Abstract: The present invention provides a composition comprising a) at least one epoxy resin, b) at least one cyclic amine of the formula (I) in which R1 to R4 is H or an organic radical and X?—(Y1)m-(A1)n-(Y2)o-(A2)p-(Y3)q-(A3)r-(Y4)s—,??(II) where, independently of one another, m, n, o, p, q, r and s=0 or 1, A1, A2, A3=alkylene or alkenylene radical and Y1, Y2, Y3, Y4=NR5, PR5, O or S, where R5 independently=organic radical, where any two organic radicals selected from R1 to R5 and any radicals present in the alkylene and/or alkenylene radicals A1, A2, A3 may also form one or more further rings, with the proviso that at least one of the radicals selected from R1 to R5 present and any radicals present in the alkylene and/or alkenylene radicals A1, A2, A3 is substituted by at least one —NHR6 or —NH2 group, where R6=organic radical, and c) at least one salt of a very strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and unsubstituted ammonium ions, and t

Abstract: An epoxy resin composition includes [A] an epoxy resin, [B] dicyandiamide, [C] an aromatic urea and [D] a boric acid ester and satisfies any one of (i) requirements [a] and [b], (ii) requirements [c] and [d] and (iii) requirements [c] and [e]:[a]: the time from when the temperature reaches 100° C. till when the heat flow reaches a peak top is 60 minutes or shorter as determined by a differential scanning calorimetry; [b]: the time from when the temperature reaches 60° C.

Abstract: The present invention provides a heat-curing resin composition which is curable without UV irradiation or the like and in which exudation of unreacted epoxy resin and the like at the time of pressure thermoforming is satisfactory. The heat-curing resin composition comprises: an acrylic copolymer containing an epoxy group-containing (meth)acrylic ester monomer; an epoxy resin; and a curing agent for the epoxy resin, wherein the curing agent contains organic acid dihydrazide, and part of epoxy groups of the acrylic copolymer are cross-linked by liquid polyamine or liquid polyamidoamine, each having at least one of a primary amino group and a secondary amino group.

Abstract: A curable composition including (a) at least one divinylarene dioxide; (b) at least one phenol, wherein the phenol is unsubstituted at a 2-, 4-, or 6-phenolic ring position; and (c) at least one acid compound-related cure catalyst; and a cured product made from the above curable composition.

Abstract: Methods and formulations for distortional thermosets are disclosed that display enhanced composite mechanical performances and robust sorption resistance. The composition includes an epoxy resin of formula (I): and a diamine curing agent. The resultant distortional thermoset compositions possess superior out-life requirements and advantageous reaction kinetics for preparing prepreg compositions and materials.

Abstract: Disclosed are molecular and polymeric compounds having desirable properties as semiconducting materials. Such compounds can exhibit desirable electronic properties and possess processing advantages including solution-processability and/or good stability. Organic transistor and photovoltaic devices incorporating the present compounds as the active layer exhibit good device performance.

Abstract: The purpose of the present invention is to provide a polymerizable resin composition with which the cured product refractive index is high and the viscosity under a high shear stress is a specific viscosity or lower. Provided is an polymerizable epoxy composition comprising (A1) an S-containing epoxy resin represented by a general formula, (A2) an epoxy compound having a softening point of 70° C. or lower, (B) a curing promoter, and (C) a thiol compound having two or more thiol groups per molecule, wherein viscosity at 25° C. and 60 rpm as determined using a B viscometer is between 100 and 15,000 mPa·s.

Abstract: The present invention relates to a heat-curable composition comprising (a) at least one compound which is capable of undergoing cationic polymerization; and (b) at least one sulfonium sulfate selected from compounds of the formulae Ia and Ib where Yn? is a monovalent or divalent anion selected from (1) where n, M, R1 to R10 are as defined in claim 1 and in the description. The present invention also relates to novel sulfonium sulfates of the formulae Ia and Ib, to a process for curing cationically polymerizable material and to the cured material obtained by said process.

Abstract: An epoxy resin composition having components (A), (B), (C), and (D), wherein the epoxy resin composition has a viscosity at 40° C. of about 1×103 to about 1×104 Pa·s, a curing start temperature of about 90 to about 110° C., and a minimum viscosity at the curing start temperature of about 2 to about 20 Pa·s, wherein the components (A), (B), (C), and (D) are as follows: (A) About 60 weight parts or more of a tetraglycidyl amine type epoxy resin per 100 weight parts of the epoxy resin blend; (B) Dicyandiamide; (C) Diaminodiphenyl sulfone and (D) Urea compound.

Abstract: An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. In the formula (1), R1 is an aralkyl group, and R2 is a lower alkyl group, provided that when R2 is a methyl group, R1 is not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.

Abstract: Methods and compositions including a compound represented by formula (I): wherein n represents an integer of from 1 to 4, RHL('s) each independently represents Cl or F, and R1 represents an alkyl group having from 8 to 20 carbon atoms.

Abstract: The present invention relates to a sealant for liquid crystals having extremely low contamination nature to a liquid crystal, excellent coatability and bondability to a substrate, long service life and pot life and high adhesive strength. A sealant for liquid crystals of the present invention is characterized by comprising (a) an epoxy resin represented by general formula (1): (wherein a represents an integer of 2 to 4; n represents 0 to 3 (average value); R represents a divalent hydrocarbon group of 2 to 6 carbon atoms; A represents a polyvalent aromatic group; and G represents a glycidyl group, provided that when n is 0, (a) an epoxy resin represented by general formula (1) is a bisphenol S-type.), (b) a thermo-curing agent, (c) and a filler having average particle diameter of not larger than 3 ?m.

Abstract: A compound including an epoxy group that has a heat curing property and a chalcone group that has a radiation curing property is represented by the following formula: wherein n is an integer from 1 to 10,000, and each of R1, R2, R3, R4, R5, R6, R7 and R8 is selected from a group consisting of a hydrogen atom, alkyl group, alkoxy group, halogen atom and nitro group. The compound has a high curing efficiency. A photoresist composition including the compound above substantially prevents the formation of remnant in a photoresist pattern used in the manufacturing of a color filter. In addition, the color filter pattern that is formed using the photoresist composition has high color reproductivity and brightness.

Abstract: A sealant composition for a plastic liquid crystal display cell is composed of a two-component epoxy resin composition of a base resin liquid and a curing agent liquid, wherein the base resin is a liquid epoxy resin having from 1.7 to 6 in weight average of epoxy groups in one molecule and an ionic conductivity of 2 mS/m or less; and the curing agent has an ionic conductivity of 0.6 mS/m or less. The sealant composition facilitates the fabrication of plastic liquid crystal displays having enhanced durability and sealant properties, particularly in high temperature and high humidity environments.

Abstract: A process for producing an aromatic polyether having a high molecular weight, small dispersion of the molecular weight, excellent in the heat resistance as well as the impact resistance and represented by the formula (1): wherein each of x1 and x2 independently represents a halogen, and n represents an integer of 1 or above is provided, which comprises polymerizing 4,4′-biphenol with a 4,4′-dihalogenodiphenyl sulfone represented by the formula (2): wherein x1 and x2 have the same meaning as above, in an amount exceeding 1 time by mole and not exceeding 1.05 time by mole based on said 4,4′-biphenol in diphenyl sulfone and in the presence of an alkali metal carbonate and/or an alkali metal bicarbonate at a temperature which is not lower than 240° C. and not higher than 270° C.

Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphenol-A (DGEBA) compared to traditional epoxy resins of comparable molecular weight prepared by the advancement process. The product can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.

Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.

Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

Abstract: Dental materials containing monomers and/or prepolymers can be subjected to a polymer-forming reaction. The dental materials comprise at least one initiating system and optionally comprise fillers, colorants, flow modifiers, stabilizers, ion-releasing substances as well as compounds which increase X-ray capacity or other modifiers. The dental materials are characterized in that the initiating system is proportioned such that the dental materials are sufficiently capable of flowing for at least 10 seconds after exposure to oxygen, whereupon they subsequently harden into a solid material.

Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.

Abstract: The invention relates to preparations with improved curing behavior, which are characterized in that they contain 0.0005 to 50 wt. % of soluble and/or fine-particle organic and/or inorganic alkaline earth and/or alkali metal compounds. The preparations according to the invention may be used for bonding, sealing, casting and coating substrates, also in medical dental and technical dental preparations, and for making impressions of articles and, more particularly, for making dental impressions.

Abstract: A perfluoro group-containing compound are represented by the following formula (I): —Rf— is a perfluoro group; and —A represents —OH or a group: or —CyF2y+1 or —CzF2z−1 and a perfluoro group-containing polymerizable compound represented by the following formula (II): R1—O—CH2—CH(OH)—CH2—O—Rf—B  (II) In Formula (II), —Rf— is a perfluoro group; —B is —OH or —O—CH2—CH(OH)—CH2—O—R2, or —CyF2y+1 or —CzF2z−1; and R1 and R2 each is a dehydroxyl residue of a (meth)acryloyl group-containing compound or a vinyl group-containing compound. The hardened polymer from the compound has water-repellency, oil-repellency and adhering ability.

Abstract: A conjugated diene polymer is produced by continuously polymerizing a conjugated diene monomer with a catalyst consisting essentially of specified components (a) to (c) and reacting with at least one of specified components (d) and (e) and has a content of cis-1,4-bond of not less than 85%, a content of 1,2-vinyl bond of not more than 2.0% and a ratio of weight average molecular weight (Mw) to number average molecular weight (Mn) of not more than 5, and contains at least one functional group selected from epoxy group and hydroxyl group in its molecule. And also, a rubber composition comprises 10-200 parts by weight of silica based on 100 parts by weight of rubber ingredient consisting of 10-100% by weight of the above conjugated diene polymer and 90-0% by weight of the other diene polymer or natural rubber.

Abstract: A curing agent for epoxy resins, the curing agent containing as an active ingredient a compound represented by the formula (1) or a salt thereof and an amine compound or a salt thereof, the curing agent being characterized in that at least one of the compound represented by the formula (1) and the amine compound is a salt of thiocyanic acid; and an epoxy resin composition having the curing agent incorporated therein: NH2N(R1)(R2)  (1) wherein R1 and R2 are the same or different and each represents alkyl having 1 to 8 carbon atoms, aryl, a nitrogen-containing heterocyclic group or when taken together, represents alkylene having 2 to 11 carbon atoms or a group represented by —R3—R4—R5— wherein R3 and R5 are the same or different and each represents alkylene having 1 to 8 carbon atoms, and R4 is an oxygen atom, a sulfur atom or a group ═NR6 or ═NNH2, wherein R6 is a hydrogen atom or alkyl having 1 to 8 carbon atoms.

Abstract: An epoxy-amine composition includes an epoxy resin, an amine curing agent and elemental sulfur as a cure accelerator. The degree of acceleration is highly regulated by the concentration of sulfur in the epoxy-amine composition and the time and conditions of the contact between sulfur and the amine curing agent of the epoxy-amine composition.

Abstract: A fluorine-containing epoxy resin composition comprising a fluorine-containing aromatic epoxy resin having in one molecule at least one perfluoroalkyl group having 6 to 12 carbon atoms and preferably at least two epoxy groups, a cationic polymerization catalyst, and optionally a compatibilizing agent having an epoxy group and a fluoromethyl group is coated on discharge openings of an ink jet recording head, followed by exposure to activation energy rays in a given pattern form to form cured coatings with a desired pattern so that the discharge openings can be endowed with ink repellency.

Abstract: The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. The present invention includes the polymerization of epoxy resins, vinyl ethers and other cationically curable monomers.

Abstract: Metal cyanide catalysts are complexed with organic sulfone or sulfoxide compounds. The catalysts are active alkylene oxide polymerization catalysts that tend to have short induction periods and moderate exotherms.

Abstract: The present invention provides a curable resin composition with excellent low temperature curability and good storage stability, which comprises (A) a polyepoxide compound, (B) a curing agent containing at least one functional group selected from carboxyl group and acid anhydride group, and (C) a potential curing catalyst composed of a reaction product of an onium salt and diphenyl phosphate.

Abstract: A resin composition comprising a fluorine-containing aliphatic epoxy resin having in one molecule at least one perfluoroalkyl group having 6 to 12 carbon atoms and at lest two epoxy groups, a cationic polymerization catalyst, and optionally a compatibilizing agent having an epoxy group and a fluoromethyl group is applied to a discharge opening surface of an ink jet recording head, followed by irradiation with an activation energy ray in a given pattern to form a cured film in a desired pattern, so that the discharge opening surface is endowed with ink repellency.

Abstract: A composition comprises from 60-98 weight percent of a casting resin such as an epoxy resin, from 2-30 weight percent of an alcohol or sugar such as 3 (4), 8 (9)-bis(hydroxymethyl)tricyclo[5.2.1.02,6]decane, from 0.2 to 2.0 weight percent of a thermal initiator such as an onium salt, from 0.2-2.0 weight percent of a bonding agent such as 3-glycidyloxypropyltrimethoxysilane, from 0-3.0 weight percent of a flow improver, from 0.2-5.0 weight percent of a metal complex with an organic ligand such as an amino acid, acetate, carbonic acid, amine and acetylacetonate including zinc di-(2-ethylhexanoate) and from 0-4 weight percent of a thixotropic agent and/or a flow modifier.

Abstract: The present invention relates to thiolamide curing agents and methods for their preparation and use. The thiolamide curing agents are the reaction product of a thiol containing compound and an amine containing compound.

Abstract: Disclosed herein is a one-part polythiol-type epoxy resin composition having an excellent low-temperature quick curability and a good storage stability (shelf stability), which can be prepared by using, as essential components, (1) an epoxy resin having two or more epoxy groups per one molecule, (2) a thiol compound having two or more thiol groups per one molecule, (3) a solid dispersion-type latent curing accelerator and (4) a borate ester compound.

Abstract: The invention relates to a single-component adhesive system that consists at least of a casting resin, in particular of an epoxy casting resin, and a multivalent alcohol. The low-viscosity adhesive system can be microdosed, is stable in storage, is completely hardenable and is suitable for applications in which the dimensional tolerances are in the &mgr;m and sub-&mgr;m region.

Abstract: A process for preparing radiation-curable, urethane-functional prepolymers by reacting an isocyanate-functional component A with an OH-containing component B, wherein either component A embraces two different isocyanate compounds A1 or one isocyanate compound A1 and at least one isocyanate compound A2 or component B embraces at least two different compounds B1. Also, the prepolymers obtainable by the process and the radiation-curable formulations comprising them. Furthermore, the use of the radiation-curable formulations for coating substrates, a method of coating substrates, and the coated substrates themselves.

Abstract: A composition that includes an epoxy compound, a thiol curing agent, a catalyst and a phosphorus--containing compound having at least one P--OH group and at least one organic moiety characterized by the presence of an ethylenically unsaturated group. The composition is particularly useful as a sealer for an adhesive joint.

Abstract: Curable reaction resin mixtures which are suitable for stereolithography have the following composition:a cationically curable monomer and/or oligomer,an initiator with the following structure: ##STR1## where the following applies: R.sup.1 and R.sup.2 are alkyl or cycloalkyl, or together with the S atom they form a heterocyclic ring,R.sup.3 is H or alkyl,R.sup.4, R.sup.5, R.sup.6 and R.sup.7 are H, alkyl or alkoxy,X.sup.- is a non-nucleophilic anion,and optionally a filler, pigment and/or additive.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.

Abstract: The present invention relates to polyglycidyl ether compounds containing at least three mono- or divalent radicals A of the general formula wherein R.sub.

Abstract: An elastomeric epoxy composition and curing agents for elastomeric epoxy compositions, the elastomeric epoxy composition being the reaction product of a substituted amide and an epoxy.

Abstract: The present invention is directed to sulfonium salt-containing compounds represented by a following general formula; ##STR1## wherein R.sub.1 is alkyl containing from 1 to 18 carbon atoms, hydroxy, alkoxy containing from 1 to 18 carbon atoms, alkylcarbonyloxy containing from 1 to 18 carbon atoms or halogen, n is any of 0, 1, 2 or 3, however, each of R.sub.1 may be different from the others when n is 2 or more, R.sub.2 is alkyl containing from 1 to 6 carbon atoms, R.sub.3 and R.sub.4 are each independently hydrogen or alkyl containing from 1 to 6 carbon atoms, R.sub.5 and R.sub.6 are each independently hydrogen, alkyl containing from 1 to 6 carbon atoms, hydroxy, alkoxy containing from 1 to 6 carbon atoms, alkylcarbonyloxy containing from 1 to 18 carbon atoms or aromatic carbonyloxy, and R.sub.7 is alkyl containing from 4 to 20 carbon atoms or a group represented by a following formula; ##STR2## wherein R.sub.

Abstract: Disclosed is a thermosetting coating composition comprising (A) an epoxy compound and (B) an aromatic sulfonium salt represented by the formula ##STR1## wherein R.sup.1 represents a hydrogen atom, a hydroxyl group, an alkoxyl group, or a group represented by the formula ##STR2## wherein Y represents an alkyl group, an alkoxyl group, a phenyl group or a phenoxy group all of which may have a substituent, each of R.sup.2 and R.sup.3 represents a hydrogen atom, a halogen atom, or an alkyl group, each of R.sup.4 and R.sup.5 represents an alkyl group, an aralkyl group or an aryl group all of which may have a substituent, and X.sup.- represents SbF.sub.6.sup.-, PF.sub.6.sup.-, AsF.sub.6.sup.-, or BF.sub.4.sup.-.

Abstract: A coating powder based on an epoxy resin is applied to a substrate and fused and cured thereon. Curing is effected by exposing the coating powder at the point of application to a fluid curative or cure catalyst, e.g., by exposing the fusing coating powder to an ammonia-containing atmosphere.

Abstract: The invention provides a curable, structural epoxy adhesive composition comprising: (a) an epoxy resin; (b) a curing agent for the epoxy resin; and (c) a compound of the formula I: ##STR1## in which R.sup.1 and R.sup.2, which may be the same or different, are selected from an alkyl group, a hydroxyalkyl group, a cycloalkyl group, an aryl group, an arylalkyl group, or a heterocyclic group in which the one to three non-carbon atoms in the ring are independently selected from S, N, and O.

Abstract: A method of preparing epoxy parts wherein the interval of low viscosity of an amine-hardened epoxy system can be extended without sacrifice of cure time. Suitable catalysts for the epoxy-amine hardener reaction are generated in situ. As an advantage, more epoxy articles may be prepared with a given mold capacity having improved wet-out of fiber reinforcement attributed to a larger interval of low viscosity.

Abstract: A method of encapsulating a semiconductor comprising encapsulating a semiconductor in a curable epoxy resin composition comprising a liquid epoxy resin, an inorganic filler, an onium salt compound and an internal releasing agent, and substantially not containing a hardener, and then molding the above composition.

Abstract: The invention relates to mixtures containing:a) a cationically polymerizable compound andb) a compound of the formula I[R.sup.1 (Fe.sup.II R.sup.2).sub.a ].sub.q.sup..sym.an anX.sup..crclbar.q (I)in which a is 1 or 2, n is 1 or 2, R.sup.1 is a substituted or unsubstituted .pi.-arene, R.sup.2 is a substituted or unsubstituted .pi.-arene or cyclopentadienyl anion or indenyl anion, q is an integer from 1 to 3 and X is FSO.sub.3.sup.- or a q-valent anion of an organic sulfonic acid or of a carboxylic acid; R.sup.1 can also be a polymeric, aromatic ligand. The invention also relates to the novel compounds of the formula I. The curable mixtures can be processed in particular for the production of coatings having a good resistance to heat.

Abstract: A thermally-curable aromatic amine-epoxy composition comprises(a) at least one polyepoxy compound;(b) a curing amount of at least one aromatic polyamine compound; and(c) a catalytically effective amount of at least one cure accelerator compound which is a .pi.-electron acceptor, and which lowers the cure exotherm peak temperature (as measured by differential scanning calorimetry (DSC) at 10.degree. C. per minute) of the composition by at least about 8 percent relative to the corresponding composition without the cure accelerator. Such accelerator compounds moderate and/or accelerate the thermal curing of aromatic amine-epoxy resins, enabling cure to occur at lower temperatures and/or in shorter time periods than those required for the unaccelerated composition.

Abstract: A curable epoxide composition consists essentially of curable epoxides, dicyandiamide as a curing agent in an amount less than needed to fully cure the epoxides, an imidazole in an amount exceeding that needed as a catalyst and capable of curing the epoxides in combination with the dicyandiamide, a reactivity controller for the imidazole to reduce the curing speed, and a solvent. The use of undesirable solvents such as DMF is reduced. A glass transition temperature greater than 135.degree. C. is obtained in the cured composition and is maximized by balancing the amounts of dicyandiamide, the imidazole, and the reactivity controller.

Abstract: An epoxy resin system comprising a) at least one nitrogen containing epoxy compound having at least two epoxy groups, b) at least one phosphorus compound with at least one epoxy group, c) at least one metallic complex compound as curing agent and d) optionally filler and additive substances free of halogenated compounds and having a low degree of inflammability.