Digital Positioning Technique Patents (Class 700/186)
  • Publication number: 20020123823
    Abstract: This invention relates to a control apparatus for numerical control in a cutting machine having a turret which can be rotated to arbitrary positions, and characterized by including means for obtaining turret axis data (&Dgr;X, &Dgr;Z) from reference offset values (X0, Z0) corresponding to a length from a cutting edge to a turret axis B, turret angle data &agr;, and cutting edge data (m, n), and moving the turret on the basis of these turret axis data (&Dgr;X, &Dgr;Z) to perform a cutting.
    Type: Application
    Filed: February 22, 2002
    Publication date: September 5, 2002
    Inventors: Hisao Harada, Hiroki Nakahira, Katsuaki Ono
  • Patent number: 6438454
    Abstract: A robot failure diagnosing system in which sound input by the user is interpreted/recognized by a command recognizing section in order to notify a request for a diagnosis to a self-diagnosis section. For example, the user can input a command which prompts a self-diagnosis operation in the form of a natural communication, such as by saying, “Perform a self-diagnosis operation,” and by asking, “How do you feel, robot?” With respect to this, the robot can indicate the self-diagnosis result in the form of a natural conversation, such as by saying, “I'm not feeling well,” “My leg hurts,” and “I'm hungry.” The robot failure diagnosing system performs a self-diagnosis of a failure or abnormality in a system, and feeds back the diagnosis result to the user.
    Type: Grant
    Filed: November 24, 2000
    Date of Patent: August 20, 2002
    Assignee: Sony Corporation
    Inventor: Yoshihiro Kuroki
  • Patent number: 6430465
    Abstract: The present invention preferably employs non-contact, small-displacement, capacitive sensors to determine Abbe errors due to the pitch, yaw, or roll of a near linear mechanical stage that are not indicated by an on-axis position indicator, such as a linear scale encoder or laser interferometer. The system is calibrated against a precise reference standard so the corrections depend only on sensing small changes in the sensor readings and not on absolute accuracy of the sensor readings. Although the present invention is preferred for use in split-axis positioning systems with inertially separated stages, the invention can be employed in typical split-axis or stacked stage systems to reduce their manufacturing costs.
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: August 6, 2002
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Donald R. Cutler
  • Publication number: 20020103567
    Abstract: A method of and apparatus for synchronous control of a leading element and a follower element in which synchronism is started smoothly and a mechanical shock at the start of synchronism is reduced. When the follower element is started to move to be synchronized with the leading element, motion of the follower element is started before the follower element reaches a start position of the synchronism, and brought into synchronism with the leading element at the start position of synchronism. A positional relationship between the leading element and the follower element in synchronism, and a start position for starting the synchronism of the follower element and the leading element is set. An acceleration control of the follower element is performed between a motion start position preceding the start position of the synchronism and the start position of the synchronism.
    Type: Application
    Filed: December 21, 2001
    Publication date: August 1, 2002
    Inventors: Tetsuo Hishikawa, Takashi Idei, Kentaro Fujibayashi
  • Patent number: 6405357
    Abstract: A method for positioning bond pads in a semiconductor die comprises the steps of (I) setting parameters including (a) setting a baseline pad pitch to a first value, (b) setting a first pad position equal to a first pad value and (c) providing a focal point; (II) determining a first angle between a first line through a center of the first pad position and the focal point and a second line through a center of the semiconductor die and normal to the edge; (III) determining a first pad spacing increment value equal to the first value divided by a cosine of the first angle; (IV) setting a second pad position equal to a second pad value, wherein the second pad value at least equals the first pad value plus the first value if both of the first bond pad and the second bond pad are ground pad or power pad with the same potential, else the second pad value at least equals the first pad value plus the first pad spacing increment value; and (V) using the first and second pad values to respectively position a first bond p
    Type: Grant
    Filed: May 2, 2000
    Date of Patent: June 11, 2002
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Te Tsung Chao, Hui Chin Fang
  • Patent number: 6400994
    Abstract: The invention is a unit for pneumatically controlling the position of a workpiece relative to a predetermined workpiece configuration, comprising an enclosure, a minimum of one measuring nozzle for a gaseous pressure medium, which measuring nozzle is located in a contact surface a workpiece fixture. A pressure supply line is connected to the measuring nozzle via pressure lines. Separate adjoining modular enclosure components are detachably connected to one another and each is fitted with a connection leading to measuring nozzle. A first enclosure end cover can be connected to a pressure supply unit and a second enclosure end cover is located at a distance from the first enclosure end cover. The first enclosure end cover, the modular enclosure components that adjoin the first enclosure end cover, and the second enclosure end cover that adjoins the modular enclosure components form the overall enclosure 68.
    Type: Grant
    Filed: June 24, 1999
    Date of Patent: June 4, 2002
    Assignee: Samson Aktiengesellschaft
    Inventor: Wilfried Gerk
  • Patent number: 6401004
    Abstract: A device for analyzing NC program is provided with a machining method analyzing means (34) which extracts machining conditions for every machining work element by analyzing an actual NC machining program, and data base creating means (35). The device extracts necessary machining information from the actual NC machining program and allows the data bases (21, 22, 23 and 24) to reflect the information.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: June 4, 2002
    Assignees: Kabushiki Kaisha Mori Seiki Seisakusho, Mitutoyo Corporation, Okuma Corporation
    Inventors: Kazuo Yamazaki, Naoki Morita, Sadayuki Matsumiya, Yasushi Fukaya
  • Publication number: 20020049513
    Abstract: An improved servo system for galvanometers, scanners and similar devices which uses digital processing to increase the dynamic range and provide greater effective resolution. The system provides digital control of a reference point that directly influences the excitation, which in turn directly influences the gain of the circuit. A high and low resolution switching path is provided to optimize dynamic range. Wide angle torque compensation improves uniformity of response at large angular deflections from zero. Improved thermal protection allows safe operation near system thermal limits. A graphical user interface allows adjustments and changes response on the fly for tuning due to input conditions or user control.
    Type: Application
    Filed: September 21, 2001
    Publication date: April 25, 2002
    Inventors: Michael B. Nussbaum, Michael R. Shannon, Fredrick A. Stewart
  • Patent number: 6317653
    Abstract: A correct track calculating section calculates a correction amount in accordance with a reaction force acting on the working end of a robot. The correction amount is added to a given provisional target position so as to reduce the reaction force. When the reaction force increases excessively, an on-off switch is closed and a selector switch is switched to decelerate and stop the working end of the motor at a virtual position.
    Type: Grant
    Filed: April 18, 2000
    Date of Patent: November 13, 2001
    Assignee: Denso Corporation
    Inventor: Koji Kamiya
  • Patent number: 6311100
    Abstract: A technique is provided for utilizing a computer system to generate tool paths for the computed aided machining (CAM) in at least four axis of a selected workpiece or part, particularly a complex part having hidden surfaces. The technique involves storing in the computer system both a surface point representation of a workpiece, which representation contains a unique code for each surface point, and a representation of the tool for which the paths are to be generated. The workpiece surface is viewed from a discrete number of orientations and a map of surface points visible from each of the orientations is generated. The map is then used to obtain selected most promising access directions for access to voxels in the delta volume to be removed or for access to surface points for a finishing operation. Such most promising access directions may for example be obtained by thinning an access cone for the voxel/point.
    Type: Grant
    Filed: September 14, 1998
    Date of Patent: October 30, 2001
    Assignee: Mass. Institute of Technology
    Inventors: Sanjay E. Sarma, Putta Laxmiprasad, Mahadevan Balasubramaniam
  • Publication number: 20010016786
    Abstract: So as to achieve accurate detection of the bonding tool position in, for instance, a wire bonding apparatus, the positional relationship between a position detection camera and a reference hole formed in, for instance, a clamper is measured by imaging the reference hole by the position detection camera. The position detection camera and a bonding tool are moved by an XY table, and the tip end of the bonding tool is inserted into the reference hole. Then, the bonding tool is moved in the X and Y directions, and the contact of the bonding tool to an edge of the reference hole is detected based upon changes in the waveform of the ultrasonic vibrations applied to the bonding tool, thus measuring the positional relationship between the tool and the reference hole. The offset amount between the position detection camera and the bonding tool is then determined based upon the measured values and the amounts of movement of the bonding tool between the locations for such measured values.
    Type: Application
    Filed: February 12, 2001
    Publication date: August 23, 2001
    Applicant: KABUSHIKI KAISHA SHINKAWA
    Inventors: Kuniyuki Takahashi, Shinji Maki
  • Patent number: 6269284
    Abstract: A machine tool is controlled through a process incorporating the steps of (1) measuring geometric and thermal errors with accurate instruments, (2) creating a global differential wet model of machine tool position, and (3) using this model to control real time compensation of machine tool operation. A controller modifies encoder-type position feedback signals used by the machine to compensate for geometric and thermal errors in the manner dictated by the global differential wet model.
    Type: Grant
    Filed: April 20, 1998
    Date of Patent: July 31, 2001
    Inventors: Kam C. Lau, Quanhe Ma, Herbert Lau
  • Patent number: 6243621
    Abstract: A method of determining position information of a workpiece relative to a robot includes the ability to move the workpiece into a variety of orientations relative to the robot during the touch sensing location procedure. The position information is then used for performing a robot operation including coordinated motion. A coordinated reference frame is defined with respect to a moveable positioner that supports the workpiece. Known kinematic relationships between the positioner and the robot are used to control operation of the robot within the coordinated reference frame throughout the touch sensing location procedure. By moving the workpiece relative to the robot during the touch sensing location procedure, a greater variety of workpieces can be processed and relatively complicated workpiece configurations can be accurately determined. The robot operating parameters are modified according to the determined position information.
    Type: Grant
    Filed: March 13, 1998
    Date of Patent: June 5, 2001
    Assignee: FANUC Robotics North America, Inc.
    Inventors: Jianming Tao, Jason Tsai, Robert A. Bolhouse
  • Patent number: 6243657
    Abstract: A pipeline inspection and defect mapping system includes a pig having an inertial measurement unit and a pipeline inspection unit for recording pig location and defect detection events, each record time-stamped by a highly precise onboard clock. The system also includes several magloggers at precisely known locations along the pipeline, each containing a fluxgate magnetometer for detecting the passage of the pig along the pipeline and further containing a highly precise clock synchronized with the clock in the pig. The locations of the various magloggers are known in a north/east/down coordinate system through a differential global positioning satellite process. Finally, a postprocessing off-line computer system receives downloaded maglogger, inertial measurement, and odometer data and through the use of several Kalman filters, derives the location of the detected defects in the north/east/down coordinate frame. Consequently, a task of identifying sites for repair activity is much simplified.
    Type: Grant
    Filed: December 23, 1997
    Date of Patent: June 5, 2001
    Assignee: PII North America, Inc.
    Inventors: Alan Tuck, Gary Brayson, Mario B. Ignagni, Alan B. Touchberry, Donald William Anderson, Stephen James Glen, James Michael Alexander Gilman
  • Patent number: 6236325
    Abstract: A position detector and cable for use in the same can be provided for reducing the space and cost as well as easing maintenance. A scale unit (1) generates an alarm signal (ALAM) for informing of an error when it occurs associated with generating position pulses (PA, PB and PZ). A signal cable (6) transfers the alarm signal (ALAM) to a connector (7). The connector (7) contains an alarm indicator (31) that lights on in response to the alarm signal (ALAM) output from the scale unit (1) when an irregularity occurs.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: May 22, 2001
    Assignee: Mitutoyo Corporation
    Inventors: Shingo Kuroki, Yasuo Yamaguchi, Hiroaki Kawada
  • Patent number: 6230072
    Abstract: The Boiler Automated Welding System (BAWS) is an automatic welding system for repair of worn boiler tubes in cyclone boilers. Repair of these tubes is essential for extending the life of this component used within electrical power plants. The BAWS utilizes: 1) a multiaxis positioner which forms the required cylindrical coordinate motion system, 2) a tube tracking systems for determination of motion paths during welding, 3) a two axis gimbaled welding torch holder for orientation of the welds relative to the motion path, 4) an integrated welding system and 5) a computer controller which coordinates these devices in a logical method. The BAWS multiaxis positioner allows for orientation of the system within the cyclone boiler to take advantage of the symmetry of the tube layout (cylindrical coordinates). The positioner allows each individual tube to be scanned and a weld path determined using a laser scanning device.
    Type: Grant
    Filed: February 9, 1998
    Date of Patent: May 8, 2001
    Inventors: John W. Powell, Matthew J. Dvornak, Charles C. King
  • Patent number: 6226555
    Abstract: A software logic controller using flowchart programming includes exception handling elements for handling exception conditions in a manufacturing process. Exception handling is programmed using a Begin Exception element to start monitoring the occurrence of a specific exception condition and an End Exception element to stop the monitoring process. Monitoring is conducted once during every scan cycle of the computer as long as the Begin Exception element is still active.
    Type: Grant
    Filed: May 14, 1998
    Date of Patent: May 1, 2001
    Assignee: Steeplechase Software, Inc.
    Inventors: Chuck E. Kallal, Mike W. Messick, Kevin P. Aretha, Jason A. McLees, David J. Gee, Richard L. Mahn, Don C. Stokes
  • Patent number: 6157873
    Abstract: A robot programming system is provided comprising a simulated work cell configuration, a tool position and orientation sensor assembly, and a programing computer. The simulated work cell configuration includes a tangible artificial tool and a tangible artificial workpiece, wherein the position and orientation of the artificial tool relative to the workpiece is variable. The sensor assembly is operative to sense the position and the orientation of the artificial tool. The programming computer is in communication with the sensor assembly and is programmed to (i) display a variable virtual robot configuration based upon the sensed position and orientation of the artificial tool, (ii) receive discrete artificial tool positions and orientations from the sensor assembly, and (iii) create a robot job data file including the discrete artificial tool positions and orientations.
    Type: Grant
    Filed: April 9, 1998
    Date of Patent: December 5, 2000
    Assignee: Motoman, Inc.
    Inventors: William Harold DeCamp, Brendan John Comerford, Gregory Webb
  • Patent number: 6144892
    Abstract: A gauging system is disclosed. The gauging system is adapted to determine the dimensions of an elongate workpiece. A movement assembly is provided for effecting relative longitudinal movement between the gauging device and the elongate workpiece so that the gauging device can repeatedly detect the diameter of the workpiece relative to reference positions along the length of the workpiece. This enables the profile of the workpiece to be accurately determined. The gauging device may comprise a laser gauge, or other non-contact gauge. Alternatively, the gauging device may comprise a contact gauge.
    Type: Grant
    Filed: February 10, 1998
    Date of Patent: November 7, 2000
    Assignee: Royal Master Grinders, Inc.
    Inventors: Charles J. Cheetham, Christopher J. Humme
  • Patent number: 6088627
    Abstract: A process for machining mechanical parts, including the milling of parts having a complex shape, includes the steps of determining the volume of the part to be machined, defining a corresponding machining grid, plotting the machining grid defined for the volume of the part to be machined, programming the plotted machining grid, and machining the part, grid line by grid line, according to the established programming. The process is implemented with an apparatus including a machining head coupled with a tool support. The tool support for the machining head (e.g., a cutting tool head) is positioned to face a predetermined point of the grid line to be machined, and immobilized. The machining head is mobilized to machine the desired grid line, with the tool support remaining fixed.
    Type: Grant
    Filed: June 6, 1997
    Date of Patent: July 11, 2000
    Assignee: Constructions Mecaniques des Vosges Marioni
    Inventor: Francois Wildenberg
  • Patent number: 6047225
    Abstract: An automatic programming apparatus comprises a machining unit preparing section for preparing plural machining units, a machining unit defining section for selecting a designated machining unit from the prepared machining units and designating the arrangement and size of the machining area of the selected machining unit, and an machined material creating section for creating a shape with the machining area shape removed from the material shape. The automatic programming apparatus and method for an NC machine which can easily create a machining program in complicated machining and also create a correct program quickly in complicated machining by trial and error.
    Type: Grant
    Filed: January 15, 1998
    Date of Patent: April 4, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kenji Iriguchi, Kiyotaka Kato, Susumu Matsubara
  • Patent number: 5999861
    Abstract: A method and apparatus is presented for designing an RF modular hybrid circuit assembly. The apparatus comprises a rule-based control mechanism, a graphical user interface and a library of RF hybrid elements including model front- and back-sides, and input/output instances. The method comprises the steps of initializing standardized front- and back-plane models, adding input/output instances along the perimeter of the back-plane, designing the hybrid circuit on the front-plane and combining the two planes to arrive at an RF modular hybrid layout design. A data library of RF hybrid elements is provided to facilitate rapid prototyping. The final design is then sent concurrently to a photo-plotter and a laser subsystem for printing the thick-film and cutting the PTHs respectively.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: December 7, 1999
    Assignee: Hewlett Packard Company
    Inventors: Lewis R. Dove, Daniel J. Miller