Material Contains A Phosphorus Atom Patents (Class 528/89)
  • Patent number: 9512257
    Abstract: A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: December 6, 2016
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Dein-Run Fung, Te-Chao Liao, Chia-Cheng Chao, Hao-Sheng Chen
  • Patent number: 9428632
    Abstract: A quaternary phosphonium salt, an epoxy resin composition including the quaternary phosphonium salt, and a semiconductor device encapsulated with the epoxy resin composition, the quaternary phosphonium salt being represented by Formula 1:
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: August 30, 2016
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Min Gyum Kim, Seung Han, Hwan Sung Cheon
  • Publication number: 20150087749
    Abstract: A curable composition including (a) at least one divinylarene dioxide; (b) at least one phenol, wherein the phenol is unsubstituted at a 2-, 4-, or 6-phenolic ring position; and (c) at least one acid compound-related cure catalyst; and a cured product made from the above curable composition.
    Type: Application
    Filed: May 23, 2013
    Publication date: March 26, 2015
    Applicant: Dow Global Technologies LLC
    Inventor: Maurice J. Marks
  • Patent number: 8877847
    Abstract: Paper coating compositions contain specific polyethers which are obtained by reacting a diglycidyl ether with a water soluble polyol containing at least one polyoxyethylene chain acting as deflocculants, water retention agents and gloss enhancers.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: November 4, 2014
    Assignee: Lamberti SpA
    Inventors: Franco Federici, Thierry Bossi, Stefano Fumagalli, Riccardo Vago, Giovanni Floridi, Giuseppe Li Bassi
  • Patent number: 8853350
    Abstract: The synthesis of a polyoxometalate-loaded epoxy uses a one-step cure by applying an external stimulus to release the acid from the polyoxometalate and thereby catalyze the cure reaction of the epoxy resin. Such polyoxometalate-loaded epoxy composites afford the cured epoxy unique properties imparted by the intrinsic properties of the polyoxometalate. For example, polyoxometalate-loaded epoxy composites can be used as corrosion resistant epoxy coatings, for encapsulation of electronics with improved dielectric properties, and for structural applications with improved mechanical properties.
    Type: Grant
    Filed: September 25, 2012
    Date of Patent: October 7, 2014
    Assignee: Sandia Corporation
    Inventor: Benjamin J. Anderson
  • Publication number: 20140213751
    Abstract: The present invention provides an epoxy resin molded article excellent in thermal conductivity and an epoxy composition suitable for forming such an epoxy resin molded article. Namely, the present invention relates to an epoxy composition containing an epoxy monomer having a mesogenic skeleton and a phenolic curing agent having a triphenyl methane structure.
    Type: Application
    Filed: January 31, 2014
    Publication date: July 31, 2014
    Applicant: Nitto Denko Corporation
    Inventors: Saori FUKUZAKI, Seiji IZUTANI, Miho YAMAGUCHI
  • Patent number: 8426547
    Abstract: A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: April 23, 2013
    Assignee: Chang Chun Plastics Co., Ltd
    Inventors: Fang-Hsien Su, Chi-Hung Liu, Chun-Hsiung Kao, An-Pang Tu, Kuen-Yuan Hwang
  • Patent number: 8362188
    Abstract: The present invention provides a flame-retardant hardener for epoxy resin having a compound represented by formula (I): In addition, the present invention also provides a flame-retardant resin material comprising the aforementioned flame-retardant hardener for epoxy resin. Moreover, the present invention further provides a method for manufacturing a flame-retardant hardener for epoxy resin, which can be directly applied in a resin curing process after a cooling step without additional purification. As described by the present invention, the flame-retardant hardener for epoxy resin in accordance with the present invention can replace the conventional toxic halogenated resins, and provide an environmental-friendly flame-retardant hardener for epoxy resin.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: January 29, 2013
    Inventor: Chien-Hong Chen
  • Publication number: 20110172384
    Abstract: A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9.
    Type: Application
    Filed: March 29, 2010
    Publication date: July 14, 2011
    Applicant: CHANG CHUN PLASTICS CO., LTD
    Inventors: Fang-Hsien SU, Chi-Hung LIU, Chun-Hsiung KAO, An-Pang TU, Kuen-Yuan HWANG
  • Publication number: 20110118385
    Abstract: A process is for preparing a self-healing composite material including a matrix of epoxy polymer in which a catalyst of ring opening metathesis reaction and vessels containing at least one monomer able to polymerize due to a ring opening metathesis reaction are dispersed. The process includes the preliminary step of dispersing at molecular level the catalyst in a mixture containing at least one precursor of the epoxy polymer, and then the steps of dispersing, in the mixture, the vessels and a tertiary amine acting as curing agent of the precursor, and the step of curing the mixture by at least a first heating stage performed at a temperature between 70 and 90° C. for a time between 1 and 5 hours, and a second heating stage performed at a temperature between 90 and 170° C. for a time between 2 and 3 hours.
    Type: Application
    Filed: November 11, 2010
    Publication date: May 19, 2011
    Applicant: Alenia Aeronautica S.p.A.
    Inventors: Liberata Guadagno, Marialuigia Raimondo, Carlo Naddeo, Annaluisa Mariconda, Raffaele Corvino, Pasquale Longo, Vittoria Vittoria, Salvatore Russo, Generoso Iannuzzo
  • Patent number: 7763702
    Abstract: The invention relates to sulfonimide bearing phenolic compounds and the use of those compounds to produce polyphosphazenes functionalized by one or more of those compounds alone, or in combination with cosubstituents. The invention also relates to blends of sulfonimide functionalized phosphazene polymers with other polymers, membranes formed of the functionalized polymers, and the use of those membranes in devices such as fuel cells.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: July 27, 2010
    Assignee: The Penn State Research Foundation
    Inventors: Harry R. Allcock, Michael A. Hofmann, Catherine M. Ambler, Maher E. Andrew, Richard M. Wood, Daniel T. Welna
  • Publication number: 20070232728
    Abstract: An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation which exhibit high flame resistance, and high soldering resistance after humidified, and has an advantage of low material and production costs. A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1), and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85° C. and 85% R.H.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 4, 2007
    Inventors: Masashi Endo, Hirofumi Kuroda
  • Patent number: 7074738
    Abstract: A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: July 11, 2006
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Akiko Okubo, Yoshiyuki Goh, Yoshihito Akiyama, Hiroshi Hirose, Hirotaka Nonaka, Maki Sugawara
  • Patent number: 7056978
    Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
    Type: Grant
    Filed: November 6, 2002
    Date of Patent: June 6, 2006
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Jayesh P. Shah
  • Patent number: 6946421
    Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermo-setting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: September 20, 2005
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Sumiya Miyake, Akiko Okubo, Hiromi Honda, Yoshiyuki Go, Hiroshi Nagata, Minoru Kobayashi
  • Patent number: 6887919
    Abstract: A pressure sensitive adhesive composed of a mixture comprising a) a styrene block copolymer having a star-shaped structure and a molecular weight Mw of more than 300,000 g/mol, or having elastomer blocks which contain more than 30% by weight of 1,2-linked diene in their block structure, or both, and which is crosslinkable by exposure to UV-light or electron beams, and b) one or more block copolymers composed of vinylaromatic blocks and elastomer blocks, the block polyvinylaromatic content being greater than 20%, and c) one or more tackifier resins.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: May 3, 2005
    Assignee: tesa AG
    Inventors: Thorsten Krawinkel, Bernd Lühmann, Renke Bargmann
  • Patent number: 6881812
    Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: April 19, 2005
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Sumiya Miyake, Akiko Okubo, Hiromi Honda, Yoshiyuki Go, Hiroshi Nagata, Minoru Kobayashi
  • Patent number: 6830825
    Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: December 14, 2004
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takafumi Sumiyoshi, Ayako Mizushima, Ken Oota, Yoshio Fujieda, Hiroki Nikaido, Takashi Aihara
  • Patent number: 6828407
    Abstract: The present invention provides a polymer electrolyte composition excellent in radical resistance and/or proton conductivity. The polymer electrolyte composition comprises an aromatic polymer phosphonic acid derivative represented by the following formula (1); and at least one selected from the group consisting of a phosphoric acid derivative and a polymer electrolyte. (wherein -Z- represents —SO2— or —CO—, x and y each represent 0.01-0.99 provided that the sum of x and y is 1, —Ar— represents a divalent aromatic group of 4-18 carbon atoms which may contain a hetero atom and may contain one or more substituents, n represents the average number of substituents per unit structure of polymeric moiety containing the aromatic group and is a positive number of 8 or less, and R and R′ each independently represent a hydrogen atom or an alkyl group).
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: December 7, 2004
    Assignees: Sumitomo Chemical Company, Limited, Toyota Jidosha Kabushiki Kaisha
    Inventors: Shigeru Sasaki, Arihiro Yashiro, Yasuaki Hidaka, Takumi Taniguchi
  • Patent number: 6803004
    Abstract: The present invention provides low cost resins (e.g., advanced epoxy resins), processes for making these resins, and coatings made with theses resins. Specifically, the present invention provides high throughput extrusion processing of advanced epoxy resins using an appropriate amount of an iminium salt catalyst. Preferred iminium salt catalysts are stable at room temperature in the reaction mixture (thereby enabling the pre-mixing of ingredients and the stable storage of the pre-mixed ingredients) and yet are highly efficient at the processing temperatures described herein. An example of one such advance epoxy resin is the reaction product of diglycidyl ether of bisphenol A with bisphenol A in the presence of an iminium salt catalyst. Preferred processes are performed using no solvent or only negligible amounts of solvent. One preferred extrusion process utilizes an intermeshing co-rotating twin-screw extruder, however, other types of extruders may alternatively be employed.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: October 12, 2004
    Assignee: Valspar Sourcing, Inc.
    Inventors: Alan Bochan, Thomas R. Mallen, Mike A. Lucarelli
  • Patent number: 6800717
    Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphenol-A (DGEBA) compared to traditional epoxy resins of comparable molecular weight prepared by the advancement process. The product can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: October 5, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Frederick Herbert Walker, John Bartram Dickenson
  • Patent number: 6797821
    Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.
    Type: Grant
    Filed: January 30, 2002
    Date of Patent: September 28, 2004
    Inventors: Chun-Shan Wang, Jeng-Yueh Shieh, Ching Hsuan Lin
  • Patent number: 6765043
    Abstract: An epoxy resin that contains, in a molecule, two mesogens coupled by a folded chain, is provided using a method that ensures easy synthesis of such an epoxy resin, and a uniform epoxy resin composition is provided based on this epoxy resin. The epoxy resin includes a major compound having a structure expressed by the Chemical Formula (1), and a method is provided for manufacturing the epoxy resin by reaction of (A) an epoxy resin with one mesogen contained in a molecule and (B) a compound with two elements of active hydrogen contained in a molecule, with the percentage composition of (B) active hydrogen with respect to (A) epoxy group being 0.25 and over, up to and including 0.7.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: July 20, 2004
    Assignee: Hitachi, Ltd.
    Inventors: Masaki Akatsuka, Yoshitaka Takezawa, Hisashi Morooka
  • Patent number: 6762251
    Abstract: The present invention is a thermoplastic polyhydroxypolyether resin having flame retardancy by itself represented by general formula (1), wherein phosphorus content is from 1% to 6% by weight, and weight-average molecular weight is from 10,000 to 200,000, and an insulation film produced therefrom.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: July 13, 2004
    Assignee: Tohto Kasei Co., Ltd.
    Inventors: Masao Gunji, Chiaki Asano, Hiroshi Sato
  • Patent number: 6753086
    Abstract: An epoxy resin molding material which comprises as essential components thereof (A) a compound having at least two epoxy groups in one molecule, (B) a compound having at least two phenolic hydroxyl groups in one molecule, (C) a molecular compound represented by any one of general formulae (1) and (2) and (D) an inorganic filler. The material exhibits an increased curing rate and an excellent storage stability. (P represents phosphorus atom, R1, R2, R3 and R4 each represent a substituted or unsubstituted aromatic group or an alkyl group, A1 and A2 each represent a divalent aromatic group, B1 represents a single bond, a divalent group selected from ether groups, sulfone groups, sulfide groups and carbonyl groups or a divaient organic group having 1 to 13 carbon atoms and 0≦m≦0.75.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: June 22, 2004
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Hiroshi Nagata, Yoshiyuki Goh
  • Publication number: 20040077821
    Abstract: Disclosed is a flame retarding resin composition comprising (A) one or more epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of the component B is a phosphorus-containing compound represented by the following formula (I): 1
    Type: Application
    Filed: April 8, 2003
    Publication date: April 22, 2004
    Inventors: Kuen-Yuan Hwang, An-Pang Tu, Chi-Yi Ju, Chun-Hsiung Kao, Fang-Shian Su
  • Publication number: 20040044168
    Abstract: The present invention discloses a phosphorus- and nitrogen-containing resin hardener, which has a structure represented by the following formula: 1
    Type: Application
    Filed: June 26, 2003
    Publication date: March 4, 2004
    Applicant: Chang Chun Plastics Co., Ltd.
    Inventors: Kuen Yuan Hwang, Hong Hsing Chen, An Pang Tu
  • Publication number: 20040044167
    Abstract: An epoxy resin composition comprising an epoxy resin (A), a curing agent (B) and a curing accelerator (C), wherein the curing agent (B) is a phenol compound having two or more functional groups or a compound obtained by esterification of the phenol compound or a mixture of these compounds, and the curing accelerator (C) is a salt of a phosphazenium compound represented by a formula (I): 1
    Type: Application
    Filed: May 21, 2003
    Publication date: March 4, 2004
    Inventors: Sunao Maeda, Tatsuhiro Urakami, Tomoyuki Kawabata, Koutarou Suzuki, Tadahito Nobori
  • Patent number: 6670017
    Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: December 30, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Mitchell Huang, Michael A. Kropp
  • Patent number: 6649728
    Abstract: A catalyst for curing epoxy resins comprises a tetraalkylphosphonium tetrafluoroborate represented by Formula (1): wherein R1, R2, R3, and R4 are each C1-C5 linear or branched alkyl and may be the same or different, and the halogen ion content in the tetraalkylphosphonium tetrafluoroborate is 20 ppm or less. An epoxy resin powder coating composition containing this catalyst exhibits a prolonged pot life and can be baked at decreased temperatures.
    Type: Grant
    Filed: July 3, 2002
    Date of Patent: November 18, 2003
    Assignee: Nippon Chemical Industrial Co., Ltd.
    Inventors: Hiroshi Kawakabe, Masashi Sugiya, Yoshifusa Hara
  • Patent number: 6645631
    Abstract: A flame retardant phosphorus element-containing epoxy resin composition substantially free of halogen, including: (I) a non-halogenated epoxy resin material selected from: (A) a non-halogenated phosphorus element-containing epoxy resin; (B) a mixture of: (1) a non-halogenated, non-phosphorus element-containing epoxy resin, and (2) a phosphorus element-containing compound; or (C) the reaction product of: (1) a non-halogenated epoxy resin; and (2) a phosphorus element-containing compound; or (D) a combination of two or more of components (A) to (C); and (II) (A) a multi-functional phenolic crosslinking agent having a hydroxy functionality of at least 2; (B) a material which forms a multifunctional phenolic crosslinking agent having a hydroxy functionality of at least 2, upon heating or (C) a mixture of components (A) and (B); in an amount of from about 50% to about 150% of the stoichiometric amount needed to cure the epoxy resin.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: November 11, 2003
    Assignee: Dow Global Technologies Inc.
    Inventors: Joseph Gan, Alan Goodson
  • Patent number: 6620862
    Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: September 16, 2003
    Assignees: Amkor Technology, Inc., Nitto Denko Corporation
    Inventors: Hirotaka Ueda, Masaki Mizutani
  • Patent number: 6613839
    Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: September 2, 2003
    Assignee: The Dow Chemical Company
    Inventors: Joseph Gan, John P. Everett
  • Patent number: 6599960
    Abstract: The invention relates to preparations with improved curing behavior, which are characterized in that they contain 0.0005 to 50 wt. % of soluble and/or fine-particle organic and/or inorganic alkaline earth and/or alkali metal compounds. The preparations according to the invention may be used for bonding, sealing, casting and coating substrates, also in medical dental and technical dental preparations, and for making impressions of articles and, more particularly, for making dental impressions.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: July 29, 2003
    Assignee: Espe Dental AG
    Inventors: Gunther Eckhardt, Gunther Lechner, Erich Wanek, Ursula Somnitz
  • Publication number: 20030125502
    Abstract: Aqueous curing agents for epoxy resin dispersions comprising mixtures, adducts and/or salts of partly esterified organic phosphoric acids A1 or partly esterified phosphonic acids A2 with organic amines B selected from the group consisting of epoxide-amine adducts B1, Mannich bases B2, polyaminoamides B3, and condensation products B4 of diamines or polyamines B42 with di- or polyhydroxyaromatics B41, their preparation and a method of use comprising mixing thereof with aqueous epoxy resin dispersions in particular for coating metals as corrosion protection
    Type: Application
    Filed: November 15, 2002
    Publication date: July 3, 2003
    Inventors: Roland Feola, Willibald Paar, Johann Gmoser
  • Publication number: 20030120021
    Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.
    Type: Application
    Filed: January 30, 2002
    Publication date: June 26, 2003
    Applicant: Chun-Shan WANG
    Inventors: Chun-Shan Wang, Jeng-Yueh Shieh, Ching Hsuan Lin
  • Patent number: 6562410
    Abstract: Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic cation and of a non-nucleophilic anion; (C) at least one 1,1,2,2-substituted-1,2-ethane-diol and/or a derivative thereof, and (D) optionally further additives; and wherein said component (C) is a compound of formula (I), wherein each of R1, R2, and R3 independently of the other is unsubstituted phenyl or has one of the meanings of R4; R4 is substituted phenyl optionally substituted &agr;-naphthyl or &bgr;-naphthyl, or an optionally substituted aromatic heterocyclic ring system or each of R1 and R2 and/or R3 and R4 independently of the other form a residue of formula (II), wherein each of R5 and R6 independently of the other is hydrogen or (C1-C4)alkyl; R7 is —(CH2)n— or —S— or —O—; and n is 0, 1, 2, or 3.
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: May 13, 2003
    Assignee: Vantico Inc.
    Inventors: Carl Walter Mayer, Ramaswami Sreenivasan, Kikkeri Divakar
  • Patent number: 6558812
    Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler is provided, the curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid and 1-isopropyl-4-methyl-bicyclo[2.2.2]oct-5-ene-2,3-dicarboxylic acid per 100 parts by weight of the entire curing agent. The composition is adherent to the surface of silicon chips, and especially to polyimide resins and nitride films and has high thermal shock resistance. A semiconductor device sealed with the cured epoxy resin composition remains reliable.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: May 6, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Toshio Shiobara
  • Patent number: 6555628
    Abstract: A controlled conversion resin having an epoxy functionality of greater than 2 and comprising moieties derived from epoxy resin, dihydric phenol, acid anhydride, or amine. The resin is prepared by reacting an epoxy resin with a dihydric phenol, an acid anhydride, or amine or other branching agent in the presence of a catalyst and terminating the reaction at a point such that the reaction product contains both epoxy and terminal hydroxyl groups.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: April 29, 2003
    Assignee: Dow Global Technologies Inc.
    Inventors: Joseph Gan, Emile C. Trottier
  • Patent number: 6551714
    Abstract: The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition comprising as essential components (A) an epoxy resin, (B) a curing agent and (C) a phosphorus compound containing at least as part thereof a phosphine oxide compound, a prepreg produced by impregnating this flame-retardant resin composition in a fiber base, and a laminate produced by hot-pressing a single sheet or a pile of two or more sheets of the prepreg.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: April 22, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventor: Akihiko Tobisawa
  • Patent number: 6548620
    Abstract: The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epoxy resin composition comprises an epoxy resin composition obtained by reacting 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound. The composition has a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1): of 0.5% by weight or less. The curable epoxy resin composition contains the epoxy resin composition and a hardener for the epoxy resin.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: April 15, 2003
    Assignee: Japan Epoxy Resins Co., Ltd.
    Inventor: Yasuyuki Murata
  • Patent number: 6548627
    Abstract: The present invention relates to novel flame-retardant phosphorus-containing epoxy resins with an epoxy value of from 0.05 to 1.0 moll 100 g containing structural units which derive from (A) polyepoxy compounds having at least two epoxy groups per molecule, and (B) organic phosphinic acids. The invention further relates to a process for their preparation, and to their use. Besides their flame retardancy, the novel flame-retardant phosphorus-containing epoxy resins have especially good storage stability.
    Type: Grant
    Filed: April 19, 2000
    Date of Patent: April 15, 2003
    Assignee: Clariant GmbH
    Inventor: Sebastian Hörold
  • Patent number: 6531549
    Abstract: A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin, and the ratio of an endotherm between 50° C. and 130° C. to an endotherm between 80° C. and 125° C., measured by raising the temperature at a rate of 10° C. per minute using a DSC device, is 1.03 or more.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: March 11, 2003
    Assignee: Japan Epoxy Resins Co., Ltd.
    Inventors: Yasuyuki Murata, Masayuki Tsutsumi, Kiyotaka Ikebata, Ken Tanaka
  • Patent number: 6524989
    Abstract: This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to the boron atom, and a latent catalyst having a structure wherein the above phosphonium borate is the recurring unit and at least two of said recurring unit are connected through at least one of the four specific groups bonded to the boron atom. This invention also provides a thermosetting resin composition comprising such a latent catalyst and an epoxy resin molding material comprising such a latent catalyst and further provides a semiconductor device in which a semiconductor is encapsulated with said epoxy resin molding material.
    Type: Grant
    Filed: April 13, 2001
    Date of Patent: February 25, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Sumiya Miyake, Akiko Okubo, Hiromi Honda, Yoshiyuki Go, Hiroshi Nagata, Minoru Kobayashi
  • Patent number: 6512074
    Abstract: Polymerization catalysts of oxirane compounds are catalysts which are suitable to carry out suspension precipitation polymerization of the oxirane compounds in an organic solvent which cannot dissolve the polymers and comprise a reaction product of (A) an alkylaluminum compound, (B) an oxoacid compound of phosphorus having at least one OH group in its molecule and (C) a nitrogen-containing cyclic compound having pKa of 6 to 8. A process for preparing the polymers of the oxirane compounds is a process wherein the monomeric oxirane compounds are subjected to the suspension precipitation polymerization in the organic solvent which cannot dissolve the polymers in the presence of the catalysts to prepare the polymers of the oxirane compounds.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: January 28, 2003
    Assignee: Daiso Co., Ltd.
    Inventors: Shigeru Shoji, Yasumi Shimizu, Katsuhito Miura
  • Patent number: 6492483
    Abstract: The present invention discloses a continuous process and the associated system for upstaging liquid epoxy resins to produce resins with higher molecular weight. The process comprises passing continuously (i) a liquid epoxy resin having a first molecular weight, (ii) a catalyst and (iii) a compound having at least one active hydrogen or reactive functional group capable of reacting with the liquid epoxy resin in the presence of the catalyst, flow through one or more reaction chambers and under conditions effective to produce a stream comprising an upstaged epoxy resin product having a second molecular weight. The second molecular weight is higher than the first molecular weight.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: December 10, 2002
    Assignee: Resolution Performance Products LLC
    Inventors: Simon Ming-Kung Li, Harry Frank, Rupert R. Dominguez
  • Patent number: 6462164
    Abstract: A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, acid anhydride latent heat activated curing agent and an accelerator for the acid anhydride curing agent characterized in that 2-phenylimidazole phosphate salt is the accelerator.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: October 8, 2002
    Assignee: Air Products and Chemical, Inc.
    Inventors: Dilipkumar Nandlal Shah, William Edward Starner
  • Patent number: 6441064
    Abstract: A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, dicyandiamide latent heat activated curing agent and an accelerator for the dicyandiamide curing agent characterized in that an imidazole phosphate salt is the accelerator.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: August 27, 2002
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Dilipkumar Nandlal Shah, William Edward Starner
  • Patent number: 6420460
    Abstract: The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. The present invention includes the polymerization of epoxy resins, vinyl ethers and other cationically curable monomers.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: July 16, 2002
    Assignee: UCB S.A.
    Inventors: Wenqin Zhang, John H. Malpert, Douglas C. Neckers, Dustin B. Martin
  • Patent number: 6353080
    Abstract: A flame retardant epoxy resin composition containing not more than 10% by wgt. of halogen, comprising an epoxy resin, stated concentrations of phosphoric acid ester, nitrogen—containing cross-linking agent having an amine functionality of at least 2 and a catalyst capable of promoting the reaction of the phosphoric acid ester with the epoxy resin and promoting the curing of the epoxy resin with the cross-linker, and optionally a Lewis acid in a stated amount.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: March 5, 2002
    Assignee: The Dow Chemical Company
    Inventors: Joseph Gan, Alan Goodson, Raymond A. Koenig, John P. Everett