Silicon Reactant Contains An Aryl Group Patents (Class 528/43)
  • Patent number: 9302915
    Abstract: A method for producing a polysilane includes a step of reacting (i) at least two silane monomers and (ii) at least one alkali metal. The silane monomers contain the following structural units: at least one aryl group, at least one alkyl group, at least one alkenyl group, and at least three halogen atoms. At least three of the halogen atoms are bonded to a silicon atom of one of the silane monomers.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: April 5, 2016
    Assignee: BJS Ceramics GmbH
    Inventors: Tobias Lehmann, Joahim Bill, Andreas Kienzle
  • Patent number: 9164386
    Abstract: [Object] To provide a negative-working photosensitive siloxane composition developable inorganically, and also to provide a cured film-manufacturing method employing that. [Means] The present invention provides a negative-working photosensitive siloxane composition comprising a polysiloxane, a silicon-containing compound having a pKa of 2.0 to 15.7, a photo-polymerization initiator, and a solvent. This composition is coat on a substrate, exposed to light, developed with an inorganic developer, and heated, so that a cured film can be obtained.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: October 20, 2015
    Assignee: AZ ELECTRONIC MATERIALS (LUXEMBOURG) S.A.R.L.
    Inventors: Daishi Yokoyama, Atsuko Noya, Yuji Tashiro, Naofumi Yoshida, Yasuaki Tanaka, Takashi Fuke, Megumi Takahashi, Katsuto Taniguchi, Toshiaki Nonaka
  • Patent number: 9029493
    Abstract: Provided is an organopolysiloxane and its use. The organopolysiloxane may exhibit excellent processibility and workability. In addition, when the organopolysiloxane is used as an encapsulant, it exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property. Moreover, the organopolysiloxane may provide an encapsulant exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: May 12, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 9011591
    Abstract: Compositions for use in microelectronic applications: Ra comprises one or more multiple bonds, provided that, if Ra comprises more than one multiple bond, these multiple bonds are not in a conjugated configuration; and R1, R2, R3 are independently selected from alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and Rb is selected from H or a saturated group comprising alkyl, alkylene, or alkylidene; and R4, R5, R6 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and Rc comprises more than one multiple bond, and these multiple bonds are in a conjugated configuration; and R7, R8, R9 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl; and R10, R11, R12, R13 are independently alkoxyl, hydroxyl, halide, OC(O)R, OC(O)OR, wherein R is alkyl or a substituted alkyl.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: April 21, 2015
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Yuanqiao Rao, Robert L. Auger, John D. Weaver, Paul J. Popa, Roxanne M. Jenkins, Christopher P. Sullivan, Jessica P. Evans, Cecilia W. Kiarie, Yasmin N. Srivastava, Jeffrey L. Fenton, Jr.
  • Patent number: 9006355
    Abstract: Provided herein are silicon-based compositions, which after curing is a coating composition having strong substrate adhesion and scratch resistance. The compositions are formed from a mixture of constituents comprising: from about 20% to about 90% (w/w) of a first siloxane selected from the group consisting of silsesquioxane, methylmethoxysiloxane, and combinations thereof; and from about 10% to about 80% (w/w) of one or more silicon compounds selected from the group consisting of a second siloxane, silane, and silazane. Optionally, the compositions may comprise from about 0.1% to about 5% (w/w) alkyltitanate.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: April 14, 2015
    Assignee: Burning Bush Group, LLC
    Inventor: Chris Fish
  • Patent number: 9006374
    Abstract: This application relates to a curable composition and its use. The curable composition may exhibit excellent processibility and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: April 14, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Bum Gyu Choi, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 8993707
    Abstract: Aqueous emulsions of epoxy- and organo-substituted, branched organopolysiloxanes are prepared by emulsifying the latter in water with the aid of a dispersing agent. The emulsions are storage stable and are useful in multi-component coating, adhesive, and binder systems.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: March 31, 2015
    Assignee: Wacker Chemical Corporation
    Inventors: Timothy McCormack, Daniel Calimente
  • Patent number: 8946350
    Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: February 3, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Min A Yu
  • Patent number: 8937131
    Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: January 20, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Min A Yu
  • Patent number: 8937136
    Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: January 20, 2015
    Assignee: LG Chem, Ltd.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 8921505
    Abstract: The present invention relates to a method for preparing poly(organic oxidized silicon) particles having UV-absorbing groups, including reacting an organoalkoxysilane precursor having a UV-absorbing group selected from a group consisting of organotrialkoxysilane, diorganoalkoxysilane and a mixture thereof, in the presence of a base, with a silane compound selected from a group consisting of tetraalkoxysilane, alkyltrialkoxysilane, tetraalkoxysilane, aryltrialkoxysilane, dialkyldialkoxysilane, diaryldialkoxysilane, arylalkyldialkoxysilane and a mixture thereof, serving as a crosslinking regulator and UV stability enhancer, so as to prepare poly(organic oxidized silicon) particles selected from a group consisting of polysilsesquioxane, silsesquioxane-siloxane copolymer, silsesquioxane-silica copolymer, silsesquioxane-siloxane-silica copolymer and silsesquioxane-siloxane copolymer, having UV-absorbing groups.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: December 30, 2014
    Assignee: Nano and Micro Technologies Co., Ltd.
    Inventors: Young Baek Kim, Goo Jin Jeong, In Whan Kim
  • Patent number: 8921496
    Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: December 30, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 8916653
    Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: December 23, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 8916671
    Abstract: A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.
    Type: Grant
    Filed: July 23, 2012
    Date of Patent: December 23, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoun Kim
  • Patent number: 8916654
    Abstract: A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: December 23, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Bum Gyu Choi, Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Dae Ho Kang, Min Kyoun Kim, Byung Kyu Cho
  • Patent number: 8883950
    Abstract: A silicone resin composition contains a silicon-containing component including a silicon atom to which a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group is bonded and a silicon atom to which an alkenyl group is bonded. The number of moles of alkenyl group per 1 g of the silicon-containing component is 200 to 2000 ?mol/g.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: November 11, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Ryuichi Kimura, Munehisa Mitani
  • Patent number: 8865320
    Abstract: A light-emitting device including: a substrate; a light-emitting diode; and an optical resonance layer to resonate light emitted from the light-emitting diode. The optical resonance layer includes a first layer, including a polysilsesquioxane-based copolymer. A linking group connecting two different silicon (Si) atoms of the polysilsesquioxane-based copolymer can be —O—, or a substituted or unsubstituted C1-C30 alkylene group.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: October 21, 2014
    Assignees: Samsung Display Co., Ltd., Seoul National University Industry Foundation
    Inventors: Sun-Young Lee, Jong-Hyuk Lee, Young-Woo Song, Joon-Gu Lee, So-Young Lee, Do-Young Yoon
  • Patent number: 8809482
    Abstract: This invention pertains to silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin comprises the units (Ph(CH2)rSiO(3-x)/2(OR?)x)m (HSiO(3-x)/2(OR?)x)n (MeSiO(3-x)/2(OR?)x)o (RSiO(3-x)/2(OR?)x)p (R1SiO(3-x)/2(OR?)x)q where Ph is a phenyl group, Me is a methyl group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selected from a carboxylic acid group, a carboxylic acid forming group, and mixtures thereof; and R1 is selected from substituted phenyl groups, ester groups, polyether groups; mercapto groups, sulfur-containing organic functional groups, hydroxyl producing group, aryl sulphonic ester groups, and reactive or curable organic functional groups; and r has a value of 0, 1, 2, 3, or 4; x has a value of 0, 1 or 2; wherein in the resin m has a value of 0 to 0.90; n has a value of 0.05 to 0.99; o has a value of 0 to 0.95; p has a value of 0.01 to 0.5; q has a value of 0 to 0.5; and m+n+o+p+q?1.
    Type: Grant
    Filed: October 19, 2009
    Date of Patent: August 19, 2014
    Assignee: Dow Corning Corporation
    Inventors: Peng-Fei Fu, Eric Moyer, Craig Yeakle
  • Patent number: 8809478
    Abstract: A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including R1SiX3, R2SiX3, R3R4SiX2 and R5SiX3, the total of R2SiX3 and R3R4SiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of R2 to R4 is a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: August 19, 2014
    Assignee: Adeka Corporation
    Inventors: Masako Saito, Ichiro Hiratsuka, Masahiro Wada, Ryota Chiba, Takuya Kanazawa, Osamu Yoshioka, Takehito Tsukamoto, Junko Toda
  • Patent number: 8791213
    Abstract: The invention provides a curable silicone resin composition comprising: (A) an organopolysiloxane containing an aromatic group having two or more alkenyl groups, and having a viscosity at 25° C. of 10 to 1,000,000 mPa·s, (B) an organopolysiloxane having a resin structure, comprising 10 to 80 mol % of a SiO4/2 unit, 1 to 80 mol % of a (R1)2SiO2/2 unit, and 1 to 60 mol % of a (R2)3SiO1/2 unit, and containing a SiOH group in a range of 0.1 to 5.0 mol %, (C) an organohydrogenpolysiloxane having two or more SiH group, and among whole substituents bonded to the silicon atom, 20 to 80 mol % is a phenyl group, and a SiO4/2 unit is less than 5 mol %, and (D) a platinum group metal catalyst, and the component (B) is contained in an amount of 20 to 80% by mass based on a sum of the component (A) and the component (B).
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: July 29, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tomoyuki Mizunashi, Tsutomu Kashiwagi, Kinya Kodama
  • Patent number: 8791222
    Abstract: This invention concerns a polymer coating composition for use as non-focal optical power limiting dye containing polymeric materials. This composition contains: (1) one or more Modified Polymers comprising a Polymer, such as a hyperbranched polymer family, especially HB-PCS, HB-PU, HB-PUSOX or PC with one or more of: a) reverse saturable dye (RSA), b) multi-photon absorption dye (MPA), c) an azo dye, or d) absorption dye, which dye is chemically bonded to the pendant groups of the Polymer (along its chain and/or termini) or which forms a part of the backbone of the Polymer; (2) carbon nanotubes (CNT) as optical power limiters (OPL); and (3) a self-focusing component.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: July 29, 2014
    Assignee: Oxazogen, Inc.
    Inventors: Abhijit Sarkar, Petar R. Dvornic, James P. Godschalx
  • Patent number: 8765899
    Abstract: A silicon polymer material, which has a silicon polymer backbone with chromophore groups attached directly to at least a part of the silicon atoms, the polymer further exhibiting carbosilane bonds. The film forming composition and resulting coating properties can be tailored to suit the specific exposure wavelength and device fabrication and design requirements. By using two different chromophores the refractive index and the absorption co-efficient can be efficiently tuned. By varying the proportion of carbosilane bonds, and a desired Si-content of the anti-reflective coating composition can be obtained.
    Type: Grant
    Filed: November 6, 2008
    Date of Patent: July 1, 2014
    Assignee: Braggone Oy
    Inventor: Ari Kärkkäinen
  • Patent number: 8735525
    Abstract: The present invention relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: May 27, 2014
    Assignee: LG Chem, Ltd
    Inventors: Min Jin Ko, Myung Sun Moon, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min Kyoung Kim
  • Patent number: 8728624
    Abstract: A fixing material includes a silane compound polymer as the main component, the silane compound polymer being produced by condensing a silane compound mixture that includes at least one silane compound (1) shown by the following formula (1): R1Si(OR2)p(X1)3-p (wherein R1 represents a group including an ester structure or a cyanoalkyl group, R2 represents an alkyl group having 1 to 6 carbon atoms or the like, X1 represents a halogen atom, and p is an integer from 0 to 3), and at least one silane compound (2) shown by the following formula (2): Si(OR3)q(X2)4-q (wherein R3 represents an alkyl group having 1 to 6 carbon atoms, X2 represents a halogen atom, and q is an integer from 0 to 4). A sealed optical device includes an optical device that is sealed with a cured product of the fixing material. The fixing material produces a cured product that exhibits high hardness, excellent transparency and heat resistance, and rarely undergoes coloration even when subjected to high-energy light or heat for a long time.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: May 20, 2014
    Assignee: Lintec Corporation
    Inventors: Takashi Tamada, Mikihiro Kashio
  • Patent number: 8697829
    Abstract: A process for the manufacture of polyorganosiloxanes having ionic groups and reactive functional groups includes (a) conversion of a low molecular weight aralkylene modified polysiloxane to a corresponding sulfonic acid functional material by treating the low molecular weight aralkylene modified polysiloxane with a sulfonating agent; (b) subjecting the reaction product obtained in step (a) to an equilibration reaction with an acid catalyzed ring opening polymerization-effective polyorganosiloxane; and (c) subjecting the reaction product obtained in step (b) to a hydrosilylation reaction with an unsaturated hydrocarbon containing at least one epoxy group, an unsaturated hydrocarbon containing at least two unsaturation moieties, an unsaturated hydrocarbon containing at least one sulfur heteroatom, an unsaturated hydrocarbon containing a monovalent organosilane group, an unsaturated hydrocarbon containing one hydroxyl containing group, an unsaturated hydrocarbon containing one or more of a halogen, carboxylate,
    Type: Grant
    Filed: January 4, 2012
    Date of Patent: April 15, 2014
    Assignee: Momentive Performance Materials Inc.
    Inventors: Anubhav Saxena, Alok Sarkar
  • Patent number: 8674048
    Abstract: This invention relates to methods for preparing polyheterosiloxane materials having at least two different non-Si metal elements. The polyheterosiloxane materials prepared by these methods are solid materials which can be easily dispersed in a solvent of choice.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: March 18, 2014
    Assignee: Dow Corning Corporation
    Inventors: John Bernard Horstman, Nanguo Liu, Randall Gene Schmidt
  • Patent number: 8674037
    Abstract: A silicon-containing polymer represented by the following average unit formula: (O2/2SiR1-R2-C6H4-R2-SiR1O2/2)x [R3 SiO(4-a)/2]y(R4O1/2)z (wherein R1 designates identical or different, substituted or unsubstituted monovalent hydrocarbon groups; R2 designates identical or different, substituted or unsubstituted alkylene groups; R3 designates substituted or unsubstituted monovalent hydrocarbon groups; R4 designates alkyl groups or hydrogen atoms; ‘a’ is a positive number that satisfies the following condition: 0=a=3; and ‘x’, ‘y’, and ‘z’ are positive numbers that satisfy the following conditions: 0<x<0.1; 0<y<1; 0=z<0.1; and (x+y+z)=1); and a curable polymer composition comprising: (A) the aforementioned silicon-containing polymer; (B) an organosilicon compound that contains in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: March 18, 2014
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Yoshitsugu Morita, Yoshinori Taniguchi, Hiroshi Ueki
  • Patent number: 8653217
    Abstract: A method of forming an antireflective coating on an electronic device comprising (A) applying to an electronic device an ARC composition comprising (i) a silsesquioxane resin having the formula (PhSiO(3-X)/2(OH)x)mHSiO(3-x)/2(OH)x)N(MeSiO(3-x)/2(OH)x)p where Ph is a phenyl group, Me is a methyl group, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95, p has a value of 0.05 to 0.95, and m+n+p?1; and (ii) a solvent; and (B) removing the solvent and curing the silsesquioxane resin to form an antireflective coating on the electronic device.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: February 18, 2014
    Assignee: Dow Corning Corporation
    Inventors: Peng-Fei Fu, Eric Scott Moyer, Craig Rollin Yeakle
  • Patent number: 8642246
    Abstract: Compositions for use in tri-layer applications are described herein, wherein the composition has a matrix and includes: a formulated polymer comprising at least one type of silicon-based moiety forming the matrix of the polymer, a plurality of vinyl groups coupled to the matrix of the polymer, and a plurality of phenyl groups coupled to the matrix of the polymer, at least one condensation catalyst, and at least one solvent. Tri-layer structures are also contemplated herein that comprise an organic underlayer (first layer), antireflective compositions and/or films contemplated herein (second layer) and a photoresist material (third layer) that are coupled to one another.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: February 4, 2014
    Assignee: Honeywell International Inc.
    Inventors: Joseph Kennedy, Songyuan Xie, Kim Do, Sudip Mukhopadhyay
  • Patent number: 8618211
    Abstract: A thermally conductive grease includes 2 vol % to 15 vol % of a combination of three polyorganosiloxanes and 65 vol % to 98 vol % of a thermally conductive filler. The grease may be used as a thermal interface material for dissipating heat from (opto)electronic devices, in both TIM1 and TIM2 applications.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: December 31, 2013
    Assignee: Dow Corning Corporation
    Inventors: Dorab Edul Bhagwagar, David Ha, Sarah Nicol, Kai Su
  • Publication number: 20130345385
    Abstract: The present invention relates to a process for producing a composite material composed of a) at least one oxidic phase and b) an organic polymer phase. The copolymerization of at least one compound of the formula I [(ArO)mMOnRrHp]q??(I) in which M is B, Al, Ga, In, Si, Ge, Sn, P, As or Sb, Ar is phenyl or naphthyl, R is alkyl, alkenyl, cycloalkyl or aryl, where aryl is unsubstituted or may have one or more substituents, with formaldehyde or formaldehyde equivalents, in a reaction medium which is essentially anhydrous, to obtain a composite material having an arrangement of phase domains similar to those nanocomposite materials obtainable by twin polymerization, and to the use of the composite material for production of gas storage materials, rubber mixtures, low-K dielectrics and electrode materials for lithium ion batteries.
    Type: Application
    Filed: June 25, 2013
    Publication date: December 26, 2013
    Inventors: Arno Lange, Gerhard Cox, Hannes Wolf, Szilard Csihony
  • Patent number: 8614282
    Abstract: A silicone resin composition comprising (A) an organopolysiloxane containing silicon-bonded aryl and alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane, and (C) an addition reaction catalyst is low gas permeable. An optoelectronic device encapsulated therewith is highly reliable.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: December 24, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihira Hamamoto, Tsutomu Kashiwagi
  • Patent number: 8586693
    Abstract: A composition for coating comprising at least one compound of formula I and optionally at least one compound of formula II RaSi(R1)n(X1)3-n??I RbSi(R2)m(X2)3-m??II wherein Ra is a straight-chain or branched C(1-24) alkyl group, Rb is an aromatic group, such as an optionally substituted carbocyclic and heterocyclic group comprising five-, six- or ten-membered ring systems, which is linked by a single covalent bond or a spacer unit, such as a straight-chain or branched alkyl residue having 1 to 8 carbon atoms, to the Si— atom, R1 and R2 are independently of each other a lower alkyl group, such as a straight chain and branched hydrocarbon radical having 1 to 6 carbon atoms, X1 and X2 are independently of each other a hydrolysable group, such as a halogen or an alkoxy group and n, m are independently of each other 0 or 1, with the proviso that if n and m are independently of each other 0 or 1, X may represent the same or different groups.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: November 19, 2013
    Assignee: University of Zurich Office Vice President of Research
    Inventors: Jan Zimmermann, Stefan Seeger, Georg Artus, Stefan Jung
  • Publication number: 20130295372
    Abstract: Methods of preparing silicone materials using electron beam curing are described. The materials are hot melt processed and cured in the absence of an effective amount of catalysts and initiators. Both functional and nonfunctionalized silicone materials may be used. Exemplary cured materials include silicone pressure sensitive adhesives, silicone foams, and non-tacky silicone films.
    Type: Application
    Filed: July 9, 2013
    Publication date: November 7, 2013
    Inventors: Junkang J. Liu, Clayton A. George
  • Patent number: 8569429
    Abstract: An optical semiconductor device that combines low gas permeability and high reliability. A curable silicone resin composition comprising: (A) an alkenyl group-containing organopolysiloxane comprising an organopolysiloxane represented by an average composition formula (1) and containing at least two alkenyl groups per molecule: (R1SiO3/2)a(R22SiO)b(R3R42SiO1/2)c??(1) wherein R1 represents an alkyl group, R2 represents an aryl group, R3 represents an alkenyl group, and R4 represents an alkyl group or an aryl group, (B) an organohydrogenpolysiloxane represented by an average composition formula (2) and containing at least two silicon atom-bonded hydrogen atoms per molecule: R1dR2eHfSiO(4-d-e-f)/2??(2) wherein R1 and R2 are as defined above, and (C) an addition reaction catalyst.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: October 29, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshihira Hamamoto, Tsutomu Kashiwagi
  • Patent number: 8536293
    Abstract: The present invention provides a triblock copolymer and a viscoelastic biostable foam comprising the same.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: September 17, 2013
    Assignee: Vysera Biomedical Limited
    Inventors: Niall Behan, Ashutosh Kumar
  • Patent number: 8536295
    Abstract: The disclosure provides methods and materials for imparting corrosion resistance to a substrate, as well as the corrosion-resistant substrates prepared accordingly. Compositions and methods include nonpyrolyzed, silicon-based polymer coatings prepared on substrates. The prepared coatings are highly stable and resistant to corrosion. The invention finds utility, for example, in the fields of surface and coating chemistry. The composition contains silicon-containing polymers having units of the following formulae: [R1Si(OH)O]k??(III) [R1Si(OR10)O]m??(IV) [R1SiO1.5]n??(V) [R1Si(H)O]p??(VI) [R2R3SiO]q??(VII).
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: September 17, 2013
    Assignee: SRI International
    Inventors: Yigal D. Blum, David K. Hui, David Brent MacQueen
  • Patent number: 8512870
    Abstract: A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: August 20, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: June-Ho Shin, Sang-Ran Koh, Sung-Hwan Cha, Hyun-Jung Ahn, Young-Eun Choi
  • Patent number: 8513372
    Abstract: Described herein are photo-patternable sol-gel precursors and their methods of preparation. The sol-gel precursors are thermally stable and form compositions that have high refractive indices and low optical loss values. The precursors can be used to make sol-gel compositions that are ideally suited toward optical waveguide applications in the realm of telecommunications wavelengths.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: August 20, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Joshua Tillema, Mohanalingam Kathaperumal, Wan-Yun Hsieh, Michiharu Yamamoto
  • Publication number: 20130210236
    Abstract: The present invention provides a silicon-containing surface modifier wherein the modifier contains one or more of a repeating unit shown by the following general formula (A) and a partial structure shown by the following general formula (C).The present invention has an object to provide a resist underlayer film applicable not only to a negatively developed resist pattern formed by a hydrophilic organic compound but also to a conventional positively developed resist pattern formed by a hydrophobic compound.
    Type: Application
    Filed: January 22, 2013
    Publication date: August 15, 2013
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Shin-Etsu Chemical Co., Ltd.
  • Patent number: 8492487
    Abstract: A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100° C., and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150° C. A method for adhering the composition to the substrate is also provided.
    Type: Grant
    Filed: November 10, 2011
    Date of Patent: July 23, 2013
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Hidenori Koshikawa, Mikio Shiono
  • Patent number: 8486604
    Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: July 16, 2013
    Assignee: JSR Corporation
    Inventors: Masaaki Hanamura, Daigo Ichinohe, Hideaki Takase
  • Patent number: 8470937
    Abstract: Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: June 25, 2013
    Assignee: Adeka Corporation
    Inventors: Ken-ichiro Hiwatari, Isamu Yumoto
  • Patent number: 8470953
    Abstract: A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: June 25, 2013
    Assignee: Lintec Corporation
    Inventors: Mikihiro Kashio, Toshio Sugizaki, Osamu Moriya
  • Patent number: 8470900
    Abstract: The present invention relates to a porous polymer and a synthetic method thereof. The porous polymer has the following general formula: wherein, the positions marked with the numeral 1-10 are C, CH, N, or CH with its H being substituted by methyl, ethyl, amido, carboxyl, methoxyl, hydroxyl, or ester group; the positions marked with letter a or b are C, N+, or B?.
    Type: Grant
    Filed: October 15, 2012
    Date of Patent: June 25, 2013
    Assignee: Shen Zhen Poremat Technology Co. Ltd.
    Inventors: Shilun Qiu, Guangshan Zhu, Teng Ben
  • Publication number: 20130144026
    Abstract: Disclosed is a method form making a thermo-stable and transparent resin. In the method, at first, polyborosiloxane is syhthesized by hydrolyzing and condensing a boron-containing compound, used as a precursor, and a silane compound. Then, epoxy group-containing polyborosiloxane is synthesized by grafting an epoxy group to the polyborosiloxane. Finally, an epoxy/PGB composite is synthesized by reacting the epoxy group-containing polyborosiloxane with epoxy for consolidation, thus providing a homogenous, stable, net-shaped composite.
    Type: Application
    Filed: March 9, 2012
    Publication date: June 6, 2013
    Applicant: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Wen-Chiung Su, Chi-Fa Hsieh, Yeng-Fong Shih
  • Patent number: 8455604
    Abstract: Polysilanes, inks containing the same, and methods for their preparation are disclosed. The polysilane may have the formula H-[(AHR)n(c-AmHpm-2)q]—H, where A is independently Si or Ge; R is H, -AaHa+1Ra, halogen, aryl or substituted aryl; (n+a)?10 if q=0, q?3 if n=0, and (n+q)?6 if both n and q?0; p is 1 or 2; and m is from 3 to 12. The method may include combining a silane compound of the formula AHaR14-a, AkHgR1?h and/or c-AmHpmR1rm with a catalyst of the formula R4xR5yMXz (or an immobilized derivative thereof) to form a poly(aryl)silane; then washing the poly(aryl)silane with an aqueous washing composition and contacting the poly(aryl)silane with an adsorbent to remove the metal M. Alternatively, the method may include halogenating a polyarylsilane and reducing the halopolysilane with a metal hydride to form the polysilane.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: June 4, 2013
    Assignee: Kovio, Inc.
    Inventors: Wenzhuo Guo, Vladimir K. Dioumaev, Joerg Rockenberger, Brent Ridley
  • Patent number: 8455607
    Abstract: A curable liquid polysiloxane/TiO2 composite for use as a light emitting diode encapsulant is provided, comprising: a polysiloxane with TiO2 domains having an average domain size of less than 5 nm, wherein the curable liquid polysiloxane/TiO2 composite contains 20 to 60 mol % TiO2 (based on total solids); wherein the curable liquid polysiloxane/TiO2 composite exhibits a refractive index of >1.61 to 1.7 and wherein the curable liquid polysiloxane/TiO2 composite is a liquid at room temperature and atmospheric pressure. Also provided is a light emitting diode manufacturing assembly.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: June 4, 2013
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Weijun Zhou, Binghe Gu, John W. Lyons, Allen S. Bulick, Garo Khanarian, Paul J. Popa, John R. Ell
  • Patent number: 8450445
    Abstract: A method of making a light emitting diode (LED) having an optical element is provided, comprising: providing a curable liquid polysiloxane/TiO2 composite, which exhibits a refractive index of >1.61 to 1.7 and which is a liquid at room temperature and atmospheric pressure; providing a semiconductor light emitting diode die having a face, wherein the semiconductor light emitting diode die emits light through the face; contacting the semiconductor light emitting diode die with the curable liquid polysiloxane/TiO2 composite; and, curing the curable liquid polysiloxane/TiO2 composite to form an optical element; wherein at least a portion of the optical element is adjacent to the face.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: May 28, 2013
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: John W. Lyons, Binghe Gu, Allen S. Bulick, Weijun Zhou, Paul J. Popa, Garo Khanarian, John R. Ell
  • Patent number: 8420764
    Abstract: A polymer having a structural unit represented by Formula (3): wherein R1 is phenyl in which any hydrogen may be replaced by halogen or alkyl having 1 to 5 carbon atoms; in the alkyl having 1 to 5 carbon atoms, any —CH2—, which is not adjacent to each other, may be replaced by —O—, and any hydrogen may be replaced by halogen; Q1 is hydrogen, halogen, alkyl having 1 to 10 carbon atoms, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cyclohexenyl, or phenyl in which any hydrogen may be replaced by halogen or alkyl having 1 to 5 carbon atoms; in the alkyl having 1 to 10 carbon atoms and alkyl having 1 to 5 carbon atoms which is a substituent of phenyl, any —CH2—, which is not adjacent to each other, may be replaced by —O—, —CH?CH— or —C?C—, and any hydrogen may be replaced by halogen; and Q3 is a group represented by Formula (4): <—Z0A1-Z1lA2-Z2mA3-Z3nA4p-Z5—??(4) wherein a code <represents a bonding point with silicon; l, m, n and p are independently 0, 1, 2 or 3; and A1, A2, A3, A4, Z0, Z1, Z2, Z
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: April 16, 2013
    Assignee: JNC Corporation
    Inventors: Jyun-ichi Inagaki, Yasuyuki Sasada, Takashi Kato