Abstract: A computer system that schedules loads across a set of processor cores is described. During operation, the computer system receives thermal measurements from sensors associated with the set of processor cores, and removes noise from the thermal measurements. Then, the computer system analyzes thermal properties of the set of processor cores based on the thermal measurements. Next, the computer system receives a process to be executed, and schedules the process to be executed by at least one of the processor cores based on the analysis. This scheduling is performed in a manner that reduces spatial and temporal thermal variations in the integrated circuit.

Abstract: Design structures, method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: A method of controlling a motor speed for a fan assembly includes receiving a duty cycle value at a microcontroller. The microcontroller receives a measured fan speed from a speed sensor. An expected fan speed is determined, where the expected fan speed corresponds to the duty cycle value. The measured fan speed is compared with the expected fan speed. A duty cycle of a motor driving signal is reduced if the measured fan speed is less than a predetermined fraction of the expected fan speed.

Abstract: An apparatus, system and method of integrating performance monitor data with thermal event information are provided. A thermal event, in this case, is when the temperature of a chip within which is embedded a processor exceeds a user-configurable value while the processor is processing instructions and/or using storage devices that are being monitored. In any event, when the thermal event occurs, the temperature of the chip along with the performance monitor data is stored for future uses, which include performance and diagnostic analyses.

Abstract: A method and system for testing a computer is presented. The temperature of the computer is controlled by one or more on-board fans inside the computer's enclosure. Voltages are controlled at the Voltage Regulator Module (VRM) level. A test program is then run under varying temperature and VRM voltages, and the results of the test program are logged. The present invention can be used either at the manufacturer's location or the customer's site, either under local or remote control.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: A graphical user interface for configuring parameters associated with a portable infrared imager is provided. The interface can be used to manually or automatically set range and span parameters. The interface can also be used to configure one or more alarms to notify a user that a detected temperature is outside a predetermined range. In some embodiments, a non-linear temperature scale can be displayed.

Abstract: A heat dissipation device for cooling an electronic device. The heat dissipation device comprises a fan, a controller connected to the fan and coupled to the electronic device and a sensor connected to the controller and sending a first signal to the controller by detecting a temperature variation in the electronic device. The electronic device sends a second signal to the controller, the controller changes the speed of the fan according to either the first signal or the second signal.

Abstract: An integrated circuit comprises a power device located on a die. The power device is operably coupled to a processing function, wherein the signal processing function is operably coupled to two or more temperature sensors. A first temperature sensor is operably coupled to the power device to measure a temperature of the power device and the second temperature sensor is located, such that it measures a substantially ambient temperature related to the die. The signal processing function determines the temperature gradient therebetween.

Abstract: A method and apparatus for automatically sensing the temperature of a battery during the testing and charging. The method and apparatus can monitor the temperature of the battery, the charger or both. Additionally, a user can be notified when the temperature is at or exceeds a predetermined level. The temperature data is also used to aid in efficiently charging the battery.

Abstract: The present invention provides a method for cooling a CPU. The method includes the steps of: setting a passive cooling mode; setting a critical temperature and a reference temperature that is lower than the critical temperature; setting a plurality of temperature intervals between the reference temperature and the critical temperature; predetermining a duty cycle corresponding to each temperature interval; detecting a current temperature of the CPU; comparing the current temperature with the reference temperature and the critical temperature; entering into the passive cooling mode if the current temperature is between the reference temperature and the critical temperature; confirming which temperature interval the current temperature falls in; confirming a corresponding predetermined duty cycle according to the temperature interval; and switching the CPU between a working status and a sleeping status according to the confirmed predetermined duty cycle. A related system is also disclosed.

Abstract: An implantable drug infusion pump for delivering drug therapy is made more reliable and its performance improved by monitoring drug pump temperature. Monitoring pump temperature can also provide for temperature-related drug therapy modification. A pump temperature sensor is read by the infusion pump's microprocessor. Pump temperature data is stored in pump memory for later access by a remote controller. A simple thermistor or semiconductor temperature sensor can provide fast and reliable temperature monitoring of the pump and/or of a patient by reading the temperature sensor's value and calculating a temperature therefrom.

Abstract: Monitoring method and system are provided for dynamically determining flow rate of a first fluid and a second fluid through a heat exchanger. The method includes: pre-characterizing the heat exchanger to generate pre-characterized correlation data correlating effectiveness of the heat exchanger to various flow rates of the first and second fluids through the heat exchanger; sensing inlet and outlet temperatures of the first and second fluids through the heat exchanger, when operational; automatically determining flow rates of the first and second fluids through the heat exchanger using the sensed inlet and outlet temperatures of the first and second fluids and the pre-characterized correlation data; and outputting the determined flow rates of the first and second fluids. The automatically determining employs the determined effectiveness of the heat exchanger in interpolating from the pre-characterized correlation data the flow rates of the first and second fluids.

Abstract: Systems and methods of overheat detection provide for generating a control signal on a die containing a processor based on an internal temperature of the processor and a control temperature threshold. It can be determined whether to generate a warning temperature event on the die based on a behavior of the control signal. In one embodiment, the warning temperature event provides for initiation of an automated data saving process, which reduces the abruptness of conventional warning temperature shutdowns. Other embodiments provide the user the option of saving his or her work before a shutdown temperature threshold is reached.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A thermal management method of operation to cool critical heat generating components and when a critical electronic component approaches its designated maximum operation temperature or its rate of temperature increase is determined to be in excess a predetermined level, its operating speed is reduced in small increments (1% to 5%), and/or a cooling fan speed it increased in small increments, (1% to 5%), and, if necessary, operation of a variable capacity heat transfer component is induced to cool the critical component.

Abstract: Methods, apparatus, and products for detecting an increase in thermal resistance of a heat sink in a computer system, the heat sink dissipating heat for a component of the computer system, the computer system including a fan controlling airflow across the heat sink, the computer system also including a temperature monitoring device, including: measuring, by a monitoring module through use of the temperature monitoring device during operation of the computer system, thermal resistance of the heat sink; determining whether the measured thermal resistance of the heat sink is greater than a threshold thermal resistance, the threshold thermal resistance stored in a thermal profile in non-volatile memory, and if the measured thermal resistance of the heat sink is greater than the threshold thermal resistance, notifying a system administrator.

Abstract: One embodiment of the present invention provides a multi-chip package including a logic device providing a clock signal having a frequency and a memory device. The memory device receives the clock signal and operates at the clock signal frequency. The memory device includes a temperature sensor providing a temperature signal indicative of a temperature of the memory device, wherein the logic device adjusts the clock signal frequency bases on the temperature signal.

Abstract: A computer system that schedules loads across a set of processor cores is described. During operation, the computer system receives thermal measurements from sensors associated with the set of processor cores, and removes noise from the thermal measurements. Then, the computer system analyzes thermal properties of the set of processor cores based on the thermal measurements. Next, the computer system receives a process to be executed, and schedules the process to be executed by at least one of the processor cores based on the analysis. This scheduling is performed in a manner that reduces spatial and temporal thermal variations in the integrated circuit.

Abstract: An electrical load is supplied with power from a driving power source, and a microprocessor (CPU) controls the opening/closing current supply rate (duty factor) of an opening/closing element in accordance with target current and driving power source voltage so that open loop control is carried out to achieve predetermined target current. The voltage between both the ends of a current detecting resistor connected to the ground side of the opening/closing element is input as a monitoring voltage from a current detecting amplifying circuit portion through a multichannel AD converter to CPU. When the error between the comparison target voltage corresponding to the target current and the monitoring voltage is above a first permissible error, CPU judges that there is an abnormality sign, and if the error is above a larger second permissible error, CPU judges that there is appearing abnormality.

Abstract: An apparatus comprises a matrix of thermoelectric devices for applying thermal gradients across an electronic component mounted in a PCB substrate within an enclosed housing. A matrix of thermosensitive devices are placed around the perimeter of the electronic component to measure thermal gradients associated with the component. A controller controls the matrix of thermoelectric devices based on the thermal gradients measured by the matrix of thermosensitive devices with a matrix of thermocouple coefficients.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: Methods and apparatus to manage throttling in computing environments are described herein. One example method may include receiving an indication that a first memory module has reached a temperature and remapping information from the first memory module to a second memory in response to the received indication. Other methods are described.

Abstract: A method, apparatus, and system are disclosed. In one embodiment the method detects a temperature event in a processor and then modifies the bus frequency of an I/O bus coupled to an I/O controller hub in response to the temperature event. In another embodiment, the apparatus includes a temperature detection unit that detects a temperature event in a processor and, additionally, a bus frequency modification unit that will modify the bus frequency of an I/O bus in response to the temperature event.

Abstract: A temperature averaging thermal sensor is implemented in an integrated circuit such as a microprocessor. The temperature averaging thermal sensor monitors the temperature of the integrated circuit in a plurality of different locations across the integrated circuit, calculates an average temperature and generates an output to indicate that the average temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Sense circuitry reads the programmable input values and generates an interrupt when the temperature of the microprocessor reaches a threshold temperature.

Abstract: A system, a method, and an article of manufacture for adjusting CO emission levels in predetermined locations in a boiler system are provided. The boiler system has a plurality of burners and a plurality of CO sensors disposed therein. The system determines locations within the boiler system that have relatively high CO levels utilizing the plurality of CO sensors and then adjusts A/F ratios of burners affecting those locations to decrease the CO levels at the locations.

Abstract: In one embodiment, an apparatus is constituted with a temperature sensing circuit adapted to be coupled to a current sources circuit, and configured to measure a circuit temperature and to generate a temperature-indicating signal in response to the circuit temperature and an adjustable current output by the current sources circuit; a reference voltage circuit to be coupled the current sources circuit and configured to provide a reference signal in response to a reference current output by the current sources circuit; and a trip generator circuit coupled to the temperature sensing circuit and the reference voltage circuit and configured to generate a trip point signal if a difference between the reference and the temperature-indicating signals indicates that a threshold circuit temperature has been reached or exceeded.

Abstract: Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

Abstract: A combination weather station and USB hub having an AC power source and a heat sink. The heat sink serves to dissipate heat generated by the AC power source and the internal components of the hub, in order to prevent the temperature readings of the weather station's thermometer from being compromised.

Abstract: A thermal overload protection for an electrical device, particularly an electric motor (M), measures a load current supplied to the electrical device (M), and calculates the thermal load on the electrical device on the basis of the measured load current, and shuts off (S2) a current supply (L1, L2, L3) when the thermal load reaches a given threshold level. The protection comprises a processor system employing X-bit, preferably X=32, fixed-point arithmetic, wherein the thermal load is calculated by a mathematic equation programmed into the microprocessor system structured such that a result or a provisional result never exceeds the X-bit value.

Abstract: A measuring apparatus for measuring the thermal resistance of a heat dissipating device, the heat dissipating device includes a fan and a heat sink. The measuring apparatus includes a base, and a fixing member. The base receives a heat element and the heat sink therein. The base includes a bottom wall, and two opposite sidewalls perpendicular to the bottom wall. The fixing member is placed on the heat sink, and two ends of the fixing member are slidably connected to the sidewalls of the base. A plurality of groups of fixing holes is defined in the fixing member for fixing different size fans.

Abstract: The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without comprising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: Network architecture, computer system and/or server, circuit, device, apparatus, method, and computer program and control mechanism for managing power consumption and workload in computer system and data and information servers. Further provides power and energy consumption and workload management and control systems and architectures for high-density and modular multi-server computer systems that maintain performance while conserving energy and method for power management and workload management. Dynamic server power management and optional dynamic workload management for multi-server environments is provided by aspects of the invention. Modular network devices and integrated server system, including modular servers, management units, switches and switching fabrics, modular power supplies and modular fans and a special backplane architecture are provided as well as dynamically reconfigurable multi-purpose modules and servers.

Abstract: There is provided an electronic apparatus including a plurality of hard disk drives having a standby state and an active state as power application state. The electronic apparatus includes a drive setting portion to set each of the plurality of hard disk drives to a cache hard disk drive or a storage hard disk drive so as to use one hard disk drive in the active state as a cache hard disk drive and use a remaining hard disk drive as a storage hard disk drive, and a power control portion to control application of power to each of the hard disk drives according to setting by the drive setting portion.

Abstract: A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.

Abstract: The present invention provides a method, an apparatus, and a computer program product for measuring the temperature of a microprocessor through the use of ESD circuitry. The present invention uses diodes and an I/O pad within ESD circuits to determine the temperature at the location of the ESD circuitry. First, a current measuring device connects to a diode. A user or a computer program disables the protected component or circuitry, and subsequently applies a predetermined voltage to the I/O pad. This creates a reverse saturation current through the diode, which is measured by the current measuring device. From this current the user or a computer program determines the temperature of the microprocessor at the diode through the use of a graphical representation of diode reverse saturation current and corresponding temperature.

Abstract: A method for determining an exhaust gas temperature of an internal combustion engine, which is performed by measuring a lambda value of the exhaust gas of the internal combustion engine and calculating a calculated exhaust gas temperature as a function of the measured lambda value, and comparing the calculated exhaust gas temperature with a measured exhaust gas temperature and adapting a function used for the calculation as a function of the comparison.

Abstract: An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

Abstract: A virtual ?T trip criterion is implemented in an electrical power distribution system to provide current-based tripping for a solid state power switching device. A first-order system model is implemented either by hardware or software to represent a rise in temperature of the electrical wire through which power is supplied. When the simulated temperature exceeds a threshold, the solid state power switching device may be tripped.

Abstract: Thermal subsystems of manufactured information handling systems are tested for compliance with desired parameters by running a thermal diagnostics module in firmware during one or more manufacturing activities performed on the information handling system. The thermal diagnostics module monitors and stores one or more thermal parameters detected at the information handling system, such as the maximum temperature zone detected during a manufacturing activity. The stored thermal parameter is read after the manufacturing activity and compared with an expected value to determine the status of the thermal subsystem. For instance, an information handling system maximum operating temperature is detected by firmware running on an embedded controller during imaging of a hard disk drive and fails thermal testing if the detected maximum operating temperature exceeds a predetermined value, such as a value that would not be reached if the thermal subsystem functioning properly.

Abstract: A printer and a method of driving a cooling fan of the printer include a storage unit temporarily stores printing option data and image data, and a control unit controls an operation of a printing unit in one of a warming-up mode, a standby mode, a printing mode and a sleep mode based on the printing option data and the image data as inputted into the control unit. The control unit outputs a control signal variably controlling an RPM (Rotation Per Minute) of the cooling fan based on the operation mode and a printing speed of the printing unit. A cooling fan driving unit drives the cooling fan at a different RPM based on the control signal input from the control unit. Accordingly, the printer and the method of driving the cooling fan of the printer are capable of shortening the warming-up time to increase an initial printing speed, preventing the printing unit from being overheated, extending a lifespan of the cooling fan, and reducing a power consumption.

Abstract: To provide a data processing device with cooling fan capable of executing data processing by using a processor which always works within the maximum range of its specifications. In the data processing device with cooling fan 3 for cooling down the processor 1 that performs data processing, the device includes: a working rate calculating section 4 for calculating the working rate of the processor 1; and a control section 5 for activating the cooling fan 3 when the value of the working rate reaches or exceeds a predetermined reference value.

Abstract: A mechanism for utilizing a single set of one or more thermal sensors, e.g., thermal diodes, provided on the integrated circuit device, chip, etc., to control the operation of the integrated circuit device, associated cooling system, and high-frequency PLLs is provided. By utilizing a single set of thermal sensors to provide multiple functions, e.g., controlling the operation of the integrated circuit device, the cooling system, and the PLLs, silicon real-estate usage is reduced through combining circuitry functionality. Moreover, the integrated circuit device yield is improved by reducing circuitry complexity and increasing PLL robustness to temperature. Furthermore, the PLL circuitry operating range is improved by compensating for temperature.

Abstract: A scheme to facilitate deterministic thermal management by having either device connected via a link to generate a thermal management request based on one device's thermal capability and the present conditions. The request is transmitted over the link to the other device with a specific sleep period. Consequently, the receiving device responds with an acknowledgement within a pre-configured or pre-agreed response time.

Abstract: A thermal management system according to an embodiment of the present invention includes first and second thermo sensors embedded in a chip, a trimming control circuit which determines a characteristic of the first thermo sensor based on a trimming value, a nonvolatile memory which stores trimming data relating the characteristic of the first thermo sensor in an initial state and a system controller which provides temperature data to the trimming control circuit, wherein the temperature data relates a chip temperature detected by the second thermo sensor, wherein the trimming control circuit updates the trimming value based on the temperature data and the trimming data.

Abstract: Disclosed are embodiments of an improved on-chip temperature sensing circuit, based on bolometry, which provides self calibration of the on-chip temperature sensors for ideality and an associated method of sensing temperature at a specific on-chip location. The circuit comprises a temperature sensor, an identical reference sensor with a thermally coupled heater and a comparator. The comparator is adapted to receive and compare the outputs from both the temperature and reference sensors and to drive the heater with current until the outputs match. Based on the current forced into the heater, the temperature rise of the reference sensor can be calculated, which in this state, is equal to that of the temperature sensor.

Abstract: A method and associated algorithm for controlling and optimizing the temperature of a device under test (DUT) through calculation of a moving setpoint which varies from the user-specified DUT core temperature. The method generally comprises (i) calculating a system operating range based on limits imposed by the DUT, associated temperature control system, and thermal conditioning equipment; (ii) determining the allowable operating range for the DUT based on permissible DUT stress and DUT core temperature; and (iii) calculating a control setpoint based on DUT and conditioning system temperature data, one or more pre-selected setup factors, and the system and DUT operating ranges. In another aspect of the invention, variable temperature differential limits are imposed on the CSP as a function of DUT core temperature in order to mitigate thermal shock to the DUT. Methods and apparatus for latent temperature control are also disclosed.

Abstract: Embodiments of the present invention provide a system that characterizes the reliability of a computer system. The system first collects samples of a performance parameter from the computer system. Next, the system computes the length of a line between the samples, wherein the line includes a component which is proportionate to a difference between values of the samples and a component which is proportionate to a time interval between the samples. The system then adds the computed length to a cumulative length variable which can be used to characterize the reliability of the computer system.

Abstract: Design structures, method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: The present invention supports power management modes which includes (1) a maximum power performance mode, (2) a battery-optimized mode, and (3) a performance/optimization cycling mode for performing the maximum performance mode and the battery-optimized mode alternately within a prescribed period of time. The cycling mode allows flexibility in power management and faster charging of the battery.