Abstract: Provided is a surface machining method for performing machining such as cutting, grinding, electrical discharging or the like to obtain a planar material of a uniform thickness.

Abstract: A machine tool (10) has a Z table (18) sliding in the Z direction in a horizontal plane, a support body (22) provided on the Z table (18) and sliding in the vertical direction, a rotation arm (32) supported at the support body (22) and endlessly rotatable in a vertical plane facing work (W), an arm motor (34) for rotating the rotation arm (32), a processing spindle (36) rotatably supported and placed at a position of a distance R from the center C of rotation of the rotation arm (32), and a spindle motor (38) for rotating the processing spindle (36).

Abstract: A system and methods for batch sorting objects and mapping the objects on a tray having a fixed dimension along an x-axis and a fixed dimension along a y-axis. Certain aspects of the present embodiments include (a) storing the objects in a queue; (b) sorting the objects in the queue according to a dimension of the objects; (c) mapping the objects sequentially into a first column of a plurality of columns on the tray until the first column is filled; (d) mapping the objects into a subsequent column until the subsequent column is filled; (e) repeating step (d) until only a last column in the plurality of columns remains to be filled, or until no more objects remain in the queue; and (f) mapping the objects into the last column in accordance with a column organization plan. In certain embodiments, at least one of the columns, and not necessarily the last column, includes objects mapped in accordance with a column organization plan.

Abstract: To provide a method for determining a component pickup order used by a component mounting apparatus which has plural mounting heads, and which causes the mounting heads to alternately pick up components from a component supplying unit and mount the components onto boards. The component pickup order determining method includes pickup order determining steps (S2 and S4) of determining an order according to which the plural mounting heads pick up components from the component supplying unit, so that some of the components corresponding to two or more tasks do not remain in any one of restricted areas where one of the mounting heads cannot pick up any components, when the component supplying unit includes the restricted areas and a task is referred to as at least one of components which is mounted in one of repeatedly executed operation sequences each of which includes suctioning, moving and mounting of the components executed by the mounting heads.

Abstract: In one embodiment, the present invention includes a sensor having a roller adapted on a shaft to roll along a workpiece surface, a compliant member adapted around at least a portion of the roller, and an encoder to code information regarding movement of the roller. In some implementations, the encoder may be in communication with a processor of a machine to provide information regarding workpiece movement.

Abstract: The present invention provides a method for machining a part from a workpiece. The workpiece is divided into a plurality of sectors and a plurality of fiducials are disposed within each sector. The separation distance between each fiducial is then calibrated to a workpiece distance unit. The present invention then includes the steps of a) positioning the workpiece into the desired position relative to a cutting machine; b) calibrating the cutting machine to the workpiece distance units of one sector; c) cutting one sector with the calibrated cutting machine; d) repeating steps a-c until the part is completed.

Abstract: A control system controls a support structure of a lithographic apparatus. A first measurement system measures the position of a substrate supported by the support structure, in a first coordinate system. A second measurement system measures the position of the support structure in a second coordinate system, the first measurement system having a presumed position in the second coordinate system. A controller controls the position of the support structure based on measurements by the second measurement system, to convert the measured position of the substrate into a converted position of the support structure in the second coordinate system, to position the support structure based on the converted position, to receive a position error signal indicative of a difference between the presumed position and an actual position of the first measurement system in the second coordinate system, and to position the support structure dependent upon the position error signal.

Abstract: A drilling machine drills at a multiplicity of target locations on a component. Two robots, calibrated with calibration data, move the component in a 6-D coordinate system. A metrology system ascertains the position of the component relative to the drilling machine. The movement of the robots is effected by means of commands generated by means of off-line programming. The component is moved relative to the drilling machine to a target position, ready for drilling, by means of a closed-loop process in which the differences in position between the expected position (the target position) and the actual position (as viewed by the metrology system) are corrected.

Abstract: The present invention provides methods and apparatus capable of routine placement and replacement of fabricator tools in a designated tool location. The tool location can be selected from multiple tool locations arranged in a matrix with horizontal and vertical designations. In another aspect, the fabricator tool placement and replacement can be accomplished while maintaining a clean space environment about the fabricator tool.

Abstract: A method and apparatus for assembling a plurality of independently formed solid components is provided thereby forming a single delivery vehicle for a pharmaceutical or pharmaceutical-like product. The solid components can be held and fed to the apparatus via a plurality of magazines. Pusher rods and the like can be used for positioning each of the solid components. Where the components are connected via a bonding liquid, a sprayer is provided and compression pins or the like press the components with the bonding liquid together to form the final product. A rivet or other connection structure can also be used and driven through holes in each of the solid components to form the final product.

Abstract: According to the present invention, techniques for controlling copying of logical volumes within a computer storage system are provided. A representative embodiment includes a plurality of storage devices controlled by a control unit, one or more processors, and a buffer memory for temporarily storing data read from the storage devices within the control unit. The storage devices can be addressed as logical volumes.

Abstract: A method of manufacturing electronic circuits including generating CAD data, a bill of materials and an approved component vendor list for an electronic circuit and employing the CAD data, the bill of materials and the approved component vendor list for automatically generating a pick & place machine-specific component loading specification, a pick & place machine-specific component placement sequence and pick & place machine-specific component data for governing the operation of at least one specific pick & place machine in a manufacturing line.

Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.

Abstract: This invention discloses a method and system for measuring a CNC machine. The system comprises a platform, a driving module, a set of optical scales, and a detection module. The platform is driven by the driving module. In addition, the driving module further comprises a set of encoders. As the driving module drives the platform to move to a position by a first displacement, the encoders indicate the first displacement. The optical scales indicate a second displacement by which the platform is driven by the driving module. The detection module detects the difference between the first displacement and the second displacement.

Abstract: Photolithography operation in a wafer fab using relative weightings of work in progress to iteratively schedule wafers.

Abstract: A method for positioning a reel-to-reel flexible board in an automatic manufacturing process uses an optical sensor to detect a first edge and a second edge of the reel-to-reel flexible board and obtain first x-coordinate data, second x-coordinate data and y-coordinate data. A set of positioning holes is precisely formed using the obtained coordinate data. The positioning holes are used to define a starting point of a next work area to prevent the gap between the two work areas from being larger or smaller than a predetermined value. Because micro-via forming and image transfer procedures are applied on the reel-to-reel flexible board using the coordination data, shift and offset can be prevented.

Abstract: It is intended to achieve a high level of positioning accuracy for a substrate assuming a two-layer structure constituted with a transparent layer with a high level of light transmissivity and a nontransparent layer with a low level of light transmissivity. A substrate positioning device according to the present invention characterized in that only the edge of the nontransparent layer, not the edge of the transparent layer, is exclusively detected and the substrate is positioned based upon the detection results.

Abstract: A dummy substrate (17) differs from a substrate to be processed in having a first guide (G1) for assisting centering, however, it can be handled as a substitute of the substrate to be processed. In a process chamber (2), a second guide (G2) is arranged to assist the dummy substrate (17) to center. To detect a transfer shift of a transfer mechanism (TRM), at first, the dummy substrate (17) is centered to a placing table (14) on the placing table (14) or at an upper position thereof by engagement of the first and the second guides (G1, G2). The dummy substrate (17) centered in such a manner is received by the transfer mechanism (TRM) and transferred to a detector (11). Then, a detection value of a decentering quantity and that in a decentering direction of the dummy substrate (17) are obtained by the detector (11), and a transfer shift of the transfer mechanism (TRM) is obtained based on the detection values.

Abstract: In the method for controlling a movable tool, in particular a grinding tool, by means of a feed function that specifies the movement of the tool in time in at least one axis, an initial feed function in the form of at least one initial feed curve (29) is displayed on a monitor. From the initial feed function and from inputs effected by means of a pointing device, a feed function is calculated and displayed as a modified initial feed curve on the monitor. Control commands for moving the tool are produced from the feed function. The input of the feed function is simplified and rendered more flexible.

Abstract: Soldering can be performed in a state where the temperature in an object zone is stable, regardless of the heat capacity of a soldering object. A soldering device includes: a position calculation unit which calculates the position of a heated object according to operational information of a conveyer which sequentially transfers the heated object into a plurality of zones for heat processing communicated with each other; a heat capacity calculation unit which calculates the heat capacity of the heated object; and a temperature management unit which controls the temperature in an object zone into which the heated object is carried, upon receiving positional information from the position calculation unit. The temperature management unit feedforward-controls the temperature in the object zone by adjusting the heat capacity of the object zone according to the heat capacity calculated by the heat capacity calculation unit.

Abstract: A method for monitoring die placement includes receiving measurements of an alignment of a semiconductor die mounted in a package by a die packaging tool. The measurements include center offset metrics associated with displacement of a center of the die. A plurality of corner offset metrics is determined based on the center offset metrics and dimensions of the die. A maximum one of the corner offset metrics is selected as a die placement metric. An out of tolerance condition with the die packaging tool is identified based on the die placement metric.

Abstract: A system and method are disclosed for quickly characterizing the profile of a surface of a workpiece using a non-contact scanner, such as a laser scanner, in preparation for subsequent machining. The method determines the location of a plurality of features of a workpiece on a machine tool, and comprises steps of reading a first list of approximate feature locations, defining a scan path based on the first list, scanning a profile of the workpiece along the scan path and calculating an actual location of each feature of said plurality of features based on the profile. The system and method are well suited to determining the location of features such as holes in welded header boxes.

Abstract: A method for monitoring die placement includes receiving measurements of an alignment of a semiconductor die mounted in a package by a die packaging tool. The measurements include center offset metrics associated with displacement of a center of the die. A plurality of corner offset metrics is determined based on the center offset metrics and dimensions of the die. A maximum one of the corner offset metrics is selected as a die placement metric. An out of tolerance condition with the die packaging tool is identified based on the die placement metric.

Abstract: A computing system, method, and computer program product facilitates data mining of information, for example image data, relating to a surface of a manufactured product when the manufactured product is processed using a tool relative to which the manufactured product may be randomly oriented. For each manufactured object, data pertaining to the surface is converted into a weight distribution. A rotational axis along which each surface would tend to rotate under the action of gravity with the surface supported at its geometric centroid is determined. The sets of data can then be properly oriented relative to one another for data mining by aligning the rotational axis of each set of data.

Abstract: The invention provides a semiconductor processing apparatus having a high throughput capable of appropriately coping with the positional displacement that may occur during transfer of the wafer after correcting the position thereof, without slowing down the transfer speed of the wafer. A position correction quantity of the wafer with respect to a vacuum robot is computed based on the outputs of a ? axis sensor for detecting the interception angle of the wafer during rotation of the vacuum robot and an R axis sensor for detecting the interception distance of the wafer during expansion and contraction of the vacuum robot. If the position correction quantity exceeds a predetermined standard value, an operation to change the position data is performed, and if the distance data obtained based on the outputs from the ? axis sensor and the R axis sensor exceeds a predetermined permissible value, it is determined that a displacement error has occurred and the operation is stopped.

Abstract: A handler is provided, including a chamber in which to-be-tested packaged chips contained in a test tray are connected to sockets of a test board, an exchanging unit exchanging the test trays with the chamber; a transferring unit transferring the test tray containing the to-be-tested packaged chips from the exchanging unit to the chamber, and transferring the test tray containing tested packaged chips from the chamber to the exchanging unit, a picker removing the tested packaged chips from the test tray staying in the exchanging unit and putting the to-be-tested packaged chips into the test tray staying in the exchanging unit; and an inserting unit including a pusher pushing the test tray to connect the to-be-tested packaged chips to the sockets of the test board, a pusher driving unit driving the pusher, a sensor sensing an amount of pressure applied by the pusher to the test tray; and a controller controlling the pusher driving unit to enable the pusher to apply a proper amount of pressure to the test tray.

Abstract: The intensity of light of a predetermined wavelength corresponding to the type of a protective tape joined to the surface of a semiconductor wafer is adjusted by a controller, and a holding stage for holding the semiconductor wafer is scanned rotationally. At this time, at a V notch portion for positioning formed in the semiconductor wafer, light is transmitted through the protective sheet covering the surface, which is received by a photoreception sensor. Based on the change in the reception amount of light in the photoreception sensor, the position of a detection site is specified.

Abstract: A power tool control system allows a user to operate a power tool through a graphical user interface communicatively coupled with a non-contact measurement and alignment device. The graphical user interface correlates user engageable selectors with a logically related menu of power tool setting options displayed on a display screen in a high quality and easily readable format. The non-contact measurement and alignment device uses one or more lasers to determine power tool settings and establish proper alignment based on user needs. The power tool control system further enables stud detection and visual indication of stud location.

Abstract: By taking into consideration tool-specific distortion signatures and reticle-specific placement characteristics in an alignment control system, the control quality of sophisticated APC strategies may be significantly enhanced. Respective correction data may be established on the basis of any combinations of tool/reticles and layers to be aligned to each other, which may modify the respective target values of alignment parameters used for controlling the alignment process on the basis of standard overlay measurement data obtained from dedicated overlay marks.

Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.

Abstract: In a system for an exchange of information between a machine tool (1) and a transfer device (11) for feeding blank or pre-machined work pieces or tools to the machine tool (1) or removing machined products or tools from the machine tool (1), the machine tool (1) comprises a control unit (3) and an interface (4), whereby the control unit (3) monitors and controls machining states of the machine tool (1) and transmits information regarding the machining states of the machine tool (1) via the interface (4) to the transfer device (11) to activate the transfer device (11). The transfer device (11) receives the information via an interface (14) assigned to it, processes the information by means of a control unit (13) assigned to it and reacts in response to the information, whereby a printer interface is used as the interface (4) of the machine tool (1).

Abstract: A quality control method for two-dimensional matrix codes on metallic workpieces, the codes being in the form of stamped marking dots is disclosed. The stamping process for the marking dots is carried out by a marking tool (17) with the aid of predetermined digital positional data. The corresponding image data is then recorded for analysis by an image processing device (22), exclusively at the locations that have been predetermined by the positional data, or additional image data that has been previously generated is also used for the analysis, to establish whether a correct marking dot with the required quality characteristics is present.

Abstract: Methods and systems for position sensing are disclosed. In one embodiment, a method includes measuring at least three discrete point positions associated with a first component by using at least one transmitter having a known position and orientation and in a line of sight with the three discrete point positions, the three discrete point positions having known distances relative to one another. The method computes a current position and orientation of the first component using data provided by the at least one transmitter and the three discrete point positions, along with position and orientation data from a last known location of the first component assuming that no sudden position changes since the first component has moved from the last known location. The first and second components may be a workpiece and a tool that performs a manufacturing operation on the workpiece.

Abstract: An assembly system may assemble articles of manufacture at a plurality of assembly regions and may log a time at which each article of manufacture enters or exits an assembly region. Assembly regions may include sequential assembly stations that process the articles. A method of determining when a specific article was processed by a specific assembly station may include receiving input identifying a specific article; receiving additional input identifying one of the plurality of sequential assembly stations; determining an offset of the identified sequential assembly station relative to a first assembly station or to a last assembly station within a region that comprises the identified sequential assembly station; and determining a time at which a second sequentially processed article entered or exited the region. The identified specific article and the second sequentially processed article may have been separated by a number of articles corresponding to the offset.

Abstract: One embodiment of the present invention provides a system that automatically detects and corrects a misalignment of a semiconductor chip. During operation, the system uses a position-detection mechanism integrated with the chip to determine the misalignment of the chip from a desired alignment for the chip. Next, the system uses an actuation mechanism integrated with the chip to automatically correct the misalignment, thereby improving performance and reliability of the chip.

Abstract: A processing system includes a transfer chamber, a plurality of chambers connected to the transfer chamber, a transfer apparatus disposed in the transfer chamber, and a control section configured to control the transfer apparatus. The transfer apparatus includes a base and transfer arm configured to perform a slide motion and a swing motion, respectively. The control section includes a storage portion and an operational controller. The storage portion stores pattern model data concerning a plurality of motion patterns each indicative of a composite motion of the slide motion and the swing motion, and track model data concerning time-based motion tracks respectively corresponding to the motion patterns. The operational controller is configured to retrieve necessary data from the pattern model data and the track model data and control the transfer apparatus in accordance therewith.

Abstract: In a first aspect, a computer program product is provided. The computer program product includes a medium readable by a computer. The computer readable medium has computer program code adapted to (1) create a band map that indicates an expected status of one or more positions along a band of a continuously moving conveyor system, each position adapted to receive a carrier support adapted to transport at least one substrate carrier around an electronic device manufacturing facility; (2) monitor status of the one or more positions included in the continuously moving conveyor system; and (3) control operation of the continuously moving conveyor system based on the status of the one or more positions. Numerous other aspects are provided.

Abstract: A method and apparatus is provided for determining substrate drift from its nominal or intended position. The apparatus includes at least two fixed reference points. The reference points can be fixed with respect to the processing tool, or with respect to the end effector. As a robotic arm moves the end effector and substrate along a path, a camera captures images of the edge of the substrate and the reference points. Two or more cameras can also be provided. A computer can then calculate positional drift of the substrate, relative to its expected or centered position on the end effector, based upon these readings, and this drift can be corrected in subsequent robotic arm movement.

Abstract: Assisting-work management apparatus and an assisting-work management program for performing the assisting work in a substrate work machine system efficiently by a plurality of workers. A worker determining section (140) determines a worker to perform an objective work obtained according to assisting work occurrence information acquired by an assisting work occurrence information acquiring section (110) and a work informing section (180) informs the determined worker of the objective work. The workers determining section (140) can determine the worker of the objective work appropriately based on set worker information, current worker information, the worker intension, and the like.

Abstract: Methods and systems for large-scale airframe assembly are disclosed. In one embodiment, a method includes measuring a plurality of discrete point positions at least one of on and adjacent to at least one of a first and a second component, and measuring at least one surface position on the at least one of the first and second components. The measured positions are compared with a desired position information (e.g., a computer aided design model). The comparison may include applying a fitting routine to the measured positions and the desired position information. Next, a transformation matrix for improving the comparison between the measured positions and the desired position information is computed. At least one of the first and second components is then moved according to the transformation matrix. During movement, the plurality of discrete point positions may be monitored and provided to the position control system by a feedback loop.

Abstract: A transfer correcting method for a thin material transfer apparatus includes detecting a front end of a thin material by the sensor, and transferring the thin material from a position of the sensor, to a processing unit, and further a reference transfer range from the processing unit to produce a first processed thin material portion, and transferring the thin material the reference transfer range to produce a second processed thin material portion, calculating a first correction value based on the reference transfer range and a measured length of the second processed thin material portion and a second correction value based on measured lengths of the first and second processed thin material portions, and correcting the transfer from the sensor position to the processing unit position, and the transfer from the processing unit position based on based on the first and second correction values.

Abstract: The present invention provides a precise marking apparatus for performing precise marking on an object and methods of using the same. The precise marking apparatus comprises an object input handler and an object output handler for handling the object; a transport system for transporting the object handlers during a marking process; a vision inspection unit for capturing and/or processing the image of the object; a marking system for marking the object; and a control unit for receiving information from and sending instructions to other components of the precise marking apparatus.

Abstract: A system and method for designing a tooling assembly automatically validates and maintains relationships between components in view of predefined requirements, preferences, and best design practices. The process is performed as part of a program performed by a computer system. A database containing information relevant to the design of the tooling assembly such as design standards, customer requirements and other desired attributes of the completed tooling assembly is used to define a set of requirements for each component. The specific part configuration for each component is then stored in a Master Control File for validation with respect to other components within the tooling assembly to maintain interrelationships between each component within the tooling assembly.

Abstract: The present invention features a method and apparatus for feeder setup validation on a component placement machine. Provided are a host computer in communication with a feeder setup station operable with a feeder identifier for identifying a feeder and a component identifier for identifying a component in the feeder working in conjunction with a location to determine if a component stored in a feeder mounted in a location on the component placement machine is correct for a program corresponding to operation of a system for assembling component products.

Abstract: Transfer of liquid crystal panels to subsequent processes is performed with the panels placed on transfer arms and held by suction pads. A small suction force can be sufficient, and a suction irregularity is prevented. The transfer arms are arranged at a lower side of the liquid crystal panels, thus not obstructing the liquid crystal panels. In arranging the liquid crystal panels at an image pickup device, a panel holding device is controlled to be driven so as to position panel marks to a bonding height position while negating a deflection amount of the liquid crystal panels, and furthermore a component holding device is controlled to be driven so as to position component marks to the bonding height position and to mount electronic components to the liquid crystal panels at the bonding height position.

Abstract: For assigning a tool to a workpiece conveyed on an assembly line, at least one transmitter is arranged in the area of an assembly line, and a receiver is arranged on the tool. An analyzing unit determines the distance of the tool from each transmitter, based on the transit times of at least one received signal, and an indicating device emits positions information regarding workpieces on the assembly line. An assignment unit assigns a tool or a tool position to a workpiece, based on at least one distance of the tool from the transmitter, and on the workpiece positions. The arrangement of the transmitters and receivers can also be interchanged.

Abstract: As a basic managing pattern, each manufacturing lot containing at least one workpiece is designated as a main objective to be managed. An appropriate number of similar type manufacturing lots containing workpieces having the same work conditions in at least one work step are loaded on a carrier. Then, the carrier is transported to a batch apparatus that performs simultaneous processing or machining operation applied to the workpieces or to an apparatus that brings the workpieces into an in-process work step under the same conditions, so as to cause the workpieces contained in respective similar type manufacturing lots to pass along a plurality of manufacturing process flows. Alternatively, an appropriate number of different type manufacturing lots containing workpieces having different work conditions are loaded on a carrier.

Abstract: Methods and an apparatus for determining a radiation dosage received by a product being exposed to radiation in an irradiator cell through a computer simulation are provided. One exemplary method includes a computer simulation for determining radiation dosages received by a product to be passed along a radiation cell, where the product is to be stationary at a set number of locations within the cell is provided. The method initiates with a point on the product being defined. Then, pre-calculated lengths between the point on the product and the radiation source at each of the set of locations in the cell are identified. Next, a dosage of radiation to be received by the point on the product at each location is calculated using the pre-calculated lengths.

Abstract: A machine for machining a workpiece with at least one revolving or rotating tool has a work spindle with a shaft (5), whose temperature is monitored by means of at least one temperature sensor (26). The temperature sensor is detected in contactless fashion. The sensor (26) is preferably a radiation-sensitive sensor, which detects the temperature radiation output. by the shaft (5). In triggering the positioning drive mechanisms, the control unit (35) of the machine (1) takes into account the temperature expansions of the shaft (5) that result from the temperature changes in the shaft. The positioning drive mechanisms serve to position a tool (6), carried by the shaft (5), relative to the workpiece (2). A machining precision is thus achieved that is independent of the temperature and temperature changes of the machine (1) overall, of temperature changes in the coolant—lubricant, and of temperature changes in the tool (6) and the shaft (5), that can all be caused by the power converted at the machining site.

Abstract: A method for positioning substrates in a substrate processing apparatus having a substrate alignment device, a first substrate transport apparatus and a second substrate transport apparatus, includes calibrating the substrate alignment device with a motion of the first substrate transport apparatus, and calibrating a coordinate system of the second substrate transport apparatus with the substrate alignment device.