank W. Harris
  • Patent number: 5084557
    Abstract: The present invention provides diamino compounds and liquid crystal aligning films comprising polyimides which are obtained from the said diamino compounds represented by the general formula: ##STR1## wherein R.sub.1 indicates an alkyl group having 3 to 22 carbon atoms, R.sub.2 indicates a hydrogen atom or an alkyl group having 1 to 22 carbon atoms, and R.sub.3 -R.sub.10 indicate a hydrogen atom or a methyl group, respectively.The liquid crystal aligning films are useful for STN mode display cells in realizing a high pretilt angle.
    Type: Grant
    Filed: June 27, 1989
    Date of Patent: January 28, 1992
    Assignee: Chisso Corporation
    Inventors: Shizuo Murata, Naoyoshi Emoto, Kenji Furukawa, Kouichi Kunimune, Ryuji Kobayashi, Masami Tanaka
  • Patent number: 5071997
    Abstract: A new class of polyimides and copolyimides made from substituted benzidines and aromatic dianhydrides and other aromatic diamines. The polyimides obtained with said diamines are distinguished by excellent thermal, excellent solubility, excellent electrical properties such as very low dielectric constants, excellent clarity and mechanical properties making the polyimides ideally suited as coating materials for microelectronic apparatii, as membranes for selective molecular or gas separation, as fibers in molecular composites, as high tensile strength, high compression strength fibers, as film castable coatings, or as fabric components.
    Type: Grant
    Filed: July 20, 1989
    Date of Patent: December 10, 1991
    Assignee: University of Akron
    Inventor: Frank W. Harris
  • Patent number: 5070182
    Abstract: A polyimide resin having a repeating unit of the formula: ##STR1## wherein R.sub.1 is a tetravalent organic group constituting a tetracarboxylic acid or its derivative, wherein four atoms directly bonded to the four carbonyl groups are carbon atoms having no unsaturated bond, and R.sub.2 is a bivalent organic group constituting a diamine.
    Type: Grant
    Filed: April 26, 1990
    Date of Patent: December 3, 1991
    Assignee: Nissan Chemical Industries Ltd.
    Inventors: Noriaki Kohtoh, Takashi Kobayashi, Masahiko Yukawa
  • Patent number: 5061509
    Abstract: A polyimide thin film is formed on a substrate by imparting energy under vacuum, by means of heating, ultraviolet light or electron beam irradiation, or a combination thereof, to a polyimide having in the polymer main chain imide bonds and decomposable bonds such as carbon-carbon single bond differing from the imide bonds so as to break the decomposable bonds.
    Type: Grant
    Filed: August 23, 1990
    Date of Patent: October 29, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Katsuyuki Naito, Shinya Aoki, Toshio Nakayama
  • Patent number: 5059677
    Abstract: A polyimide resin having a repeating unit of the formula: ##STR1## wherein R.sub.1 is a tetravalent organic group constituting a tetracarboxylic acid or its derivative, wherein four atoms directly bonded to the four carbonyl groups are carbon atoms having no unsaturated bond, and R.sub.2 is a bivalent organic group constituting a diamine.
    Type: Grant
    Filed: January 5, 1989
    Date of Patent: October 22, 1991
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Noriaki Kohtoh, Takashi Kobayashi, Masahiko Yukawa
  • Patent number: 5047499
    Abstract: High molecular weight polyamide-imides having a reduced viscosity of 0.3 dl/g or above and exhibiting excellent heat resistance and melt flowability are produced with good economic efficiency by a process, which process comprises the two reaction stages:(a) a first reaction stage which comprises reacting (I) a trimetallitic acid derivative and (II) an aromatic diamine in the presence of a polar solvent in the presence of a first dehydration catalyst until a polyamide-imide resin having a reduced viscisity of 0.2 to 0.5 dl/g as measured at a concentration of 0.5 g/dl in dimethylformamide at 30.degree. C. is produced; and(b) a second reaction stage which comprises adding a phosphorous triester as a second dehydration catalyst to the reaction mixture resulting from the first reaction stage and further reacting the reaction mixture until a high molecular weight polyamide-imide resin having a reduced viscosity of 0.3 dl/g or above as measured at a concentration of 0.5 g/dl in dimethylformaide at 30.degree. C.
    Type: Grant
    Filed: February 15, 1989
    Date of Patent: September 10, 1991
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Toichi Sakata, Kenji Hattori, Yoshiyuki Mukoyama
  • Patent number: 5043248
    Abstract: A photosensitive amphiphilic high polymer comprises a linear recurring unit containing at least divalent 1st organic group (R.sup.1) having at least two carbon atoms and at least divalent 2nd organic group (R.sup.2) having at least two carbon atoms, said organic groups R.sup.1 and R.sup.2 being connected to each other by a divalent linkage group formed by a reaction of an acid group (A) containing a hetero atom and a basic group (B) containing a hetero group; and at least one hydrocarbon-containing group having 10 to 30 carbon atoms, which may have a substituent, bonded to said recurring unit by a covalent bond or an ionic bond; and a dimerizable or polymerizable unsaturated bond or an orthonitrobenzyl group ##STR1## which may have a substituent, contained in a part or the whole of said recurring unit.
    Type: Grant
    Filed: October 25, 1989
    Date of Patent: August 27, 1991
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masakazu Uekita, Hiroshi Awaji
  • Patent number: 5041520
    Abstract: Disclosed is a process for preparing a polyimide by reacting certain reactants. The reactants include an aromatic diamine which is 3,3'-diaminobenzophenone and/or bis(3-aminophenyl)sulfone, a tetrocarboxylic dianhydride and a dicarboxylic anhydride. A thermally stable polyimide can be obtained which displays excellent processability.
    Type: Grant
    Filed: June 26, 1989
    Date of Patent: August 20, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 5032667
    Abstract: Described herein are amide and/or imide containing polymers based on novel monomers that contain isoalkylidene bridges. These polymers have excellent toughness combined with high temperature stability, low water absorption, and good melt-fabricability.
    Type: Grant
    Filed: December 20, 1989
    Date of Patent: July 16, 1991
    Assignee: Amoco Corporation
    Inventors: James E. Harris, Abe Berger, Vilas M. Chopdekar, Markus Matzner, James Spanswick
  • Patent number: 5026820
    Abstract: Disclosed is a process for continuously mixing two liquid components, whose one liquid component is a two-liquid curing type resin which comprises continuously supplying one liquid component under stirring into a mixing container and pouring the other liquid component into said container by pushing open a needle forcibly provided to a check valve, the improvement wherein said needle is pushed open with a non-curing liquid, thereafter, a curing liquid is poured into said mixing container. According to the present invention, when, for example, a polyamide acid and a curing agent are caused to mix and react with each other, a transparent polyimide mixed uniformly is obtained and high quality molded articles of polyimide are provided therefrom.
    Type: Grant
    Filed: April 11, 1989
    Date of Patent: June 25, 1991
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takehiko Noguchi, Takashi Sakubata, Akinori Hisanaga, Tetsuo Yoshioka, Hirosaku Nagano
  • Patent number: 5026821
    Abstract: The present invention provides polyamides produced by the condensation of diamines with citric acid through the carboxyl groups attached to the carbon atoms in positions 1 and 3.These polyamides can be used for the preparation of controlled-release forms of drugs.
    Type: Grant
    Filed: March 2, 1989
    Date of Patent: June 25, 1991
    Assignee: Sanofi
    Inventors: Mahfoud Boustta, Jovanka Huquet, Michel Vert
  • Patent number: 5025088
    Abstract: The present invention here disclosed is directed to a photosensitive polymer having an inherent viscosity of 0.1 to 5 dl/g and represented by the general formula ##STR1## wherein R.sup.1 is independently a trivalent or tetravalent carbon cyclic aromatic group or heterocyclic group; R.sub.2 is independently an aliphatic group having at least 2 carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbon cyclic aromatic group, a heterocyclic group or a polysiloxane group; R.sub.3 and R.sub.4 are CH.sub.2 --CH.dbd.CH.sub.2 ; m is 1 or 2; n is 0 or 1; and m and n satisfy 1.ltoreq.m+n.ltoreq.2.The photosensitive polymer of the present invention is applicable as electronic materials such as passivation films of semiconductors and print circuits.
    Type: Grant
    Filed: July 19, 1990
    Date of Patent: June 18, 1991
    Assignee: Chisso Corporation
    Inventors: Hirotoshi Maeda, Kouichi Kunimune
  • Patent number: 5004575
    Abstract: Composite materials with matrices of tough, thermoplastic aromatic polyimides are obtained by blending semi-crystalline polyimide powders with polyamic acid solutions to form slurries, which are used in turn to prepare prepregs, the consolidation of which into finished composites is characterized by excellent melt flow during processing.
    Type: Grant
    Filed: October 21, 1988
    Date of Patent: April 2, 1991
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Norman J. Johnston, Terry L. St. Clair, Robert M. Baucom, John R. Gleason
  • Patent number: 5003037
    Abstract: Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
    Type: Grant
    Filed: August 3, 1990
    Date of Patent: March 26, 1991
    Assignee: Amoco Corporation
    Inventors: David J. Fenoglio, Douglas E. Fjare, Edwin F. Morello, Neal B. Nowicki
  • Patent number: 4997906
    Abstract: A crosslinked copolymer composition is derived from an aliphatic polyester, a dianhydride and a diisocyanate. The copolymer membrane has high thermal stability and good aromatic/saturate selectivity and permeability.
    Type: Grant
    Filed: April 3, 1990
    Date of Patent: March 5, 1991
    Assignee: Exxon Research & Engineering Company
    Inventors: Warren A. Thaler, W. S. W. Ho, Guido Sartori
  • Patent number: 4992527
    Abstract: Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
    Type: Grant
    Filed: July 23, 1990
    Date of Patent: February 12, 1991
    Assignee: Amoco Corporation
    Inventors: David J. Fenoglio, Douglas E. Fjare, John L. Melquist, Edwin F. Morello, Neal R. Nowicki
  • Patent number: 4987197
    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength.The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.
    Type: Grant
    Filed: April 24, 1989
    Date of Patent: January 22, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 4980504
    Abstract: Diamines having a 1,1,3-trimethylphenylindane dicarboxylic moiety linked on both sides to phenylene diamine by an amide bond (PIDA diamines) are disclosed. By reacting these diamines with aromatic difunctional acid derivatives, amorphous polymers having high glass transition temperatures (Tg) can be prepared. If aliphatic diacid derivatives are used the resulting polymers have a lower Tg, but have the advantage of melt-processability. The PIDA-diamines can also be used in the preparation of polyimides, being reacted either with tri- or tetracarboxylic anhydrides or with imide group-containing acid derivatives.
    Type: Grant
    Filed: July 28, 1989
    Date of Patent: December 25, 1990
    Assignee: Akzo N.V.
    Inventors: Cornelis R. H. I. De Jonge, Gerrit Hoentjen, Theodorus J. Bouwmans
  • Patent number: 4968780
    Abstract: Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzens are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
    Type: Grant
    Filed: April 25, 1990
    Date of Patent: November 6, 1990
    Assignee: Amoco Corporation
    Inventors: David J. Fenoglio, Douglas E. Fjare, John L. Melquist, Edwin F. Morello, Neal R. Nowicki
  • Patent number: 4963648
    Abstract: Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butyltoluene are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butyltoluene which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.
    Type: Grant
    Filed: April 9, 1990
    Date of Patent: October 16, 1990
    Assignee: Amoco Corporation
    Inventors: David J. Fenoglio, Douglas E. Fjare, John L. Melquist
  • Patent number: 4963647
    Abstract: The present invention provides novel heat stable polyamide-imide polymers having excellent flow properties which render them more readily processible into fibers, films, sheets and other molded articles. The polymers are prepared by forming the polycondensation product of one or more aromatic diamines and one or more trifunctional acid anhydride monomers, wherein at least one of said diamine monomers is a 12F-Diamine or 12F-Oxydiamine containing at least two CF.sub.3 ##STR1## R groups linking two aromatic moieties, wherein R is CF.sub.3 or phenyl. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, improved resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as excellent thermal properties including resistance to thermooxidative degredation.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: October 16, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Rohitkumar H. Vora, Paul N. Chen, Sr., Jeffrey S. Devolve
  • Patent number: 4959447
    Abstract: A copoly(imidine-imide) consisting of a copolymer of polyimidines and polyimides having, in the basic chain structure of the polymer, imidine structures represented by formula (I) and the imide structures represented by formula (II): ##STR1##
    Type: Grant
    Filed: September 2, 1988
    Date of Patent: September 25, 1990
    Assignee: Nippon Steel Corporation
    Inventors: Mitsuru Arai, Patrick E. Cassidy, James M. Farley
  • Patent number: 4954608
    Abstract: A copolymerized polyamic acid salt having a recurring unit represented by following formula (I) and (II) and the process for preparing thereof. ##STR1## wherein (A) or (A') represents a formula ##STR2## wherein, R.sup.1 represents a tetravalent group having at least 2 carbon atoms; R.sup.2 represents a divalent group having at least 2 carbon atoms; and R.sup.31, R.sub.32, R.sup.33, R.sup.41, R.sup.42, R.sup.43, R.sup.5, and R.sup.6 each represents a monovalent group having 1 to 30 carbon atoms selected from an aliphatic group, an alicyclic group, an aromatic group, a group in which an aliphatic group is combined with an alicyclic group or an aromatic group, each of these groups substituted by a halogen atom, a nitro group, an amino group, a cyano group, a methoxy group, or an acetoxy group, or a hydrogen atom; at least one of said R.sup.31, R.sup.32, R.sup.33, R.sup.41, R.sup.42, R.sup.43, R.sup.5 and R.sup.
    Type: Grant
    Filed: June 1, 1987
    Date of Patent: September 4, 1990
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki
    Inventors: Masakazu Uekita, Hiroshi Awaji
  • Patent number: 4954611
    Abstract: The present invention provides for shaped articles made from novel heat stable polyamide-imide polymers having excellent flow properties which render them more readily processible into fibers, films, sheets and other molded articles. The polymers are prepared by forming the polycondensation product of one or more aromatic diamines, one or more trifunctional acid anhydride monomers, and one or more tetrafunctional aromatic dianhydrides, at least one of said monomers containing the groups ##STR1## linking two aromatic moieties, wherein R is CF.sub.3 or phenyl. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, improved resistance to attach by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as excellent thermal properties including resistance to thermooxidative degradation.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: September 4, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Paul N. Chen, Sr., Rohitkumar H. Vora
  • Patent number: 4954610
    Abstract: The present invention provides novel heat stable polyamide-imide polymers having excellent flow properties which render them more readily processible into fibers, films, sheets and other molded articles. The polymers are prepared by forming the polycondensation product of one or more aromatic diamines and one or more trifunctional acid anhydride monomers, at least one of said diamine monomers containing the group ##STR1## linking two aromatic moieties, wherein R is CF.sub.3 or phenyl. In addition to improved flow properties, the polyamide-imide polymers of this invention also exhibit improved solubility properties in most organic solvents, improved resistance to attack by chlorinated solvents such as trichloroethylene as compared with polyimides, improved hydrophobic properties as well as excellent thermal properties including resistance to thermooxidative degradation.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: September 4, 1990
    Assignee: Hoechst Celanese Corp.
    Inventors: Paul N. Chen, Sr., Rohitkumar H. Vora
  • Patent number: 4945156
    Abstract: Methods of solution processing of rigid chain and ladder polymers to films, coatings, or fibers from isotropic or anisotropic solutions in aprotic organic solvents containing Lewis acids are disclosed.
    Type: Grant
    Filed: December 29, 1988
    Date of Patent: July 31, 1990
    Assignee: Honeywell Inc.
    Inventors: Samson A. Jenekhe, James R. Peterson
  • Patent number: 4943471
    Abstract: A patterned thin film suitable for use in electric and electronic devices, prepared from a polymer or a mixture of the polymer and other known compounds capable of forming a thin film by LB technique, said polymer having linear recurring units wherein an organic group R.sup.1 having at least 2 carbon atoms and a valence of at least 2 is combined alternately with an organic group R.sup.2 having at least 2 carbon atoms and a valence of at least 2 through a bivalent group formed by a reaction of an acid group A containing a hetero atom and a basic group B containing a hetero atom, and wherein a hydrocarbon-containing group R.sup.3 having 10 to 30 carbon atoms which may contain a substituent group, is linked by covalent or ionic bond to said recurring units, the number of groups R.sup.3 being at least 2 per 10 recurring units.
    Type: Grant
    Filed: September 23, 1988
    Date of Patent: July 24, 1990
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masakazu Uekita, Hiroshi Awaji, Makoto Murata, Satoshi Mizunuma
  • Patent number: 4927906
    Abstract: Novel polymers containing amide and imide moieties are produced by reaction of a spirodilactam precursor selected from 4-oxoheptanedioic acid compounds or 1,6-dioxa [4,4] spirodilactones, a primary diamine and an aromatic tricarboxylic acid compound. The polymer products have relatively high glass transition temperatures.
    Type: Grant
    Filed: December 15, 1988
    Date of Patent: May 22, 1990
    Assignee: Shell Oil Company
    Inventor: Pen C. Wang
  • Patent number: 4918153
    Abstract: The present invention relates to a copoly(imidineamide) consisting of a copolymer of polyamidines and polyimides having, in the basic chain structure of the polymer, imidine structures represented by formula [I] and the amide structures represented by formula [II]: ##STR1## The copoly(imidine-amide) of the present invention is a polymeric material of excellent heat resistance and processability useful for a wide range of industrial applications.
    Type: Grant
    Filed: March 14, 1989
    Date of Patent: April 17, 1990
    Inventors: Patrick E. Cassidy, James M. Farley, Maryanne Mores
  • Patent number: 4910293
    Abstract: An amphiphilic high polymer comprises a linear recurring unit containing at least divalent organic group (R.sub.1) having at least two carbon atoms, at least divalent organic group (R.sub.2) having at least two carbon atoms, and at least one C.sub.10-30 hydrocarbon-containing group (R.sub.3) which may have one or more substituent groups, said organic groups R.sub.1 and R.sub.2 being connected to each other by a divalent connecting group, and said hydrocarbon-containing group R.sub.3 being boned to said recurring unit by a covalent bond, and the method for producing the same comprises polycondensating a combination of monomers containing R.sub.1 and R.sub.2.
    Type: Grant
    Filed: October 11, 1988
    Date of Patent: March 20, 1990
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masakazu Uekita, Hiroshi Awaji
  • Patent number: 4873311
    Abstract: The present invention comprises a water dispersible polyamide ester useful in flexographic ink formulations and Cold Seal Release Lacquers. A high AV polyamide is reacted with a polyol to increase molecular weight via ester formation. The polyamide ester is then reacted with a cyclic carboxylic anhydride. A general formula for the product resin is as follows: ##STR1## wherein x is an integer of 1-5; R'=a polyamide ester chain of molecular weight 500-2000; where y is an integer of 1-3; R.sup.2 is independently at each occurrence the residue of a cyclic carboxylic anhydride bearing at least one free carboxyl group or ##STR2## where R.sup.3 is independently at each occurrence R' or a polyamide segment of up to 2000 MW.
    Type: Grant
    Filed: February 5, 1988
    Date of Patent: October 10, 1989
    Assignee: Union Camp Corporation
    Inventors: Walter K. Bornack, Jr., Keith R. McNally
  • Patent number: 4868281
    Abstract: A polymer has a linear recurring unit in which a first organic group (R.sub.1) having at least two carbon atoms and a valence of at least three and a second organic group (R.sub.2) having at least two carbon atoms and a valence of at least two are bonded together alternatively through a divalent connecting group, and containing at least one hydrocarbon group (R.sub.3) having 10 to 30 carbon atoms which is linked to the recurring unit by an ionic bond and which may be substituted.
    Type: Grant
    Filed: June 19, 1987
    Date of Patent: September 19, 1989
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masakazu Uekita, Hiroshi Awaji
  • Patent number: 4861857
    Abstract: Thermotropic polyesterimides based on N-(.omega.-carboxyalkylene)-trimellitic acid imides and diphenols are distinguished by superior mechanical properties while at the same time being easily processible.
    Type: Grant
    Filed: May 23, 1988
    Date of Patent: August 29, 1989
    Assignee: Bayer Aktiengesellschaft
    Inventors: Hans-Rytger Kricheldorf, Ralf Pakull, Volker Eckhardt, Hans-Rudolf Dicke
  • Patent number: 4857599
    Abstract: Dense star polymers on immobilized cores are very useful as ion-exchange resins and chelation resins. For example, an aminated form of chloromethylated styrene/divinyl benzene copolymer can be employed as an immobilized core compound and reacted successively with methyl acrylate via a Michael addition reaction and then with ethylenediamine to form a first generation dense star polymer or dendrimer. These reactions can then be repeated to form second and third generation dendrimers.
    Type: Grant
    Filed: February 8, 1988
    Date of Patent: August 15, 1989
    Assignee: The Dow Chemical Company
    Inventors: Donald A. Tomalia, James R. Stahlbush
  • Patent number: 4845278
    Abstract: A new class of polymers and processes used in their preparation are described. These polymers are comprised of crosslinkable aramids, especially aramids that are based on synthetic aromatic amino acids. The aromatic amino acids suggested for this application are selected from the classes of amino benzoic acids, aminodiphenyl carboxylic acids, aminodiphenyl ether carboxylic acids, aminodiphenyl sulfide carboxylic acids, amino diphenyl sulfoxide--and sulfone carboxylic acids, aminonaphtalene carboxylic acids, amino anthracene carboxylic acids as well as their sulfonic acid counterparts, aminopyrimidine carboxylic acids and their crosslinkable and potentially crosslinkable derivatives. Crosslinkable or potentially crosslinkable moieties are selected from a group comprising amino-, nitro-, cyano-, halogene, acetylene, vinyl, acrylic moieties. Crosslinking can be achieved after linear polymers of high molecular weight are produced from low molecular weight prepolymers.
    Type: Grant
    Filed: September 3, 1987
    Date of Patent: July 4, 1989
    Inventor: Semih Erhan
  • Patent number: 4839219
    Abstract: A thin film comprising a polymer having linear recurring units wherein an organic group R.sup.1 is combined alternately with an organic group R.sup.2 through a bivalent bonding group, wherein each of said group R.sup.1 and said group R.sup.2 has a valence of at least 2 and has at least 2 carbon atoms; each of said linear recurring units having at least one hydrocarbon-containing group R.sup.3 having 10 to 30 carbon atoms bonded with covalent bond, and a device having the thin film. The thin film of the invention is formed by building-up layers of the above polymer by LB technique, and the obtained film can be subjected to ring closure and to elimination of a known LB compound added as occasion demand by heat treatment to provide a thin film having a thickness of not more than 10,000 .ANG. and excellent heat resistance, chemical resistance and mechanical properties, and the device having the thin film is useful particularly as electric and electronic devices.
    Type: Grant
    Filed: May 19, 1987
    Date of Patent: June 13, 1989
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Masakazu Uekita, Hiroshi Awaji
  • Patent number: 4831104
    Abstract: The thermoplastic aromatic polyamideimide compolymers comprising the structural units (1), (2) and (3) represented by formulae, ##STR1## respectively, (2) and (3) being at ratio of 1 mole to 1 mole of (1), (3) being at a ratio of 0.95-0.05 mole to 0.05-0.95 mole of (2), (1) and (2) or (3) being alternatively interconnected and Ar and Ar' being composed of 5 to 70 mole % of ##STR2## and 95 to 30 mole % of ##STR3## provide the moldings being superior in heat stability and fluidity at the temperatures of 300.degree. to 400.degree. C. and injection moldable and having desired characteristics.
    Type: Grant
    Filed: July 31, 1987
    Date of Patent: May 16, 1989
    Assignee: Toray Industries, Inc.
    Inventors: Toshihiko Aya, Sho Kadoi
  • Patent number: 4755585
    Abstract: Novel polymers and molding compositions are prepared from acyl halide derivatives of tricarboxylic acids and diamines and about 1 to about 10 percent by weight of phthalic anhydride, trimellitic anhydride or aniline moieties. The polymers are useful in engineering plastics.
    Type: Grant
    Filed: July 25, 1986
    Date of Patent: July 5, 1988
    Assignee: Amoco Corporation
    Inventors: Robert B. Hanson, Jeffrey D. Felberg, Gary T. Brooks