Abstract: An efficient method of boxing fuel injectors with a good yield where a predetermined quality is secured in a predetermined number of fuel injectors forming a set for one engine, that is, a method of boxing fuel injectors, a first number of which are scheduled to be mounted in an engine, in a single box in a second number larger than the first number, provided with a step of measuring a characteristic value for the second number of fuel injectors, wherein when the first number of the characteristic values forms a set, the number of combinations of the characteristic values where a total value of this one set's worth of the characteristic values becomes a first management value or less when selecting one set's worth of the characteristic values from the second number of the characteristic values, is defined as the “number of good part combinations”, and the number of possible combinations of one set's worth of the characteristic values is defined as the “number of possible combinations”, the fuel injectors bein

Abstract: An improved quality assurance system and method for point-of-care testing are disclosed. The present invention provides quality assurance for laboratory quality tests performed by a blood analysis system or the like at the point of patient care without the need for running liquid-based quality control materials on the analysis system. Quality assurance of a quantitative physiological sample test system is performed without using a quality control sample by monitoring the thermal and temporal stress of a component used with the test system. Alert information is generated that indicates that the component has failed quality assurance when the thermal and temporal stress exceeds a predetermined thermal-temporal stress threshold. Alternatively, the present invention provides quality assurance for laboratory quality tests performed by a blood analysis system or the like at the point of patient care by minimizing the need for running liquid-based quality control materials on the analysis system.

Abstract: A method for creating a new model of a manufacturing process according to a multivariate analysis including selecting a set of data representative of multidimensional data measured during a step or phase of a manufacturing process. The method also includes determining a set of model generation conditions based on the set of data and generating the new model specifying intervals for the multidimensional data measured during a future manufacturing process based on the set of model generation conditions.

Abstract: Apparatuses and method capable of reliably tracking processes through which products have passed without calling for expensive setup are necessary in production and distribution processes of the products. A process management apparatus including a data transmission/reception unit to and from an RFID tag of an information recording medium and a data generation unit comprises a process data generation unit for representing a process, a process pass certificate data generation unit for generating process data pass certificate data and a transmission/reception unit for the process data with the information recording medium and the process pass certificate data can track the processes through which the object products have passed.

Abstract: Various embodiments related to identifying regions including physical defects in semiconductor devices are disclosed. For example, one embodiment includes receiving an electrical test mismatch reported for a scan chain; identifying a suspect logical region including a plurality of logic cones electrically connected with the scan chain; adjusting a scope of the suspect logical region by simulating data flow within the logic cones, generating simulated scan chain output based on the simulated data flow within the logic cones, and excluding at least one of the logic cones from the suspect logical region based on a comparison of the electrical test mismatch and the simulated scan chain output; after adjusting the scope of the suspect logical region, generating a candidate defect region, the candidate defect region being defined to include physical instantiations of logical cells and logical interconnections included in the suspect logical region; and displaying the candidate defect region.

Abstract: Systems and methods for managing optical inspection target components are disclosed. A method may include, but is not limited to: storing at least one external recipe component at an inspection tool node; associating at least one proxy component with the at least one external recipe component; associating the at least one external recipe component with at least one optical inspection target recipe; and storing the at least one optical inspection target recipe including the at least one proxy component in a recipe distribution server. A method may include, but is not limited to: receiving a selection of at least one recipe associated with an optical inspection target to be inspected at a first inspection tool node; and determining whether one or more external recipe components associated with the recipe are stored on at least one of the first inspection tool node and a second node.

Abstract: A multi-testing procedure management method tests on a testing platform a plurality of function units of a plurality of devices under testing (DUTs) by a test schedule management list enumerating a plurality of schedule items. The method includes determining, by comparing the schedule items on the test schedule management list, whether the schedule items are directly applicable to testing the function units; keeping the schedule items in case of affirmative determination; and deleting the schedule items in case of negative determination. The method further includes selecting existing built-in items from a test library or creating and adding new test items to the test schedule management list to eventually produce a revised version of the test schedule management list for testing the DUTs. A multi-testing procedure management system is further provided.

Abstract: A method and system for performing automated quality control analysis of a plurality of radiopharmaceuticals are provided. The method includes uniquely identifying each of the plurality of radiopharmaceuticals, and identifying and implementing a tailored quality control program for each of the radiopharmaceuticals. The method further includes automatically performing a plurality of selected quality control tests for each of the radiopharmaceuticals based on the tailored quality control program, and collecting information produced by the plurality of selected quality control tests.

Abstract: A system and method of managing therapy provided to patients in an institution. The system monitors all aspects of the medication delivery to a patient, as well as other information related to the patient, such as values of vital signs, laboratory results and patient factors such as history, diagnosis, allergies and the like. The system includes one or more databases of information, including institutionally developed rules, guidelines and protocol representing the best medical practices of the institution. The system provides alerts and/or recommendations based on the application of the rules to the information being monitored, and alerts care givers accordingly, providing for dynamic adjustment of the patient's therapy. The system also monitors the status of the alerts, and if no action is taken in a selected period of time, may escalate the priority of the alert and/or halt the delivery of medication to the patient until the alert is resolved.

Abstract: An engineering component with a designed defect and use of an engineering component with a designed defect to evaluate a production component are disclosed. A test component having a known defect is manufactured. This known defect is a flaw that is intentionally included in the test component. The test component is then analyzed to obtain a test profile of the defect. In addition, the engineering component to be tested is analyzed to obtain a production profile. This production profile is compared with the test profile to determine whether the engineering component has a defect that corresponds to the known defect.

Abstract: A substrate processing system provided with a plurality of modules for substrate processing. The substrate processing system includes an inspection substrate, which is transferred to the plurality of modules for processing therein, provided with a plurality of measuring devices which carry out a plurality of different kinds of measurements and a recorder which records measured data provided by the measuring devices. The substrate processing system includes a controller that executes control operations to subject the inspection substrate to predetermined processes in the plurality of modules. The controller obtains through data communication a plurality of different kinds of measured data recorded by the recorder as the inspection substrate is processed by the predetermined processes by the plurality of modules.

Abstract: A production information reporting/recording system is disclosed herein including a number of features to ensure efficient, flexible and reliable recording of production data in a manufacturing system. Such features include validating the content of event messages to ensure compliance of event report information with a standard. The system also supports caching IDs associated with particular aspects of an event message (e.g., a production request, a process segment) as well as a unique ID corresponding to the ID assigned by the production event database to reduce the need to access the database when assigning unique database IDs to received events. The production event messaging system also supports both asynchronous and synchronous transactional messaging between the sources of events and the production database service.

Abstract: A method of analyzing integrated circuit (IC) product yield can include storing, within a memory of a system comprising a processor, parametric data from a manufacturing process of an IC and determining a measure of non-random variation for at least one parameter of the parametric data using a pattern detection technique. The processor can compare the measure of non-random variation to a randomness criteria and selectively output a notification indicating that variation in the parameter is non-random according to the comparison of the measure of non-random variation to the randomness criteria.

Abstract: A method involves, via a sensor application interface, 1) receiving, from an application, a measurement request associated with a quality-of-service control; 2) in accord with the quality-of-service control, obtaining measurement data from a sensor; and 3) returning to the application i) the measurement data obtained from the sensor, and ii) an indicator of accuracy of the measurement data.

Abstract: The present invention is a method and system for detecting an abnormal on-line analysis or laboratory measurement and for predicting an abnormal quality excursion due to an abnormal process condition.

Abstract: A method, and apparatus for software and resource management with a model-based architecture.

Abstract: A method of establishing statistically valid assay means and ranges for quality control materials, used to qualify medical testing machines, utilizes tests on a new lot of quality control material to establish an assay mean, and uses data from a database of historical test results to establish an assay range. The system may estimate the variability of test results from prior lot data, and then compute the limits of the assay range such that a new test on a new lot of the quality control material will be expected to fall within the range with a specified probability. Because historical data is used to estimate the test variability, the number of new tests required to specify a statistically valid mean and range may be dramatically reduced, as compared with establishing the mean and range based only on tests of the new lot of material.

Abstract: According to a feature of the present disclosure, a method is provided for the determination of anomalous events in complex systems, such as problems, inefficiencies, and failures, and a tool is provided for the detection of these events. Many complex systems are non-stationary or experience periodic fluctuations or spikes in values that are outside of normal ranges, but constitute normal behavior nevertheless. The method accounts for both non-stationarity, as well as fluctuations and spikes. Additional novel features include both a threshold setting initialization method and a regression method for the determination of the start points and end points of events.

Abstract: A method of developing a statistical model for integrated circuits includes providing a set of test patterns; collecting a set of intra-die data from the set of test patterns; collecting a set of inter-die data from the set of test patterns; generating a total variation sigma (sigma_total) from the set of intra-die data and the set of inter-die data; appointing one of a global variation sigma (sigma_global) and a local variation sigma (sigma_local) as a first sigma, and a remaining one as a second sigma; generating the first sigma from one of the set of intra-data and the set of inter-data; generating the second sigma by removing the first sigma from the sigma_total; generating a corner model for global variations based on sigma_global and the set of inter-die data; and generating a corner model for local variations based on sigma_local and the set of intra-die data.

Abstract: A programming method of a coordinate measuring machine (CMM) constructs a polygonal mesh model for a manufactured part according to a point cloud of the manufactured part. Basic measurement elements, relational measurement elements, a part coordinate system, and a collision-free inspection path are obtained according to the polygonal mesh model, so as to generate a measurement program of the CMM.

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one tot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.

Abstract: An abnormality detection system includes a measurement unit, a decision unit, an alarm unit, and storage units, and serves to detect the abnormality in a control characteristic value of a plurality of products manufactured on the same production line. The decision unit receives the control characteristic value stored in the storage unit, and decides whether an abnormality exists, based on that value. More specifically, the decision unit decides that the control characteristic value is abnormal when, with respect to m (m is a natural number) pieces of the products that are consecutively manufactured, an absolute value of a difference in control characteristic value between each of the products and another manufactured immediately before the former is equal to or less than a predetermined constant.

Abstract: A method includes passing a lot through a production process and evaluating a statistical quality of the production process. Additionally, the method includes calculating an advanced process control (APC) recipe parameter adjustment (RPA) distribution value and determining if sampling is indicated. Furthermore, the method includes, if sampling is indicated, performing a measurement process of the lot.

Abstract: An inspection item recognition unit references a component type table and recognizes inspection items necessary for specified components, an inspection means selection unit references an inspection machine capability table and selects an inspection means that performs inspection of each inspection item. By this processing, inspection menu information is generated, the inspection menu information associating, for each component, the component type and position information of the component with the inspection item performed on the component and information indicating the inspection means. Each inspection machine receives input of the inspection menu information and recognizes a component for which inspection by the inspection machine is defined, and generates inspection information by associating an inspection program with the position information of the component according to the component type of the component.

Abstract: An information processing device stores an extracted feature of each inspection item of the process inspection, and a determination result of a final inspection in a memory device, calculates a separation degree between a distribution of features of products which were determined as good products at the final inspection and a distribution of features of products which were determined as defective products at the final inspection for every inspection item or every combination of inspection items based on data of the products stored in the memory device, selects an inspection item whose inspection standard is to be reset from the inspection items or the combinations of the inspection items based on a value of the separation degree. Thus providing a method of appropriately setting an inspection standard for detecting a defect sign during process inspection. Further a process inspection device and inspection standard setting device which implements the same.

Abstract: System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing an inter-metal (“IM”) WAT on a plurality of processed wafer lots; selecting a subset of the plurality of wafer lots using a lot sampling process; and selecting a sample wafer group using the wafer lot subset, wherein IM WAT is performed on wafers of the sample wafer group to obtain IM WAT data therefore. The method further comprises estimating final WAT data for all wafers in the processed wafer lots from IM WAT data obtained for the sample wafer group and providing the estimated final WAT data to a WAT APC process for controlling processes.

Abstract: Data analysis systems and related methods. An implementation of a method of determining a relationship between a variable of interest and one or more process variables represented by a corresponding plurality of tags may include accessing a data historian including historical data including a variable of interest and a plurality of tags. The method may include defining a plurality of bins, retrieving historical data corresponding with the plurality of bins using the data historian, filtering the historical data for each of the plurality of bins using one or more filters to produce filtered historical data, generating an output display using the filtered historical data for the variable of interest and each of the plurality of tags, and determining which of the plurality of tags correlate with the variable of interest using the output display. The output display may include an overlay CUSUM chart and a correlation plot.

Abstract: A method of optimizing measurement paths computes a minimum bounding box for the measurement elements on a product, and computes a capturing range of a lens of a measurement machine. The method divides the minimum bounding box into M*N partitions according to the capturing range, and assigns a number to each of the M*N partitions. The method puts the number of a partition which exclusively encloses a measurement element into a first array, and puts a number set that includes the numbers of the partitions which all enclose a measurement element into a second array, and lists the numbers of the partitions in order according to the first array and the second array to generate a measurement path.

Abstract: A method for estimating a state of a process implemented by a tool for fabricating workpieces includes collecting metrology data associated with a subset of workpieces processed in the tool. The collecting exhibits an irregular pattern. Metrology data associated with a selected state observation is received for a selected run of the process. A tuning factor for the selected run is determined based on the irregular pattern. The selected state observation is discounted based on the determined tuning factor. A state estimate of the process is determined based on the discounted selected state observation. At least one process tool operable to implement the process is controlled based on the state estimate.

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.

Abstract: The instant invention involves a method for determining the expected presence of disruptive business process innovations by performing various nonlinear dynamic processes and analysis with both expected data values and referenced data values. After processing the necessary data, the method allows for the prediction of said disruptive business processes innovations (i.e. innovations that have a game changing effect on the market or markets to which the innovation belongs). After determining the presence or non-presence of any disruptive business process innovations, the method comprises steps for providing advice to users of said method. Further, the instant invention encompasses variants of its method that are facilitated by the use of at least one computing machine.

Abstract: A computerized method for categorizing defects on a substrate. A list of defects on the substrate is received as input to a processor, where each defect is represented by a defect location and an associated micro-defect code. The input is analyzed with the processor to detect spatial clusters of defects on the substrate. The spatial clusters are analyzed with the processor to determine which of the spatial clusters represent known macro-defects and which of the spatial clusters represent unknown macro-defects. The micro-defect code associated with each defect that is included in one of the spatial clusters that is determined to be a known macro-defect is changed with the processor with a macro-defect code that is associated solely with the known macro-defect. The processor analyzes the defects that are included in one of the spatial clusters that is determined to be an unknown macro-defect to determine a predominantly occurring micro-defect code.

Abstract: A system and method for antenna analysis and electromagnetic compatibility testing in a wireless device utilizes a “parent” device that undergoes rigorous conventional testing. A “child” device having similar components may thereafter undergo abbreviated testing. Because the Total Isotropic Sensitivity of the parent device is known, testing may be performed on the child device to infer equivalence to the parent's TIS performance using the abbreviated test techniques.

Abstract: A method for making a sample for evaluation of laser irradiation position and evaluating the sample, and an apparatus which is switchable between a first mode of modification of semiconductor and a second mode of making and evaluating the sample. Specifically, a sample is made by irradiating a semiconductor substrate for evaluation with a pulse laser beam while the semiconductor substrate is moved for evaluation at an evaluation speed higher than a modifying treatment speed, each relative positional information between pulse-irradiated regions in the sample is extracted, and stability of the each relative positional information between pulse-irradiated regions is evaluated. The evaluation speed is such a speed that separates the pulse-irradiated regions on the sample from each other in a moving direction.

Abstract: A measurement system and a measurement method, which can obtain a measurement value close to a true value considering an overlay measurement error according to a higher order regression analysis model. The measurement system and the measurement method provide a technique for determining optimal positions of shots to be measured using an optimal experimental design. When the regression analysis model and the number of shots to be measured are determined in advance, a method is used for determining an optimal number of shots to be measured according to the regression analysis model and process dispersion using a confidence interval estimating method. A dynamic sampling method is used for dynamically changing the number and positions of shots to be measured according to a change in process features by combining the above two methods.

Abstract: System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process.

Abstract: An object of the invention is to be able to select easily and quickly inspection recipes which are appropriate to samples from any number of inspection recipes. A calculating device displays a plurality of inspection recipes on the GUI. An inspection recipe includes settings for controlling charged particle columns which irradiate charged particles on samples with a plurality of characteristics. Plural inspection recipes are arranged and displayed on a coordinate system which is specified by a plurality of axes having characteristic values (robustness variable of charge up, throughput of defect inspection, and accuracy of defect inspection) which have mutually trade-off relationships.

Abstract: Computer-implemented methods, computer-readable media, and systems for selecting one or more parameters for inspection of a wafer are provided.

Abstract: A system and method of diagnosing diseases from biological data is disclosed. A system for automated disease diagnostics prediction can be generated using a database of clinical test data. The diagnostics prediction can also be used to develop screening tests to screen for one or more inapparent diseases. The prediction method can be implemented with Bayesian probability estimation techniques. The system and method permit clinical test data to be analyzed and mined for improved disease diagnosis.

Abstract: A method for making a sample for evaluation of laser irradiation position and evaluating the sample, and an apparatus which is switchable between a first mode of modification of semiconductor and a second mode of making and evaluating the sample. Specifically, a sample is made by irradiating a semiconductor substrate for evaluation with a pulse laser beam while the semiconductor substrate is moved for evaluation at an evaluation speed higher than a modifying treatment speed, each relative positional information between pulse-irradiated regions in the sample is extracted, and stability of the each relative positional information between pulse-irradiated regions is evaluated. The evaluation speed is such a speed that separates the pulse-irradiated regions on the sample from each other in a moving direction.

Abstract: Disclosed herein is a forged seal imprint checking method which includes a step ST-101 of generating a reference seal imprint from a genuine seal (ST-110) and a step ST-121 of comparing a compared seal imprints with the reference seal imprint to calculate characteristic values of the compared seal imprint with respect to the reference seal imprint (ST-140). According to experimental results, forged seal imprints obtained by seals forged by etching a zinc plate or a resin plate can be recognized and forged seal imprints generated by seals forged through computer copy can be also recognized. Accordingly, an objective basis on which it can be determined whether seal imprints on documents are forged in civil and criminal cases can be provided to prevent errors which may be generated when seal imprints are inspected with the naked eyes or microscopes.

Abstract: The present invention may include performing a first measurement on a wafer of a first lot of wafers via an omniscient sampling process, calculating a first set of process tool correctables utilizing one or more results of the measurement performed via an omniscient sampling process, randomly selecting a set of field sampling locations of the wafer of a first lot of wafers, calculating a second set of process tool correctables by applying an interpolation process to the randomly selected set of field sampling locations, wherein the interpolation process utilizes values from the first set of process tool correctables for the randomly selected set of field sampling locations in order to calculate correctables for fields of the wafer of the first lot not included in the set of randomly selected fields, and determining a sub-sampling scheme by comparing the first set of process tool correctables to the second set of correctables.

Abstract: A method of evaluating an inline inspection recipe compares the capture rate of metal pattern defects in bounding boxes arising from failed electrical test vectors to the capture rate after the bounding box is shifted. A difference between the first and second capture rates indicates whether the inline inspection recipe is valid for capturing killer defects, or if the inline inspection recipe needs to be adjusted. In a particular example, the electrical test vectors are directed at a selected patterned metal layer of an FPGA (M6), and the metal pattern defect data for the selected patterned metal layer is mapped to the bounding box determined by the electrical test vector.

Abstract: A method and apparatus that enables a user to sort data from one or more sample lots, which may be obtained via a network, such as the Internet, into a composite parameter structure. The composite parameter structure is a function of one or more parameters corresponding to one or more characteristics associated with one or more sample lots. The composite parameter structure representation may be printed, stored, or transmitted to another location. A server device that is coupled and working in conjunction with a client device may implement the present invention.

Abstract: A device testing system includes a detecting module, a data determining module, an address processing module, and a data obtaining module. The detecting module detects if the device testing system has been successfully connected with a device to be tested. The data determining module determines if the device testing system includes test data required by the device to be tested. The address processing module determines if an address list includes an address of the device to be tested. The data obtaining module obtains test data required by devices to be tested whose addresses are included in the address list from the remote server. A test data obtaining method of the device testing system is also provided.

Abstract: A screening apparatus includes: a measurement unit measuring characteristics of a semiconductor device and reading an identification code allocated to the semiconductor device; a database storing a table representing a correspondence between an identification code and a fabrication condition of a semiconductor device; a conversion unit extracting, based on the identification code sent from the measurement unit, a corresponding fabrication condition from the database and associating the extracted fabrication condition with the characteristics corresponding to the fabrication condition; a characteristics reconstruction unit classifying the characteristics according to the fabrication condition sent from the conversion unit; and an evaluation and analysis unit evaluating and analyzing the characteristics classified by the characteristics reconstruction unit according to the fabrication condition in a predetermined manner and determining a semiconductor device to be screened.

Abstract: A method optimizes photomask inspection. After masks are manufactured, the method predicts the likelihood that the masks will be defect free based on defect criteria, etch area, etch mode, and etch tool type associated with the masks. The method skips an initial mask inspection for masks that have a predictability value above a predetermined value and performs the initial mask inspection for masks that have a predictability value below the predetermined value. After initial inspection is preformed (or skipped), a pellicle is mounted on the mask and then all masks are inspected or reinspected for defects and foreign matter.

Abstract: Computer-implemented methods that include correlating a backside defect with a frontside defect detected on a specimen are provided. The defects are correlated if a portion of the backside defect on the backside of the specimen is opposite to a portion of the frontside defect on the frontside of the specimen. In particular, the defects are correlated if the portion of the backside defect is aligned with the portion of the frontside defect along an axis perpendicular to the frontside and the backside of the specimen. The method may also include altering a parameter of a process tool in response to the backside defect to reduce frontside defects on additional specimen processed in the process tool. Computer-implemented methods for analyzing data representing spatial characteristics of backside defects detected on a specimen to classify the backside defects are also provided. Analyzing the data may include spatial signature analysis of the data.

Abstract: Techniques for estimating a quality of one or more wafers are presented. One or more first wafers comprising one or more first dies are tested. A probability of wafer failure is determined in accordance with one or more first test measurements of the one or more first dies. A pass status and/or a fail status of one or more second wafers is inferred by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure.

Abstract: A distortion compensation method includes determining an undisturbed phase for at least one of a first position indication signal and a second position indication signal. The method includes determining an undisturbed ratio that relates the amplitude of the first position indication signal at a first frequency to the amplitude of the second position indication signal at a second frequency. The method also includes determining a disturbed amplitude of the position indication signal and adjusting a position indication based on the disturbed amplitude and phase, the undisturbed amplitude ratio, and the undisturbed phase. The method further comprises determining a relationship between the eddy current phase of the first position indication signal and the second position indication signal.