Plural Independent Rotary Scoring Blades Patents (Class 83/864)
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Patent number: 10786920Abstract: A board scoring device for insulation board that is mobile enough to be carried on a roof and can easily score the top and bottom surfaces to be separated into multiple boards.Type: GrantFiled: May 4, 2015Date of Patent: September 29, 2020Assignee: Centimark CorporationInventor: Joshua Roberts
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Patent number: 9120284Abstract: A machine for cutting and/or pre-creasing a sheet of relatively rigid material which includes movement elements to move the sheet in a defined direction of feed, a cutting and/or pre-creasing unit mobile in a direction substantially transverse to the direction of feed of the sheet, to carry out on the sheet at least a cutting and/or pre-creasing operation. The cutting and/or pre-creasing unit includes a plurality of operating heads, each one mobile transversely to the direction of feed of the sheet in an independent and autonomous manner with respect to the other operating heads, and conformed to support, move and command a single relative cutting and/or pre-creasing tool.Type: GrantFiled: July 13, 2010Date of Patent: September 1, 2015Assignee: Panotec SRLInventor: Giuseppe Capoia
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Publication number: 20140121085Abstract: Apparatus for selectively puncturing a moving receiver includes puncturing devices, each with two parallel puncturing wheels and a pressure wheel. A drive mechanism rotates the puncturing wheels or pressure wheel of two or more puncturing devices so that the rotating puncturing wheels engage the moving receiver to puncture the moving receiver parallel to its feed direction in the puncturing areas. A transport mechanism selectively moves the plurality of puncturing devices perpendicular to the feed direction of the receiver. A controller receives a job specification including two or more specified puncture locations and causes the transport mechanism to laterally position two or more of the plurality of puncturing devices to puncture the moving receiver in the specified puncture locations. A rotatable turret with various shaft segments can be arranged so that perforating devices can be moved on and off the shaft segments.Type: ApplicationFiled: October 31, 2012Publication date: May 1, 2014Inventors: Brian J. Kwarta, James Douglas Shifley
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Publication number: 20120031251Abstract: A slitter-scorer apparatus is provided, capable of effectively positioning slitter knives in the width direction so that a paperboard sheet of a desired sheet width can be obtained.Type: ApplicationFiled: August 2, 2011Publication date: February 9, 2012Inventors: Hiroki Momonaka, Michio Suzuki, Kazuya Sawayama
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Patent number: 7789005Abstract: There is provided a tampon applicator apparatus and method for creating and scoring petals or petal tips of the tampon applicator. The apparatus has a holding element for the tampon applicator, a score device for forming a score line at the base of the petals, and two or more punch devices for creating a petal. There is also provided a vacuum for removing the portions of the tampon applicator that are punched out.Type: GrantFiled: March 22, 2005Date of Patent: September 7, 2010Assignee: Playtex Products, IncInventor: Jamshid Rejai
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Patent number: 7591072Abstract: Cutting devices including an elongate body having a handle and two rotatable cutting blades mounting on opposite sides of the body. One cutting blade is movable longitudinally relative to the other to enable variation in the longitudinal spacing between the cutting blades. In addition to or instead of the variable longitudinal spacing, one cutting blade is movable transversely relative to the other to enable variation in the transverse spacing between the cutting blades. Other cutting devices include a housing defining a blade-receiving cavity, an actuating mechanism pivotally mounted to the housing and a cutting assembly arranged in the cavity and including cutting blades. The cutting assembly is rotatable relative to the housing to selectively bring each cutting blade into a cutting position, and has a relaxed position in which the cutting blades are recessed within an outer periphery of the housing. The cutting assembly is biased into this relaxed position.Type: GrantFiled: October 14, 2005Date of Patent: September 22, 2009Inventor: David M. Stravitz
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Patent number: 7359764Abstract: A scoring bridge includes a plurality of moveable mounted carriages. The carriages each have a rotor, and the bridge has a linear stator to move the carriages. The position of a carriage designated as a reference carriage is recorded as it moves past a motion detector. The position of each remaining carriages is recorded as they individually move past the detector. The difference between the position of a carriage and the position of the reference carriage is an offset that is added to the position reading of the carriage to accurately space the carriage form the reference carriage. Each of the carriages can have a scoring assembly that includes servomotor acting through a gear arrangement on a scoring wheel. The servomotor applies a constant load to the scoring wheel and adjusts the load for any positive or negative displacement of the scoring wheel from a reference position.Type: GrantFiled: May 16, 2005Date of Patent: April 15, 2008Assignee: PPG Industries Ohio, Inc.Inventors: Robert M. Bonaddio, David Gazda, Kurt Welsch
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Patent number: 7190492Abstract: A serial recording system printer continuously records a plurality of pages on a continuous recording sheet repeatedly fed/stopped and conveyed with a constant conveyance step width. A cutter is disposed on a downstream side of a print head so that the position of the cutter can be changed in the conveyance direction. The cutter position is moved for each page in accordance with the dimension of the page, and the sheet is cut. It is assumed that a signal indicating a terminal or front end position of the page is a start point, and that a product (n?) of a conveyance step width (?) and the number of repetitions (n) is set as a conveyance distance of the recording sheet. The cutter is moved to be positioned so that a distance (A) to the cutter from a print end position of a page terminal end or a print start position of a page front end agrees with the conveyance distance (n?).Type: GrantFiled: October 11, 2002Date of Patent: March 13, 2007Assignee: Fuji Photo Film Co. LtdInventor: Kunio Hakkaku
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Patent number: 6886443Abstract: There is provided a tampon applicator apparatus and method for creating and scoring petals or petal tips of the tampon applicator. The apparatus has a holding element for the tampon applicator, a score device for forming a score line at the base of the petals, and two or more punch devices for creating a petal. There is also provided a vacuum for removing the portions of the tampon applicator that are punched out.Type: GrantFiled: June 26, 2002Date of Patent: May 3, 2005Assignee: Playtex Products, Inc.Inventor: Jamshid Rejai
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Patent number: 6848155Abstract: A method of manufacturing an edge reflection type surface acoustic wave device using a Shear Horizontal type surface acoustic wave includes the steps of making a first half cut defining a first end surface portions having a smooth surface, that is, opposing two end surfaces which function as reflection end surfaces, from the upper surface of a piezoelectric substrate after at least one of a plurality of IDTs has been formed on the upper surface of the piezoelectric substrate, making a second half cut for forming second end surface portions having a rough surface after making the first cut, and making a full cut for cutting the piezoelectric substrate so as to reach the lower surface of the piezoelectric substrate outside of the second end surface portions in the surface acoustic wave propagation direction.Type: GrantFiled: May 11, 2004Date of Patent: February 1, 2005Assignee: Murata Manufacturing Co., Ltd.Inventors: Yasuhiro Kuratani, Takao Mukai, Tomoyasu Miyata, Hideharu Yoshikawa
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Patent number: 6721060Abstract: A recording medium cutter capable of moving between two positions, a cutting position and a non-cutting position, in a short time, and also capable of cutting a recording medium at accurate positions. A main body (40) rotatably holding a rotary blade (32) and a driven blade (34) is located between side plates (36 and 38) of the cutter (30). A main shaft (39) serving as the center shaft of the rotary blade (32) is rotatably secured to the side plates (36 and 38). The main shaft (39) also serves as the rotating shaft of the main body (40). A driving motor is secured to the mounting plate (42) of the side plate (36). When the main shaft (39) is rotated by the driving motor (44), the rotary blade (32) rotates. Because the driven blade (34) is pressed against the side face of the rotary blade (32), as the rotary blade (32) rotates, the driven blade (34) revolves around the main shaft (39). As a result, the main body (40) also rotates around the main shaft (39).Type: GrantFiled: September 23, 1999Date of Patent: April 13, 2004Assignee: Canon Finetech Inc.Inventors: Iwao Kawamura, Ryouma Suzuki, Kazuhiro Murakami, Naoki Kiyohara, Kensuke Izuma, Kiyokazu Namekata, Tatsuo Fujimura, Mitsuharu Takizawa, Keiko Nazuka
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Patent number: 6631662Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: May 22, 2001Date of Patent: October 14, 2003Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6578458Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: March 18, 2002Date of Patent: June 17, 2003Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Publication number: 20020104422Abstract: Disclosed is a dual-cutting method devoid of useless strokes of cutting blades across a workpiece. The work piece has cross lines drawn in the form of lattice, and it is divided into the intermediate and opposite side zones. Two lines of substantially equal length are selected in the intermediate zone to be cut simultaneously every time the two cutting blades have been moved line-to-line distance for indexing. One of the two cutting blades is allotted to one of the opposite side zones, and the other cutting blade is allotted to the other side zone. As is the case with the cutting in the intermediate zone, two lines of substantially equal length are selected in the opposite side zones to be cut simultaneously every time the two cutting blades have been moved line-to-line distance for indexing.Type: ApplicationFiled: January 31, 2002Publication date: August 8, 2002Inventor: Katsuharu Negishi
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Patent number: 6427676Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: January 2, 2001Date of Patent: August 6, 2002Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6401580Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: May 9, 2000Date of Patent: June 11, 2002Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Publication number: 20020043145Abstract: Tile cutting device comprises a height-positionable frame positioned transversely above the translating support surface on which at least one tile to be sectioned is positioned, there being associated with said frame at least one cutting implement provided with at least one cutting blade (or wheel) rotated by a suitable motor; said cutting implement can be translationally moved horizontally relative to said frame by suitable positioning means, in order to be located in the desired position for cutting said tile.Type: ApplicationFiled: October 17, 2001Publication date: April 18, 2002Applicant: SACMI-COOPERATIVA MECCANICI IMOLA-SOC. COOP. A.R.L.Inventor: Claudio Ricci
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Patent number: 6279563Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: June 22, 2000Date of Patent: August 28, 2001Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6250192Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their elective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: November 12, 1996Date of Patent: June 26, 2001Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6196096Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: November 4, 1999Date of Patent: March 6, 2001Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6178864Abstract: A device for sawing stacks of panels comprises cutting means consisting of a pair of similar carriages located on opposite sides of the stack. Each carriage mounts a first and a second circular saw and a first and a second circular scoring saw. Both carriages can move in two directions along an axis transversal to the feed axis of the stack so as to make a first and a second cut to corresponding defined first and second cutting depths and substantially coinciding in a vertical plane in such a way as to saw right through the stack of panels.Type: GrantFiled: March 19, 1999Date of Patent: January 30, 2001Assignee: Giben Impianti S.p.A.Inventor: Piergiorgio Benuzzi
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Patent number: 6155247Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: March 17, 1999Date of Patent: December 5, 2000Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6119675Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: April 29, 1998Date of Patent: September 19, 2000Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 6006739Abstract: A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components. In addition, the wafer saw with its multiple blades, some of which may be independently laterally or vertically movable relative to other blades, can more efficiently dice silicon wafers into individual semiconductor devices.Type: GrantFiled: March 17, 1999Date of Patent: December 28, 1999Assignee: Micron Technology, Inc.Inventors: Salman Akram, Derek J. Gochnour, Michael E. Hess, David R. Hembree
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Patent number: 5983768Abstract: An apparatus and method is provided for simultaneously perforating and cutting a lithe sheet material having multiple layers containing at least an upper and lower layer, comprising a knife die having a cutting edge, wherein the cutting edge is contained in the same plane, and an anvil die located opposite the knife die, wherein the surface of the anvil die contains a pattern of cavities which corresponds to the locations where primarily only the upper layer of the material is cut completely through and protrusions of the anvil primarily correspond to the locations where the entire thickness of the material is cut along the same line as the cut through the upper layer.Type: GrantFiled: March 31, 1998Date of Patent: November 16, 1999Assignee: George Schmitt & Co., Inc.Inventors: Richard Abt, Richard J. Brining, William G. Gunther
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Patent number: 5860348Abstract: A method of dividing deep-frozen food blocks comprising forming a succession of spaced parallel blade rows each row having a plurality of spaced parallel coaxial freely rotatable discoid blades and advancing successive food blocks past the successive blade rows so that the blades in the successive blade rows rotate with a peripheral speed which more or less matches the speed of the block advance so that there is minimal relative linear motion of the blade edges and the blocks whereby the blades groove the blocks by displacing block material to the sides of the grooves and selecting a number of blade rows such that while the grooves made by any blade row are quite shallow, the grooves made by all of the blade rows divide each of the blocks into a plurality of parts. Apparatus for practicing the method is also disclosed.Type: GrantFiled: March 12, 1997Date of Patent: January 19, 1999Assignee: Pearce Processing Systems, Inc.Inventors: Charles H. Morse, Robert R. Harrison
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Patent number: 5857395Abstract: An apparatus for the manufacture of sheets of corrugated board of variable size comprises a cross cutter for severing the entire web of corrugated board disposed, in the conveying direction of a web of corrugated board, downstream of at least one longitudinal cutting arrangement, of cutting devices for cutting lateral margins and of discharge devices for the margins cut off, and upstream of at least one cross cutting arrangement for cutting sheets of corrugated board.Type: GrantFiled: July 14, 1995Date of Patent: January 12, 1999Assignee: BHS Corrugated Maschinen- und Anlagenbau GmbHInventors: Roman Bohm, Martin Grill, Felix Titz, Karl Waldeck
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Patent number: 5761982Abstract: An apparatus and method is provided for simultaneously perforating and cutting a lithe sheet material having multiple layers containing at least an upper and lower layer, comprising a knife die having a cutting edge, wherein the cutting edge is contained in the same plane, and an anvil die located opposite the knife die, wherein the surface of the anvil die contains a pattern of cavities which corresponds to the locations where primarily only the upper layer of the material is cut completely through and protrusions of the anvil primarily correspond to the locations where the entire thickness of the material is cut along the same line as the cut through the upper layer.Type: GrantFiled: June 20, 1996Date of Patent: June 9, 1998Assignee: George Schmitt & Co.Inventors: Richard B. Abt, Richard J. Brining, William G. Gunther
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Patent number: 5458025Abstract: A process for manufacturing razor blades from a continuous strip of metal stock by stamping a plurality of openings in the strip for precise registry of the blade edge when employed in the razor and then running the stock through a device which partially slits the strip along lines which are precisely located with respect to the edges of the stock and the openings. The strip is then heat treated after which it is run through a device which splits the stock along the previously slit lines to form a plurality of continuous strands containing interconnected blades disposed end to end.Type: GrantFiled: March 17, 1994Date of Patent: October 17, 1995Assignee: The Gillette CompanyInventor: Nicolae Neamtu
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Patent number: 5393294Abstract: Method for producing sheets of corrugated cardboard with a variable format in which a web of corrugated cardboard is removed continuously from a heating and pulling device of s conventional corrugated cardboard installation. The sheets are processed to the required format in at least one longitudinal cutting and grooving device. For this purpose the web is conveyed through a pulling device. A cross cutter cuts the sheets of corrugated cardboard from the cardboard web according to a preset format. The cardboard web is conveyed to a cross cutter for the corrugated cardboard sheets in the direction of conveyance without cutting them crosswise. When the format is changed, the area of the web of corrugated cardboard where the formats overlap is cut out by the cross cutter and removed to a waste container through a trap.Type: GrantFiled: September 23, 1992Date of Patent: February 28, 1995Assignee: BHS Corrugated Maschinen- und Anlagenbau GmbHInventor: Lothar Jobst
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Patent number: 5271699Abstract: A process and apparatus for forming a wood grain simulation pattern on surfaces of synthetic articles such as synthetic lumber planks. The articles are fed along a predetermined path on a conveyor surface. A plurality of cutting blades are disposed about the periphery of a rotatable cylindrical element supported on a drive shaft. As the synthetic article is fed under the rotatable cylindrical element which is in rotation, the blades which are disposed across an outer surface of the article on which a grain simulation is desired, cut a plurality of short slits spaced laterally from one another in an offset pattern. These slits extend along the feed axis of the article and simulate a wood grain in the outer surface thereof.Type: GrantFiled: November 4, 1991Date of Patent: December 21, 1993Inventors: Guy Barre, Vigneault, Remi
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Patent number: 4898569Abstract: In the production of packs, especially hinge-lid packs, from rigid packaging material (thin cardboard), hitherto individual blanks have been supplied in stacks and introduced into the packaging machine in succession. To make the handling of the blanks easier and to increase the storage capacity, the blanks (23) are now connected to one another via residual connections (25) into a continuous web of material (24) wound as a reel (30). Within the packaging machine, the blanks are severed from the web of material (23) in succession, specifically as a result of the elimination of the residual connections, preferably by being torn off. The residual connections (25) are formed in a region of the blanks (23) or in the region of folding tabs of the latter which, in the finished pack (hinge-lid pack), are concealed by other folding tabs, that is to say are on the inside.Type: GrantFiled: April 21, 1988Date of Patent: February 6, 1990Assignee: Focke & Co. (GmbH & Co.)Inventors: Heinz Focke, Kurt Liedtke
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Patent number: 4767581Abstract: A building construction element such as insulative siding is disclosed having an outer skin with an inner surface on which a plurality of individual, spaced-apart, arcuate-shaped projections are cut or gouged from the inner surface by a cutting tool means. A low density polymetric foam material is disposed over the inner surface so as to completely surround each arcuate projection to thereby securely lock the skin to the foam material after it sets.Type: GrantFiled: September 30, 1986Date of Patent: August 30, 1988Inventor: Eugene R. Tippmann
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Patent number: 4644837Abstract: The invention relates to a device for the burr-free cutting of strip-shaped material, especially made of metal, which has, for each cut, two pairs of circular knives on axis-parallel knife shafts. The strip-shaped material is cut into by the first pair of circular knives in the first parting step and is severed in the opposite direction by the second pair of circular knives in the second parting step. The characteristic feature of the invention is that the counter-knives of the two pairs of circular knives are arranged on a common knife shaft so as to rest against one another, and that they consist of an outer rigid, especially metallic, cutting ring and of an inner annular elastomeric hub part.Type: GrantFiled: March 19, 1986Date of Patent: February 24, 1987Assignee: Karl Jungel GmbH & Co. KGInventor: Werner Krus
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Patent number: 4612837Abstract: An apparatus for producing sloping roof insulation panels and more particularly, roof insulation panels made of glass fiber material covered by a base cap layer. Such apparatus includes a circular saw capable of producing a groove in at least one of the side surfaces of the panel and a band saw for cutting the panel into a first portion including at least part of the top surface of the panel and a second portion including at least a part of the bottom surface of the panel. The band saw is located in alignment with the groove or grooves produced by the circular saw.Type: GrantFiled: January 31, 1983Date of Patent: September 23, 1986Inventor: Florian Gendron
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Patent number: 4487539Abstract: In the production of metal cans, a sheet metal body plate (blank) is scored with aligned upper and lower score lines and then formed into a cylindrical single can body. Preferably the scoring is in steps; first, scoring the upper score line using a scoring roller and an anvil wheel; and, secondly, scoring the lower score line using a second scoring roller and a second anvil wheel. Then the single can bodies are conveyed by a conveyor belt and rolled over the knife edge (parting edge) of an elongated parting rail, with the parting edge aligned with the score line and with the conveyor applying pressure on each can body to part each one on the parting edge, thereby forming two can bodies from the single can body.Type: GrantFiled: January 24, 1983Date of Patent: December 11, 1984Assignee: American Can CompanyInventors: Frederick G. Taylor, Lawrence Casqueiro
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Patent number: 4475426Abstract: The apparatus for supplying chewing gum along a path to the driven feeder of a packaging machine includes a magazine, a scoring device, a pushing device for advancing chewing gum slabs from the magazine to the scoring device and a transfer device for advancing the scored gum slabs from the scoring device to the driven feeder. The pushing device and feeder are driven in relation to one another; however the scoring device and transfer device are driven at a constant speed which is independent of the operating rate of the pushing device and feeder. As a result, the chewing gum slabs are delivered to the feeder at the same speed under all operating conditions and will not become caught, deformed or piled-up in the apparatus due to changes in the operating rate of the feeder.Type: GrantFiled: April 29, 1982Date of Patent: October 9, 1984Assignee: "LOESCH"-Verpackungstechnik GmbH & Co KGInventors: Werner Dammig, Heinz Moller
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Patent number: 4370910Abstract: Using a pair of driven knifing rolls having annular wedges therearound, one above the other, a relatively hot metal piece having a rectangular cross-section is cut into three or more narrower widths. The annular wedges hold and bite into the metal piece being transferred in the longitudinal direction thereof, thus forming V-shaped grooves in the metal. The angle formed between that flank which is closer to the as-cast side of the metal piece to be cut, upon which no cutting force is exerted, and a perpendicular to the roll axis is greater than the angle formed between the opposite flank and the same perpendicular, so that the cross-sectional shape of the annular wedge is asymmetrical with respect to a line segment that passes through the pointed end of the wedge and extends perpendicular to the axis of the rolls.Type: GrantFiled: December 30, 1980Date of Patent: February 1, 1983Assignee: Nippon Steel CorporationInventors: Yasuo Suzuki, Shuji Nagata, Kazumi Yasuda
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Patent number: 4321865Abstract: In treating nuts which are supplied by way of transport means and which are held between two conveyor belts, a groove of uniform depth is milled into the shell of the nut by means of overlapping milling discs, which groove permits the shell of the nut to be broken open by a subsequent splitting means.On the transport means, the nuts are separated and aligned by vibration and the configuration of the guide tracks. A spiral conveyor with a baffle is also provided for this purpose.The conveyor belts are adapted to the different thicknesses of the nuts by means of vertically adjustable rollers.The depth of the groove which is less than the thickness of the shell of the nut is restricted by toothed rings on the milling discs and annular shoulders which are arranged at a displaced position relative thereto radially with respect to the axis of rotation.Type: GrantFiled: April 4, 1980Date of Patent: March 30, 1982Assignee: Widmer & Ernst AGInventor: Roland Ramseier
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Patent number: 4295401Abstract: Irradiated tubular rectangular fuel channels from a nuclear reactor are temporarily stored under water. In order to dispose of these highly radioactive channels and to ship them to permanent burial grounds, the channels must be placed in specially designed shipping casks under water. In order to reduce the volume of the channel so as to economize on the use of the casks, the channels are cut along their longitudinal edges to form four plates which are then nested before being placed in the storage casks, thereby greatly increasing the number of channels which may be stored in each cask. The cutting is done under water by an apparatus having four roller cutters which are positioned along the outside of the four edges or corners of a channel and are moved longitudinally down the channel edges in a reciprocating motion until the four side plates of the channel are severed.Type: GrantFiled: July 29, 1976Date of Patent: October 20, 1981Assignee: NUS CorporationInventor: William L. Mullett
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Patent number: 4275491Abstract: A shear device for splitting hot metallic bars or billets into smaller forms on a continuous basis, as the metallic bars continuously exit from a mill. The shear device comprises two mechanical complexes. The first mechanical complex is a circular shear for generating shearing stresses in the metallic bar by displacing portions of the metallic bar with respect to adjacent portions thereof, and the second mechanical complex wedges and shapes the deformed metallic bar into separate bars.Type: GrantFiled: November 30, 1979Date of Patent: June 30, 1981Inventor: Roberto Marinucci
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Patent number: 4266458Abstract: Apparatus is described for slitting an elongated web of sheet metal to produce a plurality of strips that are retained in the web during coiling by intermittently spaced connections. The connections are formed by partially sheared tabs that are easily broken apart for ultimate separation of the strips. Also described is a slitting cutter configuration particularly adapted to produce partially sheared tabs.Type: GrantFiled: June 6, 1979Date of Patent: May 12, 1981Inventor: John W. Rogers
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Patent number: 4215613Abstract: A kerfless slitter, capable of cutting various materials without generating chips or sawdust. The slitter includes a circular blade having a plurality of teeth spaced about its outer periphery and which contains a knife-edge centered along the mid plane of the blade in regard to its thickness. In practice, the blade is rotated at a peripheral speed that is equal to the linear speed of the work acted upon whereby each tooth is advanced along a cycloidal path of travel in reference to the work. Each tooth is arranged to enter the work ahead of the cutting line established by the teeth that have previously penetrated the work so that the cut is increased in length and in depth by means of a series of short slits.Type: GrantFiled: May 1, 1978Date of Patent: August 5, 1980Assignee: Eric A. AndersonInventors: Eric A. Anderson, Walter A. Maier
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Patent number: 4211137Abstract: Apparatus for cutting stiff sheet material. A straightedge barrier aligns the material. A back supporting the material includes a first bar perpendicular to the straightedge barrier. Along one edge of the first bar is a straight strip blade having a shearing face and a cutting edge making an acute angle with the shearing face, preferably of about 15.degree.. On a second bar, spaced from and parallel to the first bar, is a carriage in rolling engagement with the second bar and carrying a series of rotatably supported shearing rollers, preferably at least four. The rollers are substantially coplanar, the axes for the first three lie along a line inclined to the blade and getting successively closer thereto, and are frustoconical at an inclination of about 6.degree.. The fourth roller is mounted somewhat closer than it would be if its axis lay along that line and is the only roller which extends beyond the cutting edge into engagement with the shearing face of the blade, being spring-urged thereagainst.Type: GrantFiled: January 29, 1979Date of Patent: July 8, 1980Inventor: Donald C. Pierce