Abstract: To improve the precision of temperature compensation in an infrared sensor and obtain a sharp image, a correction is applied to a variation in output voltage (referred to as “background infrared radiation absorption intensity distribution” below) due to intensity distribution of background infrared radiation, which is light other than the incident infrared radiation on the infrared sensor, and the temperature characteristic of each individual bolometer constituting the infrared sensor. That is, the temperature of the infrared sensor is measured as a first temperature, a correction value for the output voltage of each bolometer is found by referring to a table, which indicates the background infrared radiation absorption intensity distribution versus the temperature of the infrared sensor, as well as the first temperature, and the variation in output voltage is corrected.

Abstract: A user computer device is provided that comprises a temperature sensitive touchscreen having a temperature sensitive user interface comprising multiple thermal energy emitter/detector devices, such as thermocouples. The multiple thermal energy emitter/detector devices are capable both of detecting thermal energy and emitting thermal energy. The temperature sensitive user interface generates thermal patterns that may be transferred to other thermally sensitive electronic devices or that may be used to authenticate the user computer device. The user computer device also can detect and thermally communicate with a thermal energy docking station and, based on thermal recognition, activate applications displayed on the temperature sensitive touchscreen. Further, the user computer device can auto-bias a temperature of the temperature sensitive user interface in order to better assure proper operation of the temperature sensitive user interface in all operating conditions.

Abstract: An on die thermal sensor (ODTS) for use in a semiconductor device includes a temperature information output unit for measuring an internal temperature of the semiconductor device to generate a temperature information code having temperature information, and updating the temperature information code according to a refresh period.

Abstract: Methods of estimating the temperature of a reaction site on a measurement strip in a blood glucose measuring devices are provided. In one embodiment, a method includes determining an activation initiation time, an activation duration time, a thermal magnitude and a temperature elevation for heat generating components within a device. The temperature elevation for each of the heat generating components is determined at least in part by an impulse response matrix [Xi], the activation initiation time, the activation duration time and the thermal magnitude for each of the heat generating components.

Abstract: An ear-type thermometer which measures body temperature using a temperature detection element 21 that detects ambient temperature and an infrared detection element 22 that detects infrared radiation from a measurement site within the aural cavity, the 2 elements housed in a probe 3, wherein the ear-type thermometer comprises a probe cover 10 which can be detachably provided with the probe, a detection switch 60 which detects that the probe cover is attached or detached to the probe, and two temperature conversion coefficients 52a and 52b which corrects body temperature based on the detection result from the two detection elements.

Abstract: Correcting a temperature measurement of a target sensed at one temperature sensor in an asset tracking device by using another temperature sensor. The asset tracking device includes at least one heat source that affects the temperature sensor for sensing the temperature of the target. The other temperature sensor measures temperature at a location in the asset tracking device. The relationships between an actual temperature of the target and the temperature measured at the two sensors are established through experiments or model. Using the relationships, the measured temperature of the target can be corrected to obtain a corrected temperature of the target.

Abstract: An optical measurement instrument includes one or more temperature sensors (122) arranged to measure sample well specific temperatures from sample wells (111-117) arranged to store samples (103-109) to be optically measured. A processing device (121) of the optical measurement instrument is arranged to correct, using a pre-determined mathematical rule, measurement results obtained by the optical measurements on the basis of the measured sample well specific temperatures. Hence, the adverse effect caused by temperature differences between different samples on the accuracy of the temperature correction of the measurement results is mitigated.

Abstract: A temperature measurement device is provided to measure an environment temperature and includes a thermistor, a resistor, a determination circuit, and a measurement circuit. The thermistor is coupled to a first node. The thermistor has a specific impedance value at a specific environment temperature point. The resistor has a first terminal coupled to the first node. The determination circuit determines a real impedance value of the resistor. The measurement circuit is coupled to the first node for receiving a measurement value signal generated at the first node and obtains a value of the specific environment temperature point according to the measurement value signal and the real impedance value of the resistor.

Abstract: A temperature detector includes a plurality of comparators, an electronic component and a controller. Each of the comparators is responsible for detecting different temperature ranges. The electronic component has a temperature-dependent threshold voltage and an output connected to inputs of the plurality of comparators. The controller is configured to enable only one of the comparators at one time and to generate a value to the other inputs of the plurality of comparators.

Abstract: Aspects of the invention may comprise an integrated circuit comprising a memory, a temperature sensor, a crystal, and a communication module. Data stored in the memory may indicate a frequency of the crystal as a function of temperature and/or time. The memory may be writable via the communication module. Data stored in the memory of the integrated circuit may be updated based on an age and/or time of use of the integrated circuit. The time of use may be one or both of: how long the crystal has been oscillating since its most-recent start up, and how long the crystal has been in use over its lifetime. An electronic device may calculate a frequency of an oscillating signal output by the crystal based on a temperature indication from the temperature sensor and data read from the memory of the integrated circuit.

Abstract: Disclosed is a method for pre-heating a hard disk drive of a computer device, wherein a temperature sensor and a heater are arranged at preset locations outside the computer device. The temperature sensor detects an external temperature of the hard disk drive, which is compared with an activation temperature threshold stored in a data memory unit of the computer device. The activation temperature threshold is calibrated by a preset compensation value stored in the data memory unit. When the external temperature of the hard disk drive subtracting the preset compensation value is less than the activation temperature threshold of the hard disk drive, the activation of the hard disk drive is prohibited and the heater carries out heating on the hard disk drive until the activation temperature threshold of the hard disk drive is reached; thereafter, the hard disk drive is activated again.

Abstract: A temperature sensor is provided. The temperature sensor includes: a temperature sensing unit for sensing a temperature and outputting a temperature sensing signal; an analog-to-digital converter (ADC), coupled to the temperature sensing unit, for converting the temperature sensing signal to a digital value, having an ADC output range; a calibration unit, coupled to the ADC, for correlating the ADC output range with at least one temperature range; a memory unit, coupled to the calibration unit, recording the ADC output range, and the at least one temperature range, and the correlation therebetween.

Abstract: A method for measuring the intra-die temperature of a wafer with a fast response time is described. The method includes providing a wafer in a thermal process chamber, radiating the wafer in a first predetermined radiation range to heat the wafer to a predetermined temperature range for a predetermined time, receiving the radiation reflected from a die area while the wafer is being heated and detecting reflected radiation having a second predetermined radiation range, and determining a temperature of the die area by a processor being responsive to the detected second predetermined radiation range.

Abstract: A high-resolution, non-contact sensor that measures the temperature of an elongated roll comprises an array of low-mass air temperature elements positioned adjacent the cylindrical surface. As the roll rotates a boundary layer of air is formed along the contour of the roll. Each air temperature element can be housed in a chamber into which a portion of the boundary layer air directed. The temperature of the air temperature element eventually stabilizes and is a function of the roll surface temperature. Associated air compensator elements detect ambient air temperatures and the actual surface temperature profile is extracted from calibration curves based on measurements from both the air temperature and compensator elements.

Abstract: A system and a method for monitoring and inspecting food safety is disclosed. The system adopts insert and use concept that only requires an initial push on a button to begin its function. The system provides visual alert for different conditions if food products are in unsafe status. The system is pre-calibrated during manufacture without complicated or multi-step calibration or recalibration procedures during application. The system relies on modern surface-mount microprocessor technology that enables long-term calibration stability along with very low power consumption for extended battery life.

Abstract: The disclosure generally relates to method and apparatus for predicting the steady state temperature of solid state devices, preferably under transient conditions. An apparatus according to one embodiment of the disclosure includes a thermocouple for detecting temperature of the solid state system; a processor in communication with the thermocouple and programmed with instructions to: construct an initial curve for the solid state system, the initial curve having a shape; obtain a plurality of theoretical temperature curves for the solid state system; select one of the plurality of theoretical temperature curves having a shape closest to the shape of the initial curve; and superimposing the selected theoretical temperature curve on the initial curve to predict the steady state temperature.

Abstract: Methods and systems for calibrating a temperature control system in a vapor deposition chamber. A temperature sensor senses temperature within a semiconductor processing chamber and generates an output signal. A temperature control system controls a chamber temperature by controlling a heating apparatus based on the output signal. A method includes instructing the control system to target a setpoint temperature, and depositing a layer of material onto a surface in the chamber by a vapor deposition process. A variation of a property of the layer is measured while depositing the layer, the property known to vary cyclically as a thickness of the layer increases. The measured property is allowed to vary cyclically for one or more cycles. If there is a difference between a time period of one or more of the cycles and an expected time period associated with the setpoint temperature, the temperature control system is adjusted based on the difference.

Abstract: A microcontroller operated module is affixed to a firearm. The module includes an accelerometer for measuring the G force of each round fired by the firearm, a flash memory (non-volatile memory) for storing the shot profile data that includes shot count and recoil data and transmitting it to a remote location such as a remote computer via a serial communication device pursuant to RS232 standard, Bluetooth, a wave or other low power RF transmitter. The module including a wake up circuit adapted to switch upon detection of a fired shot to signal said microcontroller to initialize a low power mode to activate said MEMS accelerometer faster than said accelerometer would activate by itself.

Abstract: Sensor measurements are used to detect when a device incorporating the sensor is stationary. While the device is stationary, sensor measurements at a current device temperature are used to estimate model parameters. The model parameters can be used in a state estimator to provide an estimated attitude that can be provided to other applications. In some implementations, the estimated attitude can be used to mitigate interference in other sensor measurements.

Abstract: A temperature measuring and identification (TMID) device obtains identification information and temperature information of a connected device having a temperature sensing circuit (TSC). The TSC includes a temperature sensing element (TSE) connected in parallel with a voltage clamping network (VCN) that limits the voltage across the TSE to an identification voltage within an identification voltage range when the voltage is greater than or equal to a lower voltage of the identification voltage range. When a voltage below the lower range is applied to the TSC, the VCN appears as an open circuit and the resistance of the TSC corresponds to temperature. A translation circuit within the TMID shifts TSC voltages within the identification voltage range to a normalization voltage range. Accordingly, voltages corresponding to temperature as well as voltages corresponding to identification are within the normalization voltage range.

Abstract: A method including digitally modelling a temperature measured by a sensor by using a modeled signal and estimating a lag error signal for the sensor from the modeled signal and a signal obtained by filtering the modeled signal, the filter having as a parameter an estimate of a time constant of the sensor, and correcting the measurement signal delivered by the sensor by the estimated lag error signal. The time constant of the sensor is estimated as a function of time from the measurement signal and the modeled signal.

Abstract: An automatic auto-correcting method is presented to improve the accuracy of fiber optic distributed temperature measurements derived from Raman back scatterings utilizing two light sources with different wavelengths, by appropriate choice of the wavelengths of the two sources, the use of single pulse modulating circuit for the two light sources, and use of one of the light sources as a primary measurement system and the second light source as an occasional correcting source.

Abstract: Aspects of a method and system for signal generation via a temperature sensing crystal integrated circuit are provided. In this regard, a temperature sensing crystal integrated circuit (TSCIC) comprising a memory and a crystal or crystal oscillator may generate a signal indicative of a measured temperature. The generated signal and data stored in the memory may be utilized to configure one or more circuits communicatively coupled to the TSCIC. The data stored in the memory may characterize behavior of the TSCIC as a function of temperature and/or time. The data characterizing the behavior of the TSCIC may indicate variations in frequency of the crystal or crystal oscillator as a function of temperature and/or time. The data characterizing the behavior of the TSCIC may comprise one or both of a frequency value and a frequency correction value.

Abstract: A thermometer includes a first surface temperature measurement unit; a first reference temperature measurement unit; a second surface temperature measurement unit; a second reference temperature measurement unit; a temperature correction unit that calculates a mounting positional difference between the first and second surface temperature measurement units from a measurement subject and a mounting positional difference between the first and second reference temperature measurement units from the measurement subject in terms of temperature differences that compensate for temperature dependence, thus correcting the first surface temperature and first reference temperature, or the second surface temperature and second reference temperature; and a core temperature calculation unit that calculates a core temperature of the measurement subject using the first surface temperature and first reference temperature or the second surface temperature and second reference temperature corrected by the temperature correction

Abstract: A method for determining an exhaust gas temperature of an internal combustion engine, which is performed by measuring a lambda value of the exhaust gas of the internal combustion engine and calculating a calculated exhaust gas temperature as a function of the measured lambda value, and comparing the calculated exhaust gas temperature with a measured exhaust gas temperature and adapting a function used for the calculation as a function of the comparison.

Abstract: A method for wafer analysis with artificial neural network and the system thereof are disclosed. The method of the system of the present invention has several steps, including: first of all, providing a test unit for wafer test and generating a plurality of test data; next, transmitting the test data to a processing unit for transferring to output data; then, comparing the output data with predictive value and modifying bias and making the output data close to the predictive value, and repeating the steps mentioned above to train this system; finally, analyzing wafers by the trained system. Using this system to analyze wafers not only saves time, but also reduces manpower and the risk resulting from artificial analysis.

Abstract: Pade Approximant function emulators are used to model the nonlinear offset and/or nonlinear sensitivity behaviors of a sensor relative to temperature sub-ranges and to produce temperature compensating corrections for both offset and sensitivity as desired. In order to avoid use of brute force division for generating the Pade Approximant function signals, in one set of embodiments, feedback is used to provide a corresponding effect. In order to minimize the number of coefficients that are to be resolved and stored, in one set of embodiments, first or higher order Pade Approximants with normalized denominators are used so that each function can be defined with just three coefficients. Embodiments that are more analog in nature or more digital in nature are disclosed. Methods for resolving the Pade Approximant coefficients and calibrating each sensor unit on a mass production basis are also disclosed.

Abstract: Aspects of a method and system for compensating temperature readings from a temperature sensing crystal integrated circuit are provided. An electronic device may digitize a temperature indication received from a temperature sensing circuit, digitize one or more calibration voltages received from said temperature sensing circuit, and calculate a compensated temperature indication utilizing the digitized calibration voltage(s), and the digitized temperature indication, and data from a table that characterizes behavior of the temperature sensing circuit as a function of temperature. One or more circuits in the electronic device may be controlled based on the compensated temperature indication. The compensated temperature indication may compensate for a gain error and/or offset error of a digital to analog converter that digitizes the temperature indication and the calibration voltage(s). There may be two calibration voltages.

Abstract: A method and apparatus for estimating the temperature sensed upon contact with a surface. The method includes contactless heating of the surface, contactless measurement of a time change in temperature of the surface, and estimation of the temperature sensed upon contact with the surface on the basis of this time change in temperature.

Abstract: A system and method of determining the temperature of a rotating electromagnetic machine, such as an electric motor or generator. A temperature calibration parameter is calculated based on the temperature of an object situated close to the motor, such as a motor drive connected to the motor, and a first resistance value of the winding. In exemplary embodiments, the motor drive and first resistance value are determined only after the motor has been idle for some predetermined time period. Once the calibration parameter is calculated, the processor uses it along with subsequent resistance measurements to calculate the temperature of the motor.

Abstract: A method and system for calibrating temperature measurement devices, such as pyrometers, in thermal processing chambers are disclosed. According to the present invention, the system includes a calibrating light source that emits light energy onto a substrate contained in the thermal processing chamber. A light detector then detects the amount of light that is being transmitted through the substrate. The amount of detected light energy is then used to calibrate a temperature measurement device that is used in the system.

Abstract: An on die thermal sensor (ODTS) includes a thermal sensor for outputting a first comparing voltage by detecting a temperature of the semiconductor memory device; a comparing unit for outputting a trimming code by comparing the first comparing voltage with a second comparing voltage and increasing or decreasing a preset digital code in response to the comparing result; and a voltage level adjusting unit for adjusting a voltage level of the second comparing voltage by determining a maximum variation voltage and a minimum variation voltage based on the trimming code and a temperature control code.

Abstract: A method for on-orbit calibration of the temperature sensors of a blackbody is disclosed. The method may include selecting a blackbody traveling in a micro-gravity environment and comprising a sensor, a container positioned proximate the sensor and containing a material, and a heat transfer device positioned proximate the at least one container. The heat transfer device may transition the material through a phase change. The temperature sensor may monitor the temperature of the material during the phase change. Additionally, the state of the material may be measured by displacement of the container to improve the accuracy of the plateau temperature measurement. A correction may be calculated to correct any disparity between the temperature reported by the temperature sensor during the phase change and the known plateau temperature, measured at a threshold state of the material, corresponding to that phase change.

Abstract: The present invention describes a method for determining a value for the temperature, radiation, emissivity, transmissivity and/or reflectivity of an object (2) such as a semiconductor wafer in a rapid heating system (1), wherein an output signal from a radiation detector (50) which records temperature radiation from the object is used as a measurement value, and wherein prediction values for the measurement values are calculated in a model system (100). The development over time of the measurement values is compared with the development over time of the prediction values and the measurement value is corrected if the difference exceeds predetermined threshold value.

Abstract: A method and a system for determining the rotor temperature of an electric motor of a hybrid vehicle. In a method for determining the rotor temperature of an electric motor of a hybrid vehicle in which it is possible to reliably determine the rotor temperature using simple means, the rotor temperature of the electric motor being ascertained by measuring an operating parameter of the electric motor during operation of the hybrid vehicle.

Abstract: A method of reducing de-icing heater error (DHE) in total air temperature (TAT) probes is provided. Using the method, a nominal DHE function is obtained for a particular type of TAT probe, with the nominal DHE function having been derived from a plurality of TAT probes of the particular type. A probe specific correction coefficient is calculated for an individual TAT probe of the particular type as a function of a measured DHE at a first airflow and a predicted DHE at the first airflow. The predicted DHE at the first airflow is determined using the nominal DHE function derived from the plurality of TAT probes of the particular type. The probe specific correction coefficient is then stored for later use, or used to determine DHE with the individual TAT probe over a range of airflows as a function of the probe specific correction coefficient.

Abstract: A method for interpreting a temperature reading of a thermistor includes the steps of calculating a power dissipation of the thermistor via a processor and calculating a temperature error for the temperature reading via the processor using the power dissipation.

Abstract: A method for adaptive compensation of a temperature drift of a sensor, designed to measure the torque of a shaft or a drive train or the force in mechanical equipment during operation. A sensor signal is recurrently measured. An associated temperature is determined. An offset value is calculated as a function of temperature based on measured and stored data. The measured signal value is compensated using the calculated offset value. When the sensor is unloaded or nearly unloaded is detected. When the sensor is unloaded or nearly unloaded the signal sensor signal value and the associated temperature value are stored in a memory and a model of the sensor offset is updated. A system and computer program product for adaptive compensation of the temperature drift of such a sensor signal offset.

Abstract: A method and apparatus for determining an operating voltage lower bound for preventing photovoltaic (PV) cell reverse breakdown during power conversion. The method comprises determining a PV cell operating temperature; computing, at a controller, an operating voltage corresponding to a maximum power point (MPP) based on the PV cell operating temperature; and determining, at the controller, an operating voltage lower bound based on the operating voltage.

Abstract: Aspects of a method and system for compensating temperature readings from a temperature sensing crystal integrated circuit are provided. In this regard, a temperature indication and calibration voltages from a temperature sensing crystal integrated circuit (TSCIC) may be digitized and the digital signals may be utilized to calculate a compensated temperature indication. Data derived from a memory integrated within the TSCIC may be retrieved based on the compensated temperature indication. The retrieved data may be utilized to control operation of one or more circuits. The compensated temperature indication may be calculated by removing a gain error and/or offset error from the digitized temperature indication. The compensated temperature indication may be utilized as an index for a data table. The compensated temperature indication may be a normalized compensated temperature indication. The calibration voltages may include a minimum voltage and/or a maximum voltage that the TSCIC is operable to output.

Abstract: An apparatus and a method monitor condition of a temperature measurement point in an industrial process system by sensing vibration frequency of a thermowell positioned in a process fluid flow passage and providing a diagnostic output based upon the vibration frequency sensed. The apparatus includes a temperature measurement point having a thermowell, a vibration sensor, a temperature sensor, and a transmitter. The vibration sensor is fixedly attached to the thermowell, and the temperature sensor is positioned inside a bore cavity of the thermowell. The transmitter is electrically connected to both the temperature sensor and the vibration sensor.

Abstract: An evaluation method for pneumatic tires and a system thereof, is provided, capable of appropriately evaluating an adverse effect, such as deterioration, of tire temperature by expressing severity of a temperature imposed on a member of tire made of rubber or the like in quantitative and convenient manners. Detection counts are calculated for each detected temperature according to a detection counts calculating unit 102 based on information of temperatures of pneumatic tires detected by a temperature sensor of a temperature detector 101. Temperature severity numbers of the pneumatic tires are calculated from a computing equation by a severity calculating unit 104 based on the detection counts and contribution coefficients of deterioration of tire rubber with temperatures stored in a contribution coefficient storage 103 as parameters. Using the calculated temperature severity number, a determination unit 105 determines thermal deterioration of the tire.

Abstract: The present subject matter is directed to a high-speed high resolution and accuracy time interpolator circuit. The interpolator uses basic dual ramp time-to-digital converter architecture, but provides circuits and methodologies to improve the accuracy, reduce the effective intrinsic jitter, and reduce the measurement time. Improved aspects of the present subject matter correspond to the introduction of a current mirror for improved settling time, a high frequency clock for improved resolution and ADC sample processing to improve resolution and accuracy.

Abstract: Fluid temperature control and sensor calibration is disclosed. In an embodiment, a fluid temperature control unit includes a heater configured to heat a first fluid in a first fluid path, a first temperature sensor configured to measure a temperature of the first fluid in the first fluid path, a second temperature sensor configured to measure a temperature of a second fluid in a second fluid path, and a controller configured to control the heater on the basis of the temperature sensed by the first sensor and the temperature sensed by the second sensor.

Abstract: In a method for monitoring the functionality of a temperature sensor that can deliver an electrical signal as a function of the measured temperature and is disposed, in particular, in the cooling water circuit of an internal combustion engine, the persistence of the temperature sensor in the high signal range is made possible by a method encompassing the following steps: Characterizing the sensor as possibly faulty if the sensor indicates, upon engine shutdown, at least a maximum value of the cooling fluid temperature; determining a first gradient of the cooling fluid temperature, measured by the possibly faulty sensor, up to a first point in time after engine shutdown, and characterizing the sensor as fault-free if the gradient exceeds a minimum value; determining a second gradient of the cooling fluid temperature, measured by the possibly faulty sensor, between the point in time and a point in time after engine shutdown, and characterizing the sensor as fault-free if the second gradient exceeds a minimum va

Abstract: A temperature sensor, in accordance with the principles of the invention comprises a silicon substrate. The silicon substrate includes a bandgap, an offset circuit for providing calibration offsets, and a gain block for providing an output that varies substantially linearly with changes in temperature of the substrate.

Abstract: The invention relates to a method for determining the exhaust gas temperature of a vehicle motor using a temperature probe comprising a temperature sensor and a protective tube, which surrounds the temperature sensor and projects into an exhaust gas flow. According to the invention, a corrected temperature value is calculated from a plurality of chronologically consecutive temperature measurement values, using a characteristic of the thermal inertia of the temperature probe. The invention further relates to a temperature probe comprising an evaluation unit, which during operation carries out such a method.

Abstract: This invention relates a method to use a bipolar transistor as temperature sensor and/or self-calibrated thermometer which is immune to errors generated by parasitic elements as resistances and ideality factors and their evolution. In this invention the product of the collector current values ICmi(VEBmi) as a function of the emitter-base forward bias voltage VEBim; ICi(VEBi)×exp(?qVEBi/kT0) is plotted as a function of the emitter-base forward bias voltage VEBim. T0 is a parameter which ensures that a region of the above mentioned plot results with a slope equal to zero, while simultaneously represents the transistor absolute temperature at the moment at which the collector current ICmi is obtained as a function of the forward bias VEBmi.

Abstract: System and method for auto correcting temperature measurement in a system using a fiber optic distributed sensor and a single light source by making use of both spontaneous and stimulated Raman backscattering.

Abstract: Temperature of an electric power device of a hybrid transmission is managed based upon device temperatures and power flow, ambient temperature, and a cooling circuit flow rate.