Abstract: The present disclosure is directed to a detection structure for a vertical-axis resonant accelerometer. The detection structure includes an inertial mass suspended above a substrate and having a window provided therewithin and traversing it throughout a thickness thereof. The inertial mass is coupled to a main anchorage, arranged in the window and integral with the substrate, through a first and a second anchoring elastic element of a torsional type. The detection structure also includes at least a first resonant element having longitudinal extension, coupled between the first elastic element and a first constraint element arranged in the window. The first constraint element is suspended above the substrate, to which it is fixedly coupled through a first auxiliary anchoring element which extends below the first resonant element with longitudinal extension and is integrally coupled between the first constraint element and the main anchorage.

Abstract: A rotation rate sensor, including at least: one oscillating mass, deflectable in a drive direction and in a detection direction oriented perpendicularly to the drive direction; one drive circuit for prompting a defined oscillatory movement of the oscillating mass in the drive direction; one circuit for detecting a measuring signal, which corresponds to the deflection of the oscillating mass in the detection direction; and one read-out circuit for reading out and pre-processing the measuring signal. The read-out circuit includes a demodulator, with which a useful signal and a quadrature signal are extractable from the measuring signal. The read-out circuit includes a sigma-delta A/D converter. An offset voltage is feedable to the sigma-delta A/D converter, which is selected in such a way that tonal artifacts in the frequency spectrum of the digitized useful signal are shifted into a frequency range outside of the bandwidths of the useful signal to be expected.

Abstract: A method is provided for identifying or authenticating an object. The method includes vibrating the object at a plurality of frequencies. The vibrations from the object are sensed at each of the plurality of frequencies using an accelerometer. A vibration profile of the object is generated using the sensed vibrations. The generated vibration profile is then compared to a stored vibration profile. It is determined if the generated vibration profile matches the stored vibration profile. A match indicates that the object has been identified or authenticated. In another embodiment, an object capable of implementing the method is provided. In another embodiment, the object may include a replaceable accessary. In this case, the initial and generated vibration profiles may be created with the replacement accessary attached to the object. A match of the generated and initial vibration profiles indicates that the replaceable accessary is authentic.

Abstract: The disclosure describes techniques to damp the proof mass motion of an accelerometer while achieving an underdamped resonator. In an example of an in-plane micro-electromechanical systems (MEMS) VBA, the proof mass may contain one or more damping combs that include one or more banks of rotor comb fingers attached to the proof mass. The rotor comb fingers may be interdigitated with stator comb fingers that are attached to fixed geometry. These damping comb fingers may provide air damping for the proof mass when the MEMS die is placed into a package containing a pressure above a vacuum. The geometry of the damping combs with a reduced air gap and large overlap area between the rotor comb fingers and stator comb fingers. The geometry of resonator of the VBA of this disclosure may be configured to avoid air damping.

Abstract: A physical quantity sensor module includes: a resonant frequency shift based physical quantity sensor whose frequency adjusts with a adjust in physical quantity; a reference signal oscillator which outputs a reference signal; a frequency delta-sigma modulator which performs frequency delta-sigma modulation of the reference signal, using an operation signal based on a measurement target signal as an output from the resonant frequency shift based physical quantity sensor, and generates a frequency delta-sigma modulated signal; a first low-pass filter provided on an output side of the frequency delta-sigma modulator and operating synchronously with the measurement target signal as the output from the resonant frequency shift based physical quantity sensor; and a second low-pass filter provided on an output side of the first low-pass filter and operating synchronously with the reference signal.

Abstract: An example system comprising: a microelectromechanical system (MEMS) vibrating beam accelerometer (VBA) comprising: a proof mass; and a first resonator mechanically coupled to the proof mass; a first electrode configured to apply a force to the proof mass.

Abstract: An accelerometer including: a housing having an internal cavity; a piezoelectric material disposed in the internal cavity; a mass movable disposed in the internal cavity; and a spring disposed between the piezoelectric material and a portion of the housing, the spring being compressively preloaded against the piezoelectric material; wherein the mass is movable when the housing experiences an acceleration such that the mass acts upon the spring and the spring acts against the piezoelectric material, the piezoelectric material outputting a signal corresponding to a magnitude of the acceleration.

Abstract: A MEMS device is provided comprising a substrate; a proof mass coupled to the substrate and configured to move along a resonator axis; a drive structure comprising at least one electrode and configured to drive the proof mass to move along the resonator axis; and a pivoting linkage coupled to the proof mass at first and second ends of the pivoting linkage, the first end comprising a first fixed pivot and the second end comprising a second fixed pivot, the pivoting linkage comprising: a first bar configured to pivot about the first fixed pivot and a first dynamic pivot; a second bar configured to pivot about the second fixed pivot and a second dynamic pivot; and a third bar configured to pivot about the first dynamic pivot and the second dynamic pivot, wherein the proof mass moves along the resonator axis when the pivoting linkage pivots.

Abstract: A physical quantity sensor includes a base, at least two arms, a movable plate, a hinge, and a physical quantity measurement element. Four quadrants of the sensor are defined by first and second orthogonal lines. The first line passes through the center of the sensor and crosses the hinge. The second line extends along the hinge. Fixed regions of the sensor are located in the first and second quadrants. No fixed regions are located in at least one of the third and fourth quadrants. The third and fourth quadrants are closer to the base than the first and second quadrants in a plan view.

Abstract: There is provided a resonant sensor comprising: a substrate; a proof mass suspended from the substrate by one or more flexures to allow the proof mass to move relative to the frame along a sensitive axis; a first and a second resonant element connected between the frame and the proof mass; wherein the proof mass is positioned between the first and the second resonant element along the sensitive axis, and wherein the first and the second resonant elements have a substantially identical structure to one another; and drive and sensing circuitry comprising: a first electrode assembly coupled to first drive circuitry configured to drive the first resonant element in a first mode; a second electrode assembly coupled to second drive circuitry configured to drive the second resonant element in a second mode, different to the first mode; and a sensing circuit configured to determine a measure of acceleration.

Abstract: The invention provides a resonant sensor comprising: a substrate; one or more proof masses suspended from the substrate to allow for movement of the one or more proof masses along a sensitive axis; a first resonant element having a first end and a second end, the first resonant element extending between the first end and the second end along the sensitive axis, wherein the first end is connected to the one or more proof masses through a non-inverting lever and the second end is connected to the one or more proof masses through an inverting lever; and an electrode assembly positioned adjacent to the first resonant element. A resonant sensor in accordance the invention comprises a resonant element that is suspended between two proof masses or between two portions of a single proof mass, and so is not connected directly to the substrate. This isolates the resonant element from thermal stress that might otherwise be transferred from the substrate.

Abstract: This disclosure is related to devices, systems, and techniques for determining an acceleration of a vibrating beam accelerometer (VBA). For example, a system includes processing circuitry configured to receive, from a first resonator, one or more electrical signals indicative of a frequency of a first mechanical beam and a frequency of a second mechanical beam, determine, based on the one or more electrical signals, the frequency of the first mechanical beam and the frequency of the second mechanical beam, and calculate, based on the frequency of the first mechanical beam and the frequency of the second mechanical beam, an acceleration of a proof mass assembly.

Abstract: A rotation-rate sensor having a substrate, the rotation-rate sensor having a drive structure that is movable in relation to the substrate, the drive structure being attached to the substrate by a spring system, the spring system having a first spring component that connects the drive structure and the substrate, and a second spring component that connects the drive structure and the substrate, the first spring component and the second spring component being connected by an intermediate piece, wherein the intermediate piece includes a first edge bar and a second edge bar, a group of connecting bars being configured between the first and second edge bar, the connecting bars of the group of connecting bars each being disposed at an opening angle of between 1° and 89° on the first and/or second edge bar.

Abstract: A sensor element according to the present technology includes a base portion, a movable portion, first and second bridge portions, and an acceleration detector unit. The movable portion is movable relative to the base portion by reception of an acceleration along at least a uniaxial direction. The first bridge portion includes a first beam and a first structure, the first beam connects the base portion and the movable portion, the first structure being provided between the first beam and the base portion and supporting the first beam. The second bridge portion includes a second beam and a second structure, the second beam extends in a second axis direction orthogonal to the first axis and parallel to the main surface and connects the base portion and the movable portion, the second structure being provided between the second beam and the base portion and supports the second beam.

Abstract: Piezoresistive detection resonant device comprising a substrate, a mobile par configured to move with respect the substrate, suspension elements suspending the mobile part to the substrate, a piezoresistive detection device to detect the motions of the mobile part, said piezoresistive detection device comprising at least one strain gauge, wherein the piezoresistive detection resonant device also comprises a folded spring with at least two spring arms, connected to the mobile part and configured to be deformed by the motion of the mobile part, the at least one gauge being suspended between the substrate and the folded spring in such manner that the deformation of the gauge is reduced compared to the motion of the mobile part.

Abstract: A resonant mechanical structure, such as one for use in a torsional oscillator MEMS accelerometer that includes a mounting substrate and a reference mass configured to move within a reference mass plane, the resonant mechanical structure being connected to the mounting structure and the reference mass, and the resonant mechanical structure including a body, a center of mass, and an aperture, wherein the aperture is surrounded and defined by the body, and wherein the body includes a first mass portion and a second mass portion that are configured to oscillate about an oscillation axis located within the reference mass plane, wherein the center of mass is located on the oscillation axis, and wherein a movement of the reference mass within the reference mass plane varies a moment of inertia of the body while the center of mass of the body remains located on the oscillation axis.

Abstract: A device for measuring an acceleration includes a vibrating accelerometer including: a semiconductor substrate forming a fixed frame of the accelerometer; a test weight of the same material as the substrate and connected to the fixed frame, movable translationally along at least one sensing axis of the vibrating accelerometer; a guide of the same material as the substrate, connected to the fixed frame and test weight, guiding the test weight in the direction of the sensing axis; a layer made of a piezoelectric semiconductor deposited on the substrate, the layer being tensilely prestrained; a resonator in the layer connected to the fixed frame, the resonator subjected to tension or compression in the direction of the sensing axis; and at least one transducer connected to the resonator, able to actuate the resonator, to keep the resonator oscillating and/or to detect an electrical signal generated by the resonator.

Abstract: An MEMS or NEMS accelerometer adapted to measure an acceleration along a sensing axis includes a substrate featuring a plane; a mass having a central zone and suspended relative to the substrate; a single lever arm comprising: a first end connected to the substrate by means of a first connection adapted to allow rotation of the lever arm about a rotation axis perpendicular to the sensing axis, and a second end connected to the mass by means of a second connection adapted to transmit movement in translation of the mass to the lever arm whilst allowing rotation of the lever arm about the rotation axis; the second end of the lever arm being disposed at the level of the central zone of the mass; at least one strain gauge comprising: a first end connected to the substrate, and a second end connected to the lever arm.

Abstract: An integrated MEMS structure includes a driving assembly anchored to a substrate and actuated with a driving movement. A pair of sensing masses suspended above the substrate and coupled to the driving assembly via elastic elements is fixed in the driving movement and performs a movement along a first direction of detection, in response to an external stress. A coupling assembly couples the pair of sensing masses mechanically to couple the vibration modes. The coupling assembly is formed by a rigid element, which connects the sensing masses and has a point of constraint in an intermediate position between the sensing masses, and elastic coupling elements for coupling the rigid element to the sensing masses to present a first stiffness to a movement in phase-opposition and a second stiffness, greater than the first, to a movement in phase, of the sensing masses along the direction of detection.

Abstract: A physical quantity sensor module includes: a resonant frequency shift based physical quantity sensor whose frequency adjusts with a adjust in physical quantity; a reference signal oscillator which outputs a reference signal; a frequency delta-sigma modulator which performs frequency delta-sigma modulation of the reference signal, using an operation signal based on a measurement target signal as an output from the resonant frequency shift based physical quantity sensor, and generates a frequency delta-sigma modulated signal; a first low-pass filter provided on an output side of the frequency delta-sigma modulator and operating synchronously with the measurement target signal as the output from the resonant frequency shift based physical quantity sensor; and a second low-pass filter provided on an output side of the first low-pass filter and operating synchronously with the reference signal.

Abstract: A microelectromechanical and/or nanoelectromechanical device having a fixed part, at least one suspended part configured to be moveable in the plane of the device with respect to the fixed part along at least one first direction and a first suspension means for suspending the suspended part. The first suspension means includes two suspension elements each having a first end fixed directly to the suspended part and a second end connected to the fixed part, each suspension element having a half-ellipse shape in the plane and extending between the first end and the second end, and the two suspension elements being arranged with respect to each other so as to form an ellipse.

Abstract: Provided are a force sensor module and a display device including the same. The display device includes a display panel, and a force sensor module overlapping the display panel, and including a circuit board, and the force sensor partially attached to the circuit board, and including an attachment portion having a surface facing the circuit board and attached to the circuit board, and a non-attachment portion having a surface spaced apart from the circuit board.

Abstract: Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.

Abstract: A MEMS sensor is disclosed that includes dual pendulous proof masses comprised of sections of different thickness to allow simultaneous suppression of vertical and lateral thermal gradient-induced offsets in a MEMS sensor while still allowing for the normal operation of the accelerometer. In an embodiment, the structure and different sections of the MEMS sensor is realized using multiple polysilicon layers. In other embodiments, the structure and different thickness sections may be realized with other materials and processes. For example, plating, etching, or silicon-on-nothing (SON) processing.

Abstract: A MEMS sensor comprising preloaded suspension springs and a method for mechanically preloading suspension springs of a MEMS sensor are described. The MEMS sensor comprises a MEMS support structure; a plurality of suspension springs connected to the support structure; and, a proof mass flexibly suspended by the suspension springs; wherein at least one of the suspension springs is mechanically preloaded with a compressive force for reducing the natural frequency of said proof mass.

Abstract: One embodiment includes a gyroscope system. The system includes a sensor system comprising a vibrating-mass and electrodes each arranged to provide one of a driving force and a force-rebalance to the vibrating-mass in each of three orthogonal axes. The system also includes a gyroscope controller that generates a drive signal provided to a first electrode of the electrodes to provide the driving force to facilitate an in-plane periodic oscillatory motion of the vibrating-mass along a first axis of the three orthogonal axes. The gyroscope controller also generates a force-rebalance signal provided to each of a second electrode and a third electrode of the plurality of electrodes associated with a respective second axis and a respective third axis of the three orthogonal axes to calculate a rotation of the gyroscope system about the respective second axis and the respective third axis of the three orthogonal axes.

Abstract: A system and method in accordance with an embodiment reduces the cross-axis sensitivity of a gyroscope. This is achieved by building a gyroscope using a mechanical transducer that comprises a spring system that is less sensitive to fabrication imperfection and optimized to minimize the response to the rotations other than the intended input rotation axis. The longitudinal axes of the first and second flexible elements are parallel to each other and parallel to the first direction.

Abstract: A MEMS device includes a substrate, a proof mass capable of moving relative to the substrate, and a motion limit structure. The motion limit structure includes an arm structure flexibly coupled to the proof mass or the substrate. The arm structure has a first contact region and a second contact region. In response to a shock force that causes the proof mass to move, the first contact region contacts a first stop region on the other one of the proof mass and the substrate. Following contact of the first contact region with the first stop region and upon continuation of the shock force, the second contact region contacts a second stop region on the other one of the proof mass and the substrate such that the contact between the second contact and stop regions reduces a contact force between the first contact and stop regions.

Abstract: An inertial sensor includes a proof mass spaced apart from a surface of a substrate. The proof mass has a first section and a second section, where the first section has a first mass that is greater than a second mass of the second section. An anchor is coupled to the surface of the substrate and a spring system is interconnected between the anchor and the first and second sections of the proof mass. The spring system enables translational motion of the first and second sections of the proof mass in response to linear acceleration forces imposed on the inertial sensor in any of three orthogonal directions.

Abstract: A microelectromechanical (MEMS) accelerometer has a proof mass, a sense electrode, and an auxiliary electrode. The sense electrode is located relative to the proof mass such that a capacitance formed by the sense electrode and the proof mass changes in response to a linear acceleration along a sense axis of the accelerometer. The auxiliary electrode is located relative to the proof mass such that a capacitance formed by the auxiliary electrode and proof mass is static in response to the linear acceleration. A sense drive signal is applied at the sense electrode and an auxiliary drive signal is applied at the auxiliary electrode. The sense drive signal and the auxiliary drive signal have difference frequencies. A portion of a sensed signal at the sense drive frequency is used to determine linear acceleration while a portion of the sensed signal at the auxiliary drive frequency is used to identify damage within a sense path from the proof mass.

Abstract: Linear accelerometer comprising a fixed part, a rotationally moving part in the plane of the accelerometer around an axis of rotation orthogonal to the plane of the accelerometer, the moving part comprising a centre of gravity distinct from the point of intersection of the axis of rotation and the plane of the accelerometer, means forming pivot link between the moving part and the fixed part, means for detecting the displacement of the moving part with respect to the fixed part, means for viscous damping the displacement of the moving part in said plane, said viscous damping means comprising interdigitated combs, at least one first comb on the moving part and at least one second comb on the fixed part (2), the first comb and the second comb being interdigitated.

Abstract: A micromechanical sensor that can detect shock effects in order to prevent false measurements. The sensor includes a substrate having a measurement axis and a detection axis that are disposed orthogonally to each other, and first and second driving masses disposed in a plane containing the measurement and detection axes. Each of the driving masses is rotatably coupled to the substrate via a central suspension disposed on the detection axis. The sensor includes drive electrodes that generate rotary motions in each of the driving masses about a drive axis thereof. At least one elastic connecting element allows the driving masses to deflect in opposite directions in response to a rate of rotation about the measurement axis but deflect in the same direction in response to a shock condition.

Abstract: A system includes a circular oscillator suspended by a flexible support structure to a support frame, a drive mechanism configured to induce the circular oscillator into a two-dimensional drive oscillation, where the drive oscillation is modified responsive to a sense oscillation of the circular oscillator caused by an angular rotation of the support frame and the circular oscillator, and a plurality of digital proximity switches disposed around a perimeter of the circular oscillator. During the modified drive oscillation a plurality of the digital proximity switches are configured to switch between an open state and a closed state and generate a time and position output to allow for a determination of each of a plurality of variable oscillation parameters for each oscillation of the modified drive oscillation.

Abstract: A method for manufacturing a micromechanical device layer is performed on a device wafer comprising a single layer of homogenous material. The method comprises patterning a first mask on a first face of the device wafer, the first mask patterning at least lateral dimensions of comb structures and outlines of large device structures. First trenches are etched, the first trenches defining the lateral dimensions of the at least comb structures and outlines of large device structures in a single deep etching process. Recession etching may be used on one or two faces of the device wafer for creating structures at least partially recessed below the respective surfaces of the device wafer. A double mask etching process may be used on one or two faces of the device wafer for creating structures at least partially recessed to mutually varying depths from the respective face of the device wafer.

Abstract: An acceleration sensor includes weights, a support, and beams on which piezoresistive elements are disposed. The weights include projections and recesses. The support includes projections and recesses. The beams are connected to the projections and the recesses.

Abstract: A resonant sensor includes a mover that is movable in a first direction, a supporter that extends in a second direction perpendicular to the first direction, the supporter being connected to the mover and a fixer, the supporter supporting the mover which is movable in the first direction, and a resonator that is vibratable, at least a part of the resonator being embedded in the supporter.

Abstract: The invention relates to an automatic system for monitoring the mixing of conglomerates. The inventive system can be used to monitor and measure the volume of a conglomerate, i.e. a concrete, mortar or other similar product, and the conditions in which the conglomerate is being mixed inside a mixer. The invention is characterized in that the system is provided with a sensor which rotates integrally with the mixer and which is fitted with a blade that is sensitive to the stresses exerted by the conglomerate thereon. The invention is also characterized in that the aforementioned information is transmitted to one or more terminals, by means of radio communication or other similar wireless communication means, for use in industrial processes.

Abstract: A micromechanical sensor is provided having a substrate having a main plane of extension and having a movable element, the movable element being pivotable about an axis of rotation that is essentially parallel to the main plane of extension, from a rest position into a deflected position, the movable element having an asymmetrical mass distribution relative to the axis of rotation, so that, as a function of a force exerted on the movable element oriented essentially perpendicular to the main plane of extension, a deflection movement of the movable element is produced in the form of a pivot movement about the axis of rotation, the micromechanical sensor having a damping element, the damping element being pivotable about the axis of rotation, the damping element being connected to the movable element so as to be capable of rotational movement, or the damping element being integrated with the movable element.

Abstract: A multi-axis microelectromechanical-systems (MEMS) inertial measurement unit (IMU) is fabricated in a vacuum sealed single packaged device. An FM vibratory gyroscope and an FM resonant accelerometer both for generating FM output signals is fabricated in the silicon chip using MEMS. A signal processor is coupled to the an FM vibratory gyroscope and to the FM resonant accelerometer for receiving the FM gyroscopic output signals and the FM accelerometer output signals. The signal processor generates simultaneous and decoupled measurement of input acceleration, input rotation rate, and temperature and/or temperature distribution within the IMU, self-calibration of the biases and scale factors of the IMU and its support electronics against temperature variations and other common mode errors, and reduction of the cross axis sensitivity by reducing acceleration errors in the gyroscope and rotation errors in the accelerometer.

Abstract: A device is described that includes a pendulous proof mass, a support base, a flexure, and at least two resonators. The support base defines a plane and supports the pendulous proof mass. The flexure flexibly connects the pendulous proof mass to the support base, suspends the pendulous proof mass within the support base, and in response to an acceleration of the device, the pendulous proof mass rotates about the flexure in the plane defined by the support base. The at least two resonators flexibly connect the pendulous proof mass to the support base and flex based on the rotation of the pendulous proof mass about the flexure, wherein each of the at least two resonators resonate at a respective resonant frequency.

Abstract: A system includes a silicon carbide (SiC) semiconductor device and a hermetically sealed packaging enclosing the SiC semiconductor device. The hermetically sealed packaging is configured to maintain a particular atmosphere near the SiC semiconductor device. Further, the particular atmosphere limits a shift in a threshold voltage of the SiC semiconductor device to less than 1 V during operation.

Abstract: The invention comprises an inertial sensor comprising a frame, a proof mass, a first resonant element, the first resonant element being fixed to the frame and electrostatically coupled to the proof mass, and a second resonant element, the second resonant element being fixed to the frame, adjacent to the first resonant element such that there is substantially no electrostatic coupling between the second resonant element and the proof mass. A coupling is provided between the first resonant element and the second resonant element. A drive means is coupled to the first and second resonant elements for vibrating the first and second resonant elements and a sensor assembly is provided for detecting the amplitude of vibration of at least one of the resonant elements.

Abstract: A micro-electro mechanical apparatus with interdigitated spring including a substrate, at least one first mass, a movable electrode, a stationary electrode, an anchor and an interdigitated spring is provided. The movable electrode is disposed on the mass along an axial direction. The stationary electrode is disposed on the substrate along the axial direction, and the movable electrode and the stationary electrode have a critical gap there between. The interdigitated springs connects the mass and the anchor along the axial direction. The interdigitated spring includes first folded portions, first connecting portions, second folded portions, and second connecting portions. Each first folded portion includes two first spans and a first head portion. Each second folded portion includes two second spans and a second head portion. A width of the first span and a width of the second span are greater than the critical gap respectively.

Abstract: Disclosed herein is an acceleration sensor, including: a mass body part including a first mass body and a second mass body; a frame supporting the first mass body and the second mass body; first flexible parts each connecting the first mass body and the second mass body to the frame; and second flexible parts each connecting the first mass body and the second mass body to the frame, wherein the first mass body and the second mass body are each connected to the frame so as to be eccentric by the second flexible part.

Abstract: An accelerometer, comprises, a measurement mass, a top cap silicon wafer and a bottom cap silicon wafer, which both are coupled with the said measurement mass; the measurement mass comprises a support frame, a mass, and a plurality of resilient beams; the mass and the resilient beams are located within the support frame; the mass and the support frame are connected by several sets of the resilient beams, and each set comprises two resilient folding beams; the resilient folding beams are symmetrically provided with respect to the midline of the mass; a connection beam is provided in between each set of the resilient folding beams to connect the resilient folding beams together. Silicon wafers with electrodes are bonded on the top and bottom surfaces of the measurement mass; and forms a capacitor with the measurement mass. The accelerometer in the present invention has a large mode isolation ratio, and it is symmetrical in high order vibrational modes , which further decreases the noise of the MEMS chip.

Abstract: A crystal oscillator circuit includes an oscillator configured to generate a signal having an oscillation amplitude. A high-pass filter is configured to filter the output signal to generate a filtered output signal. An automatic gain control (AGC) module is configured to generate an initial gain control signal when the filtered output signal is not received by the AGC module. The high-pass filter is configured to prevent the filtered output signal from being received by the AGC module when the oscillation amplitude is substantially equal to zero. The AGC module is configured to generate a steady-state gain control signal when the filtered output signal is received by the AGC module. A gain stage is configured to provide a first amount of gain to the oscillator module based on the initial gain control signal and a second amount of gain to the oscillator module based on the steady-state gain control signal.

Abstract: A MEMS pressure sensor device is provided that can provide both a linear output with regard to external pressure, and a differential capacitance output so as to improve the signal amplitude level. These benefits are provided through use of a rotating proof mass that generates capacitive output from electrodes configured at both ends of the rotating proof mass. Sensor output can then be generated using a difference between the capacitances generated from the ends of the rotating proof mass. An additional benefit of such a configuration is that the differential capacitance output changes in a more linear fashion with respect to external pressure changes than does a capacitive output from traditional MEMS pressure sensors.

Abstract: Disclosed herein are example methods, systems, and devices involving electrically-conductive wires, such as standard IC bonding wires, that are configured so as to operate as inertial sensors. One embodiment of the disclosed methods, systems, and devices may take the form of a system that includes a first electrically-conductive wire and a second electrically-conductive wire, where the first wire and the second wire are electromagnetically coupled; and a sensor oscillator, where the sensor oscillator is coupled to the first wire and the second wire, and where the sensor oscillator is configured to output a sensor-oscillator signal that is frequency modulated based on a change in complex impedance between the first wire and the second wire, where the change in complex impedance is due to a displacement of the first wire relative to the second wire.

Abstract: A multi-axis microelectromechanical-systems (MEMS) inertial measurement unit (IMU) is fabricated in a vacuum sealed single packaged device. An FM vibratory gyroscope and an FM resonant accelerometer both for generating FM output signals is fabricated in the silicon chip using MEMS. A signal processor is coupled to the an FM vibratory gyroscope and to the FM resonant accelerometer for receiving the FM gyroscopic output signals and the FM accelerometer output signals. The signal processor generates simultaneous and decoupled measurement of input acceleration, input rotation rate, and temperature and/or temperature distribution within the IMU, self-calibration of the biases and scale factors of the IMU and its support electronics against temperature variations and other common mode errors, and reduction of the cross axis sensitivity by reducing acceleration errors in the gyroscope and rotation errors in the accelerometer.

Abstract: The invention comprises an inertia! sensor comprising a frame, a proof mass; a first resonant element having a proximal end and a distal end, the first resonant element being fixed to the frame at its proximal end and coupled to the proof mass at its distal end, a second resonant element having a proximal end and a distal end, the second resonant element being fixed to the frame at its proximal end, adjacent to the first resonant element such that there is no coupling between the second resonant element and the proof mass, a means for coupling the first resonant element to the second resonant element; a drive means coupled to the first and second resonant elements for vibrating the first and second resonant elements; and a sensor assembly for detecting the amplitude of vibration of the resonant elements.