Abstract: Provided is poly(tetraphenyl)silole siloxane having quantum well structures, and thus, organic-inorganic hybrid polymers having these quantum well structures are applied to electronic devices, which allows flexible non-volatile TFT memory devices to be realized.

Abstract: A compound for filling small gaps in a semiconductor device and a composition comprising the compound are provided. The composition can completely fill holes having a diameter of 70 nm or less and an aspect ratio (i.e. height/diameter ratio) of 1 or more in a semiconductor substrate without any defects, e.g., air voids, by a general spin coating technique. In addition, the composition can be completely removed from holes at a controllable rate without leaving any residue by the treatment with a hydrofluoric acid solution after being cured by baking. Furthermore, the composition is highly stable during storage.

Abstract: This invention relates to acrylic functional resin compositions. More particularly, this invention relates to Poly [organ-co-(meth)acryloxyorgano]silsequioxane resins that are curable upon exposure to ultraviolet radiation with photo initiator or upon heating with or without a free radical generator. The resin compositions have high storage stability at room temperature and produces films that are useful as planarization layer, interlayer dielectric, passivation layer, gas permeable layer, negative photoresist, antireflective coating, conformal coating and IC packaging.

Abstract: An antifouling condensation curing organopolysiloxane composition is prepared by premixing a part or all of (A) a diorganopolysiloxane free of a reactive group with a part or all of (B) silica to form a premix, then mixing the premix with the remainder of (A) and (B), (C) a base diorganopolysiloxane, and (D) a silane. The composition has a good balance of low viscosity and high thixotropy, can be thickly coated in a single pass, and cures into a coating having rubber strength and surface smoothness and exhibiting satisfactory antifouling property over a long period of time.

Abstract: A mask material composition that is used for diffusion barrier of an impurity diffusing component into a semiconductor substrate includes a siloxane resin (A1) containing a constituent unit represented by the following formula (a1): wherein R1 is a single bond or C1-C5 alkylene group; and R2 is a C6-C20 aryl group.

Abstract: Anti-reflective coating materials for ultraviolet photolithography include at least one absorbing compounds and at least one pH tuning agent that are incorporated into spin-on materials. Suitable absorbing compounds are those that absorb around wavelengths such as 365 nm, 248 nm, 193 nm and 157 nm that may be used in photolithography. Suitable pH tuning agents not only adjust the pH of the final spin-on composition, but also influence the chemical performance and characteristics, mechanical performance and structural makeup of the final spin-on composition that is part of the layered material, electronic component or semiconductor component, such that the final spin-on composition is more compatible with the resist material that is coupled to it. A method of making absorbing and pH tuned spin-on materials includes combining at least one organic absorbing compound and at least one pH tuning agent with at least one silane reactant during synthesis of the spin-on materials and compositions.

Abstract: A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure:

Abstract: Silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin has the formula (PhSiO(3?x)/2(OR?)x)m(HSiO(3?x)/2(OR?)x)n(MeSiO(3?x)/2(OR?)x)o(RSiO(3?x)/2(OR?)x)p(R2SiO(3?x)/2(OR?)x)q where Ph is a phenyl group, Me is a methyl group; R is selected from a sulfur-containing organic functional group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R2 is selected from ester groups, polyether groups; and polyethylene oxide groups; x has a value of 0, 1 or 2; m has a value of 0.01 to 0.97; n has a value of 0.01 to 0.97; o has a value of 0.01 to 0.97; p has a value of 0.01 to 0.97; q has a value of 0 to 0.96; and m+n+o+p+q?1.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c(SiO4/2)d (wherein R1, R2, and R3 are each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of R3 are aryl groups, and a, b, c, and d are numbers that satisfy 0?a?0.8, 0?b?0.8, 0.2?c?0.9, 0?d<0.8, and a+b+c+d=1), and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a compound that has a group capable of reacting with the epoxy group; (C) a cure accelerator; and (D) a thermally conductive filler, has excellent handling characteristics and that cures rapidly to give a cured product that is highly thermally conductive, very flexible, highly adhesive, and very flame retardant.

Abstract: A silsesquioxane resin comprised of the units (Ph(CH2)rSiO(3-x)/2(OR?)x)m, (HSiO(3-x)/2(OR?)x)n?(MeSiO(3-x)/2(OR?)x)o?(RSiO(3-x)/2(OR?)x)p, (R1SiO(3-x)/2(OR?)x)q where Ph is a phenyl group, Me is a methyl group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selected from an aryl sulfonate ester group; and R1 is selected from substituted phenyl groups, ester groups, polyether groups; mercapto groups, and reactive or curable organic functional groups; and r has a value of 0, 1, 2, 3, or 4; x has a value of 0, 1 or 2; wherein in the resin m has a value of 0 to 0.95; n has a value of 0.05 to 0.95; o has a value of 0.05 to 0.95; p has a value of 0.05 to 0.5; q has a value of 0 to 0.5; and m+n+o+p+q=1.

Abstract: Solution-processable dielectric materials are provided, along with precursor compositions and processes for preparing the same. Composites and electronic devices including the dielectric materials also are provided.

Abstract: Disclosed herein is an organosilicon nanocluster, wherein a silicon cluster is substituted with a conductive organic material, a silicon thin film including the same, a thin film transistor including the silicon thin film, a display device including the thin film transistor, and methods of forming the same. The organosilicon nanocluster may more easily and efficiently form a thin film while maintaining electrical characteristics of an amorphous silicon thin film.

Abstract: A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.

Abstract: This invention pertains to silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin is comprised of the units (Ph(CH2)rSiO(3?x)/2(OR?)x)m (HSiO(3?x)/2(OR?)x)n (MeSiO(3?x)/2(OR?)x)o (RSiO(3?x)/2(OR?)x)p (R1SiO(3?x)/2(OR?)x)q where Ph is a phenyl group, Me is a methyl group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selected from a hydroxyl producing group; and R1 is selected from substituted phenyl groups, ester groups, polyether groups; mercapto groups, and reactive or curable organic functional groups; and r has a value of 0, 1, 2, 3, or 4; x has a value of 0, 1 or 2; wherein in the resin m has a value of 0 to 0.95; n has a value of 0.05 to 0.95; o has a value of 0.05 to 0.95; p has a value of 0.05 to 0.5; q has a value of 0 to 0.5; and m+n+o+p+q?1.

Abstract: Polysilanes, inks containing the same, and methods for their preparation are disclosed. The polysilane generally has the formula H-[(AHR)n(c-AmHpm-2)q]—H, where each instance of A is independently Si or Ge; R is H, -AaHa+1Ra, halogen, aryl or substituted aryl; (n+a)?10 if q=0, q?3 if n=0, and (n+q)?6 if both n and q?0; p is 1 or 2; and m is from 3 to 12. In one aspect, the method generally includes the steps of combining a silane compound of the formula AHaR14-a, the formula AkHgR1?h and/or the formula c-AmHpmR1rm with a catalyst of the formula R4xR5yMXz (or an immobilized derivative thereof) to form a poly(aryl)silane; then washing the poly(aryl)silane with an aqueous washing composition and contacting the poly(aryl)silane with an adsorbent to remove the metal M. In another aspect, the method includes the steps of halogenating a polyarylsilane to form a halopolysilane; and reducing the halopolysilane with a metal hydride to form the polysilane.

Abstract: A silicone polymer gel/coating which can be sprayed from an aerosol can preferably has a viscosity of 2,000-5,000 cps. and provides a moisture resistant coating of preferably 20-30 mils to protect components in telephone installation and maintenance applications. It is preferably sprayed from a can using Spray Actuator OTP 0025. It preferably includes a molecular sieve. It can also be used as a tire shine.

Abstract: Provided is a curable silicone rubber composition, comprising (A) an organopolysiloxane containing two or more aliphatic unsaturated bonds within each molecule, having a viscosity at 25° C. within a range from 10 to 100,000 mm2/s, and containing a phenyl group and/or cyclohexyl group, (B) an organopolysiloxane with a resin structure comprising SiO2 units and (R1)3SiO0.5 units (wherein, each R1 represents, independently, a vinyl group, an allyl group, or a monovalent hydrocarbon group that contains no aliphatic unsaturated bonds, provided one or more of all the R1 groups within this component (B) represent, independently, a phenyl group or a cyclohexyl group), (C) an organohydrogenpolysiloxane, and (D) a platinum group metal-based catalyst, wherein the component (B) exists in a quantity that represents from 20 to 80% by mass of the combination of the component (A) and the component (B).

Abstract: Provided is an addition-curable silicone composition including A: a diorganopolysiloxane having a structure represented by a formula (1): (R1)(R2)2SiO((Ar)2SiO)nSi(R2)2(R1) (where R1 represents an aliphatic unsaturated group, R2 represents identical or different, unsubstituted or substituted monovalent hydrocarbon groups, Ar represents identical or different, unsubstituted or substituted aryl groups that may or may not contain a hetero atom, and n represents an integer of 1 or greater), B: an organosilicon compound containing at least two hydrogen atoms bonded to silicon atoms per molecule, and containing no aliphatic unsaturated groups, in an amount that is sufficient to cure the composition in the presence of the hydrosilylation catalyst described below, and C: a platinum group metal-based hydrosilylation catalyst.

Abstract: An adhesive silicone rubber composition comprising (A) 100 pbw of an organopolysiloxane containing at least two silicon-bonded alkenyl radicals, (B) 0.5-20 pbw of an organohydrogenpolysiloxane containing at least two Si—H radicals, (C) a hydrosilylation catalyst, and (D) 0.1-50 pbw of an organosilicon compound having at least one phenyl structure, at least one alicyclic epoxy radical, and at least one Si—H radical is applicable to an electrolyte membrane and a separator in a polymer electrolyte fuel cell to form a firm integrally molded part.

Abstract: The purpose of the present invention is to provide an organic silicon compound which has a vinyl group more reactive than those of the conventional organic silicon compounds and can be bonded with another compound. The present organic silicon compound is represented by the following formula (1), wherein R1 is, independently of each other, a vinyl group or an alkyl group having 1 to 4 carbon atoms, R2 is an alkylene group having 3 to 6 carbon atoms, and R3 is, independently of each other, a hydrogen atom or an alkyl group having 1 to 4 carbon atoms and optionally substituted with one or more fluorine atoms.

Abstract: A curable aryl siloxane composition is disclosed. A heat stable cured aryl polysiloxane composition is further disclosed, along with a method of making that heat stable cured aryl polysiloxane composition from the curable aryl siloxane composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with the heat stable cured aryl polysiloxane are further disclosed.

Abstract: A siloxane resin having the formula: (HSiO3/2)a(RSiO3/2)b(SiO4/2)c where R is Z, Z(CH2)n or ZO(CH2)n where Z is a phenyl or substituted phenyl group; n has a value of 1 to 6, a has value of 0.01 to 0.7, b has a value of 0.05 to 0.7, c has a value of 0.1 to 0.9 and a+b+c?1. The siloxane resins are useful in anti-reflective coating compositions.

Abstract: Materials and methods are provided whereby polymers with least 0.5 mole % of the pendant group or end group containing —Si(OR?)3 are used to control aluminosilicate scaling in an industrial process having an alkaline process stream such as a pulping mill process stream or a high level nuclear waste processing plant. When materials of the present invention are added to the alkaline process stream, they reduce and even completely prevent formation of aluminosilicate scale on equipment surfaces such as evaporator walls and heating surfaces. The present materials are effective at treatment concentrations that make them economically practical.

Abstract: Carbosilane-containing polymers (including oligomers) having the following structural features: greater than one repeat unit; at least four Si-arylene bonds; at least one (meth)acrylate moiety, Si—H moiety, or both; no Si—O bonds; preferably at least four silicon atoms; wherein two silicon atoms are separated by one arylene group in each repeat unit.

Abstract: The present invention concerns a process for the preparation of a silicone coating of low dielectric constant, comprising the following essential steps: a) a film-forming silicone composition is deposited on the surface of a substrate, said silicone composition comprising: (i) at least one crosslinkable film-forming silicone resin, (ii) at least one ?,?-hydroxylated, essentially linear silicone oil capable of degrading under the action of heat, and (iii) at least one solvent capable of rendering the silicone resin (i) compatible with the silicone oil (ii), b) the solvent (iii) is removed, preferably by heating, and, simultaneously or sequentially, c) the film-forming silicone composition is cured by heating. The invention deals also with a silicone coating obtained by this process and an integrated circuit comprising such a silicone coating as an electrical insulator.

Abstract: A process includes the steps of: 1) heating a mold at a temperature ranging from 100° C. to 200° C.; 2) feeding a silicone encapsulant composition including a mold release agent, where the composition has a viscosity ranging from 100 cps to 3,000 cps at operating temperatures of the process, to an assembly for preventing the silicone encapsulant composition from flowing backward out of the assembly; 3) injecting the silicone encapsulant composition from the assembly into a mold having a horizontal orientation and having a mold cavity through a gate, where the mold cavity has a top and a bottom, a vent is located at the top of the mold cavity, the vent comprises a channel 0.1 mm to 1 mm wide by 0.0001 mm to 0.

Abstract: A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided.

Abstract: A composition includes a copolymer including a mixture of monomeric units having structures (A), (B), and (C), and one or more of structures (D) or (E): HSiO(3-a)/2(OH)a??(A) Si(3-b)/2(OH)b—CH2)n—SiO(3-c)/2(OH)c??(B) R1SiO(3-d)/2(OH)d??(C) MeSi(3-e)/2(OH)e??(D) R2SiO(3-f)/2(OH)f??(E) wherein a, b, c, d, e, and f are independently from 0 to 2, n is from 0 to about 10, R1 is a chromophore, and R2 is a hydrophilic group.

Abstract: A thermoplastic composition includes a poly(arylene ether) and a poly(arylene ether)-polysiloxane block copolymer. The thermoplastic composition is prepared by a method that includes oxidatively copolymerizing a monohydric phenol and a hydroxyaryl-terminated polysiloxane. The method is simpler than prior methods of preparing poly(arylene ether)-polysiloxane block copolymers by linking pre-formed poly(arylene ether) and polysiloxane blocks. The method is also produces greater incorporation of polysiloxane into the poly(arylene ether)-polysiloxane block copolymer than prior methods of copolymerizing monohydric phenols and hydroxyaryl-terminated polysiloxane.

Abstract: The invention relates to a dental composition comprising a) carbosilane containing component (A) comprising at least 1 Si-Aryl bond, at least 1 silicon atom, at least 2 Si—H functional moieties, no Si-Oxygen bond, b) unsaturated component (131), and/or epoxy component (132), c) initiator (C), d) optionally filler (D) and e) optionally component (E) selected from modifiers, dyes, pigments, thixotropic agents, flow improvers, polymeric thickeners, surfactants, odorous substances, diluting agent(s) and flavorings.

Abstract: A polymer containing: a constitutional unit A that is derived from fluorosilsesquioxane having one addition polymerizable functional group in a molecule; a constitutional unit B that is derived from organopolysiloxane having an addition polymerizable functional group; and a constitutional unit C that is derived from an addition polymerizable functional monomer containing a group having active hydrogen, and optionally containing a constitutional unit D that is derived from an addition polymerizable monomer other than the fluorosilsesquioxane having one addition polymerizable functional group in a molecule, the organopolysiloxane having an addition polymerizable functional group and the addition polymerizable monomer containing a group having active hydrogen.

Abstract: Provided is a curable silicone rubber composition, including: (A) an organopolysiloxane containing two or more silicon atom-bonded aliphatic unsaturated groups within each molecule, and containing a phenyl group and/or cyclohexyl group, (B) an organopolysiloxane resin with a three dimensional network structure consisting essentially of Q units and M units, and containing one or more phenyl groups and/or cyclohexyl groups, (C) an organohydrogenpolysiloxane, and (D) a platinum group metal-based catalyst, in which the component (B) exists in a quantity that represents from 20 to 80% by mass of the combination of the component (A) and the component (B), and in the component B, the quantity of low molecular weight substances, for which the weight average molecular weight measured by GPC and calculated against polystyrene standards is not greater than 500, is not greater than 5%.

Abstract: Bottom antireflective coating (BARC) that exhibit enhanced wet strip rates, BARC compositions for fabricating such BARCs, and methods for manufacturing such BARC compositions are provided. According to one exemplary embodiment, a bottom antireflective coating (BARC) composition comprises an inorganic-based compound, an absorbing material, and a wet strip-rate modifier combination. The wet strip-rate modifier composition comprises a combination of a short chain linear alcohol and dipropylene glycol (DPG), a combination of the short chain linear alcohol and tetraethylene glycol (TEG), a combination of DPG and TEG, or a combination of the short chain linear alcohol, DPG, and TEG.

Abstract: Doped polysilanes, inks containing the same, and methods for their preparation and use are disclosed. The doped polysilane generally has the formula H-[AaHb(DRx)m]q-[(AcHdR1e)n]p—H, where each instance of A is independently Si or Ge, and D is B, P, As or Sb. In preferred embodiments, R is H, -AfHf+1R2f, alkyl, aryl or substituted aryl, and R1 is independently H, halogen, aryl or substituted aryl. In one aspect, the method of making a doped poly(aryl)silane generally includes the steps of combining a doped silane of the formula AaHb+2(DRx)m (optionally further including a silane of the formula AcHd+2R1e) with a catalyst of the formula R4wR5yMXz (or an immobilized derivative thereof) to form a doped poly(aryl)silane, then removing the metal M. In another aspect, the method of making a doped polysilane includes the steps of halogenating a doped polyarylsilane, and reducing the doped halopolysilane with a metal hydride to form the doped polysilane.

Abstract: A mask material composition that is used for diffusion barrier of an impurity diffusing component into a semiconductor substrate includes a siloxane resin (A1) containing a constituent unit represented by the following formula (a1): wherein R1 is a single bond or C1-C5 alkylene group; and R2 is a C6-C20 aryl group.

Abstract: This invention relates generally to a new class of chemoselective polymer materials primarily designed to sorb hydrogen bond basic analytes such as organophosphonate esters (nerve agents and precursors) and nitro-substituted compounds (explosives). In particular, the invention relates to linear polycarbosilane compounds for use in various analytical applications involving sorbent polymer materials, including chromatography, chemical trapping, analyte collection, and chemical sensor applications.

Abstract: A composition for coating comprising at least one compound of formula (I): R<a>Si(R<1>)n(X<1>)3-n, and optionally at least one compound of formula (II): R<b>Si(R<2>)m(X<2>)3-m, wherein R<a> is a straight-chain or branched C(1-24) alkyl group, R<b> is an aromatic group, such as an optionally substituted carbocyclic and heterocyclic group comprising five-, six- or ten-membered ring systems, which is linked by a single covalent bond or a spacer unit, such as a straight-chain or branched alkyl residue having 1 to 8 carbon atoms, to the Si- atom, R<1> and R<2> are, independently of each other a lower alkyl group, such as a straight chain and branched hydrocarbon radical having 1 to 6 carbon atoms, X<1> and X<2> are independently of each other a hydrolysable group, such as a halogen or an alkoxy group and n, m are independently of each other 0 or 1, with the proviso that if n and m are independently of each other 0 or 1, X may represent the sam

Abstract: The invention relates to a dental composition comprising a) carbosilane containing component (A) comprising at least 1 Si-Aryl bond, at least 1 silicon atom, at least 1 unsaturated moiety, no Si-Oxygen bond, b) initiator (B), c) optionally filler (C) and d) optionally component (D) selected from modifiers, dyes, pigments, thixotropic agents, flow improvers, polymeric thickeners, surfactants, odorous substances, diluting agent(s) and flavouring.

Abstract: A silicone fluid comprising a chromophore-substituted polyorganosiloxane having a formula (2): wherein x is an integer in the range of 60 to 2000; y is an integer in the range of 5 to 100; a ratio x:y is in a range of about 10:1 to about 20:1; and X is a photostabilizing chromophore.

Abstract: An organic electroluminescent element comprising a cathode and an anode having therebetween at least one organic compound layer, wherein one of the organic compound layer comprises a polymer having a repeat unit represented by Formula (1) (wherein Ar1 represents an arylene group which may have a substituent or a heteroarylene group having not more than two heteroatoms, which may have a substituent; and L1 represents a divalent linkage group selected from a prescribed group; and n1 represents an integer of not less than two).

Abstract: The present invention relates to polycarbonate, polyester carbonate and polyester having end groups derived from alkylsiloxane-substituted phenols, as well as to the use of phenolic compounds having alkylsiloxane substituents as chain terminators in the preparation of polycarbonate, polyester carbonate and polyester, as well as to mouldings and extrudates produced from these polymers, to processes for the preparation of the polymers, and to novel phenolic compounds of formula (2).

Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.

Abstract: The present invention discloses to a high refractive index polysiloxane (co)polymer comprising refractive index modifying groups chemically bonded in clustered configuration to the polysiloxane backbone. The invention also discloses methods for the preparation of such high refractive index polysiloxane (co)polymers A polysiloxane according to the invention is very suitable for use as a material for the production of intra-ocular lenses.

Abstract: A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.

Abstract: Curable fluoropolyether compositions comprising (a) a polyfluorodialkenyl compound, (b) a fluorinated organohydrogenpolysiloxane, (c) a platinum catalyst, (d) hydrophobic silica powder, (e) a tackifier in the form of a specific silicon compound, and (f) an organosiloxane having a SiH group, an epoxy and/or trialkoxysilyl group, and a perfluoroalkyl or perfluoropolyether group cure to thermoplastic resins to form a durable tight bond at a low temperature within a short time and are readily releasable from metal molds.

Abstract: A siloxane resin having the formula: (HSiO3/2)a(RSiO3/2)b(SiO4/2)c where R is Z, Z(CH2)n or ZO(CH2)n where Z is a phenyl or substituted phenyl group; n has a value of 1 to 6, a has value of 0.01 to 0.7, b has a value of 0.05 to 0.7, c has a value of 0.1 to 0.9 and a+b+c?1. The siloxane resins are useful in anti-reflective coating compositions.

Abstract: Silsesquioxane resins useful in forming the antireflective coating having the formula (PhSiO(3-x)/2(OH)x)mHSiO(3-x)/2(OH)x)n(MeSiO(3-x)/2(OH)x)p(RSiO(3-x)/2(OH)x)q where Ph is a phenyl group, Me is a methyl group, R is selected from ester groups and polyether groups, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95, p has a value of 0.05 to 0.95, q has a value of 0.01 to 0.30 and m+n+p+q?1.

Abstract: Polysiloxanes of formula (I) [M? Dn]3 T ??(I), where M?=QSiY2O1/2 D=SiY2O2/2 T=SiZO3/2 are useful as softeners for wovens, nonwovens and/or fibers composed of natural and/or synthetic raw materials.

Abstract: There is disclosed a thermosetting silicon-containing antireflection film-forming composition, to form a silicon-containing antireflection film in a multilayer resist process used in a lithography, wherein the composition is at least capable of forming—on an organic film that is an underlayer film having a naphthalene skeleton—a silicon-containing antireflection film whose refractive index “n” and extinction coefficient “k” at 193 nm satisfy the following relationship: 2n?3.08?k?20n?29.4 and 0.01?k?0.5.

Abstract: Provided are a polycarbonate resin which can solve problems present in an electrophotographic photoreceptor and an electrophotographic photoreceptor in which the above polycarbonate resin is used and which is improved in a cleaning property, a lubricity and an abrasion resistance. The polycarbonate resin comprises a repetitive unit represented by the following Formula (1), and the electrophotographic photoreceptor in which a photosensitive layer is provided on a conductive substrate contains the above polycarbonate resin in the above photosensitive layer. In the following Formula (1), R represents an alkyl group having 1 to 3 carbon atoms; n1 is an integer of 2 to 4; and n2 is an integer of 1 to 200.