Abstract: In certain embodiments, a thermoelectric heat pump includes a heat transfer region having an array of thermoelectric modules, a waste channel in substantial thermal communication with a high temperature portion of the heat transfer region, and a main channel in substantial thermal communication with a low temperature portion of the heat transfer region. An enclosure wall provides a barrier between fluid in the waste channel and fluid in the main channel throughout the interior of the thermoelectric heat pump. In some embodiments, the waste fluid channel and the main fluid channel are positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the enclosure wall are substantially decreased or minimized at corresponding positions along the channels.

Abstract: The present disclosure provides a method and a thermoelectric cooling apparatus for cooling a fluid. The thermoelectric cooling apparatus comprises one or more of thermoelectric devices, a hot sink, a cold sink, and a heat rejection apparatus which comprises condenser fins and a fan to attain a high figure of merit. The heat from the fluid is transferred to the hot sink and/or one or more heat pipes by the one or more thermoelectric devices. The heat from the one or more heat pipes is dissipated to the ambient through condenser fins and the fan.

Abstract: The various embodiments of the present system disclose a system for an optimal cooling by a thermoelectric cooling module and an electric fan thereof. The system comprises a thermoelectric cooling module, an electric fan and a housing. The thermoelectric cooling module comprises a plurality of thermoelectric sub-modules, a hot side management module, a cold side management module and an integrated control module. The present invention provides an optimal cooling on the basis of an external weather condition. The present invention further provides an optimal cooling by implementing an efficient fluid circulation mechanism. The present invention also provides a dynamic management over the working of various modules of the said system.

Abstract: A vehicle noise-proof cover is provided which includes a thermoelectric element and which is capable of efficiently generating electric power. The vehicle noise-proof cover is placed so as to cover a driving force generating device of a vehicle. The vehicle noise-proof cover includes: a cover body having a noise absorption layer made of a foamed resin; a heat supply member having a heat collection portion that is placed on a back surface side of the cover body and directly or indirectly contacts the driving force generating device, a heat supply portion that is placed on a front surface side of the cover body, and a heat transfer portion that is connected to the heat collection portion and the heat supply portion and transfers heat from the heat collection portion to the heat supply portion.

Abstract: A hand power tool, in particular an angle grinder, includes a drive unit, an electronic unit, and a cooling device configured, at least partially, to cool the drive unit and/or the electronic unit. The cooling device includes at least one cooling unit configured, at least partially, for localized cooling.

Abstract: Vehicle air comfort systems and methods. The systems and methods may comprise: (1) a plurality of flow tunnels for passage of a heat-transfer fluid; (2) a thermoelectric cooler in thermal communication with the flow tunnels for thermally conditioning the heat-transfer fluid in the flow tunnels; (3) an air inlet for receiving unconditioned air; (4) a thermal exchange assembly for facilitating thermal exchange between the thermally conditioned heat-transfer fluid and the unconditioned air to result in conditioning of the air; and (5) an air outlet for outputting the conditioned air into the vehicle.

Abstract: A thermoelectrically cooled system and method is disclosed, which includes a thermoelectrically cooled sleeve, which is configured to hold one or more cylindrical cans of a retail product. The thermoelectrically cooled sleeve includes an outer cylindrical body, an inner cylindrical body, a thermoelectric element located between the outer cylindrical body and the inner cylindrical body, and at least one pair of electrical leads attachable to the thermoelectrically cooled sleeve, and upon application of a source of electrical power to the pair of electrical leads heat moves through the thermoelectric element from the inner cylindrical body to the outer cylindrical body of the thermoelectrically cooled sleeve.

Abstract: A system that cools an electric component by a cooling medium cooled by a heat exchanger, the system includes a pipe through which a cooling medium to cool the electronic component flows; a metal member configured to be coupled with an outer surface of the pipe; a Peltier device configured to cool the metal member to a temperature lower than a temperature of the outer surface of the pipe; a detector that detects dew condensation of outer air occurring on the metal member; and a processor that lowers the temperature of the cooling medium, and stops lowering a temperature of cooling medium when the occurrence of dew condensation of outer air on the metal member is detected.

Abstract: A heat exchanger includes a first plate and a second plate connected to the first plate to define a duct between the first plate and the second plate. At least one elastic cooling fin is disposed inside the duct between the first plate and the second plate. The at least one elastic fin exerts a load on the first plate.

Abstract: Tray having a container receiving space and a stepped outer sidewall including a lower step and an upper step, a cooling unit providing cooled air to the space and having a housing with a stepped base that includes a lower step and an upper step, the cooling unit venting exhaust from an end distal to the base, a plurality of containers each having a perimeter flange and, when the container is inserted into the space, portions of the flange are seated on the respective lower steps of the tray and the stepped base of the housing, and a cover configured to sealingly contact the upper steps when the cover is in a closed position, the cover shielding the containers from the exhaust, and being movably attached to the housing and movable along the housing in a range that includes the closed position at which the cover contacts the upper steps.

Abstract: A thermoelectric wine pouch cooler/dispenser apparatus powered by household current has a thermally insulated cabinet that sits on a countertop or other flat surface and has a thermoelectric cooling system. The cabinet has at least one thermally insulated compartment that receives a removable bag support housing containing a collapsible flexible wine-filled bag from a “bag-in-box” wine container and its dispensing valve. The bag support housing includes a spring biased plate to facilitate emptying of the contents of the bag. The temperature of each compartment is individually controlled by a digital temperature controller and a thermoelectric cooling assembly which includes a fan and a cold plate engaged on a thermally conductive heat transfer block at the top of each compartment which engages the bag support housing.

Abstract: The present invention provides an air conditioned headgear and clothing. The headgear includes a thermoelectric cooling module and a control chip. The control chip includes a power supply circuit to supply driving current to the thermoelectric cooling module. The inner temperature of the headgear, the temperature of a heat sink, and the environmental temperature are sensed. A microcontroller of the control chip controls the power supply circuit to provide the driving current to the thermoelectric cooling module via processing the inner temperature of the headgear, a preset temperature, the temperature of the heat sink, and the environmental temperature using the PID control. In the present invention, the temperature is controlled using the PID control, thus wide fluctuations of the temperature is avoided, energy can be used effectively, and thermal cycle can be avoided.

Abstract: A method of controlling temperature in a semiconductor device that includes a stacked device configuration is disclosed. The method includes providing a Peltier element having a metal-based heat sink formed above a first substrate of the stacked device configuration and a metal-based heat source formed above a second substrate of the stacked device configuration, and establishing a current flow through the Peltier element when the semiconductor device is in a specified operating phase.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.

Abstract: A microchannel cooling device includes a heat sink having a liquid refrigerant flow channel having a microscopic cross section and connected to a heat source thermally, and a thermoelectric element provided on the heat sink and extending parallel to a direction of extension of the liquid refrigerant flow channel.

Abstract: According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.

Abstract: A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.

Abstract: A cooling system for rotating machines, such as electric motors, is provided. A heat exchanger housing is coupled with the housing of an electric motor. At least one Peltier effect device is coupled to an outer wall of the heat exchanger housing. At least one outflow air passage and at least one return air passage are defined within the heat exchanger housing to extend between the motor housing and the outer wall of the heat exchanger housing. The at least one outflow air passage transports heated air to the outer wall to facilitate heat transfer from the air to the outer wall. The at least one Peltier effect device facilitates heat transfer from the outer wall.

Abstract: Methods and systems for pumping compressible fluids in high pressure applications such as high-pressure liquid chromatography (HPLC) or supercritical fluid chromatography (SFC) applications are disclosed. An improved cooling device for a pump head for use in a supercritical fluid chromatography (SFC) system is described. A system for chilling a pumping system, includes a Peltier cooling element in thermal contact with a pump head, wherein the cooling element chills the pump head and a mobile phase fluid flowstream prior to the mobile phase fluid entering the pump; a fluid-cooled heat exchanger, attached to the Peltier cooling element, which removes heat from the cooling element using a circulating fluid; and a second heat exchanger which cools the circulating fluid.

Abstract: In a dehumidification/humidification device, a blower and an adsorbent module are contained in a casing. In other embodiment, the blower, the adsorbent module, and a flow passage-changing device are contained in the casing. The adsorbent module includes an adsorbing element formed by carrying an adsorbent on a permeable element and a heater directly disposed on the adsorbing element. The state of the electrification of the heater is changed and an air-blowing direction or a flow passage is changed, whereby a dehumidified air is discharged from a first suction/discharge port (or discharge port), and a humidified air is discharged from a second suction/discharge port (or discharge port).

Abstract: A thermoelectric element includes at least one thermopair and a pn-junction. The thermopair has a first material with a positive Seebeck coefficient and a second material with a negative Seebeck coefficient. The first material is selectively contacted by way of a conductor with the p-side of the pn-junction, and the second material is selectively contacted by way of a conductor with the n-side of the pn-junction.

Abstract: A hybrid thermoelectric-ejector active cooling system having an increased Coefficient of Performance (COP) when compared to typical thermoelectric cooling modules. A thermoelectric cooling module is integrated with an ejector cooling device so that heat from the thermoelectric cooling module is rejected to a high temperature evaporator of the ejector cooling device. This provides for a total COP greater than the sum of the COPs of the thermoelectric cooling module and ejector cooling device individually. For example, given 1 unit input power into the thermoelectric cooling module, the heat received by the cold side of the thermoelectric cooling module would be COPTEC×1; and the energy rejected by the hot side of the thermoelectric cooling module and to drive the ejector cooling device would be COPTEC+1. Thus, the cooling received by the low temperature evaporator of the ejector cooling device is COPEJ×(COPTEC+1); and therefore total COPTE-Ej-AC is COPEj+COPTEC+COPEj×COPTEC.

Abstract: A heat exchanger having a thermoelectric element. A heat-generating pack defines therein a circulation space, and has a passage in an upper portion of one end and a passage in the lower portion of the opposite end. A heat-absorbing pack defines therein a circulation space, and has a passage in the lower portion of one end and a passage in the upper portion of the opposite end. The heat-generating pack and the heat-absorbing pack are stacked on each other. The thermoelectric element is disposed between the heat-generating pack and the heat-absorbing pack, and has a heat-generating surface adjoining the heat-generating pack and a heat-absorbing surface adjoining the heat-absorbing pack.

Abstract: The battery thermal management device includes a thermally conductive structure and a thermoelectric module. The thermally conductive structure is coupleable to a battery and operable to provide a thermal path between the battery and the thermoelectric module. The thermoelectric module is operable to transfer heat between itself and the thermally conductive structure thereby maintaining temperature of the battery within a desired range. Such a device can allow battery temperature management in an industrial deployment without requiring use of a battery enclosure and active cooling mechanisms.

Abstract: A thermoelectric arrangement for use in a cooling system (4, 6) of a motor vehicle has a thermocouple (8) with a first, heat-outputting thermal element (10), a second, heat-absorbing thermal element (12) and a conductor element (14) through which current flows. At least two cooling circuits (16, 18, 20) are provided. The first thermal element (10) is arranged in at least one cooling circuit (16, 18, 20), and the second thermal element (12) is arranged in at least one heating circuit (48). The first thermal element (10) is arranged in a first connecting line (22) that is connected fluidically to the respective cooling circuits (16, 18, 20) via valve arrangements (24, 26; 28, 30; 32, 34) on the input and output sides of the first thermal element (10). A cooling system having such a thermoelectric arrangement also is described.

Abstract: A device for supporting a person may include a thermoelectric generator configured to receive heat provided from the person. The device may further include a first heat conductor overlapping the first thermoelectric generator and configured to conduct the heat to the thermoelectric generator. The device may further include a second heat conductor overlapping the first heat conductor and configured to conduct the heat to the first heat conductor. The first heat conductor may be disposed between the first thermoelectric generator and the second heat conductor. The second heat conductor may be softer than the first heat conductor. The device may further include a heat sink thermally connected to the first thermoelectric generator.

Abstract: A portable, solar assisted, temperature controlled container comprises: a body with a cavity; a lid sealable thereon; a detachable solar panel producing electric power; a thermoelectric cooling unit; an interior heat sink secured in the cavity proximate to an interior side of the thermoelectric cooling unit with an interior fan to direct cavity air thereon; an exterior heat sink secured proximate to an exterior-facing side of the thermoelectric cooling unit with an exterior fan to direct exterior air thereon. The thermoelectric cooling unit transports heat to maintain a thermostat-controlled temperature in the cavity. The interior and exterior fans and the interior and exterior heat sinks increase efficiency of the heat transport. One or more wheels rotatably attached to the body are coupled to a faraday generator to generate electrical power to replace/supplement the solar power. A rechargeable battery may also replace/supplement solar power during periods of inadequate solar power generation.

Abstract: An icemaker is mounted remotely from a freezer compartment. The icemaker includes an ice mold. A thermoelectric device is provided and includes a warm side and an opposite cold side. A flow pathway is connected in communication between the cold side of the thermoelectric device and the icemaker. In one aspect, a fan is operatively positioned to move air from the fresh food compartment across the warm side of the thermoelectric device and a pump moves fluid from the cold side of the thermoelectric device to the icemaker. Cold air, such as from a refrigerator compartment, may be used to dissipate heat from the warm side of the thermoelectric device for providing cold fluid to and for cooling the ice mold of the icemaker.

Abstract: The present invention discloses a thermal block unit for thermal treatment of samples comprising temperature regulating units, temperature sensors for measuring temperature at different locations of the thermal block unit, a converter for converting signals from the temperature sensors into digital signals and a thermal block interface for communicating with an instrument.

Abstract: A variable-thermal-resistance mounting system may include a cylinder coupled to a heat source, or heat load and a rod movably engaged to the cylinder and coupled to a remaining one of the heat source and heat load. The rod may be coupled to a heat load. The rod may be axially slidable relative to the cylinder between a collapsed position and an extended position in a manner causing a change in heat flow between the heat source and the heat load such that the warm-side temperature of the heat load is initially set at a substantially optimal value.

Abstract: A system and method is provided for controlling condensation generation in an air conditioning system for use in a bed (mattress). During active operation of the air conditioning system to generate conditioned air, the relative humidity of ambient air is measured and operation of one or more thermoelectric devices (TEDs) within the air conditioning system in response to the measured relative humidity is adjusted to control condensate buildup. In addition, during a subsequent drying operation, the relative humidity of the ambient air is measured and the drying operation is adjusted or otherwise controlled based on the measurement.

Abstract: An H-bridge control circuit comprises an input stage, comparator stage, inverter stage. The operation of the H-bridge can be controlled by a single analog input signal provided by a feedback stage. Shoot-through protection is provided for the H-bridge circuit through the inclusion of a dead gap determined by inputs to the comparator stage. The dead gap can be adjusted, allowing for adjustment of the precision operation of the load. The H-bridge can be used to drive a bi-directional load such as, for example, a Peltier conditioner.

Abstract: According to certain embodiments disclosed in the present application, a climate controlled seating assembly includes a thermal module. The thermal module comprises at least one inlet channel, at least one outlet channel and a thermoelectric device (e.g., Peltier circuit) positioned upstream of the outlet channel. In one embodiment, the seating assembly includes a sensor positioned within an interior of the thermal module and configured to detect the presence of a liquid, such as water, relative humidity, condensation or other fluids, on or near said sensor.

Abstract: The rapid thermal cycling of a material is targeted. A solid state heat exchanger with a first well and second well is coupled to a power module. A thermoelectric element is coupled to the first well, the second well, and the power module, is configured to transfer thermal energy from the first well to the second well when current from the power module flows through the thermoelectric element in a first direction, and is configured to transfer thermal energy from the second well to the first well when current from the power module flows through the thermoelectric element in a second direction. A controller may be coupled to the thermoelectric elements, and may switch the direction of current flowing through the thermoelectric element in response to a determination by sensors coupled to the wells that the amount of thermal energy in the wells falls below or exceeds a pre-determined threshold.

Abstract: A thermoelectric cooling device comprises a liquid heat exchanger, at least two air heat exchangers, and at least two thermoelectric modules. The liquid heat exchanger includes a liquid circulation path through which liquid coolant flows to exchange heat with the liquid heat exchanger. Air flows over each of the air heat exchangers to exchange heat with the respective air heat exchanger. A first thermoelectric module is thermally coupled on a first side with a first side of the liquid heat exchanger and on a second side with a first air heat exchanger to transfer heat between the air heat exchanger and the liquid heat exchanger. A second thermoelectric module is thermally coupled on a first side with a second side of the liquid heat exchanger and on a second side with the second air heat exchanger to transfer heat between the air heat exchanger and the liquid heat exchanger.

Abstract: Cooling methods are provided for immersion-cooling one or more electronic components. The cooling method includes: providing a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid; and providing a vapor-condenser, heat sink, and thermal conductive path. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the heat sink includes a first region and a second region, with the first region of the heat sink being in thermal contact with the vapor-condenser.

Abstract: An auxiliary heat exchanger may reduce a temperature of a refrigerant allowed to pass through the auxiliary heat exchanger. The operation of the auxiliary heat exchanger may be controlled. In some implementations, the auxiliary heat exchangers may include fluid retention members, thermoelectric coolers, and/or other types of heat exchangers.

Abstract: A thermoelectric conversion unit includes first and second cases including first and second recesses that define first and second flow passages and have openings, first and second substrates, a plurality of thermoelectric devices in contact with inner surfaces of the first and second substrates, a connector for joining the first and second cases, first and second fins protruding from the first and second substrates in the first and second flow passages. The first and second cases include first and second opposed portions opposed to the first and second substrates outside the first and second recess, respectively. A spacer for setting distance between the first opposed portion and the second opposed portion is provided. The spacer sets the distance between the first and second opposed portions to be longer than distance between the outer surface of the first substrate and the outer surface of the second substrate.

Abstract: There is disclosed an electronic apparatus comprising a chip within a casing. A thermoelectric cooler has thermal connections to the chip and the casing and is configured to transport heat from the chip to the casing. A temperature measuring device is provided for determining the temperature of the chip. A control system is configured to maintain the chip at a target temperature by controlling current supplied to the thermoelectric cooler in response to the measured temperature. A temperature selection system is configured to select the chip target temperature dynamically on the basis of the casing temperature.

Abstract: A heat recycling system for recycling heat from an electronic device includes a pipe with an inside tube and an outside tube coiled around the inside tube. The inside tube is connected to a first airduct to receive heated air from the electronic device. The outside tube is to receive cooling air from outside. A number of thermoelectric modules are formed in walls of the inside tube. A first end of each thermoelectric module is inserted into the outside tube, and a second end of each thermoelectric module is inserted into the inside tube. Therefore, the number of thermoelectric modules may generate current.

Abstract: In certain embodiments, a thermoelectric heat pump includes a heat transfer region having an array of thermoelectric modules, a waste channel in substantial thermal communication with a high temperature portion of the heat transfer region, and a main channel in substantial thermal communication with a low temperature portion of the heat transfer region. An enclosure wall provides a barrier between fluid in the waste channel and fluid in the main channel throughout the interior of the thermoelectric heat pump. In some embodiments, the waste fluid channel and the main fluid channel are positioned and shaped such that differences in temperature between fluids disposed near opposite sides of the enclosure wall are substantially decreased or minimized at corresponding positions along the channels.

Abstract: An apparatus for delamination drying a substrate is provided. A chamber for receiving a substrate is provided. A chuck supports and clamps the substrate within the chamber. A temperature controller controls the temperature of the substrate and is able to cool the substrate. A vacuum pump is in fluid connection with the chamber. A tilting mechanism is able to tilt the chuck at least 90 degrees.

Abstract: Techniques are generally described for devices for cooling using electrocaloric material as refrigerant and methods for cooling using electrocaloric material. An example cooling system may comprise a refrigerant unit having an electrocaloric membrane disposed between a heat sink and a cooling load. The electrocaloric membrane may alternate between thermal contact with the heat sink and cooling load. The electrocaloric membrane may also be subjected to alternating electric fields for polarizing and depolarizing the electrocaloric membrane in a manner that promotes heat transfer from the cooling load to the heat sink.

Abstract: A Peltier element cooling control circuit that accurately controls a small number of elements with a simple structure. First and second amplification circuits are connected between a current detection resistor detecting current of a Peltier element and a current control circuit performing current control on the Peltier element based on voltage proportional to the current. One of two resistors determines the amplification rate of the first amplification circuit includes a thermistor. When the ambient temperature is equal to a predetermined temperature or greater, the output voltage of the second amplification circuit is supplied to the current control circuit to control the current of the Peltier element so as to be constant. When the ambient temperature is less than the predetermined temperature, the output voltage of the first amplification circuit is supplied to the current control circuit to control the current of the Peltier element in accordance with the temperature characteristics.

Abstract: A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.

Abstract: This invention relates to providing energy efficient thermo-electric heat pump systems for iso-thermal transport and storage, of perishable goods, such as vaccines, chemicals, biologicals, and other temperature sensitive goods. Also this invention relates to providing energy efficient iso-thermal transport and storage systems, of perishable goods, which are compact, light weight. This invention further relates to providing on-board energy storage for sustaining, for multiple days, the ability of such iso-thermal transport and storage systems to maintain temperature sensitive goods at a constant-temperature.

Abstract: A thermoelectric module includes an insulating substrate, plural electrodes formed on a component side of the insulating substrate, plural pettier elements each mounted on and electrically connected to the electrodes, and a mark for image recognition formed at least one of the electrodes, the mark for image recognition having lightness and/or saturation which is different from lightness and/or saturation of the electrode on an image. An entire of the electrode is usable as an electrical conduction path.

Abstract: A cooling device for electronic components is a combination of substrate (aluminum nitride substrate—thermoelectric elements—aluminum nitride substrate) and utilizing the temperature difference generated by two top and bottom ends of the cooling device to effectively remove the heat generated by the electronic components. This cooling device not only can effectively reduce temperature of the electronic components, but also store the power generated by its thermoelectric effect.

Abstract: A water cooler kit is provided for use with an evaporative cooler of a type comprising at least one cooling pad, a water reservoir, a water inlet to supply water to the reservoir from a water supply at least one conduit for distributing water onto said at least one cooling pad, a fan for moving air through said cooling pad, and a pump for transferring water from said reservoir to said conduit. The water cooler kit comprises a cooling plate disposed in the reservoir, a heat dissipating structure disposed outside of the evaporative cooler, and a heat transferring thermal conductor between the cooling plate and the heat dissipating structure to transfer heat from the cooling plate to the heat dissipating structure so that heat is extracted from water in the reservoir and dissipated outside the evaporative cooler.

Abstract: Techniques herein describe a pumping system, adapted to reduce or eliminate fluid cavitation. Optionally, the pumping system is adapted for application to a passive fluid recovery system. In one example, the pumping system includes a pump and a thermal sub-cooling device. The thermal sub-cooling device may sub-cool fluid input to a pump and heat fluid output from the pump, particularly under start-up conditions. In a further example, a controller manages power supplied to both the pump and the thermal sub-cooling device, to transition from an ambient temperature start-up condition to an elevated temperature operating condition.