Abstract: Design structures, method and systems of powering on an integrated circuit (IC) are disclosed. In one embodiment, the system includes a region in the IC including functional logic, a temperature sensor for sensing a temperature in the region when the IC is powered up and a heating element therefor; a processing unit including: a comparator for comparing the temperature against a predetermined temperature value, a controller, which in the case that the temperature is below the predetermined temperature value, delays functional operation of the IC and controls heating of the region of the IC, and a monitor for monitoring the temperature in the region; and wherein the controller, in the case that the temperature rises above the predetermined temperature value, ceases the heating and initiates functional operation of the IC.

Abstract: A mechanism for utilizing a single set of one or more thermal sensors, e.g., thermal diodes, provided on the integrated circuit device, chip, etc., to control the operation of the integrated circuit device, associated cooling system, and high-frequency PLLs is provided. By utilizing a single set of thermal sensors to provide multiple functions, e.g., controlling the operation of the integrated circuit device, the cooling system, and the PLLs, silicon real-estate usage is reduced through combining circuitry functionality. Moreover, the integrated circuit device yield is improved by reducing circuitry complexity and increasing PLL robustness to temperature. Furthermore, the PLL circuitry operating range is improved by compensating for temperature.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without comprising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: Numerous embodiments of a method to allow for adaptive performance margining of processing components on a carrier substrate are described. In one embodiment, the temperature of a processing component disposed on motherboard is measured and determined whether the temperature falls within a performance margining range. The processing speed of the component is then increased or maximized based on the performance margining range.

Abstract: The present invention provides an automated configuration system and method for electronics enclosures. The system receives user requirements generates a configuration including placement schedule, power usage schedules and heat flow schedules. Included as output of the system is a bill of materials, an equipment layout drawing and pricing based on predetermined material and labor pricing. Methods for generating a configuration are described that include iteratively repeating combinations of the steps of generating design rules, deriving a placement schedule, mapping the distribution of power usage within the enclosure and producing a heat flow analysis. Processes used to generate the configuration can be controlled by design rules derived from user requirements.

Abstract: An apparatus, system and method of integrating performance monitor data with thermal event information are provided. A thermal event, in this case, is when the temperature of a chip within which is embedded a processor exceeds a user-configurable value while the processor is processing instructions and/or using storage devices that are being monitored. In any event, when the thermal event occurs, the temperature of the chip along with the performance monitor data is stored for future uses, which include performance and diagnostic analyses.

Abstract: A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.

Abstract: A thermal management method of operation to cool critical heat generating components and when a critical electronic component approaches its designated maximum operation temperature or its rate of temperature increase is determined to be in excess a predetermined level, its operating speed is reduced in small increments (1% to 5%), and/or a cooling fan speed it increased in small increments, (1% to 5%), and, if necessary, operation of a variable capacity heat transfer component is induced to cool the critical component.

Abstract: Systems and methods of thermal management provide for dynamically the upper and lower operating points of a throttled device such as a processor. In one embodiment, it is determined that the temperature of the processor is below a threshold and moving the upper operating point and the lower operating point toward one another.

Abstract: A method of dynamically configuring a temperature profile in an integrated circuit (IC). The method includes sensing temperature of the IC, configuring a reduced operating temperature range for the IC, and modulating at least one control mechanism to maintain the temperature of the IC within the reduced operating temperature range. The configuring includes precluding configuration of the reduced operating temperature range at unauthorized privilege levels.

Abstract: A system and method is disclosed that provides a thermal shutdown circuit that generates a plurality of temperature warning flag signals. Each temperature warning flag signal represents a different temperature. The thermal shutdown circuit comprises a plurality of inverter circuits in which each inverter circuit has a different temperature turn-on threshold. A temperature to binary code converter receives the temperature warning flag signals from the inverter circuits and generates a plurality of binary coded signals that represent a temperature that is detected by the thermal shutdown circuit. A host controller unit uses the temperature information from the binary coded signals to shut down subsystems in advance of an abrupt thermal shutdown of a system.

Abstract: An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.

Abstract: Some embodiments of the invention may operate to measure a first output performance metric value associated with a current operation frequency of a processor, to set a trial operation frequency of the processor, and to measure a second output performance metric value associated with the trial operation frequency. If the measured performance variation is less than a specified acceptable performance variation, the trial operation frequency may be selected as a subsequent determined operation frequency.

Abstract: Systems, methodologies, media, and other embodiments associated with simulating a processor performance state by controlling a thermal management signal are described. One exemplary system embodiment includes a data structure for storing bit patterns that facilitate controlling a GPIO (General Purpose Input Output) block and addresses of locations to which the bit patterns can be written. The example system may also include a logic configured to receive a request to produce a performance state in a processor and to cause a frequency and voltage to be established in the processor in response to a thermal management signal being generated in response to writing the bit pattern(s) to the address(es).

Abstract: An integrated circuit comprises a power device located on a die. The power device is operably coupled to a processing function, wherein the signal processing function is operably coupled to two or more temperature sensors. A first temperature sensor is operably coupled to the power device to measure a temperature of the power device and the second temperature sensor is located, such that it measures a substantially ambient temperature related to the die. The signal processing function determines the temperature gradient therebetween. In this manner, improved reliability of the integrated circuit and power device is obtained, as the power device utilises the fact that its thermo-mechanical stress reliability strongly depends upon the temperature gradient across the die rather than the number of times it reaches an excessive temperature.

Abstract: Apparatuses, methods, and systems associated with and/or having components capable of, detecting a temperature of an integrated circuit in real time during testing are disclosed herein. In exemplary embodiments, an integrated circuit includes a register to store a temperature limit for the integrated circuit; a temperature sensor formed on the integrated circuit to sense a temperature of the integrated circuit, and output a signal indicative of the temperature sensed, based at least in part on the temperature sensed; and testing logic coupled to the register and the temperature sensor to record a temperature violation if at any time during a testing mode of operation the temperature sensed by the temperature sensor violates the stored temperature limit.

Abstract: A method for cooking a cooking load includes at least two particularly individual items for cooking, the cooking state of which is characterized by at least two cooking state parameters, including a first cooking state parameter and a second cooking state parameter, in a cooking chamber with application of at least one measuring device for recording values of at least one property of at least one cooking load, for determining at least one of said cooking state parameters, which alters depending on the cooking process, whereby at least two of the items for cooking in the cooking load, differ in size, total surface area, volume, weight and/or diameter, in particular, mean diameter.

Abstract: Thermal control for a controller in a data processing environment is described. In one embodiment, the invention includes detecting a temperature of a semiconductor device at a thermal sensor on the semiconductor device, comparing the detected temperature to a threshold, and generating a high interrupt if the temperature is above the threshold and a low interrupt if the temperature is below the threshold.

Abstract: Provided are a memory controller for controlling a refresh cycle of a memory and a method thereof. In this method, a temperature measure command is generated to measure an operating temperature of the memory. Next, a measured temperature in response to the temperature measure command is received. Then, a temperature difference between the measured temperature and a reference temperature is detected if the measured temperature is different from the reference temperature to change the refresh cycle according to the temperature difference, and if the measured temperature is equal to the reference temperature the method returns to the temperature measure command generating step. Thereafter, a refresh command is applied to the memory in response to the changed refresh cycle.

Abstract: The present invention relates to a temperature sensing device with a first temperature sensor mounted to a housing at a first location proximate a first surface of the housing. The first temperature sensor senses a first temperature while a second temperature sensor senses a second temperature. A processor circuit is coupled to the first and second temperature sensors and a mounting device is coupled to either the housing or the processor circuit. The mounting device mounts the second temperature sensor at a second location proximate a second surface of the housing which is spaced apart from the first surface. The processor circuit is configured to estimate a third temperature based on the first and second temperatures and a distance between the first and second locations which is an estimate of a temperature at a third location.

Abstract: The present invention is directed to the detection of faulty CPU heat sink coupling during system power-up. A method in accordance with an embodiment of the present invention includes: monitoring a slope of a CPU temperature rise from initial system power-up; determining if the slope of the CPU temperature rise exceeds an expected value; and in the case that the slope of the CPU temperature rise exceeds the expected value, indicating an existence of a possible fault (PFA) related to a heat sink coupled to the CPU.

Abstract: The invention relates to a method for temperature management in a network (1) with ring topology, wherein control devices (2) exchange data via the network (1) by means of transmitting/receiving units. The object of the present invention is to find a method and a data bus system which increases the fail safety of a network (1) with ring topology. For this purpose, the temperature near to the transmitting/measuring unit of at least one control device (2) is measured. As soon as the temperature at the transmitting/receiving unit (2) of the control device exceeds a predefined critical temperature Tkrit, the transmitting/receiving unit is switched off and wakeup requests put onto the network (1) by the control devices (2) are blocked.

Abstract: A computer implemented method, data processing system, and computer usable code are provided for generation of hardware thermal profiles for a set of processors. Sampling is performed of the thermal states of the set of processors during the execution of a set of workloads to create sampled information. The sampled information and thermal characteristics of the set of processors are combined and a thermal index is generated based on the sampled information and characteristics of the set of processors.

Abstract: An information processing apparatus provides control of power consumption of multiple central processors. The apparatus includes, sections for: measuring temperature of each central processor; calculating halt percentage for each of the central processors from measured temperatures halt percentages and a particular thread executed in each of the central processors; transitioning to a wait state in which a central processor executes another thread during a predetermined wait period or a running state in which an internal halt instruction is executed causing the central processor to halt processing in accordance with the halt percentage; and interrupting each of the central processors and causing a central processor that is halting processing to resume processing.

Abstract: Thermal conditions within a computer unit are monitored. A system-level temperature sensor responds to intake cooling air. A subsystem-level temperature sensor responds to the temperature of a subsystem-level component, preferably a motherboard or a backplane. When the temperature sensed by of the system-level temperature sensor falls outside of a critical limit, it is determined whether the temperature sensed by the subsystem-level temperature sensor generally correlates with the temperature sensed by the system-level temperature sensor. If there is no correlation, the operation of the computer unit is continued.

Abstract: Apparatuses, methods, and systems associated with and/or having components capable of, detecting a temperature of an integrated circuit in real time during testing are disclosed herein. In exemplary embodiments, an integrated circuit includes a register to store a temperature limit for the integrated circuit; a temperature sensor formed on the integrated circuit to sense a temperature of the integrated circuit, and output a signal indicative of the temperature sensed, based at least in part on the temperature sensed; and testing logic coupled to the register and the temperature sensor to record a temperature violation if at any time during a testing mode of operation the temperature sensed by the temperature sensor violates the stored temperature limit.

Abstract: An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.

Abstract: A controller implements a state machine for operating the bi-directional power converter with a flexible load pattern while maintaining a thermal condition of the power converter within acceptable limits. The state machine implements a wait loop in response to selected conditions to maintain the thermal condition.

Abstract: A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.

Abstract: A method for reducing instantaneous current on startup is applicable to an electronic device with a management controller. The management controller is electrically connected to a startup processing module of the electronic device such that operations of fans equipped in the electronic device can be controlled via this electrical connection relationship. When the electronic device is turned on, operations of the fans in the electronic device are disabled by the startup processing module. Then, when power is detected by the management controller, the smallest amount of current possible for operations of the fans for heat-dissipating purpose is generated by the management controller. Finally, hardware components in the electronic device are initialized by the management controller. The above method solves the problem of system instability due to large instantaneous current on startup in the prior art.

Abstract: A system for protecting against overheating of a CPU whose operation frequency is changed due to voltage variation of a driving power, includes a CPU temperature sensor to detect the temperature of the CPU, a reference temperature sensor to detect the temperature of a circuit block or multiple circuits heated due to the operation frequency of the CPU, a comparing part to output a signal indicating a higher temperature of the temperature of the CPU and the temperature of the circuit block or multiple circuits by comparing temperature values detected by the respective CPU and reference temperature sensors, and a CPU power supply to supply a stepwise decreasing driving power to decrease the operation frequency of the CPU in a stepwise fashion when the temperature value increases based on the signal indicating the higher temperature indicated by the comparing part.

Abstract: Detecting, predicting, and diagnosing faults in a cooling system. According to one embodiment, a heat sink is in thermal contact with a heat-generating electronic component. When a temperature differential between the electronic component and the heat sink exceeds a set point, a fault signal is generated. The set point may be empirically or theoretically determined. The set point may be a static set point, or it may be a dynamic set point determined according to real-time operational parameters of the system. The system may be implemented with predictive failure analysis (PFA) to provide a more reliable, efficient, inexpensive, and robust computer system.

Abstract: A fan control apparatus and method to reduce the temperature in an equipment body by a time control when setting a stop period constant at the start by adding a time axis fan control by means of a temperature sensor. The fan control apparatus includes a temperature sensor that detects the temperature in the equipment body; a CPU and a sub-microcomputer perform the control of the cooling fans according to the detected temperature value. The CPU performs communication with a server connected to the equipment body via a network, and the CPU and sub-microcomputer perform the control of the cooling fans according to the time value based on a previous communication start and the present communication start.

Abstract: Detecting, predicting, and diagnosing faults in a cooling system. According to one embodiment, a heat sink is in thermal contact with a heat-generating electronic component. When a temperature differential between the electronic component and the heat sink exceeds a set point, a fault signal is generated. The set point may be empirically or theoretically determined. The set point may be a static set point, or it may be a dynamic set point determined according to real-time operational parameters of the system. The system may be implemented with predictive failure analysis (PFA) to provide a more reliable, efficient, inexpensive, and robust computer system.

Abstract: An exemplary method for automatically detecting a type of a CPU fan includes: setting a PWM duty cycle of the CPU fan to a value of 100%; obtaining revolutions of the CPU fan at the PWM duty cycle in a fixed time period; calculating an RPM of the CPU fan as a full RPM; setting the PWM duty cycle of the CPU fan to another value below 100%; obtaining the revolutions of the CPU fan in the fixed time period, and calculating the RPM of the CPU fan as a test RPM; determining whether the test RPM is less than the full RPM; identifying the type of the CPU fan as a four-pin CPU fan if the test RPM is less than the full RPM; and identifying the type of the CPU fan as a three-pin CPU fan if the test RPM is not less than the full RPM.

Abstract: A manufacturer determines a maximum ambient temperature for an electronic device to be manufactured. The device has a data processor equipped with a utilization monitor. A test unit of the device is manufactured and placed under test at the maximum ambient temperature. The manufacturer during this test stage runs the application software for the electronic device at this time, in the test state. The temperature of the processor and its utilization reading are observed If the processor temperature increases out of range, then the software should be changed to utilize less processing capacity of the processor. A suitable reduction or adjustment in the software is determined, and the utilization amount is stored in memory. The electronic device is constructed with the alert circuitry and process. Hence, if the user should task the processor beyond the predetermined limit, the electronic device communicates that to the user.

Abstract: A method of controlling a motor speed for a fan assembly includes receiving a duty cycle value at a microcontroller. The microcontroller receives a measured fan speed from a speed sensor. An expected fan speed is determined, where the expected fan speed corresponds to the duty cycle value. The measured fan speed is compared with the expected fan speed. A duty cycle of a motor driving signal is reduced if the measured fan speed is less than a predetermined fraction of the expected fan speed.

Abstract: In some embodiments, an apparatus comprises a thermal sensor to detect a first temperature reading at a location proximate a buffer circuit at a first point in time and to detect a second temperature reading at a location proximate a buffer circuit at a second point in time, logic to generate a buffer compensation activation signal when the second temperature reading differs from the first temperature reading by an amount exceeding a threshold, and logic to transmit the buffer compensation activation signal to a buffer compensation module. Other embodiments are described.

Abstract: The present invention provides a one-chip microcomputer that can realize the control of cooling equipment, the control of the brightness of a display device, and the control of the charge and discharge of a battery without mounting an analog circuit. The one-chip microcomputer is used in a notebook-size personal computer, and comprises: a CPU that performs operation processing; a CPG that generates a clock signal; a flash memory that stores a control program; a RAM that sores data; an 8-bit timer that controls fans; and a 14-bit timer that controls an LCD brightness controller of an LCD and a voltage charger of batteries. The one-chip microcomputer controls the fans by the 8-bit timer without mounting the analog circuit and can adjust the LCD brightness by the 14-bit timer.

Abstract: A method and corresponding software for automatically validating a computer platform thermal solution. An application program is employed to selectively execute thermal stress code to cause the platform's processor to dissipate an amount of power corresponding to a predetermined value, such as a thermal design power dissipation value specified by the processor's manufacturer. In one embodiment, tests are performed while operating at this power dissipation level to determine if a thermal overload condition exists, which may be determined by the processor's temperature, an indication that the processor is throttled, or a signal provided by the processor indicating the processor has detected a thermal overload condition. In another embodiment, a thermal resistance value is calculated based on the processor power dissipation, the temperature of the processor, and the ambient temperature of the test environment.

Abstract: According to one embodiment of the invention, a task management section of an operating system is notified of temperature abnormality by the notification that the rotation rate of the cooling fan reaches a specified rate, it executes measures to reduce the load of the processor: for example, (1) discriminating a program that does not require real-time execution, with reference to the task management table and forcibly stopping the program; (2) discriminating a program that requires real-time execution and that is in operation in a normal status, with reference to the task management table, and simplifying or omitting a process of the program; and (3) discriminating a program of a low priority of real-time execution from the programs that require real-time execution, with reference to the task management table, and forcibly stopping the program.

Abstract: Thermal subsystems of manufactured information handling systems are tested for compliance with desired parameters by running a thermal diagnostics module in firmware during one or more manufacturing activities performed on the information handling system. The thermal diagnostics module monitors and stores one or more thermal parameters detected at the information handling system, such as the maximum temperature zone detected during a manufacturing activity. The stored thermal parameter is read after the manufacturing activity and compared with an expected value to determine the status of the thermal subsystem. For instance, an information handling system maximum operating temperature is detected by firmware running on an embedded controller during imaging of a hard disk drive and fails thermal testing if the detected maximum operating temperature exceeds a predetermined value, such as a value that would not be reached if the thermal subsystem functioning properly.

Abstract: An electronic system includes a device and a controller to the device. The controller is adapted to calculate a temperature estimate of the device and to control access to the device in accordance with the calculated temperature estimate.

Abstract: Multiple logic cores of integrated circuits and processors may be configured to operate at frequencies and voltages independently of each other. Additionally, other components, such as a common bridge configured to interface with the logic cores, may operate at a voltage and frequency independent of the voltage and frequency at which the logic cores are operating. The operating frequency and/or voltage of a logic core may be independently adjusted for various reasons, including power management and temperature control. Logic circuitry at an interface between the controller and the logic cores may translate logic signals from one voltage and/or frequency to another to enable communication between the bridge and the logic core when the two are operating at different voltages and/or frequencies.

Abstract: A method of protecting a rotating device, loaded by temperature of a machine tool with one temperature sensor on that device and a temperature bloc, comprising the steps of inputting specific parameters in the temperature bloc, estimating a value for the device temperature increase caused by the activity of the device and measuring the temperature of the device.

Abstract: Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.

Abstract: A method includes detecting a change in temperature in an integrated circuit that is coupled to a differential communication link, and responding to the detected change in temperature by initiating a retraining process for the differential communication link.

Abstract: A device to control memory bandwidth including a processing unit and a memory connected to the processing unit, the memory having a memory controller driver to issue at least one command based on a memory bandwidth requirement of another driver process. A memory controller to direct data to and from the memory. An active cooling device is connected to the processing unit and a thermal sensor.

Abstract: A method includes providing an integrated circuit (IC) having a plurality of oscillators at distributed locations in the IC, determining a respective rate of oscillation of each of the oscillators, and detecting variations in local temperature in the IC based on the determined rates of oscillation. Other embodiments are described and claimed.

Abstract: A serial communication system includes an integrated circuit having a master serial interface; and a processor having a slave serial interface coupled to the master serial interface through a clock signal line and a data signal line. The slave serial interface is responsive to a read temperature command issued by the master serial interface to return a first temperature value associated with the processor.