Abstract: A photosensitive color-forming element comprises a support and a photosensitive color-forming layer carried on the support and containing therein a color-forming coupler, for example, 1-naphthol, 2-naphthol and 2,4-dichloro-1-naphthol, and a photosensitive azido compound of the formula (I) or (II): ##STR1## wherein R.sub.1 represents a hydrogen or halogen atom or an alkyl, alkoxyl, diethylamino or hydroxyl radical R.sub. 2 an alkyl, alkoxyl or hydroxyl radical, and R.sub.3 a hydrogen atom or an alkyl or phenyl radical, and, if necessary, a polymeric material capable of hardening or being insolubilized in solvent when the polymeric material is exposed to radiation rays in the presence of the above azido compound, the above-mentioned azido compound and color-forming coupler being capable of forming a dark color upon exposure to radiation rays, without a color-developing agent.

Abstract: A very small high-reflectivity mirror surrounded by a low-reflectivity region is fabricated in a self-aligned manner directly on one of the output faces of a stripe-geometry solid-state laser. The phenomenon known as filamentation is thereby effectively controlled.

Abstract: An imaging method involves a substrate having a coating which undergoes a photochemical conversion upon being irradiated to yield only products whose vapor pressure under the operative temperature is higher than that of the coating. In this way as a result of the selective vaporization of the coating the desired image is obtained. The new method has wide applications such as photography, production of microfilms, electrophotographic document duplication, production of master prints for offset printing, etc.

Abstract: A method for forming an image, which comprises subjecting an image-recording material comprising a metal layer and an inorganic material layer to imagewise exposure by application of electromagnetic radiation, and then heating the exposed material to cause a thermal doping of the unexposed area of the metal layer. This method permits the formation of negative-positive type images. The product finds a wide range of valuable industrial applications, for example, as an ordinary image-recording material, laser recording material, electron beam recording material or microrecording material, and also for producing a print-wiring plate, relief metal plate for relief and lithographic printing, or a master for electrostatic printing.

Abstract: A photo-sensitive etchant comprising (1) a first composition comprising a substance capable of producing water upon exposure to light, a binder and a solvent and (2) a second composition comprising a compound capable of producing, upon exposure to light, a metal-etching substance or a substance which reacts with another other substance to form a metal-etching product, a binder and a solvent; and a method for forming metal image by using the photosensitive etchant.

Abstract: This disclosure depicts a novel low cost, high performance color cathode ray tube of the shadow mask type, and methods and apparatus for manufacturing the tube. The tube has a novel envelope on a faceplate portion of which is corner-suspended a lightweight, non-self-rigid shadow mask. The tube has a variety of features and is especially adapted to be made by manufacturing methods which permit the screened faceplates to be interchanged, each with all others, and the shadow masks to be interchanged, each with all others, with consequent economies in manufacture and enhanced tube performance. This disclosure stresses methods of tube manufacture by which the faceplates and masks are rendered respectively interchangeable. This disclosure also stresses photoprinting methods for making masters employed in the screening of the tube faceplates and in mask manufacture, and for making masters employed in the actual screening of faceplates and in the formation of aperture patterns in shadow masks.

Abstract: A method of forming an iris diaphragm for use in a corpuscular beam apparatus and having a thin metal layer with at least one opening and an integral reinforcing portion of the same metal which is set back from each of the openings characterized by providing a substrate with the first mask leaving an unexposed surface of the configuration of the thin metal layer, applying a thin metal layer on the exposed surface, forming a second mask having configuration of the reinforcing portion of the iris diaphragm and including a portion covering the thin metal layer adjacent each opening, applying a second thicker layer of the same metal to form a reinforcing portion and subsequently removing the iris diaphragm from the surface of the substrate. Preferably, each of the masks are formed by a photo development process and the metal layers are applied by electro-depositing.

Abstract: The invention provides a method for making a relief mask used for pattern neration in planar thin film overlays, which relief mask is structurally formed to produce intimate contact between a photoresist surface and a masking pattern during exposure of the photoresist surface. The present method comprises the steps of:1. depositing gold on a blank mask substrate;2. coating the gold-covered substrate with a photosensitive material;3. forming a relief pedestal on the blank mask substrate by exposure of the photoresist and etching of the gold; and,4. forming a masking pattern on the relief pedestal.

Abstract: Light-sensitive compositions including a polymer of the type that is reactable with an azide sensitizer when exposed to light and a sensitizing amount of a naphthalene sensitizer having ortho diazo and oxo substituents at the 1,2 or the 2,1 positions of the naphthalene nucleus and further having an azidosulfonyl substituent group of which the sulfonyl moiety is bonded directly to the naphthalene nucleus at the 4 or the 5-position, are advantageous in the preparation of positive-working photolithographic materials. IN the azidosulfonyl group, the azido moiety can be linked directly or indirectly to the sulfonyl moiety, such as in the compounds 2-diazo-1,2-dihydro-1-oxo-5(4'-azidophenoxysulfonyl)naphthalene and 5-azidosulfonyl-2-diazo-1,2-dihydro-1-oxonaphthalene. The light-sensitive compositions can be coated on support materials to prepare composite photographic elements having utility as photolithographic printing masters and photoresists for etching operations.

Abstract: This invention relates to photopolymerizable compositions comprising an ethylenically unsaturated organic compound and a visible light photosensitizing composition comprising a combination of Mn.sub.2 (C0).sub.10 and a co-catalyst selected from the group consisting of a compound characterized by the formula ##SPC1##Wherein R.sub.1 is --H, --Br, or --CH.sub.3, R.sub.2 is --H or --CH.sub.3, and R.sub.3 is --H or --CH.sub.3 ; cumene; diisopropyl benzene; alkyl mercaptans containing from 10 to 16 carbon atoms; thiourea; and mixtures thereof and to polymerized products thereof. The invention also provides a process for photopolymerizing ethylenically unsaturated organic compounds with visible light in the range of 4,000 to 7,000 angstroms.

Abstract: Photopolymerizable compositions and processes for photopolymerizing such compositions are provided, said process comprising admixing with said epoxides, photosensitive organohalogen compounds in combination with an organometallic compound and thereafter applying energy to the resulting mixture. The organohalogens decompose to liberate an active catalyst which then serves to initiate polymerization of the epoxide material. The organometallic compound functions synergistically with the organohalogen to enhance the film forming properties of the resulting polymer and or sensitivity of the polymerizable system.

Abstract: A method for treating a surface of copper or copper alloy upon which a photo-etched pattern is to be provided comprising applying a relatively thin coating of cupric chloride formed from a relatively weak solution, drying said coating for moisture removal and then applying a photographic emulsion thereover. The thickness of the cupric chloride coating is approximately 1/10th or less that of the photographic emulsion and upon reaction to light emission effects a color change which is visible through the photographic emulsion thereby permitting rapid inspection of the ultimate pattern to be formed prior to performance of the customary developing, etching, and finishing techniques.

Abstract: An integrated circuit substrate surface, particularly a surface of electrically insulative material, having a pattern of elevated areas and a complementary pattern of unelevated areas is planarized by forming the photoresist pattern in registration with the pattern of unelevated areas, the photoresist pattern having narrower lateral dimensions than said elevated pattern whereby registration is facilitated, flowing the photoresist pattern to laterally expand the photoresist to cover and thereby mask the unelevated areas, and etching to lower the elevated areas which remain uncovered by the photoresist.

Abstract: This disclosure depicts a novel low cost, high performance color cathode ray tube of the shadow mask type, and methods and apparatus for manufacturing the tube. The tube has a novel envelope on a faceplate portion of which is corner-suspended a lightweight, non-self-rigid shadow mask. The tube has a variety of features and is especially adapted to be made by manufacturing methods which permit the screened faceplates to be interchanged, each with all others, and the shadow masks to be interchanged, each with all others, with consequent economies in manufacture and enhanced tube performance. This disclosure stresses methods of making masters employed in the screening of the tube faceplates and in mask manufacture.

Abstract: A color cathode ray tube provided with a fluorescent screen formed on the inner surface of the face plate of the envelope and comprising a plurality of stripes of phosphor elements, and a shadow mask formed with a plurality of slit apertures corresponding to the stripes of the phosphor element. Said slit apertures are spaced apart by transverse bridge members. Each slit aperture is surrounded by inclined side walls, and the cross-section of each transverse bridge along the longitudinal axis of the slit aperture takes a form of a hexagon having two lateral rising edge portions positioned at about the middle of the thickness of the shadow mask.

Abstract: A method for producing a photomask by exposing and development-processing a photographic light-sensitive material including a transparent support having thereon a masking layer and a silver halide emulsion layer to thereby form silver image areas, etch-bleaching the silver halide emulsion layer to thereby remove the silver image areas to uncover the masking layer thereunder, subjecting the coated support to etching to etch the uncovered masking layer with a mixed solution containing hydrofluoric acid and ammonium fluoride to thereby uncover the transparent support thereunder, and then removing the non-silver image areas to thereby reveal the masking layer.

Abstract: A light-sensitive etching agent comprising (a) a photodecomposable compound forming upon decomposition a material capable of etching a silicon compound containing film or capable of etching the film after reaction with another material, (b) a material capable of forming water upon exposure to light, (c) a binder and (d) a solvent, and a method of making a semiconductor device utilizing the light-sensitive etching agent.

Abstract: The development of an exposed electron beam sensitive resist film in a two-stage process, rather than in a single stage, with a water wash between stages, improves the sensitivity and resolution that can be achieved for the resist.

Abstract: A method for producing a photomask, by exposing and development-processing a photographic material including a transparent support having thereon a masking layer and a silver halide emulsion layer to thereby form a silver image, etch-bleaching the silver halide emulsion layer to thereby remove the silver image areas, baking the remaining non-silver image areas to thereby decompose the binder contained therein, subjecting the coated support to etching to thereby remove the masking layer located at the areas corresponding to the silver image, and removing the decomposed binder to thereby uncover the masking layer at the areas corresponding to the non-silver image areas.

Abstract: The effective sensitivity of a photo- or electron beam resist is improved by contacting the resist film with developer solution and water prior to exposure.

Abstract: Costume jewelry is manufactured through photofabrication processes from flat metal sheets to form items such as earrings and small pendants. A standard photo-fabrication operation includes covering a metal sheet with a layer of photosensitive, chemically resistive material commonly referred to as a photoresist. Portions of the covered sheet are exposed to light to outline the earrings and pendants on the sheet. The sheet is then developed and the exosed metal surface portions are chemically etched to remove excess metal and form the earrings and pendants. Thereafter, surface treatments involve supplementary photofabrication operations to provide different colors and finishes on the earrings and pendants by etching, plating and staining the exposed metal surfaces, all of which are supplemented by the retention of portons of photoresist layers of selected colors.

Abstract: A method for making multilayer devices, such as magnetic bubble domain devices, which are comprised of a plurality of layers that are deposited using only a single critical masking step. A first metallic layer is deposited on a substrate including a magnetic bubble domain film, which may or may not have a nonmagnetic material thereon. A first resist layer is then applied, selectively exposed, and developed to expose at least two areas of the first metallic film. A thicker metallic layer is then deposited in the exposed areas, or is electroplated. After this, another resist layer is applied without deforming the pattern in the first layer, selectively exposed, and developed to protect certain areas of the thick metallic layer from subsequent formation of another metallic layer. During this subsequent formation, a second metallic film is formed using the first resist layer as a mask. After this, the resists are removed and the now uncovered portions of the original thin metallic layer are etched away.

Abstract: This disclosure depicts a method of forming a pattern of electron-transmissive apertures in a color selection mask for use in a color television cathode ray tube.

Abstract: A method of forming electron-transmissive apertures in a color selection mask for use in a color cathode ray tube. The method includes providing an electrically conductive preformed blank having a relatively thin aperture-defining layer and a relatively thick substrate layer. Two photoresist layers are deposited in succession on the aperture-defining layer. The first photoresist layer is caused to have an array of aperture elements, said pattern elements having the desired ultimate mask aperture size. The second photoresist layer is caused to have an array of aperture elements which are superimposed over the array of aperture elements in the first photoresist coating and correspondingly distributed, a predetermined group of the said aperture elements being of a smaller size than the desired ultimate mask aperture size. The shadow mask blank is then etched through, using the array of apertures in the second photoresist coating as an etchant mask.

Abstract: The invention relates to a method for reducing the comsumption of etchants used in manufacturing semiconductor devices comprising the steps of supporting a semiconductor wafer, metering a predetermined volume of etchant onto the surface of said wafer to form a meniscus-contained body of etchant thereon, maintaining said wafer static during etching, sensing the completion of said etching, and spinning said wafer upon completion of the etching to remove the etchant from the wafer and terminate the etching operation.

Abstract: A method for preparing the surface of a glass substrate so that resist maial may be directly applied to the surface and adhere thereto. The invention is particularly useful in the fabrication of relief masks used for pattern generation in planar thin film overlays, which masks are used to provide intimate contact between a photoresist surface and a masking pattern during exposure of the photoresist surface. The present method comprises cleaning of the glass substrate, boiling the substrate in trichloroethylene, and heating the substrate to between 160.degree. and 200.degree.C. Resist material may then be applied directly to the glass substrate.

Abstract: A photopolymerizable element for the preparation of relief printing plates. The element comprises an addition polymerizable monomer (e.g. trimethylolpropane trimethacrylate), a free radical initiator for polymerizing the monomer (e.g. benzophenone) and a polyester-based polyurethane binding agent which is the reaction product of 4,4'-methylenebis(phenyl isocyanate), a polycaprolactone diol having a molecular weight in the range of 1,000 to 2,500, and a mixture of at least two aliphatic diol extenders. Optionally the photopolymerizable element is provided with a support layer such as a polyester film or paper.Processes for the preparation of relief printing plates from said elements are also disclosed.

Abstract: A glass or other dielectric backed transducer structure is formed by utilizing a series of processes including at least one electrostatic bond. The processes enable one to bond a semiconductor wafer to a dielectric as a glass wafer. Then by selectively removing certain conductively semiconductor, one obtains a "thin ribbon" piezoresistive bridge secured to a thin glass wafer. The resultant structure is entirely unanticipated by the prior art.A glass part is also formed by electrostatically bonding a glass wafer to a semiconductor wafer, polishing the glass to a desired depth, masking the polished glass layer according to a desired pattern representative of the glass part, etching away all the glass except the desired pattern, and thence removing all the semiconductor.

Abstract: A method of chemical machining utilizing selective plating techniques to form a metal component from sheet metal sheets, in which each sheet is degreased, rinsed in deionized water, and thoroughly dried, then is coated with a positive photoresist. The photoresist is cured, and then the image of the component to be formed is photographically applied to either side of the sheet utilizing photomasks, the photographically exposed photoresist is removed from the sheet, and the sheet etched to provide the basic component configuration. Selective plating is effected by further photographically exposing the photoresist of the sheet that overlies the portions of the sheet to be plated, by utilizing photomasks delineating the areas to be plated, after which the freshly exposed photoresist is removed, the sheet baked to better condition the resist for plating, and then suitably electroplating the areas of the sheet metal thus exposed. After plating, the completed component is soaked in acetone to remove the resist.

Abstract: Pulse width modulated surface relief phase holograms are produced on a substrate by developing a holographic interference pattern recorded on a photoresist deposited on the surface of said substrate as an amplitude modulated sinusoidal surface relief pattern so as to expose the surface of said substrate as a function of the intensity of said interference pattern, uniformly etching said substrate and removing said photoresist leaving a pulse width modulated, substantially two-level rectangular wave diffraction grating. Focused image holograms produced by this method on hard durable substrates may be used as masters for replicating said holograms in a suitable recording medium.

Abstract: Photoresists are developed and the supporting substrate is etched simultaneously therewith by bringing the resist (after exposure) into physical contact with a fluid containing a developer for the resist and an etchant for the supporting substrate.

Abstract: This invention relates to an electrophotographic process for the production of a printing form which comprises electrostatically charging a supported photoconductive and photopolymerizable layer, exposing the charged layer to light under a master, developing the resulting latent image with an electroscopic material, again exposing the layer to light, and removing the developed image areas from the support.

Abstract: A surface relief pattern, e.g. a surface relief hologram, is substantially linearly transferred to a hard durable substrate, capable of being used as a medium for permanent storage of the pattern or as a master for replicating the hologram, from a photoresist coated on the substrate, by exposing the photoresist and the substrate to a photoresist developer bath and a chemical bath capable of etching the substrate at a rate substantially proportional to the development rate of the photoresist. This technique allows the transfer of surface relief patterns with dimensions on the order of one micron or less, and is applicable to the formation of surface relief holographic patterns in permanent media for archival storage and to making master surface relief holograms.

Abstract: In selectively etching a solid oxide thin film which has chemisorbed water (surface hydroxyl groups) in its surface, the thin film is surface-treated with an organic compound which has within its molecule a functional group to react with the surface hydroxyl groups. Thereafter, photo-etching is performed by the conventional method by applying a thin film of a photosensitive organic polymer onto the treated thin film. Through selection of the sort of the organic compound, the degree of side-etch arising in the process of the selective etch can be controlled.

Abstract: A method for forming micropatterns comprising, superposing a transparent raised image formed on a transparent substrate on a photosensitive layer of a photographic material or forming a transparent raised image on the photosensitive layer of the photographic material, uniformly exposing the photosensitive layer through the transparent raised image to light to which the photosensitive layer is sensitive so that the light intensity at edges of the transparent image is non-uniform, and developing the photosensitive layer to form a micropattern corresponding to the outlines of the transparent raised image.

Abstract: In contact type photolithographic masking processes for fabricating planar structures, a photoresist is applied to a wafer and a mask is placed over the photoresist. Illumination through the mask, which has a pattern of opaque areas, produces a photochemical reaction in the photoresist which upon developing creates a duplicate of the mask pattern. However, the photoresist is conventionally applied by a spinning process and the rotation produces a build-up of the photoresist around the edges of the wafer. This build-up prevents the pattern portion of the mask from making good physical contact with the photoresist with a resultant decrease in reproducibility and accuracy of the fabricated pattern. A modified mask is formed with a channel corresponding to the peripheral build-up. The channel accepts the build-up so that good contact may be maintained between the photoresist and the patterned portion of the mask.

Abstract: A method of forming patterns on a semiconductor element is disclosed comprising the steps of (a) depositing a coating of silicon nitride, borosilicate glass, or phosphosilicate glass on the surface of a semiconductor substrate, (b) applying a photosensitive etching solution layer to the coating and drying it, (c) irradiating the substrate with ultraviolet radiation through a photomask having a required pattern to decompose the photosensitive solution and etch the coating, and (d) removing the photosensitive solution, the decomposed material, and the reaction product of the decomposed material and the coating with an organic solvent. The photosensitive etching solution consists of a compound which may be decomposed by light to a material which etches the coating, or a compound obtained from the reaction between the photodecomposed material and other material in the solution which etches said coating.

Abstract: Photolithographic techniques are employed to fabricate hemispherical or semicylindrical microlenses on the end surfaces of optical fibers. The power coupling efficiency between junction lasers and fibers is thereby significantly increased.

Abstract: a method for semiconductor device manufacture comprising the steps of, (a) repetitively aligning photomasks over a surface of a semiconductor substrate, said substrate having a layer of opaque material on said surface, said opaque material being adapted to receive and retain a photographic pattern; and (b) at least one of said steps employing a photomask of a particular construction, said particularly constructed photomask being placed in physical contact with said opaque material, said particularly constructed photomask essentially consisting of a planar glass substrate having a thickness of approximately 0.25 inches, one surface of said glass substrate having a thin film of chrome thereon, said thin film of chrome having a thickness of approximately 0.1 microns, said thin film of chrome having a photographic pattern formed therein, a layer of SiO.sub.2 fully covering said thin film of chrome and said surface of said glass substrate, said SiO.sub.