Phenolic Reactant Contains A Heterocyclic Group Other Than A 1,2-epoxy Group Per Se Patents (Class 528/96)
  • Patent number: 10125116
    Abstract: Described herein are compounds, and pharmaceutically acceptable salts and prodrugs thereof, which are useful as inhibitors of IMPDH. In certain embodiments, a compound of the invention selectively inhibits a parasitic IMPDH versus a host IMPDH. Further, the invention provides pharmaceutical compositions comprising one or more compounds of the invention. The invention also relates to methods of treating various parasitic and bacterial infections in mammals. Moreover, the compounds may be used alone or in combination with other therapeutic or prophylactic agents, such as anti-virals, anti-inflammatory agents, antimicrobials and immunosuppressants.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: November 13, 2018
    Assignees: Brandeis University, University of Georgia Research Foundation, Inc., The Brigham and Women's Hospital, Inc.
    Inventors: Lizbeth K. Hedstrom, Gregory D. Cuny, Deviprasad R. Gollapalli, Sivapriya Kirubakaran, Sushil K. Maurya, Boris Striepen, Suresh K. Gorla, Corey R. Johnson, Mandapati Kavitha, Jihan Khan
  • Patent number: 9790330
    Abstract: A method for forming a conjugated heteroaromatic polymer is described, wherein at least one compound of formula (1) is polymerized using an acid as a catalyst, wherein X is selected from S, O, Se, Te, PR2 and NR2, Y is hydrogen (H) or a precursor of a good leaving group Y? whose conjugate acid (HY) has a pKa of less than 30, Z is hydrogen (H), silyl, or a good leaving group whose conjugate acid (HZ) has a pKa of less than 30, b is 0, 1 or 2, each R1 is a substituent, and the at least one compound of formula (1) being polymerized includes at least one compound of formula (1) with Z=H and Y?H.
    Type: Grant
    Filed: October 28, 2012
    Date of Patent: October 17, 2017
    Assignee: PolyM technology corporation
    Inventors: Chien-Chung Han, Balasubramanian Arumugam
  • Patent number: 8999510
    Abstract: A metal-clad phenolic resin laminate obtained by heating and pressing a lamination which comprises: (i) a central layered portion comprising one paper base prepreg which is made of a paper base impregnated with a first phenolic resin composition containing a resol-based resin, or a predetermined number of the paper base prepregs laid on each other; (ii) outer layered portions laid on an upper and a lower sides of the central layered portion, in which each of the outer layered portions comprises one glass fiber substrate prepreg which is made of a glass fiber substrate impregnated with a second phenolic resin composition containing a resol-based resin, or a predetermined number of the glass fiber substrate prepregs laid on each other; and (iii) a metal foil laid at least on one of the outer layered portions laid on the upper and lower sides of the central layered portion.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: April 7, 2015
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventor: Masao Uesaka
  • Patent number: 8981038
    Abstract: A polyimide including a structure shown as Formula II is provided, wherein X is halogen, A1 is selected from one of Formula 1 to Formula 18, and n is from 2 to 500,
    Type: Grant
    Filed: December 25, 2012
    Date of Patent: March 17, 2015
    Assignee: Taiwan Textile Research Institute
    Inventors: Der-Jang Liaw, Wen-Hsiang Chen, Ying-Chi Huang, Bo-Cheng Tao
  • Publication number: 20150045528
    Abstract: Novel oligomers and polymers derived from the reaction of benzoxazine compounds with a mixture of epoxy compounds and amine compounds are disclosed. The compositions are useful in coating, sealants, adhesive and many other applications.
    Type: Application
    Filed: October 25, 2012
    Publication date: February 12, 2015
    Inventors: Ilya Gorodisher, Dmitriy Salnikov, Mary M. Caruso
  • Patent number: 8703882
    Abstract: Phosphorus-containing benzoxazine-based bisphenols and derivatives thereof are disclosed. The phosphorus-containing benzoxazine-based bisphenols are prepared by reacting DOPO with benzoxazine to form the phosphorus-containing benzoxazine-based bisphenols. The phosphorus-containing benzoxazine-based bisphenols can further to form advanced epoxy resins. The advanced epoxy resins can further be cured to form flame retardant epoxy thermosets.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: April 22, 2014
    Assignee: National Chunghsing University
    Inventors: Ching-Hsuan Lin, Hung-Tse Lin, Sheng Lung Chang, Yu-Ming Hu
  • Publication number: 20140010983
    Abstract: A curable composition includes 3-substituted benzoxazine, polyepoxide, and polythiol. Articles including the curable composition, methods of curing the curable composition, and a tack-free reaction product preparable from the curable composition are also disclosed.
    Type: Application
    Filed: March 27, 2012
    Publication date: January 9, 2014
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventor: Ilya Gorodisher
  • Patent number: 8609806
    Abstract: To provide phosphorus-containing epoxy resins and phosphorus-containing epoxy resin compositions having high levels of appearance, yield and economic efficiency and cured products thereof that are used for various applications. A phosphorus-containing phenol compound represented by Formula (3) obtained by reacting a compound represented by Formula (2) with a compound represented by Formula (1), wherein in the peak area (A) of the component represented by Formula (1) on a chromatogram measured under specific conditions by gel permeation chromatography, peak area (B) on the high-molecular-weight side of the component of Formula (1), and total area (C) of peak area (A) and peak area (B), the value obtained by dividing peak area (B) by total area (C) is 8 area % or less, and epoxy resin compositions and cured products comprising the phosphorus-containing phenol compound as an essential ingredient.
    Type: Grant
    Filed: September 2, 2009
    Date of Patent: December 17, 2013
    Assignee: Nippon Steel & Sumikin Chemical Co., Ltd.
    Inventors: Tetsuya Nakanishi, Hideyasu Asakage, Seigo Takuwa
  • Publication number: 20130052381
    Abstract: This disclosure relates to epoxides, polyepoxide compositions and epoxy resins whose degradation products exhibit little or no estradiol binding activity. Also disclosed are methods for making the disclosed compositions and articles of manufacture comprising the disclosed compositions.
    Type: Application
    Filed: August 1, 2012
    Publication date: February 28, 2013
    Inventors: Robert R. Gallucci, James A. Mahood, Jean Francois Morizur, Steve Dimond
  • Patent number: 8263714
    Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: September 11, 2012
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichiro Ogura, Yoshiyuki Takahashi, Kazuo Arita, Kunihiro Morinaga, Yutaka Satou
  • Publication number: 20120165429
    Abstract: The present application relates to a method for preparing epoxy resins from a mixture of epoxidized phenolic compounds, wherein said epoxidized phenolic compounds are obtained by the epoxidation of natural phenolic compounds selected from the group comprising simple phenol, acid-phenol, coumarin, naphthoquinone, stillbenoid, flavonoid, isoflavanoid, anthocyanin, condensed tannin and hydrolyzable tannin.
    Type: Application
    Filed: May 27, 2010
    Publication date: June 28, 2012
    Applicant: Centre National De La Recherche Scientifique (C.N.R.S.)
    Inventors: Bernard Boutevin, Sylvain Caillol, Carine Burguiere, Sylvie Rapior, Hélène Fulcrand, Hélène Nouailhas
  • Patent number: 7985822
    Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: July 26, 2011
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichiro Ogura, Yoshiyuki Takahashi, Kazuo Arita, Kunihiro Morinaga, Yutaka Satou
  • Patent number: 7888397
    Abstract: A poly(phenylene) compound of copolymers that can be prepared with either random or multiblock structures where a first polymer has a repeat unit with a structure of four sequentially connected phenyl rings with a total of 2 pendant phenyl groups and 4 pendant tolyl groups and the second polymer has a repeat unit with a structure of four sequentially connected phenyl rings with a total of 6 pendant phenyl groups. The second polymer has chemical groups attached to some of the pendant phenyl groups selected from CH3, CH2Br, and CH2N(CH3)3Br groups. When at least one group is CH2N(CH3)3Br, the material functions as an anion exchange membrane.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: February 15, 2011
    Assignee: Sandia Corporation
    Inventors: Michael Hibbs, Christopher J. Cornelius, Cy H. Fujimoto
  • Patent number: 7763700
    Abstract: An epoxy resin curing composition containing a compound having a benzoxazole structure represented by formula (I): wherein X1 and X2, which may be the same or different, each represent hydrogen, a substituent having a phenolic hydroxyl group, or a substituent having an epoxy group, provided that X1=X2?H; or X1 and X2 are taken together to form a 3- to 8-membered, saturated or unsaturated heterocyclic ring substituted with a substituent having a phenolic hydroxyl group or a substituent having an epoxy group; Y1 represents oxygen or sulfur; Z1 represents a substituted or unsubstituted C1-C8 hydrocarbon group or a substituted or unsubstituted C1-C8 alkoxy group; m is an integer of 0 to 4; when m is 2 to 4, a plurality of Z1s may be the same or different; n is an integer of 0 to 2; and A1 represents hydrogen, a substituent having a phenolic hydroxyl group or a substituent having an epoxy group.
    Type: Grant
    Filed: March 14, 2007
    Date of Patent: July 27, 2010
    Assignee: Adeka Corporation
    Inventor: Takahiro Mori
  • Patent number: 7632626
    Abstract: There is provided an anti-reflective coating forming composition for lithography comprising a polymer having an ethylenedicarbonyl structure and a solvent; an anti-reflective coating formed from the composition; and a method for forming photoresist pattern by use of the composition. The anti-reflective coating obtained from the composition can be used in lithography process for manufacturing a semiconductor device, has a high preventive effect for reflected light, causes no intermixing with photoresists, and has a higher etching rate than photoresists.
    Type: Grant
    Filed: April 13, 2006
    Date of Patent: December 15, 2009
    Assignee: Nissan Chemical Industries, Ltd.
    Inventor: Rikimaru Sakamoto
  • Publication number: 20090253887
    Abstract: An epoxy resin curing composition containing a compound having a benzoxazole structure represented by formula (I): wherein X1 and X2, which may be the same or different, each represent hydrogen, a substituent having a phenolic hydroxyl group, or a substituent having an epoxy group, provided that X1?X2?H; or X1 and X2 are taken together to form a 3- to 8-membered, saturated or unsaturated heterocyclic ring substituted with a substituent having a phenolic hydroxyl group or a substituent having an epoxy group; Y1 represents oxygen or sulfur; Z1 represents a substituted or unsubstituted C1-C8 hydrocarbon group or a substituted or unsubstituted C1-C8 alkoxy group; m is an integer of 0 to 4; when m is 2 to 4, a plurality of Z1s may be the same or different; n is an integer of 0 to 2; and A1 represents hydrogen, a substituent having a phenolic hydroxyl group or a substituent having an epoxy group.
    Type: Application
    Filed: March 14, 2007
    Publication date: October 8, 2009
    Applicant: ADEKA CORPORATION
    Inventor: Takahiro Mori
  • Patent number: 7150902
    Abstract: Articles are coated by applying a coating composition of a high Tg phenoxy-type material having a Tg of at least about 75° C. to at least a portion of a surface of an article, and forming a dried/cured coating of the high Tg phenoxy-type material on the article surface, where the coating has the high Tg phenoxy-type material and a PHAE; or the article surface comprises a coating includes a PHAE; or the coating has the high Tg phenoxy-type material and a PHAE, and the article surface includes a coating layer of a PHAE.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: December 19, 2006
    Assignee: Pepsico, Inc.
    Inventor: Said Farha
  • Patent number: 6903180
    Abstract: This invention relates to novel epoxy resins and epoxy resin compositions comprising said epoxy resins or cured articles thereof. The cured articles have excellent properties in respect to flame retardance, adhesiveness, moisture resistance and heat resistance and can be used in applications such as lamination, molding, casting and adhesion. The epoxy resins of this invention are represented by the following formula (3) wherein Y1 denotes a glycidyloxyarylmethyl group represented by —CH2—Ar—OG, Y2 and Y3 denote independently a glycidyl group or the aforementioned glycidyloxyarylmethyl group, Ar denotes a phenylene group which can be substituted with up to two hydrocarbon groups and G denotes a glycidyl group.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: June 7, 2005
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Masashi Kaji, Koichiro Ogami
  • Publication number: 20040158023
    Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): 1
    Type: Application
    Filed: August 4, 2003
    Publication date: August 12, 2004
    Inventors: Kuen-Yuan Hwang, An-Pang Tu, Chi-Yi Ju, Wen-Tsai Tsai
  • Publication number: 20040068082
    Abstract: The present invention relates to poly(arylene ethers) used as low k dielectric layers in electronic applications and articles containing such poly(arylene ethers) comprising the structure: 1
    Type: Application
    Filed: October 1, 2002
    Publication date: April 8, 2004
    Applicant: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Christopher Lim, Siu Choon Ng, Hardy Chan, Simon Chooi, Mei Sheng Zhou
  • Publication number: 20040054120
    Abstract: Compounds of formula (I) or (II), wherein R1 is C1-C18alkyl; C5-C12cycloalkyl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C22alkoxy groups; C5-C22aryl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups; or C7-C30aralkyl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups, and the radicals R2 to R13 are each independently of the others hydrogen; —NO2; dialkylamino; alkylthio; alkylsulfonyl; halogen; C1-C18alkyl; C1-C18alkoxy; C1-C18alkoxyalkyl; C5-C12cycloalkyl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups; C5-C22aryl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups; or C7-C10alkyl that is unsubstituted or substituted by one or more C1-C6alkyl groups or C1-C6alkoxy groups, are suitable as flame-proofing agents for thermoplastic or thermosetting polymers.
    Type: Application
    Filed: July 21, 2003
    Publication date: March 18, 2004
    Inventors: Franck Magendie, Ulrich Weidmann
  • Patent number: 6551714
    Abstract: The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition comprising as essential components (A) an epoxy resin, (B) a curing agent and (C) a phosphorus compound containing at least as part thereof a phosphine oxide compound, a prepreg produced by impregnating this flame-retardant resin composition in a fiber base, and a laminate produced by hot-pressing a single sheet or a pile of two or more sheets of the prepreg.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: April 22, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventor: Akihiko Tobisawa
  • Patent number: 6534621
    Abstract: A process for manufacturing an &agr;-halohydrin intermediate and an epoxy resin prepared therefrom including epoxidizing an &agr;-halohydrin intermediate produced from an in situ halide substitution-deesterification of an &agr;-hydroxy ester derivative which has been obtained by the coupling reaction of a phenol or a mixture of phenols and a glycidyl ester optionally in the presence of a catalyst.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: March 18, 2003
    Assignee: Dow Global Technologies Inc.
    Inventors: Clinton J. Boriack, Zeng K. Liao
  • Publication number: 20020161135
    Abstract: The invention pertains to a coating composition comprising a first compound comprising at least one bicyclo- or spiro-orthoester group and a second compound comprising at least two hydroxyl-reactive groups. The invention also comprises a process for curing the present coating composition. More particularly, the latent hydroxyl groups of the bicyclo- or spiro-orthoester groups have to be deblocked and reacted with the hydroxyl-reactive groups of the second compound if the present coating composition is to be cured. Further, a process for making bicyclo-orthoester compounds from the corresponding oxetane compound is described, as are polymers comprising at least one bicyclo- or spiro-orthoester group.
    Type: Application
    Filed: August 22, 2001
    Publication date: October 31, 2002
    Inventors: Keimpe Jan van den Berg, Klaus Hobel, Huig Klinkenberg, Arie Noomen, Josephus Christiaan van Oorschot
  • Patent number: 6462106
    Abstract: Disclosed is a novel amino-polyether-modified epoxy for an electrodeposition paint. The amin-polyether-modified epoxy compound is obtained by reacting amino polyether represented by a formula as follow: wherein m is an integer of 5 or more, R is hydrogen, methyl group or ethyl group, and n is 2 or 3, with polyglycidyl ether having a molecular weight of 1,000 to 7,000 and an epoxy equivalent of 500 to 3,500, wherein an equivalent ratio of a primary amino group of the amino polyether to an epoxy group of the polyglycidyl ether is controlled within the range of 0.52 to 1.0.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: October 8, 2002
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Shinsuke Shirakawa, Mitsuo Yamada
  • Publication number: 20020010305
    Abstract: Process for the production of 2,2,6-trimethylcyclohexane-1,4-dione by epoxidation of &bgr;-isophorone with organic percarboxylic acids at a water content below 5 wt.-% and subsequent isomerization of the mixture of &bgr;-isophorone epoxide and hydroxyisophorone.
    Type: Application
    Filed: May 8, 2001
    Publication date: January 24, 2002
    Inventors: Steffen Krill, Klaus Huthmacher, Sylvain Perrin
  • Publication number: 20010031851
    Abstract: The object was to provide an epoxy resin composition which has excellent flame retardancy, heat resistance and humidity resistance and is advantageously used for semiconductor encapsulating, laminated boards, electrical insulation and the like.
    Type: Application
    Filed: February 15, 2001
    Publication date: October 18, 2001
    Inventors: Takao Fukuzawa, Takayoshi Hirai, Tetsuro Imura, Yoshinobu Ohnuma
  • Patent number: 6303672
    Abstract: A self-dispersing curable epoxy composition is prepared upon contacting an epoxy resin with a polyoxyalkylenemonoamine having a molecular weight of from about 3,000 to about 15,000 in a ratio of about 0.001 to 0.060 reactive equivalents of polyoxyalkylenemonoamine to about 1.0 reactive equivalents of epoxy resin. The self-dispersing curable epoxy resin forms an aqueous dispersion upon mixing with water. When cured, the dispersion is useful as a coating composition.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: October 16, 2001
    Assignee: Henkel Corporation
    Inventors: John G. Papalos, Shailesh Shah, Reuben H. Grinstein, Joseph L. Mulvey, Brian G. Jewell
  • Patent number: 6297329
    Abstract: The invention pertains to a coating composition comprising a first compound comprising at least one bicyclo- or spiro-orthoester group and a second compound comprising at least two hydroxyl-reactive groups. The invention also comprises a process for curing the present coating composition. More particularly, the latent hydroxyl groups of the bicyclo- or spiro-orthoester groups have to be deblocked and reacted with the hydroxyl-reactive groups of the second compound if the present coating composition is to be cured. Further, a process for making bicyclo-orthoester compounds from the corresponding oxetane compound is described, as are polymers comprising at least one bicyclo- or spiro-orthoester group.
    Type: Grant
    Filed: February 21, 1997
    Date of Patent: October 2, 2001
    Assignee: Akzo Nobel NV
    Inventors: Keimpe Jan van den Berg, Klaus Hobel, Huig Klinkenberg, Arie Noomen, Josephus Christiaan van Oorschot
  • Patent number: 6294596
    Abstract: A self-dispersing curable epoxy composition is prepared upon contacting an epoxy resin with a polyoxyalkyleneamine having a molecular weight of from about 3,000 to about 15,000 in a ratio of about 0.001 to 0.060 reactive equivalents of polyoxyalkyleneamine to about 1.0 reactive equivalents of epoxy resin. The self-dispersing curable epoxy resin forms an aqueous dispersion upon mixing with water. When cured, the dispersion is useful as a coating composition.
    Type: Grant
    Filed: September 15, 1995
    Date of Patent: September 25, 2001
    Assignee: Henkel Corporation
    Inventors: John G. Papalos, Shailesh Shah, Reuben H. Grinstein, Joseph L. Mulvey, Brian G. Jewell
  • Patent number: 6291621
    Abstract: Provided are novel, electropolymerizable monomers of the formulae: wherein R1, R2 and R3 are selected from the group consisting of —H, —O(CH2)nCH3, wherein n has a value of 0 to 11 and m has a value of 1 to 4, and wherein no more than one of R2 and R3 is —H. Also provided are polymers resulting from the electropolymerization of these monomers.
    Type: Grant
    Filed: February 23, 1999
    Date of Patent: September 18, 2001
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Loon-Seng Tan, Balasubramanian Sankaran
  • Patent number: 6051294
    Abstract: Hydroxy-functional polyethers having a "cardo" diphenylene group in their backbones are prepared by contacting at least one dinucleophilic monomer with at least one dtglycidyl ether of a cardo bisphenol, such as bis(hydroxyphenyl)fluorene, phenolphthalein, or phenolphthalimidine or a substituted cardo bisphenol, such as a substituted bis(hydroxyphenyl)fluorene, a substituted phenolphthalein or a substituted phenolphthalimidine, under conditions sufficient to cause the nucleophillo moieties of the dinucleophilic monomer to react with epoxy moieties to form a polymer backbone containing pendant hydroxy moieties and ether, imino, amino, sulfonamido or ester linkages. These polyethers possess a combination of high barrier to oxygen transmission (i.e., oxygen transmission rate less than 10.0 cm.sup.3 -mil/100 in.sup.2 -atm-day to oxygen) and high heat resistance (i.e., Tg above 120.degree. C.).
    Type: Grant
    Filed: February 9, 1998
    Date of Patent: April 18, 2000
    Assignee: The Dow Chemical Company
    Inventors: Jerry E. White, H. Craig Silvis, Stephen E. Bales, Michael N. Mang, Muthiah N. Inbasekaran
  • Patent number: 6037425
    Abstract: The present invention provides an epoxy resin composition useful for casting applications, comprising a reaction product obtained by reacting (A) a bisphenol epoxy resin, and (B) bisphenol compounds, and if necessary, (C) monofunctional phenols or carboxylic acid compounds, in the presence of sodium compounds, wherein the epoxy resin composition has(a) an epoxy equivalent: 250 to 500 g/equivalent,(b) a sodium content: 20 to 200 ppm, and(c) a haze of its 40 wt % methyl ethyl ketone solution measured according to ASTM D 1003: 15% or less.
    Type: Grant
    Filed: November 21, 1996
    Date of Patent: March 14, 2000
    Assignee: Shell Oil Company
    Inventors: Takao Fukuzawa, Tetsuro Imura, Masayuki Ohta
  • Patent number: 6011111
    Abstract: A thermoplastic composite is prepared by applying a hydroxy-phenoxyether polymer onto the surface of reinforcing fibers or by the in-situ polymerization of mixtures of diepoxides and difunctional species in the presence of reinforcing fibers. The composites can be molded into shaped articles useful for structural materials and parts by conventional thermoforming or other fabrication techniques.
    Type: Grant
    Filed: October 18, 1993
    Date of Patent: January 4, 2000
    Assignee: The Dow Chemical Company
    Inventors: David J. Brennan, Jerry E. White, Daryl R. Calhoun
  • Patent number: 5962602
    Abstract: An epoxy sealer/healer formulation for sealing and strengthening cracked concrete comprising an epoxy resin, an amine and a dialkylene triamine-alkylene oxide adduct, where the formulation provides a modulus and/or compressive strength at least that of uncracked concrete and effective for penetrating a concrete crack at a rate of at least 10 mm/min for a crack 0.5 mm wide when applied by gravity feed. The epoxy sealer/healer preferably has a viscosity of less than 100 centipoise and a tack-free time of less than 12 hours. The epoxy sealer/healer is advantageous in being able to bond to moist concrete surfaces. A method of using the epoxy sealer/healer for sealing and restoring the strength of cracked concrete is also set forth.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: October 5, 1999
    Assignee: Sika Corporation USA
    Inventors: Stuart J. Hartman, Michael C. Coddington, David C. Elmendorf, Norman Blank
  • Patent number: 5945504
    Abstract: An episulfide which has an alicyclic, aromatic or heterocyclic skeleton and has two or more moieties represented by the formula ##STR1## wherein X is S or O, and S is in an amount of 50% or more, on the average, of the total of S and O constituting a three-membered ring. A cured material obtained by polymerizing this episulfide compound is a desirable optical material for various uses, particularly as a lens material for spectacles.
    Type: Grant
    Filed: January 13, 1997
    Date of Patent: August 31, 1999
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Akikazu Amagi, Nobuyuki Uemura, Motoharu Takeuchi, Kenichi Takahashi, Minoru Ohashi, Hiroshi Horikoshi, Masanori Shimuta
  • Patent number: 5945500
    Abstract: Methods for preparing low free resorcinol resins are disclosed. These methods generally comprise reacting a resin with an aromatic olefinic compound; suitable resins include one or more resins selected from the group consisting of a dihydric phenol, a polyhydric phenol, a dihydric phenolic novolak resin and a polyhydric phenolic novolak resin; the addition product of at least one of these resins and at least one compound selected from the group consisting of a monooxirane compound and a polyoxirane compound; and a phenol or alkyl or aralkyl substituted mono- or dihydric phenol modified form of these resins. The resins produced by this method are also disclosed, as are rubber compositions utilizing the resin produced by this method.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: August 31, 1999
    Assignee: Indspec Chemical Corp.
    Inventors: Raj B. Durairaj, Alex Peterson, Jr.
  • Patent number: 5939508
    Abstract: A copolymer is formed from reacting, within a melt, a phthalonitrile resin with an epoxy resin having at least three epoxy groups. In an alternative embodiment, a copolymer is formed by reacting a phthalonitrile resin with an epoxy resin, at least one of the epoxy and phthalonitrile resins having a perfluorinated carbon. The copolymers of the present invention have exceptional thermal stability and a low affinity for water.
    Type: Grant
    Filed: March 31, 1997
    Date of Patent: August 17, 1999
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Teddy M. Keller
  • Patent number: 5936056
    Abstract: Methods for preparing low free resorcinol resins are disclosed. These methods generally comprise reacting a resin with an aromatic olefinic compound; suitable resins include one or more resins selected from the group consisting of a dihydric phenol, a polyhydric phenol, a dihydric phenolic novolak resin and a polyhydric phenolic novolak resin; the addition product of at least one of these resins and at least one compound selected from the group consisting of a monooxirane compound and a polyoxirane compound; and a phenol or alkyl or aralkyl substituted mono- or dihydric phenol modified form of these resins. The resins produced by this method are also disclosed, as are rubber compositions utilizing the resin produced by this method.
    Type: Grant
    Filed: March 7, 1997
    Date of Patent: August 10, 1999
    Assignee: Indspec Chemical Corporation
    Inventors: Raj B. Durairaj, Alex Peterson, Jr.
  • Patent number: 5900468
    Abstract: The epoxy resin composition which comprises both components (A) an epoxy compound having at least two epoxy groups in a molecule and (B) a polyphenol compound containing a trisphenol compound represented by general formula (I) described below ##STR1## in which R.sub.1 is a methyl group, n is an integer of 0 to 2, and Ar is a group selected from ##STR2## in which R.sub.2 and R.sub.3 are each individually selected from an alkyl group having a carbon number of 1 to 6, an alkoxy group having a carbon number of 1 to 6, or a halogen atom, and m and p are an integer of 0 to 2.
    Type: Grant
    Filed: February 27, 1998
    Date of Patent: May 4, 1999
    Assignee: Shell Oil Company
    Inventors: Mareki Miura, Yoshinobu Ohnuma
  • Patent number: 5847027
    Abstract: Hardeners for elastic epoxy resin systems, obtained by reaction of(A) reaction products of epoxide compounds (A1) with sterically hindered amines (A3), and/or(B) cyclic carbonates prepared from the compounds (A) and carbon dioxide, and/or(C) cyclic carbonates prepared from reaction products(C1) of epoxide compounds (C11) with polyoxyalkyleneamines (C13) and carbon dioxide, and, if desired(D) additional epoxide compounds or unreacted residues of the initial epoxides for the preparation of (A), (B) and (C), with(E) polyamines having at least two secondary amino groups, and(F) if desired, further reactants, each of the epoxide compounds (A1) and (C11) containing at least two epoxide groups, and it being possible for monoepoxides to be admixed in each case, if desired.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: December 8, 1998
    Assignee: Vianova Resins GmbH
    Inventors: Manfred Marten, Claus Godau, Uwe Neumann
  • Patent number: 5814373
    Abstract: Hydroxy-functional polyethers having a "cardo" diphenylene group in their backbones are prepared by contacting at least one dinucleophilic monomer with at least one diglycidyl ether of a cardo bisphenol, such as bis(hydroxyphenyl)fluorene, phenolphthalein, or phenolphthalimidine or a substituted cardo bisphenol, such as a substituted bis(hydroxyphenyl)fluorene, a substituted phenolphthalein or a substituted phenolphthalimidine, under conditions sufficient to cause the nucleophilic moieties of the dinucleophilic monomer to react with epoxy moieties to form a polymer backbone containing pendant hydroxy moieties and ether, imino, amino, sulfonamido or ester linkages. These polyethers possess a combination of high barrier to oxygen transmission (i.e., oxygen transmission rate less than 10.0 cm.sup.3 -mil/100 in.sup.2 -atm-day to oxygen) and high heat resistance (i.e., Tg above 120.degree. C.).
    Type: Grant
    Filed: October 1, 1993
    Date of Patent: September 29, 1998
    Assignee: Dow Chemical Company
    Inventors: Jerry E. White, H. Craig Silvis, Stephen E. Bales, Michael N. Mang, Muthiah N. Inbasekaran
  • Patent number: 5776374
    Abstract: The present invention relates to crosslinkable thermoplastic compositions comprising a plurality of crosslinkable moieties, capable of undergoing addition polymerization, incorporated by functionalization of the precursor poly(hydroxy ethers). The poly(hydroxy ethers) comprise recurring moieties derived from aromatic dihydroxy compounds. The crosslinkable polymeric compositions are crosslinked to obtain crosslinked thermoset polymeric compositions of the invention. The polymeric compositions of the inventions can be suitably used either as an active guiding layer, and/or as a NLO active upper and lower cladding layers in an electro-optic device. The polymeric compositions can also be used as non-NLO polymers for the upper and lower cladding layers, prior to orientation by the application of an electric field.
    Type: Grant
    Filed: November 7, 1995
    Date of Patent: July 7, 1998
    Assignee: The Dow Chemical Company
    Inventors: Mark D. Newsham, Michael N. Mang, Robert J. Gulotty, Jr., Dennis W. Smith, Jr.
  • Patent number: 5736620
    Abstract: Epoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.
    Type: Grant
    Filed: May 25, 1995
    Date of Patent: April 7, 1998
    Assignee: The Dow Chemical Company
    Inventors: Jimmy D. Earls, Robert E. Hefner, Jr., Paul M. Puckett
  • Patent number: 5644003
    Abstract: An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp (d) being contained in an amount of 0.5 to 10% by weight based on the total weight of the component (a), the component (b) and the component (d), and the inorganic filler (e) being contained in an amount of 75 to 94% by weight based on the total weight of the component (a), the component (b), the component (c) and the component (e), and a semiconductor device sealed with the above epoxy resin composition. The cured product of the epoxy resin composition is good in balance of hot impact strength and hot flexural strength and hence, the semiconductor device sealed with the epoxy resin composition is excellent in soldering resistance.
    Type: Grant
    Filed: July 18, 1995
    Date of Patent: July 1, 1997
    Assignee: Sumitomo Chemical Company, Ltd.
    Inventors: Noriyuki Arai, Yutaka Shiomi, Hiroshi Nakamura, Noriaki Saito
  • Patent number: 5641852
    Abstract: Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: June 24, 1997
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroyuki Tsuji, Shoji Hara, Hirosaku Nagano
  • Patent number: 5606006
    Abstract: Cure of a novel trisepoxy resin-based composition provides a thermoset having high Tg, low dielectric constant, low water absorption and good flexural strength.
    Type: Grant
    Filed: April 8, 1996
    Date of Patent: February 25, 1997
    Assignee: Shell Oil Company
    Inventor: Pen-Chung Wang
  • Patent number: 5591811
    Abstract: 1-Imidazolylmethyl-2-naphthols are effective catalysts and accelerators for curing epoxy resins, said naphthol compounds providing epoxy resin systems with prolonged room-temperature stability and fast curing at temperatures of 110.degree.-150.degree. C.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: January 7, 1997
    Assignee: Ciba-Geigy Corporation
    Inventor: Yefim Blyakhman
  • Patent number: 5563224
    Abstract: Novel aminoplast anchored UV stabilizers are provided. Compared to unanchored stabilizers, the anchored stabilizers disclosed herein have increased compatibility with coating resins and have reduced volatility due to higher molecular weights resulting from anchoring. A process for preparing the anchored stabilizers by the reaction of unanchored stabilizers with alkoxymethylated aminoplasts in a sulfuric acid medium is also provided. The unanchored stabilizers include 2-(2-hydroxyaryl)benzotriazoles, 2-hydroxybenzophenones, 2-(2-hydroxyaryl)-4,6-diaryl-1,3,5-triazines, salicylic acid derivatives, 2-hydroxyoxanilides, and blocked derivatives thereof as well as mixtures of two or more stabilizers. The aminoplasts include alkoxymethylated derivatives of glycolurils, melamines, and benzoguanamines.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: October 8, 1996
    Assignee: Cytec Technology Corp.
    Inventors: Jeno G. Szita, Paul S. Waterman
  • Patent number: 5510431
    Abstract: Curable compositions containing (A) one or more epoxy resins, one (B) or more curing agents and (C) one or more cure controlling catalysts wherein at least one of components (A) or (B) or both components (A) and (B) contain a mesogenic moiety are prepared. These curable compositions permit processing at higher temperatures and improved properties. They are useful in the preparation of coatings, castings, electrical or laminates or composites and the like.
    Type: Grant
    Filed: June 1, 1995
    Date of Patent: April 23, 1996
    Assignee: The Dow Chemical Company
    Inventors: Jimmy D. Earls, Robert E. Hefner, Jr., James L. Bertram, Louis L. Walker