Abstract: An apparatus, system, or method for positioning a wafer on a support of a rotatable chuck may improve the accuracy and precision of various wafer edge cuts and wafer profiling at a variety of stages of wafer manufacturing. The apparatus, system, or and/or method may employ one or more of a wafer position calculator to calculate a desired wafer position and to provide desired wafer position information to a wafer arm controller; and a wafer arm controller in communication with the wafer position calculator to provide instructions to adjust a wafer arm to position the wafer on the support according to the desired wafer position. Various sensor detectors and sensor lights or other mechanisms for sensing the position of a wafer may also be used.

Abstract: Manufacturing and assembly of a shoe or a portion of a shoe is enhanced by automated placement and assembly of shoe parts. For example, a part-recognition system analyzes an image of a shoe part to identify the part and determine a location of the part. Once the part is identified and located, the part can be manipulated by an automated manufacturing tool.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part.

Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by automated placement of shoe parts. For example, a part-recognition system analyzes an image of a shoe part to identify the part and determine a location of the part. Once the part is identified and located, the part can be manipulated in an automated manner.

Abstract: A robot system according to one aspect of an embodiment includes a robot and an instructing module. The robot holds one of a plurality of feed materials used for processing a workpiece. The instructing module gives instructions to the robot, when the feed materials are used for processing the single workpiece, for an operation in which the feed material held last in the previous round of processing a workpiece is used first in the subsequent round of processing a workpiece.

Abstract: A method for avoiding an unwanted collision between a tool and a workpiece in a machine tool is disclosed, wherein when a parts program starts to run, the determination of setpoint movement values for controlling a relative movement between tool and workpiece is started based on the parts program and a determination of the material removal at the workpiece by the tool is started based on the determined setpoint movement values. It is then checked whether a tool model overlaps with a workpiece model. When an overlap is detected, the relative movement between tool and workpiece is slowed down until the relative movement stops. A related facility employing the method for controlling a machine tool is also disclosed. Unwanted collisions between a tool and a workpiece in a machine tool can thus be avoided, while attaining short machining times for the workpiece.

Abstract: A method for synchronizing a first machine of a manufacturing process section arranged to carry out a production cycle including a working part and a non-working part. The first machine is operated in conjunction with at least one second machine. The first machine carries out a process during the working part of the cycle on a workpiece that is loaded into and/or unloaded out of the first machine by the at least one second machine during the non-working part of each process cycle. Also, a system for carrying out the method and a computer program.

Abstract: A substrate treating apparatus having a substrate treating unit, a load port for receiving pods for storing the substrates, and transferring the pods to and from the substrate treating unit, and a buffer between the substrate treating unit and the load port for transferring the substrates to and from the substrate treating unit and the load port, and temporarily storing the pods; a carrier transport system for transferring the pods to and from the load port; and a host computer for transporting the pods in response to conditions. A transport-related control unit, when the load port is being used by one of the pods and a vehicle of the carrier transport system approaches to transfer another of the pods to the load port, suspends a notice of transfer disapproval until completion of the use by the one of the pods.

Abstract: A numerical controller for controlling a multi-axis machine tool for machining with three linear axes and three rotating axes has a function for compensating a setting error that arises when a workpiece is set. This numerical controller determines compensated linear axis positions of the three linear axes and compensated rotating axis positions of the three rotating axes by calculating compensated tool position and direction depending on the setting error such that the tool position and direction on the workpiece setting coordinate system are maintained on the workpiece having such a setting error, and drives and controls the axes according to the compensated linear axis positions and compensated rotating axis positions.

Abstract: A control device includes a storage unit that stores therein first position information indicating relative positions between one reference processing unit selected from a plurality of processing units and the other non-reference processing units; a first calculation unit that drives the transfer device while a jig formed in the shape of a substrate is held on the transfer device, and calculates a first compensation value for compensating a position deviation between a transfer position of the jig on the transfer device with respect to the reference processing unit and a first transfer target position; and a second calculation unit that calculates a second compensation value for compensating a position deviation between a transfer position of the jig on the transfer device with respect to the non-reference processing unit and a second transfer target position based on the first compensation value and the first position information.

Abstract: A coating and developing apparatus includes: a delivery mounting unit on which a carrier housing a plurality of substrates is to be mounted and the carrier being accessed by a delivery mechanism; a plurality of retreat mounting units on which the carriers are to be mounted; a carrier carry mechanism moving and mounting the carriers between the retreat mounting units and the delivery mounting unit; a collection schedule creating function determining a collection order for collecting the substrates placed in modules into original carriers in which the substrates were housed, when a trouble occurs; and a carry control unit controlling to carry the substrates to the carriers in which the substrates were housed according to the determined collection order.

Abstract: The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.

Abstract: A method for feedback-based optimization of a measurement data life cycle in joining processes during production, comprising the following steps: 1) analysing and simulating production on the basis of assumptions, in particular on the basis of production data, in order to prepare an initial production strategy and/or inspection strategy, 2) preparing and/or adapting a production and/or inspection order, 3) checking the production and/or inspection order for consistency, 4) exporting and storing the production and/or inspection order, 5) aligning and/or joining a component made of at least two sub-assemblies in an assembly zone, 6) analysing and simulating production on the basis of actual measurement results and feedback of an optimized production and/or inspection order into method step 2), and 7) at least one repetition of method steps 2) to 6). The invention also relates to a device for carrying out the method.

Abstract: A substrate supporting apparatus includes a pallet on which a substrate is mounted, a pallet double-end holding mechanism holding both ends of the pallet in a diameter direction while the pallet is in a vertical posture, a pallet center holding mechanism rotatably holding a center section of the pallet, and a moving mechanism moving an apparatus body, wherein the pallet double-end holding mechanism is a mechanism that grips both ends of the pallet in the diameter direction from both sides of a thickness direction, the pallet double-end holding mechanism holds the pallet during movement, the pallet is held by both of the holding mechanisms during delivery from the pallet double-end holding mechanism to the pallet center holding mechanism, and the pallet center holding mechanism rotatably holds the center section of the pallet and holding by the pallet double-end holding mechanism is released during substrate processing.

Abstract: A system and method is disclosed for calibrating a semiconductor wafer handling robot and a semiconductor wafer cassette. A robot blade boot is attached to a robot blade of the semiconductor handling robot. The robot blade boot decreases a value of tolerance for the robot blade to move between two semiconductor wafers in the semiconductor wafer cassette. In one embodiment the vertical tolerance is decreased to approximately twenty thousandths of an inch (0.020?) on a top and a bottom of the robot blade boot. The use of the robot blade boot makes the calibration steps more critical and precise. The robot blade boot is removed from the robot blade after the calibration process has been completed.

Abstract: A machine motion control system includes a number of moving parts for securing test electronic devices, a machine and an axis control card mounted on the machine. The machine includes a number of servo modules and a number of sensing units. The servo modules drive and control the corresponding moving parts on the machine. Each sensing unit is electrically connected to a corresponding moving part; the sensing units are operable to sense and transmit location information of the moving parts and the machine. The axis control card is electrically connected to the moving parts, the machine, and the sensing units. The axis control card receives location information of each moving part and processes the location information to generate a corresponding command signal, and transmits the generated command signal to the servo modules to control and adjust the moving parts.

Abstract: A position correcting system, method and tool for guiding a tool during its use based on its location relative to the material being worked on. Provided is a system and tool which uses its auto correcting technology to precisely rout or cut material. The invention provides a camera which is used to track the visual features of the surface of the material being cut to build a map and locate an image on that map used to reference the location of the tool for auto-correction of the cutting path.

Abstract: Disclosed are a processing system and a processing method such that the production cost in a workpiece processing line is reduced and that a workpiece is processed efficiently. A robot 11 has an arm 23 at the tip of which the processing machine 12 is installed, and a robot base 22 on which the arm 23 is installed. The robot base 22 is installed on a robot movement mechanism 14, and said robot movement mechanism 14 moves the robot 11. A robot control device 16 performs movement control of the arm 23, and also executes movement control on the robot movement mechanism 14. By way of movement control of the robot movement mechanism 14, the robot control device 16 executes control wherein the robot 11 is moved independently of the continuous conveyance of the workpiece 2 by the continuous conveying mechanism 20.

Abstract: A method for verifying completion of a task. Location coordinates of at least one location sensor within a work cell are obtained. At least one sensor is affixed to a tool used to operate on a feature of a structure to be assembled, fabricated or inspected. A virtual object locus is generated based on the location coordinates of the at least one location sensor. The virtual object locus corresponds to a computerized schematic of the structure to be assembled and represents of all possible locations of an object end of the tool within the work cell. One of a plurality of candidate features is identified as the most likely to be the feature operated on by the tool. The identification is based on a probability calculation for each of the candidate features that each respective candidate feature is the feature operated on by the tool.

Abstract: A control device for a gas sensor is configured to: receive a mode command to specify one of a plurality of sensor energization modes including at least a gas concentration detection mode, a protection mode and a pre-energization mode; switch a sensor element of the gas sensor into the one of the plurality of sensor energization modes according to the mode command; judge satisfaction of a certain condition where the mode command is to specify the gas concentration detection mode and the sensor element is in any of the plurality of sensor energization modes other than the pre-energization mode at the time of receipt of the mode command; and prohibit the sensor element from switching over to the gas concentration detection mode when the certain condition is satisfied.

Abstract: A system for performing alignment of two wafers is disclosed. The system comprises an optical coherence tomography system and a wafer alignment system. The wafer alignment system is configured and disposed to control the relative position of a first wafer and a second wafer.

Abstract: Based on the positions of a first marker and a second marker of a first substrate placed on a placing surface of a substrate placing table (1), a substrate processing apparatus makes the direction of a line connecting the first marker and the second marker accord with the moving direction of a gantry (2). The positions of the first marker and a third marker, in the state that the direction of the line connecting the first marker and the second marker accord with the moving direction, are stored in a storage section. After a second substrate is placed on the placing surface of the substrate placing table (1), the direction of a line connecting the first marker and the third marker on the second substrate is made to accord with the direction of a line connecting the first marker and the third marker calculated from the position of the third marker and the fourth marker on the first substrate stored in the storage section.

Abstract: A computer numerical control (CNC) machine includes a case, a communication plug, a first switch, a number of second switches, and a control circuit. The control circuit includes a first switch control unit to receive a first switch signal from the first switch, a second switch control unit to receive second switch signals from the second switches, a control unit, a command signal converting unit, a pulse signal generating unit, and an operation signal output unit. The control unit receives the first and second switch signals, determines the work mode of the CNC machine according to the first switch signal, and convert the second switch signals to command signals. The command signal converting unit converts the command signals into operation signals. The pulse signal generating unit generates pulse signals. The operation signal output unit outputs the operation signals and the pulse signals to the CNC machine via the communication plug.

Abstract: A method of automatically placing pucks on a truss assembly table includes the steps of receiving input regarding the truss assembly table and a truss to be assembled on the truss assembly table, and processing the input. Locations on the truss assembly table for each puck are selected based on the processed input that optimizes the overall support given to the truss. The pucks are automatically moved to their selected locations.

Abstract: An apparatus (1) for cutting and/or etching articles (4) having a flat surface on which designs and/or writings (11A, 11B, 11C) are reproduced has an operating group (5) arranged above a work plane (2), which work plane (2) is provided with an upper surface (3) for receiving the articles. The operating group is movable along the work plane (2) in order to operate on the articles (4) for cutting and/or etching the articles (4). A first optical device detects designs and/or writings (11A, 11B, 11C) reproduced on the articles arranged on the work plane (2). The apparatus (1) has a second optical device (9) arranged with respect to the surface (2) such as to detect the orientation as well as the position of the articles (4) on the work plane (2) as well as the designs and/or the writings (11A, 11B, 11C) reproduced on the articles.

Abstract: A method and apparatus for assembling a complex product in a parallel process system wherein a collection of components are provided for assembling the complex product. The present invention involves transferring the collection of the components to one of a plurality of similar computerized assembly cells through the use of a transport system. The collection of components is automatically assembled into the complex product through the use of the computerized assembly cells. The complex product is then transferred from one of the assembly cells to a computerized test cell, where the complex product is tested to ensure for the proper dimensioning and functioning of the complex product. The complex product is then transferred from the test cell via the transport system to either a part reject area or conveyor, if the complex product is defective, or to an automatic dunnage load or part return system, if the complex product is not defective.

Abstract: A method for verifying completion of a task is provided. In various embodiments, the method includes obtaining location coordinates of at least one location sensor within a work cell. The at least one sensor is affixed to a tool used to operate on a feature of a structure to be assembled, fabricated or inspected. The method additionally includes, generating a virtual object locus based on the location coordinates of the at least one location sensor. The virtual object locus corresponds to a computerized schematic of the structure to be assembled and represents of all possible locations of an object end of the tool within the work cell. The method further includes, identifying one of a plurality of candidate features as the most likely to be the feature operated on by the tool. The identification is based on a probability calculation for each of the candidate features that each respective candidate feature is the feature operated on by the tool.

Abstract: A controller for a positioning device is constructed and arranged to receive a position signal indicative of a position of the positioning device, compare the position signal to a set-point signal indicative of a desired position of the positioning device to obtain an error signal, selectively modify the error signal based on the amplitude and the frequency content of the error signal to obtain a modified error signal, generate a control signal for controlling the positioning device on the basis of the modified error signal. The controller may be applied to control a positioning device in a lithographic apparatus.

Abstract: In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels.

Abstract: The present invention provides a dual-arm type robotic arm and its method of transporting panels, and mainly has a first robotic arm and a second robotic arm which simultaneously extend into a processing equipment. When the second robotic arm takes out a second panel from the processing equipment, the first robotic arm simultaneously executes a stabilization operation and executes a fastening-suction release operation of a carried first panel. Then, the first robotic arm is lowered for placing the first panel in the processing equipment. Thus, the present invention can prevent from occurring a breakage risk of the first panel during being placed, and save the operation time during the first robotic arm waits to be stable and then release the fastening-suction.

Abstract: The invention relates to a device for spatially aligning at least two large-format subassembly components, in particular at least one side shell 7, 8, at least one upper shell 12, at least one lower shell 11 and/or at least one floor structure, relative to each other for integrating a component, in particular a fuselage section of an aircraft, comprising: a) at least two positioning devices for taking up in each case a subassembly component, in particular at least two side shell positioners 2, 3, at least one upper shell positioner 5 and/or at least one lower shell positioner 4, b) at least one measuring device for acquiring a multitude of measured data, in particular of positioning data relating to the subassembly components and/or to the positioning devices, c) at least one control and/or regulating device 19, in particular at least one CNC control system, and d) at least one neuronal network 20.

Abstract: Even in case that a wafer is so greatly deviated that a peripheral portion of the wafer cannot be detected, position determination of the wafer can be performed without inflicting a damage on the wafer. The wafer peripheral portion, which is a target, is detected based on output images from a plurality of imaging units disposed along a peripheral portion shape of the wafer (step S210), and a wafer position deviation correcting step (step S220) or a rough correcting step (step 230) is performed according to the number of the imaging units capable of detecting the wafer peripheral portion. In case that the wafer peripheral portion cannot be detected by all the imaging units, a wafer position adjusting step (step 240) for moving the wafer is performed in a position adjusting direction acquired by a combination of the output images by each imaging unit.

Abstract: Methods and systems to optimize wafer placement repeatability in semiconductor manufacturing equipment using a controlled series of wafer movements are provided. In one embodiment, a preliminary station calibration is performed to teach a robot position for each station interfaced to facets of a vacuum transfer module used in semiconductor manufacturing. The method also calibrates the system to obtain compensation parameters that take into account the station where the wafer is to be placed, position of sensors in each facet, and offsets derived from performing extend and retract operations of a robot arm. In another embodiment where the robot includes two arms, the method calibrates the system to compensate for differences derived from using one arm or the other. During manufacturing, the wafers are placed in the different stations using the compensation parameters.

Abstract: A substrate placing position adjusting method which acquires data on a substrate placing position where a substrate carrying unit is required to place a substrate on a substrate holding device capable of rotating about a vertical axis and included in a processing unit for processing a substrate substantially horizontally held by the substrate holding device, said substrate placing position adjusting method comprising the steps of: transferring a jig from the substrate carrying unit to the substrate holding device; measuring centrifugal acceleration imparted to a measuring position in the jig when the substrate holding device holding the jig is rotated at a fixed angular velocity; and calculating an eccentricity of the measuring position from a rotation center of the substrate holding device on the basis of a centrifugal acceleration.

Abstract: In a simultaneous multi-axis measuring machine tool system including linear drive axes and rotation axes to measure a surface shape of an object to be measured by using an on-board measuring device having a probe mounted, at one end thereof, with a spherical contactor, a numerical controller controls driving of the linear drive axes and the rotation axes so that a central axis of the probe is always oriented in a direction perpendicular to the surface of the object to be measured and that the spherical contactor of the probe comes in contact with and follows a surface of the object to be measured.

Abstract: A method for aligning a substrate to a process center of a support mechanism is provided. The method includes determining substrate thickness after substrate processing at a plurality of orientations and at a plurality of radial distances from a geometric center of the substrate. The method also includes deriving a set of process rate values from substrate thickness and process duration. The method further includes creating for a process rate an off-centered plot, which represents a substantially concentric circle whose points are a circumference of the off-centered plot having substantially the first process rate. The method yet also includes applying a curve-fitting equation to the off-centered plot to determine a set of parameters. The method yet further includes teaching a set of robot arms the set of parameters, thereby enabling the set of robot arms to align another substrate that is supported by the support mechanism with the process center.

Abstract: Even in case that a wafer is so greatly deviated that a peripheral portion of the wafer cannot be detected, position determination of the wafer can be performed without inflicting a damage on the wafer. The wafer peripheral portion, which is a target, is detected based on output images from a plurality of imaging units disposed along a peripheral portion shape of the wafer (step S210), and a wafer position deviation correcting step (step S220) or a rough correcting step (step 230) is performed according to the number of the imaging units capable of detecting the wafer peripheral portion. In case that the wafer peripheral portion cannot be detected by all the imaging units, a wafer position adjusting step (step 240) for moving the wafer is performed in a position adjusting direction acquired by a combination of the output images by each imaging unit.

Abstract: A robot system includes a manipulator; a work table arranged within a movement extent of the manipulator; an imaging unit for taking a two-dimensional image of the workpieces loaded on the work table; a workpiece supply unit for supplying workpieces onto the work table; and a control system for controlling operations of the manipulator and the imaging unit. The control system includes an imaging control unit for controlling the imaging unit to take the two-dimensional image of the workpieces loaded on the work table, a workpiece detecting unit for detecting a position and a posture of each of the workpieces loaded on the work table by comparing the two-dimensional image taken by the imaging unit with templates stored in advance, and a manipulator control unit for operating the manipulator to perform a work with respect to the workpieces detected by the workpiece detecting unit.

Abstract: An apparatus for recognizing and processing information of electronic parts includes a seating unit on which electronic parts are seated and aligned and a part information processing unit disposed adjacent to the seating unit. The part information processing unit is configured to align the electronic parts using the seating unit, recognize a recognition surface of the electronic parts, obtaining part information of the recognized surface, and store the obtained part information.

Abstract: An adjustable locator includes a locator element for contact with a workpiece supported on a fixture. The locator comprises a support element in which a ramp element is slidable. The ramp element has a ramp surface which is contacted by a plunger which carries the locator element. Displacement of the ramp element causes displacement of the plunger to adjust the position of the locator element with respect to the support element. A ratchet mechanism permits displacement of the ramp element in one direction, but prevents such movement in the opposite direction. The adjustable locator can be used in a workpiece fixture to achieve an optimum orientation of a workpiece prior to machining.

Abstract: A method for positioning substrates in a substrate processing apparatus having a substrate alignment device, a first substrate transport apparatus and a second substrate transport apparatus, includes calibrating the substrate alignment device with a motion of the first substrate transport apparatus, and calibrating a coordinate system of the second substrate transport apparatus with the substrate alignment device.

Abstract: Disclosed is a method and system for compensating for the load a part places on a part positioner system that positions the part for work operations by a robot. The part positioner system rotates a part holding assembly about the axis of rotation of a shoulder drive. The part holding assembly may have a column that extends perpendicular to the shoulder center line. A counter weight system is incorporated into the column that includes a counter weight pack that is moved along the length of the column. The shoulder drive drives the part and part holding assembly load in order to measure a torque applied to the shoulder drive. A load offset may be calculated based on the applied torque. The counter weight pack may then be moved to a position on the column calculated to balance the load of the part and part holding assembly.

Abstract: Distance meters measure distances from a reference position to a first area including an upper pitch circle portion and a second area including a lower pitch circle portion. Center coordinates of the hub is calculated based on respective center coordinates of two hub bolts included within the first and second areas. Coordinates of three points defining apexes of a triangle are acquired. Inclination angle of the hub relative to a vertical plane is calculated based on the coordinates of the three points, and an orientation of each of the hub bolts is calculated based on the center coordinates of the hub and the center coordinates of the hub bolt.

Abstract: A method of manufacturing in which a robot arm is used to pick up a workpiece which is subsequently scanned by a scanner and positioned relative to a manufacturing system for manufacturing in order to eliminate the use of a bespoke jig.

Abstract: A process for accurately determining a workpiece position in relation to a reference coordinate system is provided. The process includes providing a machine having a table and a machine coordinate system, determining locations of three reference geometric aspects of the table, providing a workpiece, and attaching the workpiece to the table. Thereafter, locations of three geometrical aspects of the workpiece are determined using photogrammetry followed by calculation of any offset between the three reference geometrical aspects of the table and the three geometrical aspects of the workpiece. Any offset that has been determined can then be used to accurately determine the workpiece position in relation to the reference coordinate system.

Abstract: Automated positioning and alignment methods and systems for aircraft structures use anthropomorphous robots with six degrees of freedom to carry the aero structure parts during the positioning and alignment. The parts and structures (if any) supporting the parts are treated as robot tools.

Abstract: Disclosed is a substrate positioning apparatus capable of accurately performing positioning of a center of a circular-shape substrate with respect to a rotating shaft. The substrate positioning apparatus includes: a substrate disposing part; a first positioning mechanism including a first reference part contacting a side of the substrate; a second positioning mechanism including a second reference part contacting the side of the substrate; a first driver configured to drive the first positioning mechanism; a controller configured to control the drive of the first positioning mechanism. In particular, the second reference part contacts the substrate at a contact part and includes an elastic part that applies force in a moving direction of the first driver to the contact part and a detector that detects position information of the second positioning mechanism.

Abstract: A control system includes at least one part mounter installing parts on a printed circuit board and a control device integrally controlling the operation of the at least one part mounter. The control device controls the part mounter using information about the printed circuit board and information on a production process flow of the printed circuit board. The control device integrally controls the operations of the part mounters, including receiving and storing information on parts that the part mounters install, information on a feeder that supplies the parts, and information on arrangement of the parts on the printed circuit board, receiving and displaying operation information and operation situations from the part mounters, and controlling operations of the part mounters using the stored information and displayed information.

Abstract: A system automatically moves large scale components of a vehicle such as an airplane, into final assembly alignment. A noncontact measurement system determines the locations of aerodynamically significant features on each of the components. The measured locations of the components are used to control an automated jacking system that includes assembly jacks for individually moving the components into assembly alignment. A system is provided for calculating the cruise configuration of the vehicle “as-built” and for transferring the cruise configuration into the vehicle where it is recorded in the form of a physical monument.

Abstract: The invention relates to a method for computer controlled machining of tubes, in particular laser cutting tubes, the method comprising the steps of: providing a length of tube; arranging the provided tube in a computer controlled machining station; executing a program for controlling the machining station in order to machine the provided tube; and measuring the dimensions of the provided length of tube prior to arranging the tube in the computer controlled machining station.