Abstract: A polyimide material comprises a polyimide. The polyimide has repeating units of formula (I). The polyimide material further comprises a coupling agent-containing filler. A method for preparing a polyimide material comprises allowing a mixture comprising an aromatic tetracarboxylic dianhydride, an aromatic diamine, and a coupling agent-containing filler to react to produce a polyamic acid. The method further comprises contacting the polyamic acid with an aliphatic dicarboxylic acid of formula (II) to produce an intermediate, and imidizing the intermediate to produce the polyimide material. A polyimide comprises repeating units of formula (I).

Abstract: The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids and that can also be used for protection of lead frame-exposed area, a thermoplastic resin composition for semiconductor for use in the adhesive agent layer therein, and a lead frame having the adhesive film and a semiconductor device; and, to achieve the object, the present invention provides a thermoplastic resin composition for semiconductor, comprising a thermoplastic resin obtained in reaction of an amine component containing an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3?-(3?-aminophenoxy)phenyl)amino-1-(3?-(3?-aminophenoxy)phenoxy)benzene and 3,3?-bis(3?-aminophenoxy)diphenylether, and an acid component (C), an adhesion film for semiconductor using the same, a lead frame having the adhesion fi

Abstract: A non-thermoplastic polyimide film exhibits high adherability without expensive surface treatment and is made from a precursor solution having high storage stability. The non-thermoplastic polyimide film comprises a non-thermoplastic polyimide resin having a block component derived from a thermoplastic polyimide. Preferably, the block component of the thermoplastic polyimide is present in an amount of 20 to 60 mol % of the entire polyimide so that the precursor solution thereof exhibits high storage stability and that the film can exhibit high adherability, in particular, high adherability to polyimide adhesives.

Abstract: A filament type nano-sized lone fiber and a method of producing the same are disclosed. In the method, a spinning solution or a spinning melt is electro-spun in drops using a spinneret to which a critical voltage is applied, and the spun drops are continuously collected on a multi-collector. The spinning solution is produced dissolving a blend or copolymer consisting of two or more kinds of polymers in a solvent. The spinning melt is produced by melting the polymers. The multi-collector is selected from the group consisting of a plate type collector, a roll type collector, and a combination thereof. The filament type nano-sized long fiber is processed into a yarn through one step during the electrospinning process, and thus, mechanical properties are better than those of conventional nanofiber non-woven fabric. Consequently, the filament type nano-sized long fiber can be utilized for the extended application.

Abstract: It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): wherein R1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.

Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.

Abstract: The present invention relates to novel imide oligomer compositions, polyimides formed therefrom, and methods for making and using the same. In particular, the invention relates to novel polyimide oligomers comprising 3,3?,4,4?-benzophenone tetracarboxylic dianhydride (BTDA), 2-(3,4-dicarboxy phenyl)-1-phenylacetylene anhydride (PE), and a mixture of 1,3-diaminobenzene and 4,4?-(1,3-phenylenediisopropylidene) bisaniline. The polyimide oligomers demonstrate low melt viscosity (these resins are melt processable) while retaining exceptional thermo-oxidative stability, high glass transition temperature, and good mechanical properties in the cured state.

Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.

Abstract: A conductive polymer having a high carrier transport ability, a conductive layer formed using the conductive polymer, an electronic device provided with the conductive layer having a high reliability, and electronic equipment provided with such an electronic device are provided. The conductive polymer includes a linear main chain, a plurality of carrier transport structures which contribute to carrier transport and each of which is represented by the following formula (1), and a linking structure which branches off from the main chain to link each of the carrier transport structures to the main chain: General Formula (1) where each R1 independently represents a hydrogen atom, a methyl group or an ethyl group, and the R1s are the same or different.

Abstract: A fluorine-containing diamine represented by the formula (1), [Chemical Formula 29] is provided. Furthermore, a fluorine-containing polymer is provided by using this fluorine-containing amine as a monomer. The fluorine-containing polymer can exhibit superior characteristics such as low dielectric property and high transparency, while maintaining high fluorine content and retaining adhesive property.

Abstract: It is an object of the present invention to provide a water-borne resin composition which can form a film being excellent in flexibility and heat resistance without reducing an insulating property and can be used suitably for a cationic electrocoating composition. A water-borne resin composition, having a hydrolysable functional group and a polymerizable unsaturated carbon bond, wherein a base resin is at least one species selected from the group consisting of a polyamide-imide resin, a polyamide resin and a polyimide resin.

Abstract: Hydroxypolyamides, hydroxypolyamide products, and post-hydroxypolyamides are disclosed as gel forming agents. Hydroxypolyamides and post-hydroxypolyamides are prepared from known methods. Hydroxypolyamide products are produced from a modified polymerization procedure which utilizes strong base for deprotonation of ammonium salts from the esterification of stoichiometrically equivalent polyacid:polyamine salts. The hydroxypolyamide products are capable of gel formation at lower concentrations than hydroxypolyamides and post-hydroxypolyamides from the known methods of preparation, and are therefore superior gel forming agents.

Abstract: To provide a liquid crystal aligning agent useful to obtain a liquid crystal alignment film which exhibits a high voltage retention characteristic even under high temperature conditions and which has a low accumulation charge, and a liquid crystal display device which is less susceptible to lowering of contrast or to image persistence.

Abstract: Photoreactive dendrimers comprising a core portion, branching units and terminal groups, wherein at least one terminal group and/or branching unit is a photoreactive group and wherein the photo reactive groups include preferably cinnamates, coumarins, benzylidenephthalimidines, benzylideneacetophenones, diphenylacetylenes stilbazoles, uracyl, quinolinone, maleinimides, or cinnamylidene acetic acid derivatives and are able to undergo photocyclization, in particular [2+2]-photocyclization.

Abstract: The present invention is related to a polyimide, which has high ionic conductivity and good structural stability, does not decompose even under low humidity, and is inexpensive, and a polymer electrolyte and a fuel cell using the same.

Abstract: A method for making polyetherimides is provided by reacting a high purity dianhydride with an aromatic diamine under condensation polymerization conditions. The dianhydrides employed are purified by a method comprising contacting a first solution containing a dianhydride compound, a solvent, and a phase transfer catalyst, with a solid inorganic adsorbent material having a total pore volume of about 0.5 milliliters/gram or greater and a cumulative pore volume distribution of about 20 percent or greater of particles having a pore diameter in a range between about 3 nanometers and about 20 nanometers. The solution containing the dianhydride compound is then separated from the solid inorganic adsorbent material to provide a purified dianhydride compound which is substantially free of the phase transfer catalyst. The purified dianhydrides are then condensed with aromatic diamines to provide polyetherimide compositions which are substantially free of residual phase transfer catalyst.

Abstract: An acrylic composition, or star acrylic polymer, includes the reaction product of an initiator, a first compound, and a highly-branched, polyfunctional core molecule. The initiator has a radical-forming portion and a functional group. The first compound, which includes a vinyl functional group, is reactive with the initiator to form a functionalized intermediate. The core molecule is reactive with the functionalized intermediate to form the acrylic composition. A method of forming the acrylic composition via free-radical polymerization includes the steps of reacting the initiator and the first compound to form the functionalized intermediate, and reacting the core molecule with the functionalized intermediate to form the acrylic composition.

Abstract: A water-soluble polyimide precursor, which can be suitably applied for aromatic polyimides and exhibits a low reduction in heat resistance and mechanical properties, an aqueous solution of the polyimide precursor and a polyimide obtained from the precursor. A heat-resistant fiber impregnated material and an impregnated sheet-like material are prepared by using the precursor and a laminate is prepared by employing the precursor.

Abstract: An anti-bacterial polymer of the present invention consists of a vapor deposition-polymerization reaction product of a diaminobenzoic acid monomer or halogen atom-containing diamine monomer and a monomer reactive with these monomers. The anti-bacterial polymer can be prepared by a method, which comprises the step of subjecting a gas obtained by evaporating a diaminobenzoic acid monomer or halogen atom-containing diamine monomer and a gas obtained by evaporating a monomer reactive with these monomers to vapor deposition-polymerization, in a vacuum, to thus form an anti-bacterial polymer. The method permits the formation of a film having a desired thickness even on the surface having a complicated shape such as the surface of, for instance, a heat exchanger.

Abstract: A polymeric dispersant of the structure: wherein R1 is selected from the group consisting of H, CH3, and a combination thereof, and n is an integer from 4 to 200, for use in printing inks.

Abstract: A material for dielectric films is a polymerizable composition containing an organic solvent, and an adamantanepolycarboxylic acid derivative represented by following Formula (1): wherein X is hydrogen atom, a hydrocarbon group or R4; R1, R2, R3 and R4 and are each independently a protected or unprotected carboxyl group, etc.; and Y1, Y2, Y3 and Y4 are each independently a single bond or a bivalent aromatic cyclic group; and an aromatic polyamine derivative represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R5, R6, R7 and R8 are each a substituent bound to Ring Z and are each independently a protected or unprotected amino group, etc., dissolved in the organic solvent.

Abstract: The present invention relates to novel polyesterpolyols with cyclic imide structure and to their use in coating compositions.

Abstract: A diamine compound represented by the formula (1): wherein R1 is a trivalent organic group, each of X1 and X2 is a bivalent organic group, X3 is an alkyl or fluoroalkyl group having from 1 to 22 carbon atoms, or a cyclic substituent selected from aromatic rings, aliphatic rings, heterocyclic rings and their substituted groups, and n is an integer of from 2 to 5. And, a polyimide precursor and a polyimide synthesized by using the diamine compound; and a treating agent for liquid crystal alignment containing the polyimide precursor and/or the polyimide.

Abstract: The present invention relates to novel polyesterpolyols with cyclic imide and isocyanurate structure and to their use in coating compositions.

Abstract: A method for preparation of a sulfonic and or sulfonic acid salt containing polyimide resins comprising melt reaction of a polyimide resin with an organic compound, wherein the organic compound contains at least one aliphatic primary amine functionality and at least one other functionality selected from the group consisting of sulfonic acids, sulfonic acid salts or mixtures thereof.

Abstract: Polyimide resins that are suitable for processing by resin transfer molding (RTM) and resin infusion (RI) methods at reduced processing temperatures are provided. The inventive RTM and RI processable polyimide resins exhibit melting at temperatures of less than about 200° C. and melt viscosities at 200° C. of less than about 3000 centipoise. A process for synthesizing the inventive resins is also provided, as is a fiber-reinforced composite material. The fiber-reinforced composite material employs the inventive polyimide resin as its resin matrix and demonstrates good heat resistance and mechanical properties.

Abstract: A material for dielectric films is a polymerizable composition containing an adamantanepolycarboxylic acid represented by following Formula (1): wherein X is a hydrogen atom, a carboxyl group or a hydrocarbon group; and Y1, Y2, Y3 and Y4 are the same as or different from one another and are each a single bond or a bivalent aromatic cyclic group; an aromatic polyamine represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R1 and R2 are each a substituent bound to Ring Z, are the same as or different from each other and are each an amino group, a mono-substituted amino group, a hydroxyl group or a mercapto group; and a solvent other than ketones and aldehydes, in which the adamantanepolycarboxylic acid and aromatic polyamine are dissolved in the solvent

Abstract: In the process of the present invention, a solvent-soluble polyimide is produced by polycondensing at least one tetracarboxylic acid component with at least one diamine component in a solvent in the presence of a tertiary amine. The tetracarboxylic acid component is selected from the group consisting of tetracarboxylic dianhydrides represented by the following formula 1: wherein R is as defined in the specification, and tetracarboxylic acids and their derivatives represented by the following formula 2: wherein R and Y1 to Y4 are as defined in the specification. Unlike the conventional techniques using an excessively large amount of a chemical imidation agent such as acetic anhydride and a chemical imidation catalyst such as triethylamine, in the process of the present invention, the solvent-soluble polyimide having a high polymerization degree is easily produced in a solvent with good productivity by using only a catalytic amount of the tertiary amine.

Abstract: The present invention provides a polyimide resin for an electrical insulating material which comprises a polyimide resin having a repeating unit represented by general formula (I): wherein R1 represents a bivalent organic group.

Abstract: Disclosed herein are polyetherimide compositions comprising structural units of the formula: derived from at least one benzimidazole diamine, wherein R1 and R2 are independently selected from hydrogen and C1–C6 alkyl groups; “A” comprises structural units of the formulae: or mixtures of the foregoing structural units; wherein “D” is a divalent aromatic group, R3 and R10–R12 are independently selected from hydrogen, halogen, and C1–C6 alkyl groups; “q” is an integer having a value of 1 up to the number of positions available on the aromatic ring for substitution; and “W” is a linking group; and “B” comprises substituted and unsubstituted arylene groups having from about 6 to about 25 carbon atoms. Methods for producing the polyetherimide compositions are also disclosed herein.

Abstract: This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol % or more of 4,4?-diamino-2,2?-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol % or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bis[4-(4-aminophenoxy)phenyl]propane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.

Abstract: A method for preparing a polyimide includes introducing a mixture of an oligomer and a solvent to an extruder, removing solvent via at least one extruder vent, and melt kneading the oligomer to form a polyimide. The polyimide has a low residual solvent content. The method is faster than solution polymerization of polyimides, and it avoids the stoichiometric inaccuracies associated with reactive extrusion processes that use monomers as starting materials.

Abstract: A monomer to produce polybenzimidazole is dissolved in polyphosphoric acid. For example, polysulfated phenylene sulfonic acid (acidic group-possessing polymer) is further dissolved in this solution. In this procedure, the acidic group-possessing polymer and the monomer are adsorbed to one another in accordance with the acid-base interaction. When the monomer is polymerized, for example, by means of dehydration polymerization in this state, then polybenzimidazole is synthesized, and the polybenzimidazole and the acidic group-possessing polymer are compatibilized with each other to produce a compatibilized polymer. When the compatibilized polymer is deposited as a solid, and the solid is separated from polyphosphoric acid, then the compatibilized polymer is obtained. A proton conductive solid polymer electrolyte as a final product is manufactured by forming the compatibilized polymer to have a predetermined shape.

Abstract: Polyimide sulfone resins are provided with a glass transition temperature of from 200–350° C., residual volatile species concentration of less than 500 ppm and a total reactive end group concentration of less than about 120 milliequivalents/kilogram resin. The resins have high heat capability and good melt stability. Methods to prepare the said resins and articles made from the resins are also provided.

Abstract: A novel polyimide resin consisting essentially of 3,3?,4,4?-benzophenonetetracarboxylic dianhydride (BTDA), 3,4,3?,4?-biphenyltetracarboxylic dianhydride (BPDA), 2,2 bis (3?,4?-dicarboxy phenyl) hexafluoro propane dianhydride (6FDA), 2-(3,4-dicarboxyphenyl)-1-phenylacetylene anhydride (4-PEPA) and an aromatic diamine.

Abstract: A photoactive side-chain polymer from the class of polyimides, polyamide acids and esters thereof, comprising as a side-chain a dendritic block incorporating photoactive groups at its surface. The dendritic block preferably represents a unit of formulae Ia, Ib or a combination of them, for example formulae Ic, wherein the broken line symbolizes the linkage to the polyimide main chain. The polymer may be used as an orientation layer for liquid crystals and in the construction of unstructured and structured optical elements and multi-layer systems.

Abstract: The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C. The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.

Abstract: The present invention relates to novel polyimides derived from 6FDA and from 3,3-dihydroxy-4,4?-diaminobiphenyl and novel polyimides derived from PMDA and from Bis-AP-AF, having alkyl, arylalkyl, heteroarylalkyl, (cycloalkyl)alkyl, fluoroalkyl or siloxane side groups. The present invention also relates to a method of producing nematic liquid-crystal devices, which comprises the steps consisting in: depositing one of the polyimides according to the invention on a substrate; annealing the polyimide in one or more steps; and defining an azimuthal orientation of the polyimide coating.

Abstract: A new class of hybrid organic-inorganic materials, and methods of synthesis, that can be used as a proton exchange membrane in a direct methanol fuel cell. In contrast with Nafion® PEM materials, which have random sulfonation, the new class of materials have ordered sulfonation achieved through self-assembly of alternating polyimide segments of different molecular weights comprising, for example, highly sulfonated hydrophilic PDA-DASA polyimide segment alternating with an unsulfonated hydrophobic 6FDA-DAS polyimide segment. An inorganic phase, e.g., 0.5–5 wt % TEOS, can be incorporated in the sulfonated polyimide copolymer to further improve its properties. The new materials exhibit reduced swelling when exposed to water, increased thermal stability, and decreased O2 and H2 gas permeability, while retaining proton conductivities similar to Nafion®. These improved properties may allow direct methanol fuel cells to operate at higher temperatures and with higher efficiencies due to reduced methanol crossover.

Abstract: A terminal-crosslinkable polyamic acid oligomer having 1) heat resistance indicated by Tg of 300° C. or more and a pyrolysis temperature of 500° C. or more, 2) toughness, and 3) capability of allowing an increase in concentration. The polyamic acid oligomer is obtained by reacting an aromatic tetracarboxylic dianhydride including 2,2?,3,3?-biphenyltetracarboxylic dianhydride, an aromatic diamine compound, and a reactive crosslinking agent including an amino group or acid anhydride group and a crosslinkable group in the molecule, and includes a crosslinkable group at the molecular terminal.

Abstract: This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3?,4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1–60 poise at 260–280° C. When the imide oligomer melt is cured at about 371° C. in a press or autoclave under 100–500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (Tg) equal to and above 310° C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232–280° C. (450–535° F.) without any solvent.

Abstract: The invention relates to biocidal polymers based on guanidine salts characterized in that they are representatives of a number of polyoxyalkylene guanidines and their salts and are a product of a polycondensation of guanidine salts with diamines which include two amino groups and polyoxyalkylene chains therebetween. In addition to a high bactericidity, these new polymer products are provided with a relatively low toxicity, an increased hydrophily, a quick and complete dilution in water, increased values of relative molar mass, and distinct characteristics of polymer surface active substances.

Abstract: The invention relates to a modified polybenzimidazole (PBI), membranes that are fabricated from these polymers, and their use in electrochemical applications. These membranes have high ionic conductivity and are suitable for solid polymer electrolytes in electrochemical applications, especially for high temperature polymer electrolyte membrane (PEM) fuel cells.

Abstract: This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electronic parts. This polyimide resin is obtained from an aromatic tetracarboxylic acid dianhydride (A) and a diamine (B) comprising 30–95 mol % of a bis(4-aminophenoxy)alkane (B1) and 5–70 mol % of a siloxanediamine (B2) as essential components.

Abstract: This invention relates to polyimides having improved thermal-oxidative stability, to the process of preparing said polyimides, and the use of polyimide prepolymers in the preparation of prepregs and composites. The polyimides are particularly useful in the preparation of fiber-reinforced, high-temperature composites for use in various engine parts including inlets, fan ducts, exit flaps and other parts of high speed aircraft.

Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.

Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.

Abstract: Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).

Abstract: Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: wherein chemical structure A2 includes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.

Abstract: A polyimide excelling in heat resistance, chemical resistance, water repellency, dielectric characteristics, electrical characteristics, and optical characteristics and a polyamide acid useful as the raw material therefor are provided. Specifically, a polyamide acid containing a chlorine atom and a fluorine atom and comprising a repeating unit represented by the following formula (1): (wherein X and X? independently denote a divalent organic group; Y and Y? independently denote a chlorine, bromine, or iodine atom; p and p? denote independently denote the number of fluorine atom {F in the formula (1)} bonded to the relevant benzene ring, representing an integer of 0-3; q and q? independently denote an integer of 0-3; and p+q total 3, and p?+q? total 3).