Abstract: Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles. The one-component epoxy resin adhesive compositions exhibit improved toughness of the adhesive as measured by its lap shear strength as well as improved environmental stability, i.e., corrosion protection, by addition of the zinc oxide nanoparticles when applied to metal substrates.

Abstract: A method of making a device housing involves providing a transparent lens with a front surface and a rear surface, and a stepped flange along at least a portion of the lens perimeter. The method includes injecting plastic onto the transparent lens perimeter, including the stepped flange, the plastic forming a plastic feature that has a front surface that is tangent to the front surface of the transparent lens, a rear surface that is tangent to the rear surface of the transparent lens, and that extends outward from the sides of the transparent lens away from a device width center line. The plastic feature is molded to the rear surface of the transparent lens at at least one of two ends of the device housing, and the plastic encapsulates a stepped middle surface of the transparent lens flange. A device housing that is made by this method is also included.

Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:

Abstract: Embodiments of the present invention relate to composite materials. In one embodiment, a composite material comprises an inorganic ceramic matrix comprising a first surface and a second surface opposite the first outer surface and generally parallel to the first outer surface. At least one open weave fiber glass fabric is disposed in the inorganic ceramic matrix between the first surface and the second surface. In another embodiment, a composite material comprises a first inorganic ceramic matrix comprising pieces of stone, a second inorganic ceramic matrix attached adjacent to the first inorganic ceramic matrix, and at least one open weave fiber glass fabric disposed in the second inorganic ceramic matrix.

Abstract: The present invention provides a cationic electrodeposition coating composition comprising: a specific amino group-containing modified epoxy resin (A); a blocked polyisocyanate curing agent (B); a water-soluble zirconium compound (C); and sulfamic acid, wherein the water-soluble zirconium compound (C) is present in an amount of 10 to 10,000 ppm, calculated as the mass of the elemental zirconium, relative to the mass of the cationic electrodeposition coating composition.

Abstract: Low molecular weight polyphenylene ether (PPE) is made from higher molecular weight PPE without using solvents by extruding the higher molecular weight PPE with a phenolic modifier and a redistribution catalyst. The low molecular weight PPE has a Mw/Mn polydispersity greater than about 2 and a Mn ranging from about 10,000 to about 20,000.

Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.

Abstract: A curable composition including (a) at least one divinylarene dioxide; (b) at least one phenol, wherein the phenol is unsubstituted at a 2-, 4-, or 6-phenolic ring position; and (c) at least one acid compound-related cure catalyst; and a cured product made from the above curable composition.

Abstract: Disclosed herein are polyglycidyl ethers of the formula: where R, m, Q, p and Z are as defined here. Also disclosed are methods of forming said polyglycidyl ethers and methods of using said polyglycidyl ethers to make epoxy resin oligomers and polymers, including powder coatings.

Abstract: A process comprising: a) contacting a polyhydric phenol and an epihalohydrin in the presence of a catalyst under reaction conditions to form an organic feed comprising a bishalohydrin ether; b) contacting the organic feed and an aqueous feed comprising an inorganic hydroxide with a high shear mixer to produce a first mixed feed; c) contacting the first mixed feed with a phase separator to form a first organic product comprising an epoxy resin and a first aqueous product; and d) recovering the first organic product, is disclosed.

Abstract: An epoxy or hardener mixture comprising (a) optionally water, (b) at least one hardener or epoxy resin, and (c) from 0.1 to 20 weight percent, based on epoxy resin of at least one distyryl phenol, tristyryl phenol or cumylphenol based additive surfactant with phosphate or sulfonate end groups having the structure R—OXn-W wherein R designates a polystyrylphenol or cumylphenol, preferentially chosen from among distyrylphenol, tristyrylphenol or cumylphenol, and mixtures thereof, and wherein OX designates ethylene oxide and/or propylene oxide. The number of groups “n” varies from 0 to 200, and W designates H, sulfate (—SO3?) or phosphate (—PO3H or —PO2—OXnR). Freeze thaw resistance and improved stability is obtained in epoxy mixtures used in dispersion form. Improved pot life and cure time is obtained using either the epoxy mixture, the hardener mixture or a combination of the two in epoxy hardener formulations.

Abstract: A polymer of formula (I): where: n is an integer from 10 to 5,000; m is an integer from 10 to 5,000; Ar1 and Ar3 are the same or different and are residues derived from a tetra-hydroxy aromatic monomer, the tetra-hydroxy aromatic monomer being wherein R is the same or different and is H or a C1-C8 alkyl, C2-C8 alkenyl or C3-C8 cycloalkyl group; and, Ar2 and Ar4 are the same or different and are residues derived from a tetra-halogenated aromatic monomer, the tetra-halogenated aromatic monomer being wherein X is F, Cl or Br, and R1 and R2 are the same or different and are wherein y is an integer from 1 to 8; with the proviso that when Ar1 is the same as Ar3 and Ar2 is the same as Ar4, R1 and R2 are not both —CN is useful as a material for gas separation, vapor separation, adsorbents or catalysis.

Abstract: Thermosetting resins and thermosetting composites comprising the thermosetting resins are hot-formable. The compositions result from contacting at least one thermosetting resin precursor with at least one hardener selected from acid anhydrides in the presence of at least one transesterification catalyst. The thermosetting resin precursor includes hydroxyl functions and/or epoxy groups, and optionally ester functions, and the total molar quantity of the transesterification catalyst is between 5 and 25% of the total molar quantity of hydroxyl and epoxy contained in the thermosetting resin precursor. Methods for manufacturing articles comprising the thermosetting resins and methods for recycling the thermosetting resins are also disclosed.

Abstract: A composition comprising (a) an epoxy resin; and (b) a hydroperoxide composition comprising a t-butyl hydroperoxide solution that contains no more than 7 weight percent water, and use of the compositions to prepare foundry shapes, the foundry shapes prepared by the process, the use of the foundry shapes to prepare cast metal articles, and the cast metal articles prepared by the process.

Abstract: An object of the invention is to provide a protein-adsorbing material having both adsorption capacity and high-speed treatment performance applicable to not only analysis use but also industrial use, in balance, and to provide a method for producing the same. The present invention provides a protein-adsorbing material comprising a polymer base-material, a polymer side-chain immobilized to the surface of the polymer base-material and a functional group having protein adsorption ability and immobilized to the polymer side-chain, in which the mass of the polymer side-chain is 5 to 30% relative to the mass of the polymer base-material.

Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, and a silicone compound. The coating is substantially free of fluorocarbon resin. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.

Abstract: A recyclable epoxy resin composition using a plant biomass in a resin skeleton and a cured material of the epoxy resin composition, and various types of products using them are provided. The epoxy resin composition comprises an epoxy resin; and a curing agent, wherein the curing agent is a biomass-derived acid anhydride having an acid anhydride bonded via an ester linkage to a biomass with a weight-average molecular weight of 300 to 5000.

Abstract: A process comprising: a) contacting a polyhydric phenol and an epihalohydrin in the presence of a catalyst under reaction conditions to form an organic feed comprising a bishalohydrin ether and a solvent; b) contacting the organic feed and an aqueous feed comprising an inorganic hydroxide in a reciprocating-plate column reactor under reaction conditions to form a dispersed aqueous phase and an organic product; and c) collecting the organic product comprising an epoxy resin, is disclosed.

Abstract: Disclosed is a method for producing a polyphenylene ether, which comprises a step of preparing a polymerization solution composed of 10-25 parts by mass of a phenolic compound (M) and 75-90 parts by mass of an aromatic solvent (A) with the total of the compound and the solvent being 100 parts by mass, and 0.1-10 parts by mass of a catalyst (C) containing a metal salt; a step of performing an oxidative polymerization of the phenolic compound (M) by passing an oxygen-containing gas through the polymerization solution; a step of stopping the polymerization by mixing an aqueous chelating agent solution into the polymerization solution; a step of subjecting a diphenoquinone compound produced as a by-product to a quinone binding process or removal by reduction; and a step of obtaining a polyphenylene ether by separating the aqueous phase through liquid-liquid separation. In the method for producing a polyphenylene ether, 0.001-0.

Abstract: Processes for lowering the glass transition temperature of a polymeric compound relative to the glass transition temperature of a control polymeric compound are disclosed. The methods include the formation of a precursor composition comprising precursor compounds to the polymeric compound dispersed or dissolved in a solvent system. The compounds are partially or fully cured in the presence of the solvent system, which is then substantially removed. After further curing, where necessary, the resulting cured polymeric compound is essentially free of plasticizers, but still has a decreased glass transition temperature relative to the glass transition temperature of a control polymeric compound. Articles of manufacture comprising such polymeric compounds are also disclosed.

Abstract: Compositions comprising at least one epoxy resin and/or reactive diluents, at least one hardener for the at least one epoxy resin, at least one curing indicator, wherein the colour of the composition changes depending on the curing degree, a process for determining sufficient cure of a composition comprising providing a composition comprising at least one epoxy resin and a hardener for the epoxy resin, adding a curing indicator, applying curing conditions to the coloured composition until the composition changes its colour and use of polymeric colourants as curing degree indicator, wherein the curing indicator is a polymeric colourant consisting of chromophores which are chemically bound to polymers having reactive groups.

Abstract: There is disclosed a biomass-derived epoxy compound as an epoxidized product of a raw-material biomass-derived compound having a weight-average molecular weight of 300 to 10000. The biomass-derived epoxy compound has a weight-average molecular weight of 600 to 20000 and is soluble in an organic solvent for the preparation of a varnish. The epoxy compound is prepared by dissolving the raw-material biomass-derived compound in an aqueous alkali solution; adding epichlorohydrin to the solution and heating the mixture; and evaporating epichlorohydrin from the heated mixture and precipitating a biomass-derived epoxy compound, in which the aqueous alkali solution has a pH of 13.5 to 11.0. The biomass-derived epoxy compound has both high solubility in organic solvents and satisfactory heat resistance and can be manufactured in a high yield on the basis of the raw material through a less number of processes.

Abstract: The present invention relates to conjugated polymers comprising specific carbazole structural units. The materials according to the invention display steeper current-voltage curves and are therefore better suited to use in organic light-emitting diodes than are comparative polymers which do not contain these units.

Abstract: An epoxy resin containing side-chain-tethered caged POSS and a preparation method thereof as well as epoxy resin material containing POSS-epoxy and a preparation method thereof are disclosed. The epoxy resin containing side-chain-tethered caged POSS (POSS epoxy) is formed by tethering of POSS group to the side chain of the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The preparation method of the POSS epoxy includes a step of reacting epoxy resin with caged POSS to form epoxy resin containing side-chain-tethered caged POSS (POSS-epoxy). The preparation method of epoxy resin material containing POSS-epoxy includes a step of reacting DGEBA epoxy resin with POSS-epoxy to get epoxy resin material containing POSS-epoxy. The POSS-epoxy is distributed evenly in the epoxy resin material with POSS-epoxy.

Abstract: Various embodiments of the present invention are directed to methods for manufacturing complex, anisotropic materials with desirable properties for information storage, processing, and display. Certain of these methods involve employing a magnetic field during manufacture to induce desired orientations of precursors, subunits, and/or molecular subassemblies. The applied magnetic field steers the precursors, subunits, and/or molecular subassemblies into desirable orientations while the precursors, subunits, and/or molecular subassemblies are assembled or self-assemble into a complex, anisotropic material. One embodiment of the present invention is a class of new, complex, well-ordered, network-like materials that include a ferromagnetic-material-based framework in which organic and/or organometallic compounds are organized.

Abstract: To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.

Abstract: A process for producing a low-molecular polyphenylene ether having a content of components with molecular weights of 20,000 or more of 10 mass % or less and a number average molecular weight of 4,000 or less by a redistribution reaction which involves reacting a raw polyphenylene ether having a number average molecular weight of 10,000 or more with a polyphenol compound and a radical initiator, characterized in that the redistribution reaction step is a step conducted in a solvent; the ratio of the raw polyphenylene ether to the solvent (raw polyphenylene ether:solvent) (mass ratio) is provided at 0.4:100 to 40:100 (mass ratio); and the ratio of the radical initiator to the solvent (radical initiator:solvent) (mass ratio) is provided at 0.5:100 to 5:100 (mass ratio).

Abstract: The present invention relates to conjugated polymers comprising specific carbazole structural units. The materials according to the invention display steeper current-voltage curves and are therefore better suited to use in organic light-emitting diodes than are comparative polymers which do not contain these units.

Abstract: This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.

Abstract: A method for producing a branched-polyether resin composition of the present invention includes a first step of obtaining a reaction mixture including: (1-A) a branched-polyether resin (X) containing a hydroxyl group, an acryloyl group, and an epoxy group and (1-B) at least one resin component selected from the group consisting of (1-B-1) a diacrylate (A2) of an aromatic difunctional epoxy resin, (1-B-2) a monoacrylate (A1) of an aromatic difunctional epoxy resin, and (1-B-3) an aromatic difunctional epoxy resin (B) other than (A1) and (A2); and a second step of mixing the reaction mixture and an unsaturated monocarboxylic acid, and reacting the epoxy group in the reaction mixture and a carboxyl group in the unsaturated monocarboxylic acid.

Abstract: A process for producing a low-molecular polyphenylene ether having a content of components with molecular weights of 20,000 or more of 10 mass % or less and a number average molecular weight of 4,000 or less by a redistribution reaction which involves reacting a raw polyphenylene ether having a number average molecular weight of 10,000 or more with a polyphenol compound and a radical initiator, characterized in that the redistribution reaction step is a step conducted in a solvent; the ratio of the raw polyphenylene ether to the solvent (raw polyphenylene ether:solvent) (mass ratio) is provided at 0.4:100 to 40:100 (mass ratio); and the ratio of the radical initiator to the solvent (radical initiator:solvent) (mass ratio) is provided at 0.5:100 to 5:100 (mass ratio).

Abstract: This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.

Abstract: A hot melt adhesive comprising an adhesive polymer and a modified rosin-terpene, preferably a phenol modified rosin terpene. The adhesive is particularly useful in packaging applications.

Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of water, tetrahydrofuran and multifunctional epoxy resins. The polyols can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: Material of electronics component and electronics components using the same material are provided. The material includes repellent that can withstand severe solder-mounting conditions, and the electronics components such as printed wiring boards can lasts repelling effect for a long period. The material is used in electronics components requiring a soldering process, and includes at least curable resin, filler and the repellent. The repellent has vapor pressure of less than 10,000 nPa at room temperature. Film is formed using the material at a given place of an electronics component such as a printed wiring board.

Abstract: A pressure sensitive adhesive composed of a mixture comprising a) a styrene block copolymer having a star-shaped structure and a molecular weight Mw of more than 300,000 g/mol, or having elastomer blocks which contain more than 30% by weight of 1,2-linked diene in their block structure, or both, and which is crosslinkable by exposure to UV-light or electron beams, and b) one or more block copolymers composed of vinylaromatic blocks and elastomer blocks, the block polyvinylaromatic content being greater than 20%, and c) one or more tackifier resins.

Abstract: The present invention provides a biphenyl based epoxy resin comprising a curing agent and an inorganic filler containing an alkali alkaline earth metal oxide wherein the epoxy resin has a variation rate of hardness at 25° C. and a relative humidity of 50% for 72 hours of less than 10% and a variation rate of flow at 25° C. and a relative humidity of 20% or below for 72 hours of less than 20%.

Abstract: Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.

Abstract: A subject for the invention is to provide a branched aromatic polycarbonate which is excellent in hue and in melt characteristics such as melt strength.

Abstract: There is provided a complex having a specified chemical structure and an asymmetric catalyst using such a complex. Further, an epoxidation of amine or ketone is enantioselectively conducted by using such an asymmetric catalyst.

Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphenol-A (DGEBA) compared to traditional epoxy resins of comparable molecular weight prepared by the advancement process. The product can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.

Abstract: The present invention relates to alicyclic epoxy compounds obtained by selectively hydrogenating aromatic rings of aromatic epoxy compounds in the presence of a hydrogenation catalyst, the concentration of the platinum group element in the product alicyclic epoxy compound being not more than 2 ppm.

Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.

Abstract: A new method of converting oligomeric chloroformates to high molecular weight polycarbonate is presented. By carefully controlling the relative concentrations and amounts of hydroxyl and chloroformate groups present in the oligomeric polycarbonate, the method of the invention provides for the efficient preparation of polycarbonate while minimizing phosgene usage. The product polycarbonates prepared by the method of the invention are fully capped with no additional phosgene required beyond that needed to prepare the oligomeric chloroformate starting material. The method of the present invention provides polycarbonates having non-detectable levels (<5 ppm) of aromatic hydroxyl endgroups, low polydispersity, and low levels of residual monomer and endcap, thereby obviating the need for monomer and endcap recycle.

Abstract: The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.

Abstract: The present invention relates to an epoxy resin composition for FRP that will be used for fishing rods, golf club shafts, and the like, a prepreg that is an intermediate material made up of an epoxy resin composition combined with reinforcing fibers, and a tubular molded article obtained using it. The epoxy resin composition for FRP of the present invention comprises (A) a bisphenol A-type epoxy resin, (B) an epoxy resin having oxazolidone rings, and (C) a curing agent. By using the epoxy resin composition for FRP of the present invention, a prepreg quite excellent in handleability and a tubular molded article improved in flexural strength in the longitudinal direction and crushing strength in the diametrical direction can be obtained.

Abstract: Dental materials containing monomers and/or prepolymers can be subjected to a polymer-forming reaction. The dental materials comprise at least one initiating system and optionally comprise fillers, colorants, flow modifiers, stabilizers, ion-releasing substances as well as compounds which increase X-ray capacity or other modifiers. The dental materials are characterized in that the initiating system is proportioned such that the dental materials are sufficiently capable of flowing for at least 10 seconds after exposure to oxygen, whereupon they subsequently harden into a solid material.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.