Abstract: A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.
Abstract: A moisture curable polyurethane composition comprising (A) a urethane prepolymer having two or more isocyanate groups in the molecule, (B) an inorganic filler as a storage stabilizer, (C) an N-silylamide compound represented by the formula (1), (D) an epoxy resin, and/or (E) a moisture latent curing agent, and a moisture curable epoxy resin composition comprising (D) an epoxy resin, (C) an N-silylamide compound, and (E) a moisture latent curing agent.
(R1—CONH)4-n—Si—R2n (1)
wherein R1 is a hydrocarbon group having 5 to 21 carbon atoms optionally containing a heteroatom, provided that when n is 0, 1 or 2, R1s may be the same or different; and R2 is an alkyl or alkoxy group having 1 to 3 carbon atoms; and n is 0, 1, 2 or 3.
The moisture curable compositions are excellent in storage stability and thixotropic properties, have high curing rates at the time of working, and can give rise to cured products having excellent mechanical properties such as tensile strength.
Abstract: The present invention has an object to provide a flame-retardant epoxy resin composition excellent in heat resistance and moisture resistance. A flame-retardant epoxy resin composition relating to the present invention contains an epoxy resin (A), a phosphazene compound (B), an epoxy hardener (C) and an inorganic filler (D), wherein the phosphazene compound (B) and the epoxy hardener (C) are included in the range of 0.
Type:
Grant
Filed:
November 7, 2002
Date of Patent:
September 28, 2004
Assignee:
Otsuka Kagaku Kabushiki Kaisha
Inventors:
Masatoshi Taniguchi, Yuji Tada, Yoichi Nishioka
Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.
Type:
Grant
Filed:
January 30, 2002
Date of Patent:
September 28, 2004
Inventors:
Chun-Shan Wang, Jeng-Yueh Shieh, Ching Hsuan Lin
Abstract: In a process for preparing polytetrahydrofuran having terminal OH groups (PTHF) from the corresponding polytetramethylene ether having acyloxy end groups by transesterification with alcohols in the presence of a sodium-containing catalyst followed by passing the alcoholic PTHF solution in the presence of a catalytic amount of water directly through at least one ion exchanger to remove the sodium ions, the removal of the sodium ions is carried out in a fully continuous ion exchange unit which comprises:
Abstract: In a process for the single-stage preparation of polytetrahydrofuran and/or tetrahydrofuran copolymers having a mean molecular weight of from 650 to 5000 dalton by polymerization of tetrahydrofuran over an acid catalyst in the presence of at least one telogen and/or comonomer, the telogen and/or comonomer is added at at least two addition points in different segments of the polymerization apparatus.
Type:
Application
Filed:
February 3, 2004
Publication date:
September 23, 2004
Inventors:
Ulrich Steinbrenner, Martin Haubner, Achim Gerstlauer, Thomas Domschke, Christoph Sigwart, Stefan Kashammer
Abstract: A cationically polymerizable liquid composition is formed from a cationically polymerizable mixture (A) and a solid resin (B) that is compatible with the mixture (A) at room temperature and has a softening point of at least 40° C., so that the composition has a viscosity at 25° C. of 20 Pa·sec or below. The cationically polymerizable mixture (A) is formed from a monofunctional monomer (A-1) having in the molecule only one cyclic ether structure represented by formula (1) below, a polyfunctional monomer (A-2) having in the molecule at least two cyclic ether structures represented by formula (1) below, and a latent cationic polymerization initiator (A-3). A tacky polymer formed by cationic polymerization of the composition is also disclosed.
(In formula (1), n denotes 0, 1, or 2, and R1 to R6 independently denote hydrogen atoms or hydrocarbon groups, which may have a substituent.
Abstract: Clear, amine-initiated polyether polyols are made by epoxidizing an amine in the presence of an alkali metal hydroxide catalyst. By reducing the amount of catalyst used during the polyol synthesis and by adding the catalyst after between 5 and 30% of the total amount of at least one alkylene oxide has been added, after lactic acid neutralization, gives a short chain polyol that has foam processing characteristics similar to the conventional sulfuric acid neutralized polyol. The polyols produced in this manner are particularly useful for the production of polyurethane and polyisocyanurate foams.
Type:
Application
Filed:
February 21, 2003
Publication date:
August 26, 2004
Inventors:
Nathan L. Anderson, Karl W. Haider, Keith J. Headley, Kerry A. Ingold, Herman P. Doerge
Abstract: A method of removing and reclaiming a double metal cyanide (DMC) catalyst from a polyol is disclosed. A polymeric acid that is soluble in the polyol is introduced into the polyol during or after the polymerization reaction. The polymeric acid reacts with the double metal cyanide catalyst thereby causing the double metal cyanide catalyst and the polymeric acid to form an agglomeration in the polyol. The agglomeration is easily separated from the polyol via filtration, for example. The recovered agglomerated DMC catalyst can then be reconstituted using an acid solution.
Abstract: An epoxy resin curing agent having a number average molecular weight of 500 to 3,000, represented by the formula (1), and a cured product thereof.
Abstract: A composition capable of providing excellent bonding characteristics, including bond strength, even at relatively high temperatures and even without the use of styrene as a reactive diluent, comprising polymerizable vinyl ester compounds, preferably in combination with a select reactive diluent for the polymerizable vinyl ester compounds, wherein the polymerizable vinyl ester compounds are preferably present in the adhesive compositions in amounts of from about 10 wt % to about 30 wt %.
Abstract: An epoxy resin composition comprising an epoxy resin, a hardening agent and a hardening accelerator as an indispensable ingredients is provided wherein the hardened resin has a high translucency and has little discoloration under high temperature and high humidity and is excellent at heat resistance and light fastness by compounding a phosphonium compound represented by the following formula (I) as a hardening accelerator.
Abstract: An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
Abstract: Compounds of the formula I wherein Q denotes a n-valent aliphatic, cycloaliphatic, aromatic or araliphatic radical, n is a integer from 4 to 512, R1 is hydrogen or methyl, Y is a radical containing 2 to 30 carbon atoms selected from alkyl, aryl, aralkyl, cycloalkyl, cycloalkylalkyl, alkoxy, aryloxy, aryloxy, cycloalkoxy, cycloalkylalkoxy, —NR2R3, —OCOR2, wherein R2 and R3 independently of one another denote alkyl, aryl, aralkyl or cycloalkyl, or Y is a radical of formula II wherein A denotes a m-valent aliphatic, cycloaliphatic, aromatic or araliphatic radical, m is an integer from 2 to 4, have a low viscosity and useful attributes in Adhesive and Tooling materials.
Abstract: The present invention relates to novel double metal cyanide (DMC) catalysts for the preparation of polyether polyols by a polyaddition reaction between alkylene oxides and starter compounds having active hydrogen atoms, wherein the catalyst contains a) at least one double metal cyanide compound, b) at least one organic complexing ligand and c) at least one fluorine-containing complexing ligand.
Type:
Application
Filed:
July 23, 2003
Publication date:
May 13, 2004
Inventors:
Pieter Ooms, Jorg Hofmann, Martin Dobler
Abstract: The present invention relates to a process for the preparation of a double metal cyanide (DMC) catalyst, which process involves:
(a) combining an aqueous solution of a metal salt with an aqueous solution of a metal cyanide salt and reacting these solutions; and
(b) recovering the DMC catalyst from the reaction mixture,
in which process the DMC catalyst is prepared in the presence of from 0.03 to 0.4 mole of alkaline metal compound, based on amount of metal salt.
Further, the present invention relates to DMC catalyst obtainable by such process, to DMC catalyst prepared from a metal salt and a metal cyanide salt in which the molar ratio of metal derived from the metal salt to metal derived from the metal cyanide salt is at least 2.25 and to a process for polymerization of alkylene oxides which process involves reacting initiator with alkylene oxide in the presence of at most 15 ppm of DMC catalyst.
Type:
Grant
Filed:
June 10, 2003
Date of Patent:
April 6, 2004
Assignee:
Shell Oil Company
Inventors:
Michiel Barend Eleveld, Robert Adrianus Wilhelmus Grotenbreg, Ronald Van Kempen
Abstract: A method of forming a polyol includes the steps of reacting an initiator with an alkylene oxide, and optionally carbon dioxide, in the presence of a double metal cyanide catalyst and a sterically hindered chain transfer agent capable of protonating the growing polyol polymer. The presence of the chain transfer agent reduces the polydispersity of the resultant polyol.
Type:
Grant
Filed:
March 31, 2003
Date of Patent:
March 30, 2004
Assignee:
BASF Corporation
Inventors:
Werner Hinz, Jacob Wildeson, Edward Michael Dexheimer, Raymond Neff
Abstract: A curable composition comprising an epoxy compound having two or more epoxy group per molecule and a curing agent wherein the curing agent comprises a hexanetricarboxylic acid, a cured product obtained from the composition, a curing method of the composition, a coating using the composition, and a coating film obtained by curing the coating. The curing time of this composition is short.
Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.
Abstract: An object of the present invention is to provide an amino composition which provides, when used as a curing agent for epoxy resin, a long pot life and an excellent appearance of a coating film to an epoxy resin composition without deteriorating the reactivity of the composition. The amino composition is obtained by addition reaction of diamine such as metaxylylenediamine and 1,3-bis (aminomethyl) cyclohexane and styrene, wherein the content of the diamine is less than 15% by weight based upon the total weight of the amino composition and the content of 1-addition product of having one phenethyl group is 50 to 100% by weight based upon the total weight of amino compound(s) obtained by the addition reaction.
Abstract: A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).
Abstract: There is provided a modified epoxy resin composition including a reaction product of an epoxy resin and an alkyl-substituted acetoacetate and a reaction product of an alcohol having at least one hydroxyl group in one molecule and an alkyl-substituted acetoacetate; a production process for the same; and a solvent-free coating using the same. The composition provides a solvent-free epoxy resin composition which has a low viscosity and excellent low-temperature curability.
Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.
Abstract: Epoxy polymer precursors and epoxy polymers resulting therefrom are tolerant to bombardment by high-energy radiation. The epoxy polymer precursors comprise at least an epoxy resin free of aromatic units and at least a curing agent selected from the group consisting of aliphatic polyamines, cycloaliphatic polyamines, polyamides, aliphatic anhydrides, cycloaliphatic anhydrides, and mixtures thereof. In one embodiment of the invention the epoxy resin comprises at least a cycloparaffinic group, and the curing agent comprises a polyamine derived from cyclohexane. Such epoxy polymer compositions are used to form reflectors elements between adjacent scintillator elements in high-energy radiation detector array.
Type:
Application
Filed:
June 12, 2002
Publication date:
December 25, 2003
Applicant:
General Electric Company
Inventors:
Sean Elliot Armstrong, Wendy Wen-Ling Lin, Alan Ilya Kasner
Abstract: The present invention provides a novel salt useful as an active species in an organic reaction and represented by the following chemical formula (1):
wherein n stands for an integer of from 1 to 8, Zn− represents an n-valent anion of an active hydrogen compound, a, b, c and d each stands for a positive integer, and Rs represent the same or different hydrocarbon groups. Also disclosed is a simple and efficient process for producing a poly(alkylene oxide) by polymerizing an alkylene oxide compound in the presence of the salt represented by the chemical formula (1).
Abstract: The present invention provides a novel salt useful as an active species in an organic reaction and represented by the following chemical formula (1): 1
Abstract: A method for producing partially fluorinated epoxides and corresponding polyether homopolymers of these polyfluorinated epoxides is described. Also described is a method for incorporating a fluoroalcohol functional group into a polymer as a pendant group. Certain perfluorinated olefins are also described. These polyfluorinated epoxides and the associated polymers and methods relating to them are useful components in photoresists, particulary in lithographic photoresists for use at low ultraviolet wavelengths (e.g., 157 nm).
Type:
Grant
Filed:
October 3, 2001
Date of Patent:
November 25, 2003
Assignee:
E. .I du Pont de Nemours and Company
Inventors:
Viacheslav Alexandrovich Petrov, Andrew Edward Fiering, Jerald Feldman
Abstract: A method for making flexible epoxy resins by curing an epoxide and a bis-phenol with an aliphatic secondary diamine having the structural formula (I) or (II):
where R1 and R2 are each individually an alkyl, alkenyl, aryl, or arylalkyl group having from about 1 to about 20 carbon atoms, and R3 and R4 are each individually an alkyl or alkenyl group having from about 1 to about 20 carbon atoms, or hydrogen.
Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
Type:
Grant
Filed:
January 31, 2002
Date of Patent:
September 23, 2003
Assignee:
National Starch and Chemical Investment Holding
Corporation
Inventors:
Paul Morganelli, Anthony DeBarros, Brian Wheelock, Jayesh Shah
Abstract: A hyperbranched dendritic polyether, which optionally is further processed, such as further chain extended, chain terminated and/or functionalised. The hyperbranched dendritic polyether is obtained in a process comprising the step of thermally initiated cationic ring-opening polymerisation of at least one oxetane having at least two reactive groups of which at least one is an oxetane group. The thermally initiated ring-opening polymerisation is performed using an effective amount of at least one initiator, such as a thermal onium salt, a Lewis acid and/or a Brønsted acid. The terminal groups in said hyperbranched dendritic polyether are substantially hydroxyl groups and used for said optional further processing.
Type:
Grant
Filed:
January 25, 2002
Date of Patent:
September 9, 2003
Assignee:
Perstorp AB
Inventors:
Helen Magnusson, Eva Malmstrom, Anders Hult, Nicola Rehnberg
Abstract: Aqueous solutions of inorganic nitrate salts are used to accelerate the gelling of epoxy gelcoat resins without adversely affecting the glass transition temperature of the finally cured gelcoat. The aqueous accelerants may be used to accelerate gelling of gelcoats that are formed during initial fabrication of composite parts. The aqueous acclerants are also useful for shortening the gel time of gelcoats that are intended for use in repairing damaged structures.
Abstract: The invention relates to double-metal cyanide (DMC) catalysts for preparing polyether polyols by the polyaddition of alkylene oxides on to starter compounds containing active hydrogen atoms, wherein the DMC catalysts are composed of: a) at least one DMC compound; b) at least one organic complexing ligand which is not a coronand; and c) at least one coronand. The DMC catalysts of the present invention have increased activity compared to known catalysts.
Type:
Grant
Filed:
August 28, 2002
Date of Patent:
July 1, 2003
Assignee:
Bayer Aktiengesellschaft
Inventors:
Walter Schäfer, Jörg Hofmann, Pieter Ooms
Abstract: A coating, sealant or adhesive composition curable at ambient temperatures of 40° C. or below comprises an epoxy resin and an amine-functional curing agent. The curing agent comprises a material containing at least two, and preferably at least three, heterocyclic secondary amine group.
Type:
Grant
Filed:
June 9, 2000
Date of Patent:
June 10, 2003
Assignee:
International Coatings Ltd.
Inventors:
Colin Cameron, Anna Thomas, Alastair Robert Marrion, Ian David Fletcher, Stefan Norbert Rudiger Niedoba
Abstract: The invention relates to a novel process for the preparation of polycondensate solutions based on polyamidoamine/epichlorohydrin resins that gives products having a very low content of organic chlorine compounds, in particular a 1,3-dichlorophenol-2-propanol content of <0.1%, in combination with high activity and good shelf-life.
Type:
Grant
Filed:
July 2, 2001
Date of Patent:
June 10, 2003
Assignee:
Bayer Aktiengesellschaft
Inventors:
Karl-Rudolf Gassen, Joachim König, Karlheinrich Meisel, Fritz Puchner, Jürgen Reiners, Horst Zwick
Abstract: The invention provides an electropolymerizable monomer comprising a chemically bound active agent, said agent being capable of affecting animal tissue.
Abstract: The invention relates to a method for continuously or discontinuously producing tetrahydrofuran polymers by homopolymerization of tetrahydrofuran, alkyl-substituted tetrahydrofurans and/or alkylene oxides in the presence of carboxylic acid anhydrides or compounds containing reactive hydrogen using an optionally non-acidified or acid-activated calcined and granular natural amorphous aluminum silicate catalyst. The inventive method provides a means for substantially suppressing the formation of cyclic ethers and for obtaining a polymer with a narrow molecular weight distribution by keeping the concentration of carboxylic acid anhydrides or alkylene oxide constantly below 1 wt. % during polymerization. The catalysts have a long life span and lead to polymers that are characterized by highly uniform properties and a narrow molecular weight distribution even if a fairly impure monomer is used.
Abstract: Process for the preparation of a DMC catalyst useful in the polymerization of alkylene oxides into polyether polyols, which process comprises the steps of (a) combining an aqueous solution of a metal salt with an aqueous solution of a metal cyanide salt and reacting these solutions, wherein at least part of this reaction takes place in the presence of an organic complexing agent, thereby forming a dispersion of a solid DMC complex in an aqueous medium; (b) combining the dispersion obtained in step (a) with a liquid, which is essentially insoluble in water and which is capable of extracting the solid DMC complex formed in step (a) from the aqueous medium, and allowing a two-phase system to be formed consisting of a first aqueous layer and a layer containing the DMC complex and the liquid added; (c) removing the first aqueous layer; and (d) recovering the DMC catalyst from the layer containing the DMC catalyst.
Type:
Application
Filed:
September 24, 2002
Publication date:
April 10, 2003
Inventors:
Michiel Barend Eleveld, Riemer Alberts De Groot, Ronald Van Kempen, Johan Paul Smit
Abstract: A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.
Type:
Grant
Filed:
March 27, 2001
Date of Patent:
March 18, 2003
Assignee:
International Business Machines Corporation
Inventors:
Robert Maynard Japp, Konstantinos I. Papathomas, Mark D. Poliks
Abstract: The invention relates to new double metal cyanide (DMC) catalysts for the production of polyether polyols by polyaddition of alkylene oxides to starter compounds containing active hydrogen atoms, wherein the catalyst contains a) double metal cyanide compounds, b) organic complex ligands different from c), and c) &agr;,&bgr;-unsaturated carboxylic acid esters. The catalysts according to the invention have a significantly improved activity in the production of polyether polyols.
Abstract: A polymerization process for producing highly branched polyesters is disclosed comprising reacting functional groups A and B of multi-functional branching monomer reactants of the formula A—L—Bn, where one of A and B represents an epoxide group, the other of A and B represents an acid chloride group, L represents a linking group between A and B, and n is at least 2. In accordance with a specific embodiment of the invention, branched polyesters are obtained which have a number average molecular weight of at least 1000 and a ratio of weight average molecular weight to number average molecular weight of less than 2. The invention provides a process for producing highly branched polyesters in one reaction step. The invention has the capability of making highly branched structures of high molecular weight and low polydispersity and has the advantages of not requiring multi-step reactions and purification.
Abstract: A radiation curable, flexible, paintable composition produced from epoxy compounds and one or more polyol(s) has enhanced durability, thick and thin film adhesion, resistance to mold growth and dimensional changes while reducing solvent emissions. The composition can reduce, if not eliminate, runs and drips during the thermal bake cycles which are associated with using conventional compositions in automotive applications.
Type:
Application
Filed:
March 6, 2002
Publication date:
December 5, 2002
Inventors:
Donald W. Taylor, Todd W. Scrivens, Laurie Denise Lovshe, Jeffrey T. Pachl
Abstract: A high char yield polybenzoxazine is formed by mixing (i) a benzoxazine compound, (ii) a furan compound, (iii) a benzoxazine-furan compound or combinations thereof, wherein the mixture has a benzoxazine ring to furan ring ratio from about 0.001 to about 10 and then heating the mixture for a sufficient time to form the polybenzoxazine.
Type:
Grant
Filed:
November 3, 2000
Date of Patent:
November 19, 2002
Assignee:
Dow Global Technologies Inc.
Inventors:
Marvin L. Dettloff, Jerry E. White, Marty J. Null
Abstract: The present invention provides a process and its utilization in a process comprising the step of carrying out an addition reaction of an alkylene oxide to an addition-receiving substance in the presence of a resin catalyst, thereby producing the addition reaction product, when the resin catalyst as used for the reaction is persevered so as to recycle it after it is recovered, the unreacted alkylene oxide remaining in the resin catalyst can be prevented from polymerizing and solidifying during the preservation, and the resin catalyst accordingly can be preserved stably for a long time. The resin catalyst as recovered after it is used for the reaction may be preserved under any of the following conditions: 1) at a low temperature of not higher than 40° C.
Abstract: The resin system comprises at least two components which can be stored separately and crosslinked with one another at room temperature, preferably without curing accelerators. The first component comprises at least one compound of the formula (I)
where A is an unsubstituted or substituted aromatic radical.
The second component comprises at least one cyclic anhydride of an organic acid.
Type:
Grant
Filed:
February 9, 2001
Date of Patent:
October 22, 2002
Assignee:
ABB Schweiz AG
Inventors:
Friedrich Vohwinkel, Stefan Foerster, Jens Rocks
Abstract: The invention is directed to a process for preparing a polyether polyol by the polyaddition of an alkylene oxide on to a starter compound containing active hydrogen atoms under basic catalysis in the presence of phosphonium cations.
Abstract: A process for preparing polytetrahydrofuran, polytetrahydrofuran copolymers or diesters or monoesters of these polymers comprises polymerizing tetrahydrofuran in the presence of at least one telogen and/or comonomer over a heterogeneous catalyst comprising hectorite.
Type:
Grant
Filed:
February 29, 2000
Date of Patent:
September 24, 2002
Assignee:
BASF Aktiengesellschaft
Inventors:
Karsten Eller, Michael Hesse, Rainer Becker, Arthur Höhn, Heinz Rütter
Abstract: EpB polyether alcohols were prepared by reacting 3,4-epoxy-1-butene with water or an alcohol such as methanol, butanol or ethylene glycol. Polyether alcohols thus prepared were found to have utility as reactive diluents for oxidatively curable coatings. In addition to this application, 3,4-epoxy-1-butene oligomers can also function as a resin, a chain extender, a monomer, and an additive for various oxidatively curable coating systems including alkyds, unsaturated polyesters, (meth)acrylate functional resins, urethanes, and latexes.
Type:
Grant
Filed:
May 4, 2000
Date of Patent:
September 17, 2002
Assignee:
Eastman Chemical Company
Inventors:
Thauming Kuo, Edward Enns McEntire, Stephen Neal Falling, Yao-Ching Liu, William Anthony Slegeir
Abstract: A silicone composition containing a polyethersiloxane block copolymer network and a fluid within the network is useful as a component of various personal care compositions.
Type:
Grant
Filed:
June 12, 2000
Date of Patent:
September 3, 2002
Assignee:
General Electric Company
Inventors:
John A. Kilgour, Michael J. O'Brien, Atchara Chaiyawat
Abstract: The present invention provides a curing agent for epoxy resin containing a siloxane-modified phenol resin (3) obtained by dealcoholization condensation reaction between a phenol resin (1) and a hydrolyzable alkoxysilane (2). The present invention further provides an epoxy resin composition comprising an epoxy resin and the above-mentioned curing agent for epoxy resin. The present invention further provides a method for preparing a siloxane-modified phenol resin (3) characterized by subjecting a phenol resin (1) and a hydrolyzable alkoxysilane (2) to dealcoholization condensation reaction.
Abstract: The present invention has its object to provide a curable composition giving cured products improved in residual tack (reduced in stickiness), with the physical properties insuring those tensile characteristics and rubber elasticity required of sealing compositions for general architectural use being retained. The present invention provides a curable composition which comprises (I) 100 parts by weight of a reactive silicon group-containing polyether oligomer with the percentage of the number of reactive silicon groups to the number of molecular chain terminals as determined by 1H-NMR analysis being not less than 85% and (II) 1 to 500 parts by weight of a plasticizer.