Abstract: Correcting a temperature measurement of a target sensed at one temperature sensor in an asset tracking device by using another temperature sensor. The asset tracking device includes at least one heat source that affects the temperature sensor for sensing the temperature of the target. The other temperature sensor measures temperature at a location in the asset tracking device. The relationships between an actual temperature of the target and the temperature measured at the two sensors are established through experiments or model. Using the relationships, the measured temperature of the target can be corrected to obtain a corrected temperature of the target.

Abstract: Methods, devices, and systems are provided for calibrating heat sources of thermal cyclers.

Abstract: A system and method for calibrating integrated circuit (IC) temperature measurement circuits. An integrated circuit (IC) includes a thermal sensor and data processing circuitry. The IC may have a temperature measurement mode of operation and a calibration mode of operation. During the calibration mode, one or more stable reference voltages, rather than sensed voltages from a thermal sensor, are selected as input voltages to the data processing circuitry. Electronic components within the data processing circuitry receive the stable reference voltages and generate a temperature digital code. The generated temperature digital code may be compared to an expected temperature digital code based on theoretical ideal gains for each of the components within the data processing circuitry. The comparison leads to an updated value for a scaling factor to be stored and used in subsequent temperature measurements.

Abstract: A method and apparatus for estimating the temperature sensed upon contact with a surface. The method includes contactless heating of the surface, contactless measurement of a time change in temperature of the surface, and estimation of the temperature sensed upon contact with the surface on the basis of this time change in temperature.

Abstract: An embodiment of the present invention is an algorithmic method means for testing the performance characteristics of humidity and temperature probes i.e. accuracy, stability, repeatability of humidity and temperature sensor probes over a user selected dynamic range that is easily programmable by and end user. Further, said testing is accomplished and completed by using a specially designed humidity and temperature test chamber, that is traceable to NIST (National Institute of Science and Technology). Ongoing and final testing results are made visible for study by an end user via computer display and there is printout availability. Further, testing in said special chamber utilizes novel method means for probe attachment to said chamber and control thereof.

Abstract: Some embodiments provide a system that tests a computing system. During operation, the system monitors a temperature of a component in the computing system while running a series of calibrated workloads on the component. Next, the system analyzes a fluctuation of the temperature resulting from the calibrated workloads to determine a thermal performance of the component. The system then uses the determined thermal performance to improve the reliability of the computing system.

Abstract: A temperature measuring device of a power semiconductor apparatus that accurately detects chip temperature even where a gradient of the measured characteristic line segment is different from a designed gradient, including a chip temperature detecting circuit that includes an A/D converter delivering a measurement value of a digital converted forward voltage across a temperature detecting diode and an operational processing unit for calibration and chip temperature calculation. In calibration processing, different known reference voltages are applied by a reference connected in place of the diode and a gradient of the line segment connecting the measurement values is calculated. The gradient is stored in a memory with an offset correction value that is one of the measurement values. A chip temperature is calculated based on a forward voltage across the diode calculated based on the measurement value and the stored values of the gradient and the offset correction value.

Abstract: A method of reducing de-icing heater error (DHE) in total air temperature (TAT) probes is provided. Using the method, a nominal DHE function is obtained for a particular type of TAT probe, with the nominal DHE function having been derived from a plurality of TAT probes of the particular type. A probe specific correction coefficient is calculated for an individual TAT probe of the particular type as a function of a measured DHE at a first airflow and a predicted DHE at the first airflow. The predicted DHE at the first airflow is determined using the nominal DHE function derived from the plurality of TAT probes of the particular type. The probe specific correction coefficient is then stored for later use, or used to determine DHE with the individual TAT probe over a range of airflows as a function of the probe specific correction coefficient.

Abstract: A method is provided for the diagnosis of the EGR cooler efficiency in a Diesel engine that includes but is not limited to construction of a model for determining the temperature drop y=?T in the EGR cooler, the model having a parameter vector ? and an input vector x; performing a model calibration phase in order to estimate the bias h0 of the system; calculation of a set of primary residuals ?(?0, x, ?T), staffing from the model equation and using the results of the calibration phase; calculation of a set of improved residuals ?N(?0): ? N ? ( ? 0 ) = 1 N ? ? k = 1 N ? ( ? ? ( ? 0 , x k , y k ) - h 0 ) where N is the number of samples on which the diagnostic test is performed; calculation of a diagnostic index S: S=?TNR0?1?N and, use of the diagnostic index S in order to diagnose the efficiency of the EGR cooler.

Abstract: A system and method for monitoring data associated with a temperature controlled container with a Reefer Unit. The monitored data retrieved from the Reefer Unit is wirelessly transmitted to an evaluation unit via at least one transponder. The transponder is connected via a wireless interface of an antenna with a reader/transmitter. The wireless interface transmits the monitored data via a bus from the reader/transmitter to a converter which then transmits the converted monitored data via a communication interface to the evaluation unit. Aside from retrieving monitored data remotely, the system can also issue remote forward commands to provide full automation and control of such containers.

Abstract: A temperature sensor includes a compare subject voltage output unit, a temperature range decision unit, and a temperature signal output unit. The compare subject voltage output unit is configured to output a reference voltage having a constant value irrespective of a change of an external temperature and a third temperature voltage that decreases in response to an increase of an external temperature. The temperature range decision unit is configured to compare the reference voltage and the third temperature voltage, and output an enable signal, to indicate whether the external temperature is different from a normal temperature. The temperature signal output unit is configured to output a specific one of a plurality of high temperature signals or a specific one of a plurality of low temperature signals, to indicate a range of the external temperature, in response to the enable signal.

Abstract: An emulation system includes a central time source generating a time reference and an emulated spacecraft control processor which contains an embedded processor that provides an emulated input/output interface to communicate simulated spacecraft data. The embedded processor processes the simulated spacecraft data and contains a real time clock engine having a real-time clock period. The system further has a first simulation that processes attitude control system data from the emulated spacecraft control processor to simulate an attitude control system of the spacecraft in real-time. The first simulation engine operative to produce sensor data for input to the emulated spacecraft control processor based on the simulated system dynamics and adjusts the real time clock period in response to the time reference.

Abstract: An onboard cooling system diagnostic strategy utilizes at least one temperature sensor fluidly positioned between an electronically controlled engine and a thermostat. The diagnostic algorithm operates by monitoring coolant temperature during engine startup. By comparing the actual coolant temperature during engine start-up to a predicted coolant temperature that should occur if no cooling system error is present, a cooling system fault condition may be identified. If a cooling system fault is detected, the diagnostic logic may activate the engine cooling fan or intrusively open an electrically controlled thermostat while monitoring the coolant temperature response to the intrusive action. If there is a substantial change in coolant temperature responsive to the intrusive action, this phenomenon can be utilized to correctly distinguish between a thermostat failure and a vehicle configuration error corresponding to an overcooled vehicle.

Abstract: Apparatus and methods are disclosed for enhancing data accuracy of a noncontact infrared thermometer. One method includes determining dry atmospheric constituency and water vapor absorption coefficients across the infrared thermometers spectral bandpass and implementing the coefficients in processing with site-based atmospheric temperature and water vapor density profile and pressure measurements to provide corrected target temperature data compensating for contamination in said raw data due to said intervening atmosphere. The method is particularly well adapted for use in correcting data from less expensive but also less accurate wideband infrared thermometers.

Abstract: An acoustic sensor acquires acoustic data corresponding to a rotating component of a machine during operation of the machine. The acoustic sensor can be configured to enhance acoustic signals in a range of frequencies corresponding to at least one evaluated condition of the rotating component and/or enhance the acoustic signals received from a directional area narrowly focused on the rotating component. The rotating component is evaluated using the acoustic data acquired by the acoustic sensor. In an embodiment, the machine can be a vehicle traveling past a parabolic microphone. In a more specific embodiment, the vehicle is a rail vehicle and the rotating component is a railroad wheel bearing.

Abstract: A temperature sensor is provided. The temperature sensor includes: a temperature sensing unit for sensing a temperature and outputting a temperature sensing signal; an analog-to-digital converter (ADC), coupled to the temperature sensing unit, for converting the temperature sensing signal to a digital value, having an ADC output range; a calibration unit, coupled to the ADC, for correlating the ADC output range with at least one temperature range; a memory unit, coupled to the calibration unit, recording the ADC output range, and the at least one temperature range, and the correlation therebetween.

Abstract: A system and related method are provided for measuring conductivity/resistivity of water having high purity, including a temperature sensor and a conductivity/resistivity sensor exposed to a water source. The system further includes a computing assembly configured to receive measurement signals from the sensors and to determine change in resistivity over a change in temperature (a collected R/T slope) from the collected temperature measurements and the collected resistivity measurements. The system compares the collected R/T slope to a standardized R/T slope at a temperature value corresponding to a midpoint temperature of the temperature measurements over the prescribed time interval. Based on the comparing, the system provides providing a compensated measurement for resistivity or conductivity of the water source. As a result, the system can calibrate the sensor continually during use, in real time, resulting in highly improved accuracy.

Abstract: Aspects of a method and system for compensating temperature readings from a temperature sensing crystal integrated circuit are provided. An electronic device may digitize a temperature indication received from a temperature sensing circuit, digitize one or more calibration voltages received from said temperature sensing circuit, and calculate a compensated temperature indication utilizing the digitized calibration voltage(s), and the digitized temperature indication, and data from a table that characterizes behavior of the temperature sensing circuit as a function of temperature. One or more circuits in the electronic device may be controlled based on the compensated temperature indication. The compensated temperature indication may compensate for a gain error and/or offset error of a digital to analog converter that digitizes the temperature indication and the calibration voltage(s). There may be two calibration voltages.

Abstract: Fluid temperature control and sensor calibration is disclosed. In an embodiment, a fluid temperature control unit includes a heater configured to heat a first fluid in a first fluid path, a first temperature sensor configured to measure a temperature of the first fluid in the first fluid path, a second temperature sensor configured to measure a temperature of a second fluid in a second fluid path, and a controller configured to control the heater on the basis of the temperature sensed by the first sensor and the temperature sensed by the second sensor.

Abstract: A system includes a first module, a second module, and a third module. The first module determines a first temperature and a first power dissipation value of a thermistor based on a resistance of a first resistor connected in series with the thermistor. The second module, after disconnecting the first resistor and connecting a second resistor in series with the thermistor, determines a second temperature and a second power dissipation value of the thermistor based on a resistance of the second resistor. The third module determines a thermal dissipation factor based on the first and second temperatures and the first and second power dissipation values, and corrects temperature sensed by the thermistor based on the thermal dissipation factor.

Abstract: An embodiment of a method for a determination, section after section, of a parameter-dependent correction value approximation course includes determining a first measurement signal value with a first parameter value associated with a sensor arrangement when the first parameter value fullfils a predetermined condition or a trigger condition is fulfilled, changing the first parameter value to obtain a second parameter value, determining a second signal value with the second parameter value and determining a second partial section of the correction value approximation course for a second parameter range based on a functional connection describing the second partial section, the first parameter value, the second parameter value, the first measurement signal value, the second measurement signal value and an initial correction value.

Abstract: A sensor system for use with a machine is disclosed. The sensor system may have a sensor associated with the machine and configured to generate a signal indicative of an actual value for a parameter of the machine, and a controller in communication with the sensor. The controller may be configured to model behavior of the machine under particular conditions and responsively generate a first predicted value for the parameter, determine a time lag coefficient for the sensor based on the signal, model behavior of the sensor based on the time lag coefficient and the first predicted value, and responsively generate a second predicted value for the parameter. The controller may also be configured to determine an error value based on the actual value and the second predicted value, and determine a compensated value for the parameter based on the first predicted value and the error value.

Abstract: An infrared sensor capable of more highly accurately correcting an electrical signal converted by a light receiving unit is provided. An infrared sensor (100) converts energy of infrared rays radiated from an object (for example, human body) to an electrical signal and outputs the electrical signal, the infrared sensor comprising: a light receiving unit (10) that includes a quantum type infrared detection element (11) and that converts the energy of the infrared rays to an electrical signal; and a correction unit (20) that corrects the output signal from the light receiving unit (10), wherein the light receiving unit (10) and the correction unit (20) are formed of the identical material on the identical substrate (1) and have the identical configuration so that the infrared rays enters in an identical manner.

Abstract: A method and apparatus for adjusting the performance of a memory system is provided. A memory system comprises a master device and a slave device. A memory channel couples the master device to the slave device such that the slave device receives the system operating information from the master device via the memory channel. The slave device further includes tuning circuitry within the slave device such that the performance of the memory system is improved.

Abstract: A gas analyzer using a quadrupole mass spectrometric method etc. is provided with an ionizer to ionize a sample gas, a first ion detector and a second ion detector each configured to detect a respective ion from ionizer, and each being disposed a respective distance from the ionizer on an opposite side of the ionizer, the respective distances being different from each other, a filter interposed between the ionizer and the first ion detector to selectively allow ions from the ionizer to pass therethrough, and an arithmetic device to correct a partial pressure of a specific component obtained from the first ion detector and selected by the filter by using a first total pressure of the sample gas obtained from the first ion detector and a second total pressure of the sample gas obtained from the second ion detector.

Abstract: A method and system for calibrating temperature measurement devices, such as pyrometers, in thermal processing chambers are disclosed. According to the present invention, the system includes a calibrating light source that emits light energy onto a substrate contained in the thermal processing chamber. A light detector then detects the amount of light that is being transmitted through the substrate. The amount of detected light energy is then used to calibrate a temperature measurement device that is used in the system.

Abstract: A semiconductor device including a temperature sensor includes a pull up circuit, a pull down circuit, a first additional current path, and a second additional current path. The pull up circuit is configured to generate a pull up current that contributes to generation of a first output current. The pull down circuit is operably coupled to the pull up circuit at an output node and configured to generate a pull down current that contributes to generation of a second output current. The first additional current path, when enabled, is configured to combine a first additional current with the pull up current to comprise the first output current. The second additional current path, when enabled, is configured to combine a second additional current with the pull down current to comprise the second output current. Respective enablement of the first additional current path and the second additional current path is complementary.

Abstract: Improvement in the accuracy of a temperature sensor is aimed at, suppressing the number of the test temperature in a test process. The semiconductor device comprises a coefficient calculation unit which calculates up to the N-th order coefficient (N is an integer equal to or greater than one) of a correction function as an N-th order approximation of a characteristic function indicating correspondence relation of temperature data measured by a temperature sensor unit and temperature, based on N+1 pieces of the temperature data including a theoretical value at a predetermined temperature in the characteristic function and N measured values of the temperature data measured by the temperature sensor unit at N points of temperature; and a correction operation unit which generates data including information on temperature, by performing calculation using the correction function to which the coefficients calculated are applied, based on temperature data measured by the temperature sensor unit.

Abstract: A method and an apparatus for estimating temperature are provided for estimating a temperature of a test point in a space with an air conditioner. In the method, a first and a second sensor device are deployed in the space, wherein the second sensor device is deployed at the test point. Then, state parameters and temperature transformation functions are defined according to temperatures detected by the first and the second sensor devices and a state of the air conditioner during a predetermined time period. After the second sensor device is removed, a current state of the air conditioner is determined by reference temperatures detected by the first sensor device and the state parameters. One of the temperature transformation functions is selected according to the current state, and a current temperature of the test point is estimated by using the selected temperature transformation function and the reference temperatures.

Abstract: An apparatus including a recording switch for recording a temperature of an object; a judging unit that measures the temperature of the object using a sensor at intervals and judges whether a difference in temperatures measured at the intervals is within a range of a pre-set value; a first acquisition unit that records and/or outputs, when a switch-on of the recording switch is detected and the difference in temperatures is within the range of the pre-set value, information including a first temperature measured using the sensor and has become valid by the switch-on of the recording switch; and a second acquisition unit that records and/or outputs, when the switch-on is detected and the difference in temperatures is outside the range information including a second temperature measured using the sensor and becomes valid when the difference in temperatures falls within the range after the switch-on is detected.

Abstract: Embodiments of the invention are generally directed to systems, methods, and apparatuses for the dynamic power control of a memory device thermal sensor. In some embodiments a memory device includes an on-die thermal sensor and enable logic to dynamically enable or disable the on-die thermal sensor. In some embodiments, the on-die thermal sensor senses thermal data responsive to a thermal data sense indication. The thermal data sense indication may be received subsequent to the expiration of a delay period.

Abstract: Temperature sensing circuitry is used for thermal management of an electronic device. The temperature sensing circuitry includes at least one thermistor placed at or near a component of the electronic device. The temperature sensing circuitry also includes a high-precision resistor for calibration purposes. The resistance of the resistor is equivalent to the resistance of the thermistor at a reference temperature. A calibration reading is obtained using a set current that is being passed through the resistor. An error present in the temperature sensing circuitry is determined based on the calibration reading and a design value. A temperature measurement associated with the component is then made using the thermistor, while the set current is being passed through the thermistor. The error is corrected in the temperature measurement of the component. Other embodiments are also described.

Abstract: An accelerometer (22) includes sense elements (24, 26, 28) for measuring acceleration (30, 32, 34) and a processor (36) in communication with the sense elements (24, 26, 28). The processor (36) executes an auto-calibration process (46) that entails collecting (94) acceleration datasets (96) and identifying a subset (130) of acceleration datasets (132) in which each of the acceleration datasets (132) represents a scenario in which the accelerometer (22) is in a static position and in which the acceleration datasets (132) represent a variety of orientations of the accelerometer (22). The subset (130) of acceleration datasets (132) is utilized to compute updated calibration parameters (184). Current calibration parameters (48) are compared to the updated parameters (184) to determine validity of the current parameters (48). When the current parameters (48) are invalid, they are replaced with the updated parameters (184), and the updated parameters (184) are implemented to calibrate the accelerometer (22).

Abstract: A vehicle includes a power inverter module (PIM), a motor/generator unit (MGU), vehicle components, temperature sensors, and a controller. The sensors measure temperatures of a motor winding of the MGU, and temperatures of the multiple phase outputs of the PIM. The second plurality of temperature sensors measures temperatures of the vehicle components. The controller calculates an average temperature of the components, and individually diagnoses each temperature sensor using the average temperature. A control circuit for the vehicle includes the first and second plurality of sensors and the controller. A temperature performance diagnostic method includes using the first plurality to measure a temperature of the motor winding and the phase outputs of the PIM, using the second plurality to measure a temperature of the components, calculating an average temperature of the components, and individually diagnosing the performance of each of the first plurality of sensors using the average temperature.

Abstract: An angular velocity sensor includes a vibration body having a sensor electrode, a driving electrode, and a monitor electrode. The monitor electrode generates a signal according to vibration of the vibration body. The sensor circuit outputs a signal representing an angular velocity applied to the vibration body. The amplitude determination circuit measures amplitude of vibration of the vibration body. A PLL circuit includes a constant voltage source for generating a constant voltage, a timing switching unit for outputting a voltage by switching selectively between the constant voltage and a voltage corresponding to the monitor signal, and a voltage-controlled oscillator for outputting an oscillation signal having a frequency corresponding to the voltage output from the timing switching unit.

Abstract: Meter electronics for geometric thermal compensation in a flow meter is provided according to the invention. The meter electronics includes an interface configured to receive sensor signals and a temperature signal (T) of the flow meter. The meter electronics further includes a processing system coupled with the interface and configured to receive the sensor signals and the temperature signal (T) and compute a geometric thermal compensation factor (TFe) for one or more flow conduits of the flow meter using the temperature signal (T). The geometric thermal compensation factor (TFe) is used to process the first and second sensor signals.

Abstract: A diagnostic system and a diagnostic method for a thermistor amplifier circuit are provided. The system includes a transistor electrically coupled to a controllable variable resistor having a predetermined resistance. The transistor applies a test voltage signal to the circuit indicative of a first temperature value. An amplitude of the test voltage value is indicative of a simulated thermistor temperature value. The microprocessor determines a test temperature value based on the amplitude of an output voltage of the circuit. The microprocessor also determines an inaccuracy value based on the test temperature value and the simulated thermistor temperature value.

Abstract: An I/O circuit for measuring temperatures uses multiple cold-junction compensation sensors permanently affixed near the terminals of the terminal block in order to compensate significant temperature variation across the terminals of the I/O module (up to 3° C.) that can substantially affect the accuracy of thermocouple measurements. The use of these multiple sensors is enabled by a compensation system that corrects for the distance between the built-in sensors and the terminals, a multiplexer that accommodates the additional signal burden produced by the sensors, and a compensation system that allows low-cost sensors to be used and calibrated to as little as a single high accuracy sensor. In one embodiment, a third temperature sensor with relatively higher accuracy is used to compensate for lower accuracy of permanently affixed sensors.

Abstract: A measurement apparatus calibrated to measure an absolute diameter of a part in a shop floor environment. The measurement apparatus includes a calibration that includes compensation factors for thermal expansion, shifting of measurement parts (arm, support tower, and related laser), and variances of these parts. The resulting measurements report an absolute diameter of a part to a higher degree of accuracy than previously possible. Also, the calculated compensation factor eliminate the need for an isolated, climate-controlled measurement room.

Abstract: An apparatus and method is described for measuring a local surface temperature of a semiconductor device under stress. The apparatus includes a substrate, and a reference MOSFET. The reference MOSFET may be disposed closely adjacent to the semiconductor device under stress. A local surface temperature of the semiconductor device under stress may be measured using the reference MOSFET, which is not under stress. The local surface temperature of the semiconductor device under stress may be determined as a function of drain current values of the reference MOSFET measured before applying stress to the semiconductor device and while the semiconductor device is under stress.

Abstract: An apparatus for detecting a temperature using transistors includes a plurality of temperature detecting units that become selectively active according to predetermined temperature intervals; and a detection signal output unit that generates detection signals according to the signals transmitted by the plurality of temperature detecting units, and outputs the detection signals.

Abstract: A temperature sensor circuit includes a band-gap reference voltage circuit. The resistor and diode-connected bipolar transistor of the band-gap reference voltage circuit are separated into a transistor-resistor series circuit and a transistor-diode series circuit. The transistor-resistor series circuit is configured such that an emitter of the bipolar transistor Q21 is connected to a power supply voltage terminal VCC, a collector thereof is grounded via the resistor R2. The transistor-diode series circuit is configured such that an emitter of the bipolar transistor Q20 is connected to the power supply voltage terminal VCC, a collector thereof is connected to a collector of the diode-connected bipolar transistor Q19, and an emitter of the diode-connected bipolar transistor is grounded. A voltage divider circuit 5 having a plurality of output terminals is connected to the transistor-resistor series circuit and the transistor-diode series circuit via first and second buffer circuits 3 and 4, respectively.

Abstract: A method and apparatus are disclosed for predicting the service life of a metallic structure subjected to cyclic loading. Such structures experience fatigue, which can lead to failure after a number of loading cycles. The disclosed invention allows for an accurate prediction of the number of cycles to failure for a metallic structure by observing the slope of the rise in surface temperature of the structure after the cyclic loading has begun. The method of this invention provides early and accurate predictions of service life and does not require destructive testing. The method and apparatus of the present invention may be installed on working equipment, thus providing service life predictions for materials in real world use. The invention uses an empirically derived relationship that was confirmed using analytical relationships and material properties. The derived formula uses two constants that may be determined empirically using a disclosed process. The constants also may be estimated mathematically.

Abstract: Temperature detection circuitry is selectively coupled to a thermistor and one of two sources representing the impedance at respective ends of the expected range of temperature to which the thermistor is to be exposed. The offset of an amplifier and a scale factor to account for gain set of the amplifier are determined in an automatic calibration process while coupled to the source(s), and thereafter temperature readings are taken from the thermistor. During the calibration process, if the gain or scale factor are outside of expected ranges, a failure is determined and an alarm given and/or a heater is disabled.

Abstract: Until the accuracy in calculation of an estimated oil temperature value which is calculated by means of a heat dissipation amount map reaches a predetermined level, an ECU determines, when a transmission oil temperature well exceeds a predetermined temperature after the engine start, whether or not an oil temperature sensor fails. When it is determined that the oil temperature sensor is normal, the ECU uses the detected oil temperature value to learn about the heat dissipation map. When the accuracy in calculation of the estimated oil temperature value reaches the predetermined level through the learning about the heat dissipation amount map, the ECU determines whether or not the oil temperature sensor fails based on the divergence of the detected oil temperature value relative to the estimated oil temperature value.

Abstract: Temperature sensing circuitry is used for thermal management of an electronic device. The temperature sensing circuitry includes at least one thermistor placed at or near a component of the electronic device. The temperature sensing circuitry also includes a high-precision resistor for calibration purposes. The resistance of the resistor is equivalent to the resistance of the thermistor at a reference temperature. A calibration reading is obtained using a set current that is being passed through the resistor. An error present in the temperature sensing circuitry is determined based on the calibration reading and a design value. A temperature measurement associated with the component is then made using the thermistor, while the set current is being passed through the thermistor. The error is corrected in the temperature measurement of the component. Other embodiments are also described.

Abstract: Provided is an analysis device or an analysis method, by which highly reliable analysis results can be obtained even in the circumstances where environment temperature changes, while reducing load on the user. The analysis device (1) is provided with a determining means (13) which determines whether environmental temperature measured by means of a temperature measuring means (6) is within a predetermined temperature range or not. The determining means (13) is so configured as to determine whether the environmental temperature is within the predetermined temperature range or not, even in the circumstances where information relating to a target substance in a sample cannot be obtained from the analysis device.

Abstract: Methods and apparatus for wafer temperature measurement and calibration of temperature measurement devices may be based on determining the absorption of a layer in a semiconductor wafer. The absorption may be determined by directing light towards the wafer and measuring light reflected from the wafer from below the surface upon which the incident light impinges. Calibration wafers and measurement systems may be arranged and configured so that light reflected at predetermined angles to the wafer surface is measured and other light is not. Measurements may also be based on evaluating the degree of contrast in an image of a pattern in or on the wafer. Other measurements may utilize a determination of an optical path length within the wafer alongside a temperature determination based on reflected or transmitted light.

Abstract: An apparatus and methods for identifying a defect and/or an operating characteristic of a system being monitored (and/or one or more of the system's components) are described. In an embodiment, orthogonally related data monitored by two or more detectors may be fused to determine whether a component of a system is defective and/or malfunctioning. Additionally or alternatively, data from a first detector may be determined to be accurate using non-orthogonally related data outputted by a second detector. Both types of determinations may be made with minimal or no false indications, which lowers the cost of operating the system being monitored. Embodiments of the invention may also be configured to forecast and/or prevent accidents and/or damage to the system being monitored by predicting whether a defect and/or a malfunction will occur.

Abstract: Aspects describe creation of autonomous control for a composite curing process. Other aspects describe a controller and an apparatus for employing an autonomous control algorithm for a composite curing application. The algorithm can be based on thermocouple rules encapsulated within a thermocouple control wrapper. The thermocouple rules allow the thermocouple wrapper carry out diagnostic operations to determine the health of the associated thermocouple by communicating with neighboring thermocouples and validating temperature readings according to the thermocouple rules.