Wire Tool Patents (Class 83/651.1)
  • Patent number: 9016182
    Abstract: A device and a method for cutting through the adhesive bead of panes that have been fixed by bonding is specified, said device having a base body on which at least one suction plate for fixing on a pane to be separated out as well as one motor-drivable coil for winding-on a separating wire are accommodated, wherein at least two guide rollers are held on the base body by means of extension arms at a distance which is adjustable in respect to each other. The device is preferably positioned approximately diagonally on the pane in such a manner that the guide rollers are situated on the outer ends of the extension arms in the vicinity of the corner regions of the pane.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: April 28, 2015
    Assignee: C. & E. Fein GmbH
    Inventor: Ralf Seebauer
  • Patent number: 9010311
    Abstract: An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: April 21, 2015
    Assignee: MacTech, Inc.
    Inventors: Steve Shae, Joel Kent Wittenbraker
  • Publication number: 20150101471
    Abstract: A cutting apparatus includes a wire cutting member, a plurality of wheels about which the wire cutting member is at least partially wrapped, a first arm member supporting at least one of the plurality of wheels, and a second arm member supporting at least one of the plurality of wheels. The first arm member and the second arm member may be moveable between a first position, in which the cutting apparatus has a first size, and a second position, in which the cutting apparatus has a second size larger than the first size. A wire saw includes an adjustment member coupled to at least one of a plurality of wheels for moving the at least one of the plurality of wheels to adjust a tension of a wire cutting member.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 16, 2015
    Inventors: Kenneth R. Pierce, Michael W. Gearhart, Roy C. Coakley
  • Patent number: 8956501
    Abstract: A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: February 17, 2015
    Assignee: Saxum LLC
    Inventor: Teo Chong Teck
  • Publication number: 20150027287
    Abstract: A system, a method and a modular apparatus may use a wire loop to cut an object. The apparatus may have a wire loop connected to pulleys on a deck attached to a frame. The deck may move relative to the frame to direct the wire loop through the object. The apparatus may have arms that may hold the object being cut. The apparatus may be configured with different cutting decks to reduce the overall size of the apparatus and/or to facilitate cutting a particular object in a particular environment.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 29, 2015
    Applicant: Mactech, Inc.
    Inventors: Michael James Harper, Joel Kent Wittenbraker
  • Publication number: 20140352506
    Abstract: A system, a method and a collapsible and/or folding apparatus may use a wire loop to cut an object. The apparatus may have a wire loop connected to pulleys on a carriage attached to a frame. The carriage may move relative to the frame to direct the wire loop through the object. The apparatus may have arms on the carriage that may be folded and/or a kicker frame pivotably connected to the frame that may be retracted to reduce the overall size of the apparatus.
    Type: Application
    Filed: June 3, 2013
    Publication date: December 4, 2014
    Applicant: Mactech, Inc.
    Inventors: Michael James Harper, Joel Kent Wittenbraker
  • Patent number: 8882026
    Abstract: A method and a device for deflating an inflated wall (1), wherein the inflated wall (1) is cut by using at least one cutting member adapted to cut the inflated wall (1) along a cutting line with the effect of causing a deflation opening of the inflated wall (1). The invention applies in particular to the inflated envelope of an aerostat balloon.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: November 11, 2014
    Assignee: Centre National d'Etudes Spatiales (C.N.E.S.)
    Inventor: Thomas Huens
  • Patent number: 8833359
    Abstract: An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: September 16, 2014
    Assignee: Mactech, Inc.
    Inventors: Steve Shae, Joel Kent Wittenbraker
  • Patent number: 8833219
    Abstract: A device for cutting a length of pipe includes a clamp portion for clamping around a length of pipe and a bow moveable with respect to the clamp portion that retains a loop of diamond embedded wire. The device further includes a feed for driving the bow with respect to the clamp portion and a detector for detecting bending of the wire and a control responsive to the detector for controlling feed rates. The device is made of modular parts and has synchronizing arms for clamping around a length of pipe. In one embodiment, the wheels are retained in enclosures with slots through which the cutting wire passes.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: September 16, 2014
    Assignee: Illinois Tool Works Inc.
    Inventor: Kenneth R. Pierce
  • Publication number: 20140222004
    Abstract: A wire saw which has excellent cutting ability and which is not easily clogged by chips formed by cutting is provided. It has a body 6 having a first metal wire 1 which is made of a cobalt-based alloy, two second metal wires 2a and 2b which are made of a cobalt-based alloy, and three third metal wires 3a-3c which are made of a cobalt-based alloy and are wound on the first metal wire 1. The second metal wires 2a and 2b are helically wound on each of the third metal wires 3a-3c in opposite directions so as to cross each other. Cutting teeth are constituted by projections 8 which are formed by the crossing points of the two second metal wires 2a and 2b.
    Type: Application
    Filed: October 17, 2012
    Publication date: August 7, 2014
    Inventors: Hiroyoshi Yamada, Kazunari Mochizuki, Satoshi Shimura
  • Publication number: 20140182435
    Abstract: A device for slicing material includes a structural support and a nanotube blade. The nanotube blade includes a nanotube filament having atoms arranged in a lattice structure and has a first end and a second end. Both the first end and the second end are coupled to the structural support and separated by a length of the nanotube blade.
    Type: Application
    Filed: December 28, 2012
    Publication date: July 3, 2014
    Applicant: Elwha LLC
    Inventors: Michael H. Baym, W. Daniel Hillis, Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T. Kare, Conor L. Myhrvold, Nathan P. Myhrvold, Tony S. Pan, Clarence T. Tegreene, Charles Whitmer, Lowell L. Wood, JR., Victoria Y.H Wood
  • Publication number: 20140183927
    Abstract: A system for slicing material includes a structural support and a nanotube blade. The nanotube blade is coupled to the structural support and includes a nanotube filament having atoms arranged in a lattice structure. A first end and a second end of the nanotube blade are coupled such that the nanotube blade forms a nanotube loop.
    Type: Application
    Filed: December 28, 2012
    Publication date: July 3, 2014
    Applicant: Elwha LLC
    Inventors: Michael H. Baym, W. Daniel Hillis, Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T. Kare, Conor L. Myhrvold, Nathan P. Myhrvold, Tony S. Pan, Clarence T. Tegreene, Charles Whitmer, Lowell L. Wood, JR., Victoria Y.H. Wood
  • Publication number: 20140165804
    Abstract: A wire having a surface and diamond particles bonded to said surface by a bond matrix, wherein each diamond particle has surface roughness of about 0.60 to about 0.80 and a sphericity of about 0.25 to about 0.50.
    Type: Application
    Filed: August 2, 2010
    Publication date: June 19, 2014
    Applicant: DIAMOND INNOVATIONS, INC.
    Inventors: Timothy Dumm, Kan-yin Ng
  • Patent number: 8701735
    Abstract: The invention discloses a coil for a winding-up device adapted for winding up a cutting wire used for cutting through an adhesive bead of a bonded-on pane, having a coil body for winding up the cutting wire, the coil body being provided with at least one opening for securing one end of the cutting wire.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: April 22, 2014
    Assignee: C. & E. Fein GmbH
    Inventors: Olaf Klabunde, Joachim Clabunde, Juergen Blickle
  • Patent number: 8695472
    Abstract: A machine for cutting structural members is described. The machine has an endless travelling wire and a frame arranged around a structural member to be cut. The travelling wire and frame have longitudinal track with carriages with at least one pulley carrying at least one cutting segment. The longitudinal tracks are adapted to be engaged via motion means in arcuate guide slots.
    Type: Grant
    Filed: August 3, 2010
    Date of Patent: April 15, 2014
    Assignee: TS R&D S.R.L.
    Inventor: Francesco Matteucci
  • Patent number: 8689777
    Abstract: Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7 to 50 at %, at least one non-metal or metalloid selected from the group consisting of boron, carbon, silicon, phosphorus, and/or nitrogen present in the range of about 1 to 35 at %, and one metal selected from the group consisting of copper, titanium, molybdenum, aluminum, and/or chromium present in the range of about 0 to 25 at %, wherein the wire has an aspect ratio of greater than one and exhibits metallic and/or crystalline phases of less than 500 nm in size.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: April 8, 2014
    Assignee: The NanoSteel Company, Inc.
    Inventors: Daniel James Branagan, Brian E. Meacham, Jason K. Walleser, Jikou Zhou, Alla V. Sergueeva, David Paratore
  • Publication number: 20130333534
    Abstract: A safety knife preferably for cutting food items such as vegetables, bread and meat without lacerations includes a handle portion and an extension. The extension includes two terminal ends, located near the handle and away from the handle, respectively. A wire blade bearing cutting elements is drawn taut between the two terminal ends. The extension includes a bevel portion, the leading edge of which travels immediately behind the wire blade. The wire blade is held under enough tension to avoid deforming when drawn through food items in a back-and-forth motion, and the bevel helps to separate items being cut. This reduces drag on the wire blade when using the knife and keeps the user's hands and fingers away from the wire blade.
    Type: Application
    Filed: June 19, 2012
    Publication date: December 19, 2013
    Inventor: Earl Votolato
  • Publication number: 20130283989
    Abstract: One embodiment of the invention provides a rotary cutter for a brush cutter, including: a head main body having a cord guide hole; and a pressure member having a cord inserting guide hole formed to radially penetrate through the pressure member. The pressure member is operable between: a first state in which the cord inserting guide hole of the pressure member is aligned with the cord guide hole of the head main body so that a cutting code is insertable into the head main body; and a second state in which the pressure member is pushed inwardly of the head main body from the first state; a third state in which the pressure member is rotated with respect to the head main body from the second state so that the inserted cutting code is made into a bent state.
    Type: Application
    Filed: March 13, 2013
    Publication date: October 31, 2013
    Inventor: Hiroki Kato
  • Patent number: 8465227
    Abstract: A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: June 18, 2013
    Assignee: Tetra Technologies, Inc.
    Inventor: Galen R. Clark, II
  • Patent number: 8464621
    Abstract: A plurality of bushings are coupled to one another via a series of bolts to provide an interlocking, articulating cutter. The bolts have a cylindrical end and a convex end. The convex ends are seated inside a concave socket coupled to the bushings. The cylindrical ends are coupled to a convex nut seated inside another concave socket coupled to an adjacent bushing. The convex ends of the bolts are configured to articulate inside the seat of the concave sockets. A washer may be placed between the bushings to provide a desired amount of flexibility and/or rigidity. The outer surface of the bushing comprises a cutting structure, such as a milled or clad cutting structure.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: June 18, 2013
    Assignee: Bisso Marine Co., Inc.
    Inventors: William A. Bisso, IV, Tjerko Jurgens
  • Patent number: 8430387
    Abstract: A leverage based cutting board system having a rotatable tower and sliding knife holster is disclosed. Control of the height of the sliding knife holster and unique locking system facilitates cutting of foodstuffs of a variety of shapes and consistencies. The system further provides an advantage of using any traditional knife. It allows rapid switching between traditional cutting and leverage cutting. The system decreases the total scale of force required to cut foodstuffs and constrains the number of untoward knife motions. The tower with its unique property of rotating 180 degree makes it apt to use both the surfaces in a single preparation. The unique texture of the board helps it to grip slippery food items. The sleek and compact design helps keeping the tower intact as it lies horizontally adjacent to the board when not in use.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: April 30, 2013
    Inventor: Mark Costin Roser
  • Publication number: 20130061731
    Abstract: The invention relates to a diamond wire of the type used in single- or multiple-wire machines for cutting blocks of hard materials, such as stone, concrete, metal or similar, in order to obtain sheets with a thickness of between 2 and 3 cm. The structure of the wire comprises a steel cable and a number of beads distributed along the length of the cable, as well as a plastic coating which is applied to the cable and secures the heads in relative positions both in terms of the longitudinal movement and rotation thereof in relation to the cable. The invention is characterised in that: each bead comprises a generally cylindrical single body of diamond material including an axial passage provided with various formations in the form of angularly equispaced ribs that project inwards and extend longitudinally; and that the external surface of the cylindrical body includes multiple corresponding angularly equispaced channels that also extend longitudinally.
    Type: Application
    Filed: March 17, 2010
    Publication date: March 14, 2013
    Applicant: W.DIAMANT HERRAMIENTAS, S.A.
    Inventors: Jesus Amador Martin, Inigo Iturriza Zubillaga
  • Publication number: 20130043218
    Abstract: Methods and apparatus for rapidly and efficiently machining rare earth magnets are disclosed. In particular various embodiments of multi-wire electrical discharge machining and wire saw machines are described that can allow for significant time savings, thereby allowing integration of a wire cutting process into a high volume production scale operation.
    Type: Application
    Filed: August 19, 2011
    Publication date: February 21, 2013
    Applicant: Apple Inc.
    Inventors: Simon Regis Louis Lancaster-Larocque, Ryan Masato Satcher
  • Patent number: 8307873
    Abstract: The invention discloses a device for cutting through an adhesive bead of a vehicle pane, in particular a windshield, having a motor-driven winding-up device that comprises a coil for winding up a cutting wire in a working direction for cutting through the adhesive bead, the winding-up device being provided with a strain relief for the cutting wire which allows the cutting wire to be withdrawn from the winding-up device in a sense opposite to the working direction.
    Type: Grant
    Filed: December 1, 2009
    Date of Patent: November 13, 2012
    Assignee: C. & E. Fein GmbH
    Inventors: Olaf Klabunde, Joachim Clabunde, Juergen Blickle, Bernd Mayer
  • Publication number: 20120222527
    Abstract: A device and a method for cutting through the adhesive bead of panes that have been fixed by bonding is specified, said device having a base body on which at least one suction plate for fixing on a pane to be separated out as well as one motor-drivable coil for winding-on a separating wire are accommodated, wherein at least two guide rollers are held on the base body by means of extension arms at a distance which is adjustable in respect to each other. The device is preferably positioned approximately diagonally on the pane in such a manner that the guide rollers are situated on the outer ends of the extension arms in the vicinity of the corner regions of the pane.
    Type: Application
    Filed: March 1, 2012
    Publication date: September 6, 2012
    Inventor: Ralf Seebauer
  • Patent number: 8210906
    Abstract: A wafer slicing method includes winding a wire around rollers and pressing the wire against an ingot while supplying slurry to the rollers. A previously conducted experiment provides a supply temperature profile of the slurry during the slicing process and the relationship to the axial displacement of the rollers. This relationship is used to implement slurry delivery during the slicing process. The resultant wafers are bowed in a uniform direction. This slicing method provides excellent reproducibility in addition to producing wafers that are bowed in a uniform direction.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: July 3, 2012
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Hiroshi Oishi, Daisuke Nakamata
  • Patent number: 8205534
    Abstract: The present invention provides cutting methods and cutting apparatus that can precisely cut workpieces in complicated shapes with high aspect ratios regardless of materials of the workpieces. The present invention is cutting methods and cutting apparatus using a wire saw wherein cutting processing is performed for a workpiece by extending a cutting wire on a cutting arm that rotates around a wire's center axis or a real cutting position relative to a fixed section and rotating the cutting arm such that a cutting direction of the wire matches a support direction of a total stiffness that supports the wire.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: June 26, 2012
    Assignee: Nagasaki University
    Inventors: Takanori Yazawa, Keiichi Ishikawa, Kou Mineta
  • Publication number: 20120132045
    Abstract: The invention relates to a suspension including a set of abrasive grains and a binder, said suspension being characterized in that: the particle size fraction D40-D60 of said set of abrasive grains comprises more than 15 vol % and less than 80 vol % of grains having a circularity of less than 0.85, the percentiles D40 and D60 being the percentiles of the cumulative particle size distribution curve of grain sizes corresponding to the grain sizes enabling the separation of the fractions consisting of 40 and 60 vol % of the grains having the largest size, respectively; and the abrasive grains are more than 25 wt % and less than 49.5 wt % of said suspension.
    Type: Application
    Filed: July 9, 2010
    Publication date: May 31, 2012
    Applicant: Saint-Gobain Centre de Recherches et D'etudes European
    Inventors: Ana-Maria Popa, Jan Olaf Roszinski, Siv M. Emanuelsen, Fabio Neuman
  • Patent number: 8171833
    Abstract: The present invention is a rail system cheese cutter comprised of an arched cutting surface, rail and cutting arm with a removable cutting wire and tension adjustment component which allows the user to adjust the tension of the wire. The rail has a milled portion where the cutting arm is to be attached to the rail. One end of the cutting arm has a rotational bearing with a slot and opening. The slot is slid around the milled portion of the rail until the rail rests in the opening of the rotational bearing. Once attached, the cutting arm can be pivoted around the rail and moved laterally along the rail allowing the user to uniformly cut or slice a food item without moving it.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: May 8, 2012
    Inventor: John Reed Felton
  • Patent number: 8151674
    Abstract: A layer cutting apparatus includes a tray having an interior defined by a bottom and sidewall. A sleeve is at least partially disposed in the interior of the tray, and a cutting line is attached to the sleeve. The cutting line is configured to be removed from the sleeve by pulling the line away from the tray at one point of the sidewall.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: April 10, 2012
    Assignee: General Mills Marketing, Inc.
    Inventors: James R. Baeten, Vanessa L. Little, Karalyn A. Littlefield, Mark W. Yungner, Robert A. Zoss, Linda Baggio
  • Patent number: 8146468
    Abstract: A device and method of cutting soft food material. The cutting is performed by an arrangement of cutting wire or ribbon that is pulled taut across a supporting frame. The cuts are made while the food material is lightly compressed and confined in a press. The press consists of a compression chamber having a bottom surface. The cutter is placed at the bottom of the compression chamber. Food material is then placed into the compression chamber atop the cutter. A compression plate is placed over the food material. The compression plate is pressed down to compress the food material. The compression squeezes the food material and liberates any excess fluids that may be present within the food material. This conditions the food material. The cutter is then pulled through the conditioned food.
    Type: Grant
    Filed: January 2, 2009
    Date of Patent: April 3, 2012
    Inventor: Wayne J. Kachelries
  • Patent number: 8141611
    Abstract: A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.
    Type: Grant
    Filed: April 9, 2009
    Date of Patent: March 27, 2012
    Assignee: HTC Corporation
    Inventors: Yao-Hsiang Lai, Ta-Cheng Liu, Jung-Hung Hung, Yu-Meng Lin, Kuo-Lung Yang
  • Patent number: 8118075
    Abstract: An apparatus for separating a laminated substrate assembly comprises at least a substantially planar assembly, a cutting member housing assembly positioned on a first side of the substantially planar assembly, a cutting member receiving assembly positioned on a second side of the substantially planar assembly, substantially opposite from the first side of the planar assembly suitable for receiving an amount of the elongated cutting member. At least one of the cutting member housing assembly or the cutting member receiving assembly is configured to provide an amount of tension to the elongated cutting member as the elongated cutting member is released by the cutting member housing assembly or received by the cutting member receiving assembly, and the elongated cutting member is configured to remove an amount of adhesive from an adhesive layer of the laminated substrate assembly.
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: February 21, 2012
    Assignee: Rockwell Collins, Inc.
    Inventors: James D. Sampica, Paul R. Nemeth, Tracy J. Barnidge, Vincent P. Marzen
  • Patent number: 8109693
    Abstract: A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: February 7, 2012
    Assignee: Tetra Technologies, Inc.
    Inventor: Galen R. Clark, II
  • Publication number: 20120017741
    Abstract: A sawing wire (100,110,120,130) with abrasive particles (20) is presented wherein the particles (20) are partly embedded in said a metallic core (14) and partly in said an organic binder layer (30). The advantage of the wire (100,110,120,130) is that the application of a metallic binder layer (30) can be avoided. Metallic binder layers add to the cost of a fixed abrasive sawing wire and in many cases pose health and safety problems which can be avoided by the use of an organic binder layer. Moreover the advantages of a good fixture of the abrasive particles in the metallic wire are maintained. Different embodiments are presented with different degrees of embedment into the metal wire.
    Type: Application
    Filed: April 28, 2010
    Publication date: January 26, 2012
    Inventors: Martin Lange, Jan Vaneecke, Rebecca Lameire
  • Publication number: 20110297784
    Abstract: A method and a device for deflating an inflated wall (1), wherein the inflated wall (1) is cut by using at least one cutting member adapted to cut the inflated wall (1) along a cutting line with the effect of causing a deflation opening of the inflated wall (1). The invention applies in particular to the inflated envelope of an aerostat balloon.
    Type: Application
    Filed: June 3, 2011
    Publication date: December 8, 2011
    Applicant: CENTRE NATIONAL D'ETUDES SPATIALES (C.N.E.S)
    Inventor: Thomas HUENS
  • Patent number: 8065995
    Abstract: A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a first top outlet and a second top outlet located in a top position with respect to a work piece for applying fluids during sawing, and at least one chute located substantially below the work piece for receiving the fluids, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluids flow in a vertical direction against and into the work piece for slicing and cleaning wafers.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: November 29, 2011
    Assignee: Cambridge Energy Resources Inc
    Inventors: Abhaya Kumar Bakshi, Bhaskar Chandra Panigrahi
  • Publication number: 20110214543
    Abstract: An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.
    Type: Application
    Filed: March 4, 2010
    Publication date: September 8, 2011
    Inventors: Steve Shae, Joel Wittenbraker
  • Publication number: 20110203436
    Abstract: A hot-wire cutter includes a frame, a tank supported on the frame, a first working head located on a floor of the tank, a second working head movably supported on the frame, a supporting unit supported on the frame and used to support an annular work piece, a restraining unit supported on the frame and used to clamp the annular work piece, and a rotating unit supported on the frame and used to rotate the annular work piece. Thus, a line between the first and second working heads is directed through the centers of initial apertures in the annular work piece, one after another, to facilitate precise processing of sections of the annular work piece corresponding to the initial apertures.
    Type: Application
    Filed: February 23, 2010
    Publication date: August 25, 2011
    Inventors: Sung-Neng Cheng, Chung-Hsien Lu, Sheng-Chih Hsu
  • Patent number: 7987753
    Abstract: A cutting machine is configured for cutting an injection molded original product. The injection molded original product has a component and stub bar connected to the component. The cutting machine includes a base portion, a supporting arm attached to the base portion, and a cutting device coupled to the supporting arm. The cutting device includes an electrothermal cutting line for cutting the component off the stub bar.
    Type: Grant
    Filed: July 22, 2008
    Date of Patent: August 2, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chien-Feng Huang
  • Patent number: 7971584
    Abstract: A sawing strip for fixing a substantially cylindrical workpiece when cutting off slices from this workpiece with a wire saw has a first face, which is concavely curved perpendicular to its longitudinal direction for connecting to the workpiece, a second face opposite the first face for connecting to a mounting plate, and two side faces which connect the first face and the second face, two edges of the sawing strip at which the side faces meet the first face at a distance a from each other, an imaginary line on the first face marking its minimum distance d from the second face, the side faces being at a distance b, measured at the height of the line and perpendicular to the distance d, wherein the distance b is less than the distance a. The sawing strip is useful for decreasing waviness of wafers cut from a cylindrical workpiece using the sawing strip.
    Type: Grant
    Filed: July 6, 2007
    Date of Patent: July 5, 2011
    Assignee: Siltronic AG
    Inventor: Peter Wiesner
  • Publication number: 20110133383
    Abstract: A leverage based cutting board system having a rotatable tower and sliding knife holster is disclosed. Control of the height of the sliding knife holster and unique locking system facilitates cutting of foodstuffs of a variety of shapes and consistencies. The system further provides an advantage of using any traditional knife. It allows rapid switching between traditional cutting and leverage cutting. The system decreases the total scale of force required to cut foodstuffs and constrains the number of untoward knife motions. The tower with its unique property of rotating 180 degree makes it apt to use both the surfaces in a single preparation. The unique texture of the board helps it to grip slippery food items. The sleek and compact design helps keeping the tower intact as it lies horizontally adjacent to the board when not in use.
    Type: Application
    Filed: December 7, 2010
    Publication date: June 9, 2011
    Inventor: Mark Costin Roser
  • Patent number: 7950319
    Abstract: A cutting device includes a substrate, a supporting arm mounted on the substrate, a driving component supported by the supporting arm, and a cutting member. The cutting member includes a connection member and a cutting wire. The connection member includes an attachment portion connected to the driving component and a securing portion. The cutting wire is positioned on the securing portion.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: May 31, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Han-Lung Lee
  • Publication number: 20110100347
    Abstract: Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7 to 50 at %, at least one non-metal or metalloid selected from the group consisting of boron, carbon, silicon, phosphorus, and/or nitrogen present in the range of about 1 to 35 at %, and one metal selected from the group consisting of copper, titanium, molybdenum, aluminum, and/or chromium present in the range of about 0 to 25 at %, wherein the wire has an aspect ratio of greater than one and exhibits metallic and/or crystalline phases of less than 500 nm in size.
    Type: Application
    Filed: November 2, 2010
    Publication date: May 5, 2011
    Applicant: THE NANOSTEEL COMPANY, INC.
    Inventors: Daniel James BRANAGAN, Brian E. MEACHAM, Jason K. WALLESER, Jikou ZHOU, Alla V. SERGUEEVA, David PARATORE
  • Patent number: 7926478
    Abstract: A superabrasive wire saw-wound structure includes a superabrasive wire saw (10) formed with an average diameter D and a reel (1). The superabrasive wire saw (10) includes a core wire (11), a bonding material (12) surrounding a surface of the core wire (11), and a plurality of superabrasive grains (13) bonded to the surface of the core wire (11) with the bonding material (12). The reel (1) includes a peripheral surface (2) having one end (3) and the other end (4). The superabrasive wire saw (10) which is to be unreeled successively toward a workpiece is wound around the peripheral surface (2) reciprocatingly between the one end (3) and the other end (4) to be multi-layered. A pitch P for winding the superabrasive wire saw (10) around the peripheral surface (2) between the one end (3) and the other end (4) satisfies a relation of D<P<2D.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: April 19, 2011
    Assignee: A.L.M.T. Corp.
    Inventors: Masanori Nakai, Masaaki Yamanaka, Yoshizumi Ishitobi
  • Patent number: 7922424
    Abstract: A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
    Type: Grant
    Filed: June 20, 2008
    Date of Patent: April 12, 2011
    Assignee: Tetra Technologies, Inc.
    Inventor: Galen R. Clark, II
  • Patent number: 7886645
    Abstract: A system for cutting blocks of cheese or other food product into chunks includes conveyors for moving the blocks along an automated, continuous, in-line processing path. A block cutter cuts the blocks longitudinally and or vertically to provide one or more stacks of slabs which are destacked by a vacuum transfer apparatus. A transverse cutter cuts the individual slabs to create chunks of cheese or other food product. The conveyors include a stack conveyor located in the processing path for conveying successive stacks of slabs from the block cutter to the product destacking apparatus in succession, and a slab conveyor located in the processing path for conveying successive slabs from the product destacking apparatus to the transverse cutter. A trim cutting module includes a rotating mechanism that rotates a block during the trim operation, allowing trim to drop to a trim disposal conveyance.
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: February 15, 2011
    Assignee: Marchant Schmidt, Inc.
    Inventor: Richard F. Schmidt
  • Patent number: 7841271
    Abstract: A cheese vat for at least preparing curd for soft fresh cheese, comprising at least one cutting frame provided with a cutting wire system, which has a frame which has at least two opposite frame parts between which cutting wire sections extend, which frame parts are provided with openings form receiving a cutting wire, wherein the ends of a cutting wire are each fastened via pull relief means.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: November 30, 2010
    Assignee: Tetra Laval Holdings & Finance S.A.
    Inventors: Sijmen Sipma, Wieger van der Meulen
  • Publication number: 20100294140
    Abstract: A cheese shredding apparatus has a table top with a rolling platform that uses 2 pairs of beveled wheels. A partitioned hopper for containing blocks of cheese. A pair of cutting grids located at opposite ends of a cutting block. A pair of push cube modules. A motor powers the rolling platform by way of a cam which converts a rotational motion from the motor into a linear motion which actuates the back and fro motion of the rolling platform. The beveled wheels roll on a pair of tracks which are held within the table top frame. The beveled wheels maintain a very precise and accurate tracking motion of the rolling platform as they move back and forth as guided by the tracks.
    Type: Application
    Filed: April 30, 2010
    Publication date: November 25, 2010
    Inventor: Steeve Fontaine
  • Publication number: 20100288092
    Abstract: The present invention discloses a vibration cutting device and a method for vibration cutting. The vibration cutting device comprises at least one first oscillating heat, a controller, by means of which the first oscillating head can be selectively electrically excited in order to carry out oscillations within a frequency range below the kilohertz range, and a cutting tool disposed between a first and a second fixture, while the first fixture is connected to the first oscillating head such that mechanical oscillations of the first oscillating head can be transferred to the cutting tool.
    Type: Application
    Filed: November 27, 2008
    Publication date: November 18, 2010
    Applicant: BRANSON ULTRASCHALL NIEDERLASSUNG DER EMERSON TECHNOLOGIES GMBH & CO., OHG
    Inventors: Christoph Manger, Joerg Sawatzki-Forster