Abstract: In a method of manufacturing a through electrode-attached glass substrate, electrode through holes and at least one dummy through hole are formed in a plate-shaped glass, and electrode members are inserted into the electrode through holes but not into the at least one dummy through-hole. The plate-shaped glass and the electrode members are welded by heating the plate-shaped glass at a temperature higher than a softening point of the plate-shaped glass so that the glass is allowed to flow into the at least one dummy through hole. Opposite surfaces of the plate-shaped glass are ground together with the electrode members so as to expose the electrode members to the opposite surfaces of the plate-shaped glass and to configure the electrode members as through electrodes that are electrically separated from each other.

Abstract: Disclosed are a component assembly for an electrical lighting device and method for sealing the same. The assembly comprises the component, such as an electrode lead wire, and a solder glass perform. The component assembly is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low-pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto without causing damage to other lamp components sensitive to high temperature. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300° C. in the range of 30-45×10−7° C.−1.