Abstract: Novel aminoplast anchored UV stabilizers are provided. Compared to unanchored stabilizers, the anchored stabilizers disclosed herein have increased compatibility with coating resins and have reduced volatility due to higher molecular weights resulting from anchoring. A process for preparing the anchored stabilizers by the reaction of unanchored stabilizers with alkoxymethylated aminoplasts in a sulfuric acid medium is also provided. The unanchored stabilizers include 2-(2-hydroxyaryl)benzotriazoles, 2-hydroxybenzophenones, 2-(2-hydroxyaryl)-4,6-diaryl-1,3,5-triazines, salicylic acid derivatives, 2-hydroxyoxanilides, and blocked derivatives thereof as well as mixtures of two or more stabilizers. The aminoplasts include alkoxymethylated derivatives of glycolurils, melamines, and benzoguanamines.

Abstract: Curable compositions containing (A) one or more epoxy resins, one (B) or more curing agents and (C) one or more cure controlling catalysts wherein at least one of components (A) or (B) or both components (A) and (B) contain a mesogenic moiety are prepared. These curable compositions permit processing at higher temperatures and improved properties. They are useful in the preparation of coatings, castings, electrical or laminates or composites and the like.

Abstract: A polyester polymer comprising repeating units (I), or repeating units (I) and (II), and having a reduced viscosity (.eta..sub.sp /c) of 0.2 to 10.0 dl/g, measured at 20.degree. C. as a 0.5 g/dl solution dissolved in methylene chloride is prepared by allowing a dihydric phenol (III), or dihydric phenols (III) and (IV), to react with a carbonate precursor or a dibasic acid. An electrophotographic photoreceptor which comprises an electroconductive substrate and a photosensitive layer disposed on the electroconductive substrate and containing the polyester polymer as a charge transporting material or a binder resin. ##STR1## wherein, W is --O-- or single bond, X is a divalent group which is derived from a dihydric phenol containing a hydrazine structure, each of R.sup.25 and R.sup.26 is a halogen atom, an alkyl group, a cycloalkyl group or an aryl group, each of m and n is an integer of 0 to 4, Y is single bond, --O--, --S--, --SO--, --SO.sub.2 --, --CR.sup.27 R.sup.28 --, a 1,1-cycloalkylene group or an .alpha.

Abstract: An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

Abstract: This invention relates to improved one part polyepoxide resins which are tough and have enhanced flexible and elastic properties. The polyepoxide resins comprise a polyepoxide resin based on a polyglycidyl ether of a phenol, an oxazolidone toughener and a latent amine curative. The improvement in the polyepoxide resin formulation comprises incorporating an oxazolidone toughener represented by the formula: ##STR1## wherein R is the residue of an aliphatic glycol or aliphatic ether glycol having from 2 to 20 carbon atoms.

Abstract: The present invention provides novel substituted biphenyl pyrazines or pyrazine derivatives ("BPD") which are functional and have useful application as a monomer for a variety of high performance polymers such as polyester, polyarylate, polycarbonate, polyetherketones, epoxides, polyimides, polyamides, and polyamides-imides; and as pigments for coating compositions such as paints. These BPD have the general formula: ##STR1## wherein R.sub.1 -R.sub.8 and n are defined herein.

Abstract: An epoxy resin composition having high epoxy curing property and sufficient storage stability, and an epoxy curing agent therefor. The curing agent or the cure accelerating agent obtained by treating the surfaces of (1) an epoxy adduct obtained by adding a nitrogen-containing heterocyclic compound, an aliphatic amine or an aromatic amine to an epoxy compound having one, two or more epoxy groups in one molecule, with (2) a boric acid compound or (3) a boric acid compound and a phenolic compound, exhibits high curing property and storage stability, and can be favorably used as a curing agent for the epoxy resin composition. The epoxy resin composition prepared by mixing the epoxy resin with (1) and (2) or (1) and (3), exhibits excellent curing property and storage stability.

Abstract: Mesogen containing biaxially oriented films are prepared from curable mixtures containing an epoxy resin and a curing agent therefor. Certain of the mesogen containing biaxially oriented films possess unique properties, such as a metallic like, highly reflective appearance. These films are useful in adhesives, coatings, laminates or composites and the like.

Abstract: Laminates containing one or more plies of substrate material impregnated with a composition containing (A) one or more epoxy resins, (B) one or more curing agent and (C) about 0.00005 to about 0.1 mole per epoxide equivalent of cure controlling catalyst, wherein at least one of components (A) or (B) contain at least one mesogenic moiety, which, optionally, has been subjected to either (a) the application of an electric field, (b) the application of a magnetic field, (c) drawing or shear forces, or (d) any combination thereof, are prepared.

Abstract: The present invention discloses oriented optical epoxy compositions comprising a reaction product of arylhydrazones with a monomer copolymerizable therewith and to oriented crosslinked polymeric composition comprising the reaction product of an epoxy arylhydrazone or the epoxy composition of the invention with a curing agent. The present invention also discloses processes for making the said compositions.

Abstract: A curable resin comprising a mixture of (a) a component consisting of at least one thermically curable compound containing at least one 1-oxa-3-aza tetraline group, and (b) a component consisting of at least one curable brominated epoxy resin.

Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

Abstract: The present invention relates to a modified epoxy resin, a method for the preparation thereof and an epoxy resin composition using the modified epoxy resin. In particular, it relates to a modified epoxy resin of the general formula (I) which is prepared by incorporating a monomaleimide having a carboxy group useful as a heat resistance-improving agent of a resin composition containing an epoxy resin and maleimides into an epoxy resin, and an epoxy resin composition for sealing a semiconductor element having the improved heat resistance and moldability by the modified epoxy resin. ##STR1## wherein, R represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms (C.sub.1 to C.sub.10), andn is 0 to 100, and m is 1 to 100.

Abstract: A diamino-alpha-alkylstilbene useful as an epoxy resin curing agent is represented by the following Formula I: ##STR1## wherein R is independently hydrogen, a C.sub.1 -C.sub.10 hydrocarbyl(oxy) group or a halogen, nitro, nitrile, phenyl or --CO--R.sup.1 group wherein R.sup.1 is independently hydrogen or a C.sub.1 -C.sub.3 hydrocarbyl group; each R.sup.4 is independently hydrogen or a C.sub.1 -C.sub.10 hydrocarbyl group; and Y is a ##STR2## group wherein n=0 or 1.

Abstract: Adducts containing terminating nitro (nitroso) groups and one or more mesogenic moieties are prepared by reacting (A) at least one compound containing an average of more than one vicinal epoxide group per molecule with (B) at least one compound containing one or more nitro (nitroso) groups and an average of one reactive hydrogen atom per molecule; with the proviso that at least one member of components (A) and (B) contains a mesogenic moiety. Reduction of these adducts provides amines which are useful as curing agents for epoxy resins.

Abstract: Anhydride compounds which contain at least one rodlike mesogenic moiety and at least two anhydride groups per molecule, wherein each of said aromatic anhydride groups is linked to the mesogen via an ester linkage are prepared. These anhydride compounds are useful in curing epoxy resins to provide the cured products with one or more improved properties.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: Epoxy resins containing more than one vicinal epoxide group per molecule and at least one thiadiazole, oxadiazole or both thiadiazole and oxadiazole moiety per molecule are disclosed, as well as curable and cured compositions thereof. Certain of these epoxy resins possess enantiotropic liquid crystallinity. These enantiotropic epoxy resins are useful in preparing copolymers with high glass transition temperatures and liquid crystalline morphology, which can result in enhanced unidirectional mechanical properties. These epoxy resins are useful in coating, casting, encapsulation, electronic or structural laminate or composite, filament winding or molding applications.

Abstract: A structural adhesive composition containing an epoxy compound, an amine hardener and a hydroxy-substituted aromatic compound having a pKa ranging from about 5 to 9.7 and a boiling point greater than about 210.degree. C. The utilization of a hydroxy-substituted aromatic compound having a pKa and a boiling point within the stated ranges provides for an adhesive composition which develops significant green strength, undergoes minimal sinkage during the bonding and curing process, and is capable of withstanding high temperature conditions.

Abstract: A waterborne structural adhesive bonding primer composition (a) that can be effectively applied to an adherend for structural adhesive applications, (b) that emits a VOC content of less than about 250 grams per liter, (c) is thermally stable, and (d) may be employed with 350.degree. F. (176.7.degree. C.) cure epoxy resin systems, which contains the combination of (i) a dialkanol amine adduct of an oxazolidinone modified polyglycidyl ether of a tris(hydroxyphenyl)alkane dissolved in a water vehicle, and (ii) a rigid ring substituted polyethylenically unsaturated carboxylate, carboxamide or carboximide intimately dispersed in the water vehicle and the dialkanol amine adduct of an oxazolidinone modified polyglycidyl ether of a tris(hydroxyphenyl)alkane. Formulations are described that contain chromate-free corrosion inhibitors.

Abstract: Thermoplastic resins are prepared by reacting polyglycidyl esters containing one or more mesogenic moieties with compounds having an average of more than one active hydrogen atom per molecule. These resins exhibit ordering of the molecular chains in the melt phase and are susceptible to orientation during processing which can result in enhanced unidirectional mechanical properties. These resins are useful in coatings, laminates, castings and the like.

Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

Abstract: Improvement in adhesion of cyanate resin adhesives by the addition of an epoxy resin. Polyether polyols may optionally be added to toughen the composition.

Abstract: Adducts containing terminating nitro (nitroso) groups and one or more mesogenic moieties are prepared by reacting (A) at least one compound containing an average of more than one vicinal epoxide group per molecule with (B) at least one compound containing one or more nitro (nitroso) groups and an average of one reactive hydrogen atom per molecule; with the proviso that at least one member of components (A) and (B) contains a mesogenic moiety. Reduction of these adducts provides amines which are useful as curing agents for epoxy resins. Curable compositions comprising an epoxy resin and the adducts can be oriented before, during or prior to curing.

Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

Abstract: A composition comprising a 1,2-dialkylidenecyclobutane such as 1,2-dimethylenecyclobutane, a polyimide such as a bismaleimide, an epoxy resin and a curing agent for the epoxy resin can be thermally cured to a tough polymer blend having a high glass transition temperature.

Abstract: A thermosetting resinous composition contains (a) a polyfunctional oxazolidinone compound and (b) a polyamine which react with one another a polyurea polymer upon heating without emitting any emanating by-product. A novel class of polyfunctional oxazolidinone compounds and an improved method for producing the same are also disclosed.

Abstract: Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unique heat stability and special utility as insulation for electric conductors to be used in the 200.degree.-250.degree. C. temperature range.

Abstract: Adducts containing terminating nitro (nitroso) groups and one or more mesogenic moieties are prepared by reacting (A) at least one compound containing an average of more than one vicinal epoxide group per molecule with (B) at least one compound containing one or more nitro (nitroso) groups and an average of one reactive hydrogen atom per molecule; with the proviso that at least one member of components (A) and (B) contains a mesogenic moiety. Reduction of these adducts provides amines which are useful as curing agents for epoxy resins.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: Epoxy resins containing more than one vicinal epoxide group per molecule and at least one thiadiazole, oxadiazole or both thiadiazole and oxadiazole moiety per molecule are disclosed, as well as curable and cured compositions thereof. Certain of these epoxy resins possess enantiotropic liquid crystallinity. These enantiotropic epoxy resins are useful in preparing copolymers with high glass transition temperatures and liquid crystalline morphology, which can result in enhanced unidirectional mechanical properties. These epoxy resins are useful in coating, casting, encapsulation, electronic or structural laminate or composite, filament winding or molding applications.

Abstract: The present invention relates to nonlinear optical materials comprising aminoaryl hydrazones and to nonlinear optical polymeric compositions containing recurring covalently bonded moieties derived from the aminoaryl hydrazones of the invention. The polymeric compositions of the present invention have high glass transition temperatures and exhibit stable nonlinear optical activity at high temperatures over a period of time.

Abstract: Novel cyclic imino ether compositions containing one or more mesogenic moieties, when polymerized, result in products having improved properties.

Abstract: An epoxy resin composition comprising:(A) as a resin chief material a bisphenol A type epoxy resin having the following formula (1), ##STR1## wherein n is 0 to 10, R.sup.1 and R.sup.2 each represents a glycidyl group, and A.sup.1 to A.sup.8 each represents a hydrogen atom or a bromine atom;(B) as an epoxy resin curing agent,(b1) a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), or(b2) a novolac resin of a bisphenol A or a brominated product thereof that is obtained by linking two or more molecules of a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), through a methylene group(s) at any of A.sup.1 to A.sup.

Abstract: Oxazolidone ring-containing epoxy resins (a) produced by the reaction between a diglycidyl ether or ester and an organic diisocyanate are reacted with (b) a first active hydrogen compound such as mono- or diols, mono- or dicarboxylic acids in less than a stoichiometric amount in terms of the active hydrogen atom relative to the epoxy group, and then with (c) a second active hydrogen compound such as amines or sulfide-acid mixtures or polycarboxylic acids in a stoichiometric amount relative to the remaining epoxy group. The resulting hydrophilic modified resin has an oxazolidone ring-containing backbone terminated with an ionizable group. A water-borne paints are formulated from the hydrophilic modified resin by dispersing in an aqueous medium containing a crosslinker and a neutralizing agent.

Abstract: Adducts containing mesogenic or rodlike moieties are prepared by reacting (1) at least one compound containing an average of more than one vicinal epoxide group per molecule with (2) at least one compound containing an average of more than one reactive hydrogen atom per molecule; with the proviso that at least one member of components (1) and (2) contains a mesogenic or rodlike moiety. These compounds are useful as curing agents for epoxy resins.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with curing agents which will normally cure epoxy resins. These curable compositions can be oriented by the application of an electric field, magnetic field drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical or mechanical properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: An epoxy resin hardener includes a synthetic resin obtained by the addition reaction of (A) an aromatic hydrocarbon containing a phenolic hydroxyl group with (B) a compound having at least two ethylenically unsaturated double bonds, the synthetic resin having a structure in which the ethylenically unsaturated double bonds in compound (B) have been opened, with a hydrogen atom that was directly bonded to one of the carbon atoms constituting the aromatic ring(s) in hydrocarbon (A) being addition-bonded to the .alpha.-position carbon atom in one of the opened double bonds in compound (B) and the .beta.-position carbon atom in the opened double bond in compound (B) being addition-bonded to that carbon atom in the aromatic ring(s) in hydrocarbon (A) from which the hydrogen atom addition-bonded to the .alpha.-position carbon atom in the opened double bond in compound (B) has been eliminated. An epoxy resin composition containing an epoxy resin and the hardener is also disclosed.

Abstract: Advanced epoxy resins containing mesogenic moieties are prepared from epoxy resins which contain such moieties.

Abstract: Advanced epoxy resin compositions are prepared by reacting epoxy resins with active hydrogen-containing compounds which contain mesogenic moieties. Curable compositions containing these advanced epoxy resin compositions are useful in adhesives, coatings, laminates castings and the like.

Abstract: An epoxy resin composition useful as a molded article is curable with a combination of curing agents including diamino-alpha-alkylstilbenes and other curing agents wherein the epoxy resin and/or the other curing agents can contain rodlike mesogenic moieties.

Abstract: An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, inorganic fillers, plasticizers and imide-epoxy resins having the formula (I) is disclosed. Use of the imide-epoxy resin in an amount of 0.1 to 20.0% by weight improves the heat and moisture resistant properties of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 denote independently H or (CH.sub.2)nCH.sub.3 radical,n denotes 0 or an integer of 1 above.

Abstract: Curable compositions are disclosed which contain (I) an advanced resin composition prepared by reacting epoxy resins with active hydrogen-containing compounds which contain mesogenic moieties and (II) a suitable curing agent.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with curing agents which will normally cure epoxy resins. These curable compositions can be oriented by the application of an electric field, magnetic field drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical or mechanical properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: Phenoxy resins are disclosed which are prepared from polyglycidyl amines containing one or more mesogenic moieties. The phenoxy resins are useful in the preparation of coatings.

Abstract: An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, plasticizer and a high performance epoxy resin selected from a group consisting of epoxy resins represented by the formulas (I-a), (I-b) and (I-c) is disclosed.Use of the high performance epoxy resin in an amount of from 0.1 to 20.0% by weight improves the heat and moisture resistance of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 represent independently H or (CH.sub.2) nCH.sub.3 radical, andn represents 0 or an integer of 1 above.

Abstract: Hydroxy-functionalized polyethers having imide groups in their backbones are prepared by contacting an imide-containing bisphenol with the diglycidyl ether of the same or another bisphenol under conditions sufficient to cause the nucleophilic phenolic hydroxyl moieties to react with epoxy groups. These poly(hydroxy ether imides) possess a combination of high barrier to oxygen transmission (i.e., oxygen transmission rates of less than 10.0 cm.sup.3 -mil/100 in.sup.2 -atm-day) and high heat resistance (i.e., T.sub.g above 120.degree. C.). These polymers are suitable for use in the manufacture of packaging materials with high barrier to oxygen.

Abstract: Novel mesogens, epoxy resins and the synthesis thereof as well as coating binders for coating compositions based upon the mesogens and epoxy resins are described.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: The invention provides epoxy resins having the following structure: ##STR1## The cross-linked epoxy resins have non-linear optical properties. The group "Z" constitutes a nonlinear optical chromophone having stilbene, azo, azomethine or propargyl moieties as linking units.