Polymerizing In The Presence Of A Specified Material Other Than Reactant Patents (Class 528/88)
  • Patent number: 9974199
    Abstract: A method of making a device housing involves providing a transparent lens with a front surface and a rear surface, and a stepped flange along at least a portion of the lens perimeter. The method includes injecting plastic onto the transparent lens perimeter, including the stepped flange, the plastic forming a plastic feature that has a front surface that is tangent to the front surface of the transparent lens, a rear surface that is tangent to the rear surface of the transparent lens, and that extends outward from the sides of the transparent lens away from a device width center line. The plastic feature is molded to the rear surface of the transparent lens at at least one of two ends of the device housing, and the plastic encapsulates a stepped middle surface of the transparent lens flange. A device housing that is made by this method is also included.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: May 15, 2018
    Assignee: Google Technology Holdings LLC
    Inventors: Joseph L. Allore, Michael J. Formenti, Michael J. Lombardi, Michael L. Neau
  • Patent number: 9890307
    Abstract: A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: February 13, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Ki Hyeok Kwon, Min Gyum Kim, Joo Young Chung, Jin Min Cheon, Jin Woo Choi, Seung Han, Dong Hwan Lee
  • Patent number: 9835418
    Abstract: Embodiments of the present invention relate to composite materials. In one embodiment, a composite material comprises an inorganic ceramic matrix comprising a first surface and a second surface opposite the first outer surface and generally parallel to the first outer surface. At least one open weave fiber glass fabric is disposed in the inorganic ceramic matrix between the first surface and the second surface. In another embodiment, a composite material comprises a first inorganic ceramic matrix comprising pieces of stone, a second inorganic ceramic matrix attached adjacent to the first inorganic ceramic matrix, and at least one open weave fiber glass fabric disposed in the second inorganic ceramic matrix.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: December 5, 2017
    Inventors: James Carl Peters, Steven John Morris, Steven Joel Parks, Garry Duran Puckett, Peter Lawrence Votruba-Drzal
  • Patent number: 9617650
    Abstract: The present invention provides a cationic electrodeposition coating composition comprising: a specific amino group-containing modified epoxy resin (A); a blocked polyisocyanate curing agent (B); a water-soluble zirconium compound (C); and sulfamic acid, wherein the water-soluble zirconium compound (C) is present in an amount of 10 to 10,000 ppm, calculated as the mass of the elemental zirconium, relative to the mass of the cationic electrodeposition coating composition.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: April 11, 2017
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, KANSAI PAINT CO., LTD.
    Inventors: Eisaku Okada, Kouji Takezoe, Hirokazu Hayashi
  • Patent number: 9493610
    Abstract: Low molecular weight polyphenylene ether (PPE) is made from higher molecular weight PPE without using solvents by extruding the higher molecular weight PPE with a phenolic modifier and a redistribution catalyst. The low molecular weight PPE has a Mw/Mn polydispersity greater than about 2 and a Mn ranging from about 10,000 to about 20,000.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: November 15, 2016
    Assignee: PolyOne Corporation
    Inventor: Roger W. Avakian
  • Patent number: 9485861
    Abstract: Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: November 1, 2016
    Assignee: ASAHI KASEI E-MATERIALS CORPORATION
    Inventors: Masaaki Endo, Takamitsu Utsumi, Shoji Otani
  • Publication number: 20150087749
    Abstract: A curable composition including (a) at least one divinylarene dioxide; (b) at least one phenol, wherein the phenol is unsubstituted at a 2-, 4-, or 6-phenolic ring position; and (c) at least one acid compound-related cure catalyst; and a cured product made from the above curable composition.
    Type: Application
    Filed: May 23, 2013
    Publication date: March 26, 2015
    Applicant: Dow Global Technologies LLC
    Inventor: Maurice J. Marks
  • Publication number: 20150018456
    Abstract: Disclosed herein are polyglycidyl ethers of the formula: where R, m, Q, p and Z are as defined here. Also disclosed are methods of forming said polyglycidyl ethers and methods of using said polyglycidyl ethers to make epoxy resin oligomers and polymers, including powder coatings.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 15, 2015
    Inventors: Robert E. Hefner, JR., Erich J. Molitor
  • Publication number: 20140336348
    Abstract: A process comprising: a) contacting a polyhydric phenol and an epihalohydrin in the presence of a catalyst under reaction conditions to form an organic feed comprising a bishalohydrin ether; b) contacting the organic feed and an aqueous feed comprising an inorganic hydroxide with a high shear mixer to produce a first mixed feed; c) contacting the first mixed feed with a phase separator to form a first organic product comprising an epoxy resin and a first aqueous product; and d) recovering the first organic product, is disclosed.
    Type: Application
    Filed: December 6, 2012
    Publication date: November 13, 2014
    Applicant: Dow Global Technologies LLC
    Inventors: Jesus A. Atias, Philip J. Carlberg, Ravindra S. Dixit, Robert M. Drake, Dan Tirtowidjojo, David H. West, William G. Worley, Thomas C. Young
  • Publication number: 20140256852
    Abstract: An epoxy or hardener mixture comprising (a) optionally water, (b) at least one hardener or epoxy resin, and (c) from 0.1 to 20 weight percent, based on epoxy resin of at least one distyryl phenol, tristyryl phenol or cumylphenol based additive surfactant with phosphate or sulfonate end groups having the structure R—OXn-W wherein R designates a polystyrylphenol or cumylphenol, preferentially chosen from among distyrylphenol, tristyrylphenol or cumylphenol, and mixtures thereof, and wherein OX designates ethylene oxide and/or propylene oxide. The number of groups “n” varies from 0 to 200, and W designates H, sulfate (—SO3?) or phosphate (—PO3H or —PO2—OXnR). Freeze thaw resistance and improved stability is obtained in epoxy mixtures used in dispersion form. Improved pot life and cure time is obtained using either the epoxy mixture, the hardener mixture or a combination of the two in epoxy hardener formulations.
    Type: Application
    Filed: March 9, 2013
    Publication date: September 11, 2014
    Inventors: Gerald Vandezande, Charles Francis Palmer, JR., Edward R. Godwin
  • Patent number: 8686104
    Abstract: A polymer of formula (I): where: n is an integer from 10 to 5,000; m is an integer from 10 to 5,000; Ar1 and Ar3 are the same or different and are residues derived from a tetra-hydroxy aromatic monomer, the tetra-hydroxy aromatic monomer being wherein R is the same or different and is H or a C1-C8 alkyl, C2-C8 alkenyl or C3-C8 cycloalkyl group; and, Ar2 and Ar4 are the same or different and are residues derived from a tetra-halogenated aromatic monomer, the tetra-halogenated aromatic monomer being wherein X is F, Cl or Br, and R1 and R2 are the same or different and are wherein y is an integer from 1 to 8; with the proviso that when Ar1 is the same as Ar3 and Ar2 is the same as Ar4, R1 and R2 are not both —CN is useful as a material for gas separation, vapor separation, adsorbents or catalysis.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: April 1, 2014
    Assignee: National Research Council of Canada
    Inventors: Naiying Du, Michael D. Guiver, Gilles P. Robertson
  • Publication number: 20130300020
    Abstract: Thermosetting resins and thermosetting composites comprising the thermosetting resins are hot-formable. The compositions result from contacting at least one thermosetting resin precursor with at least one hardener selected from acid anhydrides in the presence of at least one transesterification catalyst. The thermosetting resin precursor includes hydroxyl functions and/or epoxy groups, and optionally ester functions, and the total molar quantity of the transesterification catalyst is between 5 and 25% of the total molar quantity of hydroxyl and epoxy contained in the thermosetting resin precursor. Methods for manufacturing articles comprising the thermosetting resins and methods for recycling the thermosetting resins are also disclosed.
    Type: Application
    Filed: January 23, 2012
    Publication date: November 14, 2013
    Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
    Inventors: Ludwik Leibler, Francois Tournilhac, Damien Montarnal, Mathieu Capelot
  • Publication number: 20130251588
    Abstract: A composition comprising (a) an epoxy resin; and (b) a hydroperoxide composition comprising a t-butyl hydroperoxide solution that contains no more than 7 weight percent water, and use of the compositions to prepare foundry shapes, the foundry shapes prepared by the process, the use of the foundry shapes to prepare cast metal articles, and the cast metal articles prepared by the process.
    Type: Application
    Filed: May 1, 2013
    Publication date: September 26, 2013
    Applicant: ASK CHEMICALS L.P.
    Inventors: Wayne D. Woodson, H. Randall Shriver
  • Patent number: 8536288
    Abstract: An object of the invention is to provide a protein-adsorbing material having both adsorption capacity and high-speed treatment performance applicable to not only analysis use but also industrial use, in balance, and to provide a method for producing the same. The present invention provides a protein-adsorbing material comprising a polymer base-material, a polymer side-chain immobilized to the surface of the polymer base-material and a functional group having protein adsorption ability and immobilized to the polymer side-chain, in which the mass of the polymer side-chain is 5 to 30% relative to the mass of the polymer base-material.
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: September 17, 2013
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Goro Furumoto, Noboru Kubota, Kyoichi Saito
  • Patent number: 8507602
    Abstract: A non-stick coating composition comprising a waterborne phenoxy resin, a crosslinker, and a silicone compound. The coating is substantially free of fluorocarbon resin. An article, such as aluminum, may be coated with the composition. The composition may be multi-layers, but only the layers other than the first layer includes the silicone compound. The invention includes the method for applying the coating or coatings.
    Type: Grant
    Filed: October 22, 2007
    Date of Patent: August 13, 2013
    Assignee: Whitford Worldwide Company
    Inventors: Thomas J. Bate, Arthur Wachowski, Jan Wilhelm Ernst Moos
  • Patent number: 8420766
    Abstract: A recyclable epoxy resin composition using a plant biomass in a resin skeleton and a cured material of the epoxy resin composition, and various types of products using them are provided. The epoxy resin composition comprises an epoxy resin; and a curing agent, wherein the curing agent is a biomass-derived acid anhydride having an acid anhydride bonded via an ester linkage to a biomass with a weight-average molecular weight of 300 to 5000.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: April 16, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Yoshiaki Okabe, Hiroyuki Kagawa
  • Publication number: 20130079489
    Abstract: A process comprising: a) contacting a polyhydric phenol and an epihalohydrin in the presence of a catalyst under reaction conditions to form an organic feed comprising a bishalohydrin ether and a solvent; b) contacting the organic feed and an aqueous feed comprising an inorganic hydroxide in a reciprocating-plate column reactor under reaction conditions to form a dispersed aqueous phase and an organic product; and c) collecting the organic product comprising an epoxy resin, is disclosed.
    Type: Application
    Filed: August 31, 2012
    Publication date: March 28, 2013
    Applicant: Dow Global Technologies LLC
    Inventors: Thomas C. Young, William G. Worley, Robert M. Drake
  • Patent number: 8357769
    Abstract: Disclosed is a method for producing a polyphenylene ether, which comprises a step of preparing a polymerization solution composed of 10-25 parts by mass of a phenolic compound (M) and 75-90 parts by mass of an aromatic solvent (A) with the total of the compound and the solvent being 100 parts by mass, and 0.1-10 parts by mass of a catalyst (C) containing a metal salt; a step of performing an oxidative polymerization of the phenolic compound (M) by passing an oxygen-containing gas through the polymerization solution; a step of stopping the polymerization by mixing an aqueous chelating agent solution into the polymerization solution; a step of subjecting a diphenoquinone compound produced as a by-product to a quinone binding process or removal by reduction; and a step of obtaining a polyphenylene ether by separating the aqueous phase through liquid-liquid separation. In the method for producing a polyphenylene ether, 0.001-0.
    Type: Grant
    Filed: April 16, 2009
    Date of Patent: January 22, 2013
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Mutsumi Maeda, Hiroaki Furukawa
  • Publication number: 20120237704
    Abstract: Processes for lowering the glass transition temperature of a polymeric compound relative to the glass transition temperature of a control polymeric compound are disclosed. The methods include the formation of a precursor composition comprising precursor compounds to the polymeric compound dispersed or dissolved in a solvent system. The compounds are partially or fully cured in the presence of the solvent system, which is then substantially removed. After further curing, where necessary, the resulting cured polymeric compound is essentially free of plasticizers, but still has a decreased glass transition temperature relative to the glass transition temperature of a control polymeric compound. Articles of manufacture comprising such polymeric compounds are also disclosed.
    Type: Application
    Filed: March 16, 2012
    Publication date: September 20, 2012
    Applicant: Honeywell Federal Manufacturing & Technologies, LLC
    Inventor: Daniel E. Bowen, III
  • Publication number: 20120225187
    Abstract: Compositions comprising at least one epoxy resin and/or reactive diluents, at least one hardener for the at least one epoxy resin, at least one curing indicator, wherein the colour of the composition changes depending on the curing degree, a process for determining sufficient cure of a composition comprising providing a composition comprising at least one epoxy resin and a hardener for the epoxy resin, adding a curing indicator, applying curing conditions to the coloured composition until the composition changes its colour and use of polymeric colourants as curing degree indicator, wherein the curing indicator is a polymeric colourant consisting of chromophores which are chemically bound to polymers having reactive groups.
    Type: Application
    Filed: August 26, 2010
    Publication date: September 6, 2012
    Applicant: Elantas GmbH
    Inventors: Klaus Wilhelm Lienert, Marco Busi, Nataly Colombi, Alberto Pederzani, Paola Gherardi
  • Patent number: 8232365
    Abstract: There is disclosed a biomass-derived epoxy compound as an epoxidized product of a raw-material biomass-derived compound having a weight-average molecular weight of 300 to 10000. The biomass-derived epoxy compound has a weight-average molecular weight of 600 to 20000 and is soluble in an organic solvent for the preparation of a varnish. The epoxy compound is prepared by dissolving the raw-material biomass-derived compound in an aqueous alkali solution; adding epichlorohydrin to the solution and heating the mixture; and evaporating epichlorohydrin from the heated mixture and precipitating a biomass-derived epoxy compound, in which the aqueous alkali solution has a pH of 13.5 to 11.0. The biomass-derived epoxy compound has both high solubility in organic solvents and satisfactory heat resistance and can be manufactured in a high yield on the basis of the raw material through a less number of processes.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: July 31, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Yoshiaki Okabe, Hiroyuki Kagawa
  • Patent number: 8053547
    Abstract: The present invention relates to conjugated polymers comprising specific carbazole structural units. The materials according to the invention display steeper current-voltage curves and are therefore better suited to use in organic light-emitting diodes than are comparative polymers which do not contain these units.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: November 8, 2011
    Assignee: Merck Patent GmbH
    Inventors: Amir Parham, Aurelie Falcou, Susanne Heun, Heinrich Becker, Esther Breuning
  • Patent number: 8044152
    Abstract: An epoxy resin containing side-chain-tethered caged POSS and a preparation method thereof as well as epoxy resin material containing POSS-epoxy and a preparation method thereof are disclosed. The epoxy resin containing side-chain-tethered caged POSS (POSS epoxy) is formed by tethering of POSS group to the side chain of the diglycidyl ether of bisphenol A (DGEBA) epoxy resin. The preparation method of the POSS epoxy includes a step of reacting epoxy resin with caged POSS to form epoxy resin containing side-chain-tethered caged POSS (POSS-epoxy). The preparation method of epoxy resin material containing POSS-epoxy includes a step of reacting DGEBA epoxy resin with POSS-epoxy to get epoxy resin material containing POSS-epoxy. The POSS-epoxy is distributed evenly in the epoxy resin material with POSS-epoxy.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: October 25, 2011
    Assignee: Chung Shan Institute of Science and Technology, Armaments Bureau, M.N.D
    Inventors: Cheng-Chien Yang, Chen-Chi M. Ma, Wang-Tsae Gu, Chin-Yih Chen
  • Patent number: 7910181
    Abstract: Various embodiments of the present invention are directed to methods for manufacturing complex, anisotropic materials with desirable properties for information storage, processing, and display. Certain of these methods involve employing a magnetic field during manufacture to induce desired orientations of precursors, subunits, and/or molecular subassemblies. The applied magnetic field steers the precursors, subunits, and/or molecular subassemblies into desirable orientations while the precursors, subunits, and/or molecular subassemblies are assembled or self-assemble into a complex, anisotropic material. One embodiment of the present invention is a class of new, complex, well-ordered, network-like materials that include a ferromagnetic-material-based framework in which organic and/or organometallic compounds are organized.
    Type: Grant
    Filed: June 19, 2008
    Date of Patent: March 22, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Patricia A. Beck, Sean Zhang
  • Patent number: 7884172
    Abstract: To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: February 8, 2011
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Ryutaro Tanaka, Toru Kurihashi
  • Patent number: 7858726
    Abstract: A process for producing a low-molecular polyphenylene ether having a content of components with molecular weights of 20,000 or more of 10 mass % or less and a number average molecular weight of 4,000 or less by a redistribution reaction which involves reacting a raw polyphenylene ether having a number average molecular weight of 10,000 or more with a polyphenol compound and a radical initiator, characterized in that the redistribution reaction step is a step conducted in a solvent; the ratio of the raw polyphenylene ether to the solvent (raw polyphenylene ether:solvent) (mass ratio) is provided at 0.4:100 to 40:100 (mass ratio); and the ratio of the radical initiator to the solvent (radical initiator:solvent) (mass ratio) is provided at 0.5:100 to 5:100 (mass ratio).
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: December 28, 2010
    Assignee: Asahi Kasei Chemichals Corporation
    Inventors: Kenzo Onizuka, Minoru Sakurai
  • Patent number: 7834136
    Abstract: The present invention relates to conjugated polymers comprising specific carbazole structural units. The materials according to the invention display steeper current-voltage curves and are therefore better suited to use in organic light-emitting diodes than are comparative polymers which do not contain these units.
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: November 16, 2010
    Assignee: Covion Organic Semiconductors GmbH
    Inventors: Amir Parham, Aurelie Falcou, Susanne Heun, Heinrich Becker, Esther Breuning
  • Patent number: 7671146
    Abstract: This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: March 2, 2010
    Assignee: Sumitomo Bakelite Company, Ltd
    Inventors: Ken Ukawa, Hirofumi Kuroda
  • Publication number: 20090131622
    Abstract: A method for producing a branched-polyether resin composition of the present invention includes a first step of obtaining a reaction mixture including: (1-A) a branched-polyether resin (X) containing a hydroxyl group, an acryloyl group, and an epoxy group and (1-B) at least one resin component selected from the group consisting of (1-B-1) a diacrylate (A2) of an aromatic difunctional epoxy resin, (1-B-2) a monoacrylate (A1) of an aromatic difunctional epoxy resin, and (1-B-3) an aromatic difunctional epoxy resin (B) other than (A1) and (A2); and a second step of mixing the reaction mixture and an unsaturated monocarboxylic acid, and reacting the epoxy group in the reaction mixture and a carboxyl group in the unsaturated monocarboxylic acid.
    Type: Application
    Filed: December 20, 2005
    Publication date: May 21, 2009
    Applicant: Dainippon Ink and Chemicals, Inc.
    Inventors: Eiju Ichinose, Hideyuki Ishida, Masatoshi Motomura
  • Publication number: 20090018303
    Abstract: A process for producing a low-molecular polyphenylene ether having a content of components with molecular weights of 20,000 or more of 10 mass % or less and a number average molecular weight of 4,000 or less by a redistribution reaction which involves reacting a raw polyphenylene ether having a number average molecular weight of 10,000 or more with a polyphenol compound and a radical initiator, characterized in that the redistribution reaction step is a step conducted in a solvent; the ratio of the raw polyphenylene ether to the solvent (raw polyphenylene ether:solvent) (mass ratio) is provided at 0.4:100 to 40:100 (mass ratio); and the ratio of the radical initiator to the solvent (radical initiator:solvent) (mass ratio) is provided at 0.5:100 to 5:100 (mass ratio).
    Type: Application
    Filed: February 14, 2007
    Publication date: January 15, 2009
    Applicant: Asahi Kasei Chemicals Corporation
    Inventors: Kenzo Onizuka, Minoru Sakurai
  • Publication number: 20070213477
    Abstract: This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.
    Type: Application
    Filed: March 5, 2007
    Publication date: September 13, 2007
    Inventors: Ken Ukawa, Hirofumi Kuroda
  • Patent number: 7199204
    Abstract: A hot melt adhesive comprising an adhesive polymer and a modified rosin-terpene, preferably a phenol modified rosin terpene. The adhesive is particularly useful in packaging applications.
    Type: Grant
    Filed: May 7, 2002
    Date of Patent: April 3, 2007
    Assignees: National Starch and Chemical Investment Holding Corporation, Arizona Chemical Company
    Inventors: Dale L. Haner, Abhay K. Deshpande, Justin A. Mehaffy, George A. Locko
  • Patent number: 7112635
    Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of water, tetrahydrofuran and multifunctional epoxy resins. The polyols can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.
    Type: Grant
    Filed: March 12, 2004
    Date of Patent: September 26, 2006
    Assignee: Air Products and Chemicals, Inc.
    Inventor: Frederick Herbert Walker
  • Patent number: 7087799
    Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: August 8, 2006
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
  • Patent number: 7019045
    Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).
    Type: Grant
    Filed: May 9, 2005
    Date of Patent: March 28, 2006
    Assignee: Gun Ei Chemical Industry Co., Ltd.
    Inventors: Takeshi Tsuihiji, Michiyasu Yamazaki
  • Patent number: 6927272
    Abstract: Material of electronics component and electronics components using the same material are provided. The material includes repellent that can withstand severe solder-mounting conditions, and the electronics components such as printed wiring boards can lasts repelling effect for a long period. The material is used in electronics components requiring a soldering process, and includes at least curable resin, filler and the repellent. The repellent has vapor pressure of less than 10,000 nPa at room temperature. Film is formed using the material at a given place of an electronics component such as a printed wiring board.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: August 9, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Kazumi Iwasaki
  • Patent number: 6887919
    Abstract: A pressure sensitive adhesive composed of a mixture comprising a) a styrene block copolymer having a star-shaped structure and a molecular weight Mw of more than 300,000 g/mol, or having elastomer blocks which contain more than 30% by weight of 1,2-linked diene in their block structure, or both, and which is crosslinkable by exposure to UV-light or electron beams, and b) one or more block copolymers composed of vinylaromatic blocks and elastomer blocks, the block polyvinylaromatic content being greater than 20%, and c) one or more tackifier resins.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: May 3, 2005
    Assignee: tesa AG
    Inventors: Thorsten Krawinkel, Bernd Lühmann, Renke Bargmann
  • Patent number: 6878448
    Abstract: The present invention provides a biphenyl based epoxy resin comprising a curing agent and an inorganic filler containing an alkali alkaline earth metal oxide wherein the epoxy resin has a variation rate of hardness at 25° C. and a relative humidity of 50% for 72 hours of less than 10% and a variation rate of flow at 25° C. and a relative humidity of 20% or below for 72 hours of less than 20%.
    Type: Grant
    Filed: September 25, 2001
    Date of Patent: April 12, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Toshiaki Ishii, Hiroyoshi Kokaku, Akira Nagai, Takao Miwa
  • Patent number: 6838176
    Abstract: Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: January 4, 2005
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Kazuya Goto, Shigetsugu Hayashi, Tadayoshi Saito, Takashi Kaneko, Kazutami Mitani, Koki Wakabayashi, Yasuo Takagi
  • Publication number: 20040260049
    Abstract: A subject for the invention is to provide a branched aromatic polycarbonate which is excellent in hue and in melt characteristics such as melt strength.
    Type: Application
    Filed: March 31, 2004
    Publication date: December 23, 2004
    Applicants: Mitsubishi Chemical Corporation, Mitsubishi Engineering-Plastics Corporation
    Inventors: Masaaki Miyamoto, Takao Tayama, Hiroshi Nakano
  • Patent number: 6833442
    Abstract: There is provided a complex having a specified chemical structure and an asymmetric catalyst using such a complex. Further, an epoxidation of amine or ketone is enantioselectively conducted by using such an asymmetric catalyst.
    Type: Grant
    Filed: August 5, 2002
    Date of Patent: December 21, 2004
    Assignee: The University of Tokyo
    Inventors: Masakatsu Shibasaki, Takashi Ohshima, Tetsuhiro Nemoto
  • Patent number: 6800717
    Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphenol-A (DGEBA) compared to traditional epoxy resins of comparable molecular weight prepared by the advancement process. The product can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: October 5, 2004
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Frederick Herbert Walker, John Bartram Dickenson
  • Patent number: 6756453
    Abstract: The present invention relates to alicyclic epoxy compounds obtained by selectively hydrogenating aromatic rings of aromatic epoxy compounds in the presence of a hydrogenation catalyst, the concentration of the platinum group element in the product alicyclic epoxy compound being not more than 2 ppm.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: June 29, 2004
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Kouya Murai, Mineo Nishi, Masayuki Honda
  • Patent number: 6749765
    Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: June 15, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Edward W. Rutter, Jr., Peter Trefonas, III, Edward K. Pavelchek
  • Publication number: 20040077820
    Abstract: A new method of converting oligomeric chloroformates to high molecular weight polycarbonate is presented. By carefully controlling the relative concentrations and amounts of hydroxyl and chloroformate groups present in the oligomeric polycarbonate, the method of the invention provides for the efficient preparation of polycarbonate while minimizing phosgene usage. The product polycarbonates prepared by the method of the invention are fully capped with no additional phosgene required beyond that needed to prepare the oligomeric chloroformate starting material. The method of the present invention provides polycarbonates having non-detectable levels (<5 ppm) of aromatic hydroxyl endgroups, low polydispersity, and low levels of residual monomer and endcap, thereby obviating the need for monomer and endcap recycle.
    Type: Application
    Filed: October 16, 2002
    Publication date: April 22, 2004
    Applicant: General Electric Company
    Inventors: James Manio Silva, Pierre-Andre Bui, Thomas Joseph Fyvie, David Michel Dardaris
  • Patent number: 6720077
    Abstract: The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.
    Type: Grant
    Filed: February 13, 2002
    Date of Patent: April 13, 2004
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Yasuyuki Hirai, Hironori Suzuki, Yoshiyuki Takeda, Kenichi Oohori, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe
  • Patent number: 6670006
    Abstract: The present invention relates to an epoxy resin composition for FRP that will be used for fishing rods, golf club shafts, and the like, a prepreg that is an intermediate material made up of an epoxy resin composition combined with reinforcing fibers, and a tubular molded article obtained using it. The epoxy resin composition for FRP of the present invention comprises (A) a bisphenol A-type epoxy resin, (B) an epoxy resin having oxazolidone rings, and (C) a curing agent. By using the epoxy resin composition for FRP of the present invention, a prepreg quite excellent in handleability and a tubular molded article improved in flexural strength in the longitudinal direction and crushing strength in the diametrical direction can be obtained.
    Type: Grant
    Filed: September 27, 1999
    Date of Patent: December 30, 2003
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Masahiro Sugimori, Kazuya Gotou, Akira Agata, Yukio Nishimoto, Masato Taguchi
  • Patent number: 6652281
    Abstract: Dental materials containing monomers and/or prepolymers can be subjected to a polymer-forming reaction. The dental materials comprise at least one initiating system and optionally comprise fillers, colorants, flow modifiers, stabilizers, ion-releasing substances as well as compounds which increase X-ray capacity or other modifiers. The dental materials are characterized in that the initiating system is proportioned such that the dental materials are sufficiently capable of flowing for at least 10 seconds after exposure to oxygen, whereupon they subsequently harden into a solid material.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: November 25, 2003
    Assignee: 3M ESPE AG
    Inventors: Gunther Eckhardt, Thomas Luchterhandt, Thomas Klettke
  • Patent number: 6620862
    Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: September 16, 2003
    Assignees: Amkor Technology, Inc., Nitto Denko Corporation
    Inventors: Hirotaka Ueda, Masaki Mizutani
  • Patent number: 6613839
    Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: September 2, 2003
    Assignee: The Dow Chemical Company
    Inventors: Joseph Gan, John P. Everett