Abstract: An inertial sensor is an inertial sensor for detecting a physical quantity based on a displacement in a Z axis when defining three axes perpendicular to each other as an X axis, a Y axis, and the Z axis, and is provided with a substrate, a movable body which is fixed to the substrate, oscillates around an oscillation axis along the X axis, and has two planes opposed to each other and side surfaces connecting the two planes to each other, and a limiter which is fixed to the substrate, and is opposed to the side surfaces of the movable body, wherein the movable body is provided with a resilient portion in a portion opposed to the limiter.

Abstract: The present invention relates to MEMS (microelectromechanical systems) accelerometers, in particular to an accelerometer designed to reduce error in the accelerometer output. The MEMS accelerometer includes a proof mass, which is capable of movement along at least two perpendicular axes and at least one measurement structure. The proof mass is mechanically coupled to the measurement structure along the sense axis of the measurement structure, such that movement of the proof mass along the sense axis causes the moveable portion of the measurement structure to move, and is decoupled from the measurement structures along an axis or axes perpendicular to the sense axis of the measurement structure, such that movement of the proof mass perpendicular to the sense axis of the measurement structure does not cause the moveable portion of the measurement structure to move.

Abstract: A sensor system includes a transducer for sensing a physical stimulus along at least two orthogonal axes and an excitation circuit. The transducer includes a movable mass configured to react to the physical stimulus and multiple differential electrode pairs of electrodes. Each of the electrode pairs is configured to detect displacement of the movable mass along one of the orthogonal axes. The excitation circuit is connectable to the electrodes in various electrode connection configurations, with different polarity schemes, that enable excitation and sampling of each of the orthogonal axes during every sensing period. For each sensing period, a composite output signal is produced that includes the combined information sensed along each of the orthogonal axes. The individual sense signals for each orthogonal axis may be extracted from the composite output signals.

Abstract: A MEMS device is provided comprising a mass configured to move along a first axis and a second axis substantially perpendicular to the first axis; a drive structure coupled to the mass and configured to cause the mass to move along the first axis; a sense structure coupled to the mass and configured to detect motion of the mass along the second axis; a stress relief structure coupled to one of the drive structure or the sense structure; and at least one anchor coupled to an underlying substrate of the MEMS device, wherein the stress relief structure is coupled to the at least one anchor and the at least one anchor is disposed outside of the stress relief structure.

Abstract: A system for control of a device includes at least one sensor module detecting orientation of a user's body part. The at least one sensor module is in communication with a device module configured to command an associated device. The at least one sensor module detects orientation of the body part. The at least one sensor module sends output signals related to orientation of the user's body part to the device module and the device module controls the associated device based on the signals from the at least one sensor module.

Abstract: Embodiments are disclosed for estimating caloric expenditure using a heart rate model specific to a motion class. In an embodiment, a method comprises: obtaining acceleration and rotation rate from motion sensors of a wearable device; determining a vertical component of inertial acceleration and a vertical component of rotational acceleration from the acceleration and rotation rate, respectively; determining a magnitude of the rotation rate; determining a correlation between the inertial vertical acceleration component and rotational acceleration; determining a percentage of motion outside a dominant plane of motion; predicting a motion class based on a motion classification model that takes as input the motions, correlation and percentage; determining a likelihood the user is walking; in accordance with determining that the user is likely not walking, configuring a heart rate model based on the predicted motion class; and estimating, using the configured heart rate model, a caloric expenditure of the user.

Abstract: A MEMS device with teeter-totter structure includes a mobile mass having an area in a plane and a thickness in a direction perpendicular to the plane. The mobile mass is tiltable about a rotation axis extending parallel to the plane and formed by a first and by a second half-masses arranged on opposite sides of the rotation axis. The first and the second masses have a first and a second centroid, respectively, arranged at a first and a second distance b1, b2, respectively, from the rotation axis. First through openings are formed in the first half-mass and, together with the first half-mass, have a first total perimeter p1 in the plane. Second through openings are formed in the second half-mass and, together with the second half-mass, have a second total perimeter p2 in the plane, where the first and the second perimeters p1, p2 satisfy the equation: p1×b1=p2×b2.

Abstract: A hinge for a micromechanical and/or nanomechanical structure includes: a support, and a movable part in an out-of-plane direction. The hinge allows for the out-of-plane displacement of the movable part. The hinge further includes two torsion beams extending along the axis of rotation of the hinge, two bending elements mechanically connecting the movable part and the support and having at least one pair of a first and of a second beam parallel with each other and extending in a plane perpendicular to the axis of rotation, the first beam being connected to the support and the second beam being connected to the movable part, the first and second beams being connected to one another by a first connecting element at a longitudinal end, the two beams extending in the same direction from the first connecting element.

Abstract: A micromechanical z-inertial sensor. The micromechical z-inertial sensor includes at least one first seismic mass element; and torsion spring elements joined to the first seismic mass element. In each case, first torsion spring elements are connected to a substrate, and second torsion spring elements are connected to the first seismic mass element. A first and a second torsion spring element in each case is joined to one another with the aid of a lever element. The lever element is designed to strike against a stop element.

Abstract: A device includes a frame including a first end and a second end; a mechanism including a first side that faces the first end of the frame, and a second side that faces the second end of the frame; a first buckling member attached to the first side of the mechanism and the first end of the frame; a second buckling member attached to the second side of the mechanism and the second end of the frame; and at least one actuator that engages the mechanism, the first buckling member, and the second buckling member in a selective sequence causing the mechanism to articulate between the first end and the second end of the frame. Engagement of the first buckling member and the second buckling member by the at least one actuator causes the first buckling member and the second buckling member to buckle and unbuckle in the selective sequence.

Abstract: Disclosed is a pressure sensing element that is formed using a semiconductor substrate, the pressure sensing element including: a frame; a diaphragm that is supported by the frame; and a piezoresistor that is arranged on the diaphragm. The diaphragm includes a trench and a plurality of beams, the beams are arranged such that the beams connect a portion around an edge of the diaphragm to a portion around a center of the diaphragm and the beams cross each other in the portion around the center of the diaphragm, and a beam that is each of the beams includes a narrow portion that has a first width and a wide portion that has a second width wider than the first width.

Abstract: A sensor includes a movable element adapted for rotational motion about a rotational axis due to acceleration along an axis perpendicular to a surface of a substrate. The movable element includes first and second ends, a first section having a first length between the rotational axis and the first end, and a second section having a second length between the rotational axis and the second end that is less than the first length. A motion stop extends from the second end of the second section. The first end of the first section includes a geometric stop region for contacting the surface of the substrate at a first distance away from the rotational axis. The motion stop for contacting the surface of the substrate at a second distance away from the rotational axis. The first and second distances facilitate symmetric stop performance between the geometric stop region and the motion stop.

Abstract: This electric braking device is provided with: an electric motor MTR that, in accordance with an operation amount Bpa of a braking operation member BP, generates a pressing force Fba, being a force pressing a friction member MSB against a rotary member KTB that rotates integrally with a wheel WHL of the vehicle; and a circuit board KBN to which a processor MPR and a bridge circuit BRG are mounted. The device is further provided with a rotation angle sensor MKA for detecting the rotation angle Mka of the electric motor, and drives the electric motor MTR on the basis of the rotation angle Mka. An end face Mmk of the rotation angle sensor MKA is fixed so as to be in contact with the circuit board KBN. The device is further provided with a pressing force sensor FBA for detecting the pressing force Fba, and drives the electric motor MTR on the basis of the pressing force Fba. An end face Mfb of the pressing force sensor FBA is fixed so as to be in contact with the circuit board KBN.

Abstract: The present disclosure provides a microelectronic isolation system comprising a base, vibration isolator, primary sensor, and microprocessor. The base supports the vibration isolator, the primary sensor, and the microprocessor. The vibration isolator has a platform, isolation material, and at least one isolation sensor. The isolation material dampens an overall vibrational frequency experienced by the microelectronic isolation system. The isolation sensor measures a displacement. The displacement is a measurement of a displacement of the platform with respect to the base. The primary sensor measures a primary sensor response, which is received by the microprocessor to calculate a plurality of responses. The plurality of responses of the microprocessor being one or a combination of a measured compensation response, an inertial response, and a restored primary sensor response.

Abstract: A circuit board includes a board body including a wiring; a micro-control unit, arranged on the board body; and an inertial measurement unit arranged on the board body and in communication with the micro-control unit via the wiring to transmit inertial measurement data detected by the inertial measurement unit to the micro-control unit, and where the board body includes a main body part and an isolated part located at a peripheral of the main body part, the micro-control unit is supported on the main body part, and the inertial measurement unit is supported on the isolated part.

Abstract: A vibrator device includes: a vibrator element that includes a vibrator substrate including a vibrating arm, and an electrode arranged in the vibrator substrate; a base; a support substrate that includes a base mount fixed to the base, an element support that supports the vibrator element, and a beam that connects between the base mount and the element support, and supports the vibrator element relative to the base; a wiring pattern that is arranged in the support substrate, and is electrically connected to the vibrator element; and a buffer member that is arranged on the wiring pattern of the support substrate, and whose hardness is lower than that of the support substrate. Also the buffer member is arranged on a face of the support substrate, that opposes the vibrator element, and overlaps the vibrating arm in a plan view of the support substrate.

Abstract: A system for producing a proof-mass assembly includes a translation stage to receive a flapper hingedly supported by a bifilar flexure that extends radially inwardly from a support ring, wherein the bifilar flexure comprises a pair of flexure arms spaced apart by an opening or window; and a femtosecond laser optically coupled to the translation stage with focusing optics, the femtosecond laser applying a laser beam on the flexure arms over a plurality of passes to gradually thin the bifilar flexure regions, the laser periodically reducing a laser output to minimize damage from laser scanning and maximize bifilar flexure strength until the bifilar flexure reaches a predetermined thickness.

Abstract: A physical quantity sensor includes a substrate, a support portion fixed to the substrate, a movable body which is displaceable in a first direction with respect to the support portion and has a movable electrode provided therein, and a fixed electrode fixed to the substrate. The fixed electrode includes first and second fixed electrode fingers positioned on one side of the support portion, third and fourth fixed electrode fingers positioned on the other side thereof. The movable electrode includes first to fourth movable electrode fingers which face the first to fourth fixed electrode fingers in the first direction, respectively.

Abstract: A rotation rate sensor including a substrate, a drive structure, which is movable with regard to the substrate, a detection structure, and a Coriolis structure, the drive structure, the Coriolis structure, and the detection structure being essentially situated in a layer, in that an additional layer is situated essentially in parallel to the layer above or underneath the layer, a mechanical connection between the Coriolis structure and the drive structure being established with a first spring component, the first spring component being configured as a part of the additional layer, and/or a mechanical connection between the detection structure and the substrate being established with a second spring component, the second spring component being configured as a part of the additional layer.

Abstract: A deposition mask package according to the present embodiment includes a receiving portion, a lid portion that faces the receiving portion, a deposition mask that is arranged between the receiving portion and the lid portion and has an effective region in which a plurality of through-holes is formed. The receiving portion has a first opposing surface facing the lid portion and a concave portion provided on the first opposing surface. The concave portion is covered by a first flexible film. The effective region of the deposition mask is arranged on the concave portion with the first flexible film interposed therebetween.

Abstract: A semiconductor device includes: a die pad; a semiconductor chip mounted on the die pad; a lead having an outer lead part and an inner lead par which is set up by a lead leg part extending from the outer lead part; an encapsulating resin sealing the die pad, the semiconductor chip, and the lead so that the lead is partially exposed; a support resin part provided on a bottom surface of the inner lead part, the support resin part being a portion of the encapsulating resin; and a notch part where the encapsulating resin is absent, and locating in a region surrounded by a bottom surface of the support resin part, an outer side surface of the outer lead part and an outer side surface of the lead leg part.

Abstract: Microelectromechanical sensor with an out-of-plane detection has a cross sensitivity in a first direction in the plane with a value of ST, the sensor comprising a support, a mass suspended from the support by beams stressed by bending, in such a way that the inertial mass is capable of moving with respect to the support about an axis of rotation contained in a plane of the sensor, a stress gauge suspended between the mass and the support. The bending beams have a dimension tf in the out-of-plane direction and the mass has a dimension tM in the out-of-plane direction such that t f = 3 4 ? ( t M - 2 ? l arm ? S T ) . Larm is the distance between the centre of gravity of the mass and the centre of the bending beams projected onto the first direction.

Abstract: A MEMS device and a method of forming the same. A disclosed method includes: providing a silicon substrate layer, a buried oxide layer and a device silicon layer; using a microfabrication process to pattern a set of device features on the device silicon layer including a shuttle mass and an anchor frame; removing the silicon substrate layer and buried oxide below the shuttle mass; placing a shadow mask on a surface of the device silicon layer, wherein the shadow mask has an microscale opening to expose at least one device feature; and forming a nanoscale stopper on a sidewall of the at least one device feature by depositing a deposition material through the opening in a controlled manner.

Abstract: A manufacturing method of a physical quantity sensor includes forming first and second fixed electrodes, and a dummy electrode on a substrate; and a movable body forming. The electrode forming includes forming a first mask layer on the substrate, forming a first electrode material layer by forming a first conductive layer on the substrate and the first mask layer, forming a second conductive layer on the substrate and the first electrode material layer, forming a second mask layer by forming a mask material layer on the second conductive layer, and removing a part of a section of the mask material layer not overlapping the first electrode material layer in plan view, and forming a second electrode material layer by etching the second conductive layer, with the second mask layer as a mask such that the second conductive layer is provided on the first electrode material layer and on the substrate.

Abstract: An acceleration sensor (sensor device) includes a substrate that includes a recessed portion (second recessed portion), a fixed electrode, and a dummy electrode juxtaposed with an insulating portion, and a movable body that is supported to be rockable by the substrate, in which the movable body includes a first region facing the fixed electrode, a second region facing a part of the dummy electrode, and a connecting portion connecting the first region and the second region to each other, the fixed electrode is provided with an extension electrode portion extending to a position facing the connecting portion, in a plan view of the movable body, at least a part of the extension electrode portion faces the connecting portion, and the insulating portion between the extension electrode portion and the dummy electrode faces the connecting portion inside the recessed portion.

Abstract: An acceleration sensor includes a base substrate provided with a first recess part, and a sensor part located on the first recess part and swingably supported in a depth direction of the first recess part by a support part, wherein the sensor part is sectioned into a first part and a second part by the support part, includes a movable electrode part in the first part and the second part, a through hole is provided at least at an end side in the second part larger in mass than the first part, and the base substrate includes a fixed electrode part in a position opposed to the movable electrode part in the first recessed part, and a second recess part deeper than the first recess part is provided in a position opposed to the end side of the sensor part.

Abstract: A micromechanical spring for an inertial sensor includes first and second spring elements situated parallel to each other and anchored on an anchoring element of the inertial sensor; and a third spring element situated between the two spring elements, anchored on the anchoring element, and having on both external sides a defined number of nub elements that are formed so as to have an increasing distance from the spring elements in a defined fashion as the distance from the anchoring element increases.

Abstract: An unmanned aerial vehicle (UAV) includes a vehicle body and a multi-ocular imaging assembly. The multi-ocular imaging assembly includes at least two imaging devices disposed in and fixed to the vehicle body.

Abstract: A sensor device includes: a base having a recess; a force detecting element which is provided in the recess, and includes at least one piezoelectric element that outputs a signal in accordance with an external force; an adhesive which is provided between the force detecting element and a bottom surface of the recess; at least one electrode provided in the force detecting element; at least one terminal provided in the base; and at least one conductive paste which electrically connects the electrode and the terminal to each other, in which the conductive paste has a part that overlaps the adhesive when viewed from a direction in which the force detecting element and the bottom surface overlap each other, and in which the force detecting element overlaps the bottom surface when viewed from the direction in which the force detecting element and the bottom surface overlap each other.

Abstract: A physical quantity sensor includes a substrate, a detection flap plate which is disposed facing the substrate, a mass portion which supports the detection flap plate, a beam portion which connects the detection flap plate and the mass portion, and a first regulating portion which is positioned between the detection flap plate and the mass portion and regulates displacement of the detection flap plate in an in-plane direction. In addition, the first regulating portion is provided in a corner portion of the detection flap plate which is formed in a rectangular shape.

Abstract: A method for calculating a tension (T) in a towed antenna. The method includes towing the antenna in water, wherein the antenna includes plural particle motion sensors distributed along the antenna; measuring with the plural particle motion sensors vibrations that propagate along the antenna; calculating a value of a phase velocity (vp) of the vibrations that propagate along the antenna based on (1) an offset between two particle motion sensors and (2) a time delay of the vibrations that propagate from one of the two particle motion sensors to another one of the two particle motion sensors; selecting a relation that links the phase velocity (vp) to the tension (T); and using the value of the phase velocity and the relation to determine the tension (T) at various locations of the plural particle motion sensors along the antenna.

Abstract: A substrate for a sensor includes: a base section; a movable section connected to the base section; an arm portion as a support portion extending along the movable section from the base section; a first gap portion having a protrusion portion in which one of the movable section and the arm portion protrudes toward the other of the movable section and the arm portion, and having a predetermined gap between the protrusion portion on one side and the other of the movable section and the support portion; and a second gap portion which is located further toward the base section side than the first gap portion has a gap wider than the predetermined gap, in which in the first gap portion, one of the movable section and the arm portion has a ridge portion on the side facing the first gap portion.

Abstract: An oscillator includes a substrate, a detection flap plate which is disposed facing the substrate, and an elastically deformable beam portion which displaceably supports the detection flap plate in a Z axis direction with respect to the substrate, in which the detection flap plate is displaced to the substrate side in a range in which recovery force of the beam portion is larger than the electrostatic force which is formed between the substrate and the detection flap plate. That is, when a boundary at which electrostatic force and recovery force are equal is a pull in critical point, the detection flap plate is displaced within a region above the pull in critical point.

Abstract: Apparatus and associated methods relate to maximizing a signal to noise ratio of an accelerometer by inhibiting signals arising from movements of a proofmass in directions perpendicular to a direction of intended sensitivity. The direction of intended sensitivity of the accelerometer is along an axis of the proofmass. The accelerometer is rendered substantially insensitive to lateral accelerations of the proofmass by making the accelerometer axially symmetric. Two axially-asymmetric acceleration sensing devices are axially engaged in such a manner as to render the coupled sensing devices substantially axially-symmetric. In some embodiments, each acceleration sensor has an axially-thin membrane portion extending from a proofmass portion. The two acceleration sensors can be engaged in an antiparallel fashion at projecting ends of the proofmass portions.

Abstract: An angular acceleration sensor includes a planar surface extending along an X-Y plane, a fixed portion, a weight, a beam, and piezoresistors. The weight is supported by the fixed portion. The beam extends along an Y-axis and is connected to the fixed portion and the weight. The beam includes through-holes extending therethrough in a Z-axis direction and protrusions protruding in an X-axis direction. The positions of the piezoresistors in the Y-axis direction overlap those of the through-holes and are displaced from those of the width-direction protrusions.

Abstract: An angular acceleration sensor includes a planar surface extending along an X-Y plane, a fixed portion, a weight, a beam, and piezoresistors. The weight is supported by the fixed portion. The beam extends along a Y-axis and is connected to the fixed portion and the weight. A width of the beam in an X-axis direction is larger than a width of the connection portion at which the beam is connected to the fixed portion.

Abstract: Various embodiments provide a temperature regulated circuit. The temperature regulated circuit includes a suspended mass that is positioned in an opening of a frame. The suspended mass is suspended from the frame by a plurality of support beams that may be made of thermally insulating material. The suspended mass provides a thermally isolated substrate for an integrated circuit. The suspended mass also includes a temperature sensor configured to measure a temperature of the integrated circuit, and a heater configured to heat the integrated circuit. A controller is positioned on the frame and is configured to receive temperature measurements from the temperature sensor and control the heater based on the temperature measurements.

Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a MEMS sensor. The MEMS sensor is configured to provide a modulated output signal that is a function of the combined signal. The system is configured to demodulate and filter the modulated output signal, compare the demodulated, filtered signal with the input signal to determine amplitude and phase differences, and determine, based on the amplitude and phase differences, various parameters of the MEMS sensor. A method for determining MEMS sensor parameters is also provided.

Abstract: Disclosed herein is a sensor. A sensor according to the present invention includes a mass body, a fixing part disposed so as to be spaced apart from the mass body, a first flexible part connecting the mass body with the fixing part in a Y-axis direction, a second flexible part connecting the mass body with the fixing part in an X-axis direction, and a membrane disposed over the second flexible part and having a width in a Y-axis direction larger than a width in a Y-axis direction of the second flexible part. Here, a width of an X-axis direction of the first flexible part is larger than a thickness in a Z-axis direction thereof and a thickness in a Z-axis direction of the second flexible part is larger than a width in a Y-axis direction thereof.

Abstract: A sensor system includes a microelectromechanical systems (MEMS) sensor, control circuit, signal evaluation circuitry, a digital to analog converter, signal filters, an amplifier, demodulation circuitry and memory. The system is configured to generate high and low-frequency signals, combine them, and provide the combined input signal to a MEMS sensor. The MEMS sensor is configured to provide a modulated output signal that is a function of the combined signal. The system is configured to demodulate and filter the modulated output signal, compare the demodulated, filtered signal with the input signal to determine amplitude and phase differences, and determine, based on the amplitude and phase differences, various parameters of the MEMS sensor. A method for determining MEMS sensor parameters is also provided.

Abstract: Various examples include microelectromechanical die for sensing motion that includes symmetrical proof-mass electrodes interdigitated with asymmetrical stator electrodes. Some of these examples include electrodes that are curved around an axis orthogonal to the plane in which the electrodes are disposed. An example provides vertical flexures coupling an inner gimbal to a proof-mass in a manner permitting flexure around a horizontal axis.

Abstract: This invention relates generally to semiconductor manufacturing and packaging and more specifically to semiconductor manufacturing in MEMS (Microelectromechanical systems) inertial sensing products. Embodiments of the present invention provide a robust packaging process and a mechanical filter to reduce the mechanical shock from impact. The mechanical filter can be integrated within the package substrate as part of the packaging process, reducing the assembly complexity.

Abstract: A dynamic quantity sensor includes a force receiving portion, a first movable portion that rotates in a first rotational direction around a first rotational axis according to dynamic quantity in a first direction that the force receiving portion receives, and rotates in the first rotational direction around the first rotational axis according to dynamic quantity in a second direction different from the first direction that the force receiving portion receives; and a second movable portion that rotates in a second rotational direction around a second rotational axis according to the dynamic quantity in the first direction that the force receiving portion receives, and rotates in an opposite direction to the second rotational direction around the second rotational axis according to the dynamic quantity in the second direction that the force receiving portion receives.

Abstract: Disclosed herein is a method of setting valid output sections of a 3-axis acceleration sensor mounted within a tire of a vehicle, including setting an output signal of the 3-axis acceleration sensor in the z-axis direction as a reference signal, setting a specific section of the output signal in the z-axis direction as a valid section where a part of the tire where the 3-axis acceleration sensor is mounted contacts a road surface, and setting sections of output signals of the 3-axis acceleration sensor in the x-axis and y-axis directions corresponding to the valid section in the z-axis direction as valid sections in the x-axis and y-axis directions. The method sets precise valid sections applied to detect information between the tire and a ground surface so as to minimize a component of a noise section by connecting output signals in the x-axis, y-axis and z-axis directions.

Abstract: A micromechanical sensor device includes an evaluation circuit formed in a first substrate, and an MEMS structure which is situated in a cavity delimited by a second substrate and a third substrate, the MEMS structure and the second substrate being situated on top of each other, the MEMS structure being functionally connected to the evaluation circuit via a contact area, the contact area between the MEMS structure and the first substrate being situated essentially centrally on the second substrate and essentially centrally on the first substrate and has an essentially punctiform configuration, proceeding radially from the contact area, a clearance being formed between the first substrate and the second substrate.

Abstract: Biometric monitoring devices, including various technologies that may be implemented in such devices, are discussed herein. Additionally, techniques for utilizing altimeters in biometric monitoring devices are provided. Such techniques may, in some implementations, involve recalibrating a biometric monitoring device altimeter based on location data; using altimeter data as an aid to gesture recognition; and/or using altimeter data to manage an airplane mode of a biometric monitoring device.

Abstract: A method for determining parameters of a wind turbine is disclosed. The method may generally include receiving signals from at least one Micro Inertial Measurement Unit (MIMU) mounted on or within a component of the wind turbine and determining at least one parameter of the wind turbine based on the signals received from the at least one MIMU.

Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.

Abstract: A compound sensor includes a first unit including first and second oscillators symmetrically disposed to each other and being able to be displaced in a driving direction and a detecting direction; a second unit including third and fourth oscillators symmetrically disposed to each other and being able to be displaced in the driving direction and the detecting direction; a drive unit to drive the first through fourth oscillators so as to oscillate the first and second oscillators in opposite phase, and the third and fourth oscillators in opposite phase, and so as to oscillate the first and second unit in opposite phase; and a detection unit configured to detect displacements of the first through fourth oscillators in the detecting direction, wherein an acceleration, angular rate, angular acceleration and centrifugal force are independently detected by canceling unnecessary inertial force components from the displacements of the first through fourth oscillators.

Abstract: The An angular velocity sensor of the present invention has one end connected to a holding section and the other another end connected to a weighting section. According to the angular velocity sensor, a driving arm has a dog-leg bent structure of arms extending in a direction perpendicular to a connecting direction of the holding section and the weighting section.