Abstract: Improved thermally-curable adhesive compositions for bonding articles of poly(butylene terephthalate) together or to other articles are disclosed. The adhesive compositions comprise at least one epoxidic prepolymer having two or more epoxy groups, an aromatic halonium complex salt thermal initiator dissolved in a compatibilizing non-epoxidic organic liquid, a copper carboxylate salt cocatalyst, a polyhydric alcohol, and optionally, silica filler. The adhesive compositions when heated, cure to form an adhesive bond between articles of poly(butylene terephthalate) which exhibits a vastly improved bond strength over presently available epoxy adhesive materials.

Abstract: A thermosetting resin composition comprising (A) at least one polyfunctional epoxy compound and (B) at least one polyfunctional nitrile compound and a prepolymer thereof can give a cured product having excellent heat resistance and mechanical properties such as flexibility.

Abstract: Curable compositions are made from polyepoxide resins and hindered aromatic diamines accelerated with copper fluoborate. Cured products obtained from these compositions are useful in oil well casings, geothermal piping, chemical piping and tankage, filament wound large composites and the like.

Abstract: Compositions containing(a) an epoxide resin containing more than one 2,3-epoxypropyl group per average molecule,(b) a boron trifluoride-amine complex which is a latent hardener for epoxide resins, such as BF.sub.3 -ethylamine, and(c) certain oxidants, such as benzoyl peroxide or 2,3-dichloro-5,6-dicyanobenzoquinone, are stable on storage at ambient temperature but cure rapidly when heated above a certain threshold temperature, the oxidant having a marked accelerating effect on the rate of curing.

Abstract: A high heat resistant transparency of epoxy resins cured with adducts of trimethoxyboroxine and benzyl alcohol is disclosed to resist intense heat for these transparencies in their use on military and industrial hardware. This transparency may exist in a composite with other layers of transparent material known to those skilled in the art. The epoxy transparency layer is bound to the other transparent layers, in a variety of configurations, using an interlayer of mercaptan terminated resins. These resins greatly improve resistance to moisture permeability in and about the edges of the entire transparency.

Abstract: A curable resin is composed ofA. an epoxy resin andB. a pyrylium salt as a catalyst, with or withoutC. a metal chelate or metal salt as a co-catalyst.Preferred pyrylium salts are those of the formula ##STR1## Preferred co-catalysts are acetylacetonates, stearates, benzoates, naphthenates, octoates or phthalates of Cu.sup.++, Co.sup.++, Co.sup.+++, Fe.sup.+++ or Al.sup.+++. The resin compositions may be used to produce coatings and moldings.

Abstract: The invention relates to heat curable epoxy resin compositions consisting of an epoxy resin containing, on average, more than one epoxide group per molecule, an aromatic onium salt as catalyst, a copper complex compound as co-catalyst, and a light stabilizer. These compositions are less sensitive to UV irradiation and have a good shelf life at room temperature as well as a good high temperature reactivity.

Abstract: An improved process for curing a polyepoxide composition with a polycarboxylic acid or polycarboxylic acid anhydride is described wherein the addition of a diphenyliodonium salt accelerator provides for shortened curing reaction times at lower reaction temperatures or at room temperatures if the composition is exposed to a source of ultraviolet radiation.

Abstract: The present invention provides a curable composition comprising (1) at least one epoxy compound containing at least one vicinal-epoxy group and (2) at least one catalyst selected from lithium or Group II metal salts of a non-nucleophilic acid. The present invention further provides an active epoxy curing catalyst composition.

Abstract: High temperature-resistant thermobarriers have a filler therein. The filler can be an opaque thermobarrier material, a fabric or cloth such that a laminated thermobarrier is formed, or preformed bubbles of glass, ceramic or plastic such that a syntactic foam thermobarrier is formed. The thermobarrier contains a boroxine compound therein as well as epoxy resins and various phosphorus compounds and/or aromatic alcohols. Generally, the syntactic foam thermobarriers give the best heat protection.

Abstract: Certain classes of aromatic sulfoxonium salts, such as dimethylphenacylsulfoxonium and acetanilinodimethylsulfoxonium hexafluorophosphates, have little or no effect on prolonged heating with O-glycidyl group-containing epoxides. It has now been found that if a quinone, peroxide, or iodoso aromatic compound is also added, the sulfoxonium salts rapidly bring about the polymerization of such epoxides and curing of such polyepoxides.

Abstract: The present invention provides an curable composition comprising (1) at least one epoxy compound containing at least one vicinal-epoxy groups, (2) a miscible amount of at least one ethylenically unsaturated monomer and (3) a curing amount of at least one catalyst selected from lithium or Group II metal salts of a non-nucleophilic acid.

Abstract: This invention relates to a heat curable composition comprising(a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is at least 2,(b) an epoxy resin containing at least two ##STR2## groups, and (c) a thermal initiator member of the group consisting of(1) a substituted or unsubstituted diaryliodonium salt in combination with a free radical initiator,(2) a BF.sub.3 adduct,(3) a BF.sub.3 adduct in combination with a free radical initiator, and(4) dicyandiamide in combination with a free radical initiator.The system is stable at ordinary temperatures, but on heating the thermal initiator catalyzes the curing of the acrylate and the epoxy resin.

Abstract: A curable composition comprising:(A) at least one spiro-orthoester compound having at least one spiro-orthoester group represented by the formula: [I] ##STR1## wherein n is an integer of 3-5, (B) at least one curing agent selected from the group consisting of organic polybasic acids and their anhydrides,(C) optionally, an epoxy compound having at least one epoxy group, and(D) optionally a cationic polymerization catalyst when the composition comprises ingredient (C).Said composition is small in shrinkage on curing, and provides a cured product of high dimensional accuracy when used as a molding material.

Abstract: Liquid polyglycidyl compounds, diethyltoluylenediamine, a curing accelerator and optionally further additives form a liquid matrix system with which fibres and fibre shapes are impregnated by known techniques, particularly by filament winding, pultrusion and injection processes. The components thus produced are for example tubes capable of withstanding pressure and torsional stress.

Abstract: High molecular weight epoxy resins containing hydrolyzed epoxy groups are prepared by reacting (A) a low molecular weight epoxy resin, and (B) a hydroxyl-containing compound in the presence of (C) a catalyst therefor and (D) an excess quantity of water and thereafter removing the excess water.

Abstract: The instant invention provide a process for increasing the molecular weight of an epoxy resin by reacting (1) a polyepoxide containing more than one vicinal epoxy group in the molecule, preferably a normally liquid polyether of a polyhydric phenol, (2) a polyhydric phenol, (3) a catalytic amount of an alkali metal or alkaline earth metal salt of a non-nucleophilic acid, especially fluoboric acid and perchloric acid, preferably in the presence of (4) a base such as pyridine.

Abstract: A high heat resistant transparency of epoxy resins cured with adducts of trimethoxyboroxine and benzyl alcohol is disclosed to resist intense heat for these transparencies in their use on military and industrial hardware. Additionally, the transparency may include phosphite or phosphate compounds to improve heat resistance, with the phosphate compound in sufficient concentrations to delay gel times such that the phenyl substituted alkyl alcohol may be eliminated from the composition. This transparency may exist in a composite with other layers of transparent material known to those skilled in the art. The epoxy transparency layer is bound to the other transparent layers, in a variety of configurations, using an interlayer of mercaptan terminated resins. These resins greatly improve resistance to moisture permeability in and about the edges of the entire transparency.

Abstract: Novel coating systems comprising high-solids content blends of epoxy prepolymers, a catalyst complex comprising a complex iodonium salt and a copper salt, and a conventional pigment. The compositions cure rapidly to highly chemically resistant, tough coatings.

Abstract: High molecular weight epoxy resins containing hydrolyzed epoxy groups are prepared by reacting (A) a low molecular weight epoxy resin and (B) a hydroxyl-containing compound in the presence of (C) water (D) a hydrolysis catalyst and (E) a catalyst for effecting the reaction between (A) and (B).

Abstract: Cationically polymerizable compounds, for example cyclic ethers, can be thermally polymerised if an aromatic iodonium salt of the formula I[(Ar.sup.1)(Ar.sup.2)I].sup.+ [MX.sub.n ].sup.- (I)in which Ar.sup.1 Ar.sup.2, M, X and n are as defined in claim 1, is used as the catalyst and an agent which forms free radicals on heating and has the formula III or IV ##STR1## in which R.sup.2, R.sup.3, R.sup.5, R.sup.6, R.sup.8 and m are as defined in claim 1, for example a benzpinacol silyl ether, is used as the co-catalyst. The process is of particular importance for heat-curing epoxide resins as a one-component system.

Abstract: A resin impregnated spacer, useful for bracing electrical conductors, comprises a porous, flexible, heat resistant material impregnated with an epoxy resin containing Lewis acid curing agent and an effective amount of dibutylphosphite.

Abstract: The invention relates to a process in which, as essential components, liquid epoxy resins, carboxylic anhydrides, zinc fluoroborate complex compounds, water, tetrahydropyrane and compounds (X) which contain OH groups, COOH groups or both groups together, are reacted. Selective choice of the special quantity ratios results in reaction mixtures which, at low temperature (e.g. at 100.degree. C.), require only short moulding times and have a sufficiently long pot life. As the reaction is only slightly exothermic, the process can be used very advantageously for encapsulating electronic components.

Abstract: UV curable mixtures of C.sub.(8-28) .alpha.-olefin oxides and certain onium salt photoinitiators, for example, certain diaryliodonium salts, or triarylsulfonium salts, and optionally polyfunctional epoxy resin, have been found useful in paper release coating applications.

Abstract: Phosphorus containing polymers are prepared by copolymerizing a cyclic phosphite and an epoxide in the presence of an acid catalyst. The resulting polymer can be incorporated within a thermoplastic or thermosettable resin to increase the flame resistivity thereof.

Abstract: Novel coating systems comprising high solids content blends of epoxy prepolymers and a catalyst complex comprising a complex iodonium salt, a copper salt, and a tin salt and a conventional pigment. The compositions cure rapidly to highly chemically resistant, tough coatings.

Abstract: A sprayable, solventless bracing composition is made from the admixture of 100 parts of bisphenol A epoxy resin, up to about 8 parts of a coloring pigment, about 0.5 to about 4 parts of a thixotropic agent, about 100 to about 200 parts of butadiene/acrylonitrile polymer, and about 20 to about 40 parts of an amine terminated curing agent.

Abstract: Photopolymerizable epoxide compositions are provided which contain photoinitiators decomposable upon exposure to electromagnetic radiation to produce a Lewis acid and polymerizable epoxide compounds including an epoxide ether compound having the following general structural formula: ##STR1## wherein n equals 1-3 and wherein R is an aliphatic or cycloaliphatic group having 5-12 carbon atoms. Other epoxide compounds may be used in combination therewith to provide compositions which cure rapidly to a tack-free condition at ambient temperatures. Specific epoxide ethers disclosed are those in which n=1 and R is a group selected from the class of 2,2-dimethylpropane, 2-ethyl-1,3-hexane, 1,4-dimethylcyclohexane and 1,10-decane.

Abstract: Aromatic onium salts, such as diaryliodonium salts, have been found to be effective thermal initiators for the polymerization of epoxy resins having a viscosity of up to about 100,000 centipoises at 25.degree. C. when used in combination with copper salts. The processable epoxy resin composition can be used in filament winding and pultrusion applications.

Abstract: Epoxy resin compositions catalyzed with combinations of diaryliodonium salts of complex halogenides and copper salt catalyst activators are rendered stable at room temperature, but fully activatable at elevated temperatures by including an effective amount of a carboxyl terminated copolymer of butadiene and acrylonitrile, a hydroxy terminated copolymer of butadiene and acrylonitrile or a mixture thereof.

Abstract: A low temperature, fast curing epoxy insulating composition is made by low temperature mixing an epoxy resin with a carboxylic acid anhydride complex, the anhydride complex being the low temperature reaction product of a selected Lewis Acid catalyst and a carboxylic acid anhydride.

Abstract: A method of producing furan-epoxy powder-like binder comprising reacting the product of the polycondensation of epichlorohydrin with diphenylpropane (100 weight parts) with a ketone containing a furfurylidene group (33-200 weight parts) and a nitrogen-containing compound (8-100 weight parts). As examples of the ketone containing a furfurylidene group monofurfurylideneacetone, difurfurylideneacetone, difurfurylidenecyclohexanone, a mixture of monofurfurylideneacetone with difurfurylideneacetone in a ratio (weight parts from 1:1 to 1.4:1; 1,9-di-(.alpha.-furyl)nonanetetracene-1,3,6,8-one-5 or 1,5 -di-(.alpha.-furyl)-2,4-dimethylpentadiene-1, 4-one-3 may be mentioned. Triethanolamine, 3-methyl-5-furylpyrazoline, trifurylimidazoline, hexamethylenediamine, and low molecular polyamides with molecular weight of 2000-10000 or polyethylenepolyamine with molecular weight of 1000 are used as a nitrogen-containing compound. The reaction is performed at 130.degree.-200.degree. C.

Abstract: Microcapsules with liquid fills containing Lewis acid catalysts, catalyst concentrates comprising slurries of the microcapsules in liquid media and a method for preparing the microcapsules and concentrates.

Abstract: A process for producing a furan-epoxy powder-like binder comprising reaction of an epoxy diane resin (100 parts by weight) with a ketone of the furan series (40 to 500 parts by weight) and a modifying agent (60 to 500 parts by weight). As the ketone of the furan series use is made of monofurfurylideneacetone, difurfurylideneacetone, difurfurylidenecyclohexanone, a mixture of monofurfurylidenacetone with difurfurylidenacetone, 1,9-di-(.alpha.-furyl)-nonanetetraene-1,3,6,8-one-5, or 1,5-di-(.alpha.-furyl)-2,4-dimethylpentadiene-1,4-one-3. As the modifying agent use is made of a phenolformaldehyde resin or anhydrides of dibasic carboxylic acids. The reaction is carried out at a temperature within the range of from 130.degree. to 180.degree. C. in the presence, when required, of trifurylborate (10 to 30 parts by weight). The resulting product is cooled to a temperature of at most 30.degree. C. and disintegrated to a powder-like condition.

Abstract: Aromatic onium salts, such as diaryliodonium salts, have been found to be effective thermal initiators for the polymerization of a variety of cationically polymerizable materials including epoxides, cyclic ethers, phenol formaldehyde resins, etc., when used in combination with various cocatalysts such as organic acids and copper salts.

Abstract: Cationic polymerization of epoxy monomers, or prepolymers can be achieved by use of certain moisture sensitive dicarbonyl chelates of main row elements of Group IIIA-VA. Curable Compositions are provided which can be used as sealants, coating compounds, glues, incapsulants, etc.