Abstract: Provided is an accelerometer. The accelerometer includes a frame portion with an opening formed inside, a central portion disposed in the opening, a connecting portion disposed on an upper surface and a lower surface of the central portion and connecting the frame portion and the central portion, and a sensing portion that converts a sensed acceleration into an electrical signal, and the accelerometer senses an acceleration in a Z-axis direction penetrating an upper surface and a lower surface of the central portion, and reduces a sensing of an acceleration in an X-axis direction and a Y-axis direction crossing the Z-axis direction.

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

Abstract: An inertial sensor includes, provided that axes X, Y, and Z are three axes perpendicular to one another, a substrate, a fixed section fixed to the substrate, a movable element that swings around a swing axis extending along the axis Y, a first beam and a second beam that link the fixed section to the movable element and are torsionally deformed by the swing motion of the movable element, and a detection electrode that is disposed on the substrate and overlaps with the movable element in the plan view along the axis-Z direction, and the first beam and the second beams differ in shape from each other and have the same torsional spring constant.

Abstract: A MEMS accelerometer, including: a substrate, a movable component and a fixed electrode group, wherein a surface of the substrate has an anchoring region; the movable component is connected to the anchoring region through a supporting beam and suspended above the substrate, and the movable component includes a first proof mass and a second proof mass; the first proof mass has a first hollowed-out region in the middle, the first hollowed-out region is I-shaped, and the second proof mass is located in the first hollowed-out region; and the fixed electrode group includes a first electrode group, which is fixed on the surface of the substrate, located between the substrate and the movable component, and forms a Z-axis detection capacitor bank with the first proof mass and the second proof mass.

Abstract: The physical parameter measurement method is performed using an electronic circuit (1) with a resistive sensor (2). The resistive sensor includes two resistors (R1, R2) mounted in series, whose connection node connected to a moving mass (M), is connected to a first input of an amplifier-comparator (3). A second input of the amplifier-comparator receives a reference voltage. One output of the amplifier-comparator is connected to a logic unit (4), which provides a digital output signal (OUT). A digital-to-analogue converter (5) provides a measurement voltage (Vdac), as a function of a digital signal provided by the logic unit, to the first resistor (R1) in a first phase of a measurement cycle, whereas the second resistor (R2) is polarized by a polarization voltage, and to the second resistor in a second phase, whereas the first resistor is polarized by a polarization voltage via a switching unit.

Abstract: An accelerometer for sensing acceleration along a sensing axis, includes a flexure member (having a pendulum member pivotably connected to a support member via a hinge arrangement), a housing, and at least one mounting structure configured for clamping the support member to the housing in load bearing contact while concurrently allowing for differential movement between the support member and the housing. Embodiments also include a corresponding housing member for use with a flexure member of an accelerometer, and a flexure member for use with a housing of an accelerometer.

Abstract: An electronic device includes: a first member having a first surface; a second member placed on the side of the first surface; a functional element accommodated in a cavity formed by the first member and the second member; an external connection terminal disposed outside of the cavity on the side of the first surface of the first member; a groove portion disposed on the side of the first surface of the first member and extending from the inside to the outside of the cavity; a wiring disposed within the groove portion and electrically connecting the functional element with the external connection terminal; a first through-hole disposed at a position of the second member, the position overlapping the groove portion in plan view; and a filling member disposed within the first through-hole and filling the groove portion.

Abstract: This invention relates to methods and apparatus for measuring physical properties using microwave cavity sensors. In operation, a number of microwave cavity sensors are interrogated by a remote wireless unit in order to determine the current resonant frequency for the sensor. The current values for various parameters measured by the sensors, such as temperature, stress/stain, or the like, are determined by comparing the current resonant frequency to a first resonant frequency of the sensor, and thus, detect any change in the value of the selected parameter. In particular, the present invention is directed toward extending the range over which such measurements may be performed, using these types of sensors.

Abstract: In a microelectromechanical device, a mobile mass is suspended above a substrate via elastic suspension elements and is rotatable about said elastic suspension elements, a cover structure is set above the mobile mass and has an internal surface facing the mobile mass, and a stopper structure is arranged at the internal surface of the cover structure and extends towards the mobile mass in order to stop a movement of the mobile mass away from the substrate along an axis (z) transverse to the substrate. The stopper structure is arranged with respect to the mobile mass so as to reduce an effect of reciprocal electrostatic interaction, in particular so as to minimize a resultant twisting moment of the mobile mass about the elastic suspension elements.

Abstract: An out-of-plane comb-drive accelerometer. An example accelerometer linearizes a response. An example accelerometer includes one or more stators having a plurality of tines having a surface parallel to a surface of substrate. The tine surface is at a first distance from the surface of the substrate. A proof mass includes one or more rotors that include a plurality of rotor tines attached to an edge of the proof mass. The rotor tines are interleaved with corresponding ones of the stator tines. The rotor tines include a surface parallel to a surface of the substrate. The rotor tine surface is at a second distance from the surface of the substrate. The first distance and second distance are unequal by a threshold amount. Motion of the rotor relative to the stator in an out-of-plane direction provides a linear change in a capacitive value measured across the rotor and the stator.

Abstract: A micromechanical component includes: a substrate having a multitude of trench structures which separate a first and a second mass element of the substrate from a web element of the substrate, in such a way that the first and second mass elements enclose the web element along an extension direction of the main surface of the substrate and are disposed to allow movement relative to the substrate in the direction of a surface normal of the main surface; a first electrode layer applied on the main surface of the substrate and forms a first electrode on the web element between the first and second mass elements; and a second electrode layer applied on the first and second mass elements and forming a self-supporting second electrode above the first electrode in the area of the web element, the first and second electrode forming a capacitance.

Abstract: A capacitive accelerometer having one or more micromachined acceleration sensor assembly is disclosed. The acceleration sensor assembly comprises a spring-mass-support structure, a top cap and a bottom cap. The proof mass plate of the spring-mass-support structure has cutout spaces and is supported by a pair of branched torsional beams which are substantially located in the cutout spaces. The torsional axis of the proof mass plate is offset from the mass center in direction perpendicular to the proof mass plate. The acceleration sensor assembly further comprises multiple coplanar electrodes for differential capacitive sensing and electrostatic forcing. The capacitive accelerometer according to the present invention may comprise one, two or six micromachined acceleration sensor assemblies with electronic signal detection, conditioning and control circuits in different configurations and applications to detect and measure linear and angular accelerations.

Abstract: A tunneling accelerometer includes a proof mass that moves laterally with respect to a cap wafer. Either the proof mass or the cap wafer includes a plurality of tunneling tips such that the remaining one of proof mass and the cap wafer includes a corresponding plurality of counter electrodes. The tunneling current flowing between the tunneling tips and the counter electrodes will thus vary as the proof mass laterally displaces in response to an applied acceleration.

Abstract: A capacitive accelerometer having one or more micromachined acceleration sensor assembly is disclosed. The acceleration sensor assembly comprises a spring-mass-support structure, a top cap and a bottom cap. The proof mass plate of the spring-mass-support structure has cutout spaces and is supported by a pair of branched torsional beams which are substantially located in the cutout spaces. The torsional axis of the proof mass plate is offset from the mass center in direction perpendicular to the proof mass plate. The acceleration sensor assembly further comprises multiple coplanar electrodes for differential capacitive sensing and electrostatic forcing. The capacitive accelerometer according to the present invention may comprise one, two or six micromachined acceleration sensor assemblies with electronic signal detection, conditioning and control circuits in different configurations and applications to detect and measure linear and angular accelerations.

Abstract: A vibration measuring system for the frequency-selective measuring of especially low-frequency vibrations relevant in the area of automation and motive power engineering is disclosed which allows an economical vibration analysis of frequencies in the range of from 0 to 1 kHz. For this purpose, a broad-band transmitting structure which is directly induced by the excitation signal to be determined is coupled to a receiving structure by an electrostatic or inductive force. This force coupling brings about an amplitude modulation of a carrier signal inducing the receiving structure. The spectrum of the amplitude-modulated carrier signal can then be used to extract the actual excitation signal, e.g. by suitably choosing the frequency of the carrier signal.

Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.

Abstract: The invention relates to an inertial sensor arrangement (2), in particular for installation in a motor vehicle, having a sensor module (8) which is fitted to a carrier (6) and comprises a micromechanically produced inertial sensor and an evaluation circuit. The invention provides for the sensor module (8) to be connected to the carrier (6) by means of an elastic coupling element (14).

Abstract: An acceleration sensor is described that has a base substrate, a first electrode structure situated in stationary fashion relative to the base substrate, a sensor element having a first electrode area, and a spring device having at least one spring element. Via the spring element, the sensor element is coupled to the base substrate so that the sensor element is deflected relative to the base substrate as the result of an acceleration acting on the sensor element, thus changing the distance between the first electrode structure and the first electrode area. The sensor element and the first electrode structure are situated at least partially one over the other and are formed from a common functional layer.

Abstract: An acceleration sensor, which has realized such a high impact-resistance that a weight bottom surface of an acceleration sensor element does not directly collide with an inner bottom plate of a protection case made of ceramic, glass or silicon to avoid edges and corners of the weight bottom surface of the acceleration sensor element chipping, even when an excessive acceleration or impact is applied to the acceleration sensor. The acceleration sensor comprises the acceleration sensor element having in a center a weight that works as a pendulum when acceleration is applied, and the protection case housing the acceleration sensor element. The inner bottom plate of the protection case works as a regulation plate to prevent the weight from excessively swing downwards. An impact buffer material of a metal layer or a resin layer is provided on the weight bottom surface or the inner bottom plate of the protection case.

Abstract: An out-of-plane sensing device is provided. A proof mass is movable with respect to a substrate. A frame is positioned on the substrate and encloses the proof mass. At least one spring connects the proof mass to the frame so that the spring will exert a force on the proof mass to make the proof mass move back to its equilibrium position when the proof mass moves perpendicularly to the substrate. An electrode extends from the proof mass toward the frame. A counter electrode extends from the frame toward the proof mass, wherein the projection of the electrode onto the substrate overlaps with that of the counter electrode onto the substrate.

Abstract: The angular velocity sensor includes a container, a sensing element in the container and a viscous fluid between the container and the sensing element. The sensing element is supported by the viscous fluid such as an ER fluid or an MR fluid. The angular velocity sensor detects acceleration of the body in which the angular velocity sensor is installed. The angular velocity sensor controls the viscosity of the viscous fluid depending on the acceleration of a body, by changing a voltage applied to the viscous fluid.

Abstract: In a microelectromechanical device, a mobile mass is suspended above a substrate via elastic suspension elements and is rotatable about said elastic suspension elements, a cover structure is set above the mobile mass and has an internal surface facing the mobile mass, and a stopper structure is arranged at the internal surface of the cover structure and extends towards the mobile mass in order to stop a movement of the mobile mass away from the substrate along an axis (z) transverse to the substrate. The stopper structure is arranged with respect to the mobile mass so as to reduce an effect of reciprocal electrostatic interaction, in particular so as to minimize a resultant twisting moment of the mobile mass about the elastic suspension elements.

Abstract: An angular rate sensor includes: a circuit board; a package including an angular rate sensor chip and a connection terminal; and a conductive member. The angular rate sensor chip is accommodated in the package. The package is disposed on the circuit board through the conductive member. The package further includes a first electrode disposed on a bottom of the package, the first electrode connecting to the connection terminal. The circuit board includes a second electrode disposed on a top of the circuit board. The angular rate sensor chip in the package is electrically connected to the circuit board through the connection terminal, the first and the second electrodes and the conductive member. The circuit board and the package are electrically and elastically connected by the conductive member.

Abstract: A suspended, coupled micromachined structure including two proof masses and multiple support arms configured to suspend the masses above a substrate and a coupling spring element having two ends. Each end of the coupling spring element may be attached to a proof mass at a point between the proof masses. The frequency response characteristics of the proof masses may be improved.

Abstract: An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305) also includes a top cap press frame recess (405) and a bottom cap press frame recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of the accelerometer (305). A dicing process is performed on the accelerometer (305) to isolate the electrical leads of the accelerometer (305). The accelerometer (305) further includes overshock protection bumpers (720) and patterned metal electrodes to reduce stiction during the operation of the accelerometer (305).

Abstract: For a sensor whose sensor structure is implemented in a micromechanical structural component and which has parts which are movable in relation to the stationary substrate of the structural component, and which also includes an unsupported a seismic mass, a spring system having at least one spring, the seismic mass being connected to the substrate through the spring system, and an overload protection to limit the deflection of the spring system and the seismic mass in at least one direction, and an arrangement for detecting the deflections of the spring system and the seismic mass, whereby the impact forces may be reduced to prevent conchoidal breaks and resulting incipient damage to the sensor structure, as well as formation of particles. To that end, at least one two-dimensional stop for at least one moving part of the sensor structure is provided as overload protection.

Abstract: Disclosed is an accelerometer for measuring seismic data. The accelerometer includes a proof mass that is resiliently coupled to a support structure by folded beams, S-shaped balanced beams, straight beams, and/or folded beams with resonance damping. The support structure further includes travel stops for limiting transverse motion of the proof mass.

Abstract: The present invention is a seismometer/velocimeter, and can be also made to function as an accelerometer. The invention comprises an in-plane suspension geometry combined with a transverse periodic-sensing-array position transducer. The invention can incorporate a feedback actuator of magnetic design, incorporating fixed magnets and planar coils on the surface of the proof mass allowing for much lower noise than an equivalent electrostatic actuator without requiring high voltages. The invention may also have a dual-axis configuration by using two sets of springs. The nested suspensions allow the proof mass to move in two orthogonal directions. A three-axis configuration is possible by combining the dual-axis version with sensing and actuation of the proof mass motion out of the plane. The position sensing for the out-of-plane motion can be made using schemes common in existing state-of-the-art sensors. Actuation for the sensors may be electrostatic or electromagnetic in each of the axis.

Abstract: A three axis sensor including a substantially planar vibrator resonator (2) having a substantially ring or hoop like structure, drive means (4) for causing the resonator (2) to vibrate in an in plane cos 2&thgr; vibration mode, carrier mode pick-off means (5) for sensing movement of the resonator in response to said drive means, pick-off means (6) for sensing in plane sin 2&thgr; resonator motion induced by rotation about the z-axis, drive means (7) for nulling said motion, pick-off means (8) for sensing out of plane sin 3&thgr; resonator motion induced by rotation about the x-axis, drive means (9) for nulling said motion, pick-off means (10) for sensing out of plane cos 3&thgr; resonator motion induced by rotation about the y-axis, drive means (11) for nulling said motion, and support means (9) for flexibly supporting the resonator, wherein the support means comprises only L support beams, where L≠2J×3K and J=0, 1 or 2 and K=0 or 1 with L>24.

Abstract: An integrated circuit and method are provided for sensing activity such as acceleration in a predetermined direction of movement. The integrated released beam sensor preferably includes a switch detecting circuit region and a sensor switching region connected to and positioned adjacent the switch detecting circuit region. The sensor switching region preferably includes a plurality of floating contacts positioned adjacent and lengthwise extending outwardly from said switch detecting circuit region for defining a plurality of released beams so that each of said plurality of released beams displaces in a predetermined direction responsive to acceleration. The plurality of released beams preferably includes at least two released beams lengthwise extending outwardly from the switch detecting circuit region to different predetermined lengths and at least two released beams lengthwise extending outwardly from the switch detecting circuit region to substantially the same predetermined lengths.

Abstract: For use in a MEMS device having a suspended proof mass, a method and apparatus for securing the MEMS device during a period of high acceleration. The method may include applying a DC voltage between the proof mass and a non-suspended structure of the device. The non-suspended structure may be mounted on a substrate, and the substrate or the non-suspended structure may be electrically isolated from the proof mass by an insulating layer or by one or more islands. Applying the DC voltage creates an electrostatic force that moves the proof mass toward (or holds the proof mass near) the substrate. Movement of the proof mass may be limited by mechanical contact between the proof mass and the insulating layer, the one or more islands, or by a cage mounted on the substrate during the period of high acceleration.

Abstract: A suspended, coupled micromachined structure including two proof masses and multiple support arms configured to suspend the masses above a substrate and a coupling spring element having two ends. Each end of the coupling spring element may be attached to a proof mass at a point between the proof masses. The frequency response characteristics of the proof masses may be improved.

Abstract: A semiconductor physical quantity sensor from which a stable sensor output can be obtained even when the usage environment changes. A silicon thin film is disposed on an insulating film on a supporting substrate, and a bridge structure having a weight part and moving electrodes and cantilever structures having fixed electrodes are formed as separate sections from this silicon thin film. The moving electrodes provided on the weight part and the cantilevered fixed electrodes are disposed facing each other. Slits are formed at root portions of the cantilevered fixed electrodes at the fixed ends thereof, and the width W1 of the root portions is thereby made narrower than the width W2 of the fixed electrodes proper. As a result, the transmission of warp of the supporting substrate to the cantilevered fixed electrodes is suppressed.

Abstract: An apparatus and method for suspending two or more force-versus-displacement sensors for measuring displacement of a pendular structure relative to a frame structure, wherein a suspension structure includes the frame and pendular structures, the pendular structure having a base structure suspended from the frame structure for rotation about a first axis, a beam structure spaced away from the first axis, and a flexure suspending the beam structure from the base structure for rotation about a second axis that is substantially perpendicular to the first axis. The flexure suspending the beam structure from the base structure is positioned substantially intermediate between suspension positions of the force-versus-displacement sensors, and constrains the beam structure to motion substantially within the plane of the pendular structure.

Abstract: A micro-miniature switch apparatus (10) includes a substrate (12) having a surface (14) with first and second channels (16, 18) extending from the surface (14) into the substrate (12). The first and second channels (16, 18) are spaced apart from each other, with a channel axis (20) extending longitudinally through the first and second channels (16, 18). A body (68) that is movable relative to the substrate (12) includes two arms (70, 72). Each of the arms (70, 72) extends into one of the first and second channels (16, 18) to support the body (68) for movement relative to the substrate (12) between first and second electrical conditions of the switch apparatus (10).