Abstract: In a method of processing a substrate in accordance with an embodiment, a trench may be formed in the substrate, imprint material may be deposited at least into the trench, the imprint material in the trench may be embossed using a stamp device, and the stamp device may be removed from the trench.

Abstract: An epitaxial structure is provided. The epitaxial structure includes a substrate, an epitaxial layer and a carbon nanotube layer. The epitaxial layer is located on the substrate. The carbon nanotube layer is located between the substrate and the epitaxial layer. The carbon nanotube layer can be a carbon nanotube film drawn from a carbon nanotube array and including a plurality of successive and oriented carbon nanotubes joined end-to-end by van der Waals attractive force therebetween.

Abstract: An imprint apparatus which brings a resin on a substrate into contact with a pattern surface of a mold and cures the resin, includes a substrate holder which holds the substrate, a mold holder which holds the mold with a mold holding surface, a driving mechanism which moves the substrate holder relative to the mold holder, and a controller which controls the driving mechanism such that the substrate holder moves relative to the mold holder while the substrate holder holds a cleaning member instead of the substrate, and the cleaning member is in contact with the mold holding surface, thereby cleaning the mold holding surface.

Abstract: Described are systems and methods for formation of templates having alignment marks with high contrast material. High contrast material may be positioned within recesses of alignment marks.

Abstract: A lithography system includes at least two lithography apparatuses disposed on the same fixed base, each of which includes an object, a moving body, and a vibration isolation unit. A control unit configured to control the lithography apparatuses controls a vibration isolation unit included in a first lithography apparatus based on driving instruction information to be given to a moving body included in a second lithography apparatus, and a control indicator regarding vibration directed onto an object to be vibration-isolated included in the first lithography apparatus due to a moving operation of the moving body.

Abstract: Discrete microstructures of predefined size and shape are prepared using sol-gel phase-reversible hydrogel templates. An aqueous solution of hydrogel-forming material is covered onto a microfabricated silicon wafer master template having predefined microfeatures, such as pillars. A hydrogel template is formed, usually by lowering the temperature, and the formed hydrogel template is peeled away from the silicon master template. The wells of predefined size and shape on the hydrogel template are filled with a solution or a paste of a water-insoluble polymer, and the solvent is removed to form solid structures. The formed microstructures are released from the hydrogel template by simply melting the hydrogel template in water. The microstructures are collected by centrifugation. The microstructures fabricated by this method exhibit pre-defined size and shape that exactly correspond to the microwells of the hydrogel template.

Abstract: A medical device includes a textured surface having a predetermined nanostructure, wherein the nanostructure is less than about 500 nanometers in a broadest dimension. The textures nanostructure surface reduces friction between the medical device and biological tissue.

Abstract: A nano pattern writer includes an array of nano needles extending from a groove in a substrate. A first portion of each nano needle is located in a respective groove of the first layer and the second portion extends from the groove. The nano pattern writer includes a second layer covering the first layer such that the first portion of the nano needles is secured between the first layer and the second layer.

Abstract: A method for making an epitaxial structure is provided. The method includes the following steps. A substrate is provided. The substrate has an epitaxial growth surface for growing epitaxial layer. A first carbon nanotube layer is placed on the epitaxial growth surface. A first epitaxial layer is epitaxially grown on the epitaxial growth surface. A second carbon nanotube layer is placed on the first epitaxial layer. A second epitaxial layer is epitaxially grown on the first epitaxial layer.

Abstract: Detection of periodically repeating nanovoids is indicative of levels of substrate contamination and may aid in reduction of contaminants on substrates. Systems and methods for detecting nanovoids, in addition to, systems and methods for cleaning and/or maintaining cleanliness of substrates are described.

Abstract: A method of reducing the diameter of pores formed in a graphene sheet includes forming at least one pore having a first diameter in the graphene sheet such that the at least one pore is surrounded by passivated edges of the graphene sheet. The method further includes chemically reacting the passivated edges with a chemical compound. The method further includes forming a molecular brush at the passivated edges in response to the chemical reaction to define a second diameter that is less than the initial diameter of the at least one pore.

Abstract: The present invention provides an imprint apparatus including a mold and a stage that holds a substrate, the imprint apparatus executing a curing process of curing a resin while the mold and the resin applied to the substrate contact and a demolding process of releasing the mold from the resin cured in the curing process, the imprint apparatus including a structure that holds the mold, a pillar that supports the structure mechanically independently from the stage through an anti-vibration mount that reduces propagation of vibration, and a force providing unit that provides, to the structure, force in an opposite direction from a direction of force generated in the structure by providing demolding force to the mold during the demolding process.

Abstract: Nanoimprint lithography can be used in a variety of ways to improve resolution, pattern fidelity and symmetry of microelectronic structures for thin film head manufacturing. For example, write poles, readers, and near-field transducers can be manufactured with tighter tolerances that improve the performance of the microelectronic structures. Further, entire bars of thin film heads can be manufactured simultaneously using nanoimprint lithography, which reduces or eliminated alignment errors between neighboring thin film heads in a bar of thin film heads.

Abstract: According to one embodiment, an imprinting apparatus includes an ejecting unit, a stage, a moving unit, and an observation unit. The ejecting unit ejects and drips a hardening resin material onto a substrate to be processed. The substrate to be processed is placed onto the stage. The moving unit relatively moves the ejecting unit and the stage. The observation unit observes the dripped hardening resin material and the pattern with the state in which the dripped hardening resin material and the pattern are overlaid on a plane, before the template is brought into contact with the hardening resin material.

Abstract: A method of forming a resist pattern of high aspect ratio excelling in etching resistance by the use of nanoimprint lithography. The method of forming a resist pattern by nanoimprint lithography comprises the steps of disposing organic layer (4) on support (1); providing resist layer (2) on the organic layer (4) with the use of chemical amplification type negative resist composition containing silsesquioxane resin (A); pressing light transmission allowing mold (3) with partial light shielding portion (5) against the resist layer (2) and thereafter carrying out exposure from the upside of the mold (3); and detaching the mold (3).

Abstract: A method to fabricate an imprint mould in three dimensions including at least: a) forming at least one trench, of width W and depth h, in a substrate, thereby forming three surfaces including, a bottom of the at least one trench, sidewalls of the at least one trench, and a remaining surface of the substrate, called top of the substrate; b) forming alternate layers in the at least one trench, each having at least one portion perpendicular to the substrate, in a first material and in a second material which can be selectively etched relative to the first material; and c) selectively etching said portions of the layers perpendicular to the substrate.

Abstract: Disclosed herein is a Light Emitting Diode (LED) backlight unit without a Printed Circuit board (PCB). The LED backlight unit includes a chassis, insulating resin layer, and one or more light source modules. The insulating resin layer is formed on the chassis. The circuit patterns are formed on the insulating resin layer. The light source modules are mounted on the insulating resin layer and are electrically connected to the circuit patterns. The insulating resin layer has a thickness of 200 ?m or less, and is formed by laminating solid film insulating resin on the chassis or by applying liquid insulating resin to the chassis using a molding method employing spin coating or blade coating. Furthermore, the circuit patterns are formed by filling the engraved circuit patterns of the insulating resin layer with metal material.

Abstract: A microstructure transferring device is characterized in that the device comprises a stamper made from a first photo-curable resin composition cured with light with a first wavelength, and a light source emitting light with a second wavelength longer than the first wavelength. The microstructure is transferred to an impression receptor supplied with a second photo-curable resin composition, which is curable with light with the second wavelength emitted by the light source.

Abstract: A method for reducing graphene film thickness on a donor substrate and transferring graphene films from a donor substrate to a handle substrate includes applying a bonding material to the graphene on the donor substrate, releasing the bonding material from the donor substrate thereby leaving graphene on the bonding material, applying the bonding material with graphene onto the handle substrate, and releasing the bonding material from the handle substrate thereby leaving the graphene on the handle substrate. The donor substrate may comprise SiC, metal foil or other graphene growth substrate, and the handle substrate may comprise a semiconductor or insulator crystal, semiconductor device, epitaxial layer, flexible substrate, metal film, or organic device.

Abstract: A fabrication method of nanoparticles is provided. A substrate having a plurality of pillar structures is provided and then a plurality of ring structures is formed to surround the plurality of the pillar structures. The inner wall of each ring structure surrounds the sidewall of each pillar structure. A portion of each pillar structure is removed to reduce the height of each pillar structure and to expose the inner wall of each ring structure. The ring structures are separated from the pillar structures to form a plurality of nanoparticles. Surface modifications are applied to the ring structures before the ring structures are separated from the pillar structures on the substrate.

Abstract: The present invention provides for photonic nanoimprinted silk fibroin-based materials and methods for making same, comprising embossing silk fibroin-based films with photonic nanometer scale patterns. In addition, the invention provides for processes by which the silk fibroin-based films can be nanoimprinted at room temperature, by locally decreasing the glass transition temperature of the silk film. Such nanoimprinting process increases high throughput and improves potential for incorporation of silk-based photonics into biomedical and other optical devices.

Abstract: Methods of manufacturing a nanoimprint stamp are provided. The method may include forming a pattern on a surface of a master substrate, depositing an etch barrier layer on a surface of a stamp substrate, coating a photoresist on one of the surfaces of the master substrate and the stamp substrate on which an etch barrier layer is formed, forming a photoresist pattern by pressing the master substrate against the stamp substrate, forming a hard mask by etching the etch barrier layer using the photoresist pattern, and etching the stamp substrate using the hard mask as an etch mask.

Abstract: A pattern transfer apparatus according to one embodiment includes a transfer region selecting part that performs operation in which when performing pattern transfer from a template provided with N transfer regions (N is an integer of 2 or larger) to a transferring substrate a plurality of times, 1 to N?1 transfer regions, which are to be used to perform the transfer to regions of the transferring substrate corresponding to part of the N transfer regions, are selected such that the number of the transfer to be performed using each of the N transfer regions is evened out.

Abstract: A method of controlling wetting characteristics is described. Such method includes forming and configuring nanostructures on a surface where controlling of the wetting characteristics is desired. Surfaces and methods of fabricating such surfaces are also described.

Abstract: A method of nanopatterning includes the steps of providing the resist film (12) and forming the pattern in the resist film (12). The resist film (12) includes an organosilicone compound having at least two vinyl groups, an organosilicone crosslinker different from the organosilicone compound, a catalyst, and a catalyst inhibitor. The cured resist film (12) includes the reaction product of the organosilicone compound having at least two vinyl groups and the organosilicone crosslinker different from the organosilicone compound, in the presence of the catalyst and the catalyst inhibitor. The article (10) includes a substrate (14), and the cured resist film (12) is disposed on the substrate (14). Due to the presence of the catalyst inhibitor in the resist film (12), the resist film (12) may be manipulated for hours at room temperature without curing. At the same time, the resist film (12) cures in a sufficiently short period of time to be commercially valuable.

Abstract: Droplets of polymerizable material may be patterned on a film sheet using a roll-to-roll system. The droplets of polymerizable material may be dispensed on the film sheet such that a substantially continuous patterned layer may be formed on the film sheet. A contact system provides for smooth fluid front progression the polymerizable material during imprinting. A gas purging system may be positioned during imprinting. Gas purging systems may provide for purging in parallel as fluid front of polymerizable material moves through roll-to-roll system.

Abstract: A process using the nanoimprint technique to form the diffraction grating for the DFB-LD is disclosed. The process includes (a) coating a resist for the EB exposure on a dummy substrate, (b) irradiating the resist as varying the acceleration voltage, (c) forming a resist pattern by developing the irradiated resist, (d) coating the SOG film on the patterned resist, (e) attaching the silica substrate on the cured SOG film, and (f) removing the dummy substrate with the resist from the SOG film and the silica substrate. Using the mold thus formed, the diffraction grating for the DFB-LD is formed by the nanoimprint technique.

Abstract: Droplets of resist material are coated using the ink jet method under conditions that: the viscosity of the resist material is within a range from 8 cP to 20 cP, the surface energy of the resist material is within a range from 25 mN/m to 35 mN/m, the amount of resist material in each of the droplets is within a range from 1 pl to 10 pl, and the placement intervals among the droplets are within a range from 10 ?m to 1000 ?m. A mold is pressed against the surface of the substrate in a He and/or a depressurized atmosphere such that: an intersection angle formed between a main scanning direction of the ink jet method and the direction of the lines of the linear pattern of protrusions and recesses, which is an intersection angle when pressing the mold against the surface of the substrate, is within a range from 30° to 90°.

Abstract: A resonator fabrication method is provided. A method includes providing a plurality of electrode patterns disposed apart from each other on a substrate using a nano-imprint technique; and forming an extended electrode pattern connected to a plurality of electrode patterns, and forming a nano structure laid across an extended electrode patterns. Therefore, a nano-electromechanical system (NEMS) resonator is easily fabricated at a nanometer level.

Abstract: Devices positioned between an energy source and an imprint lithography template may block exposure of energy to portions of polymerizable material dispensed on a substrate. Portions of the polymerizable material that are blocked from the energy may remain fluid, while the remaining polymerizable material is solidified.

Abstract: A method for forming hierarchical patterns on an article by nanoimprinting is disclosed. The method includes using a first mold to form a primary pattern on the article at a first temperature and a first pressure, the first temperature and the first pressure being able to reduce the elastic modulus of the article; and using a second mold to form a second pattern on the primary pattern at a second temperature that is below the article's glass transition temperature, the forming of the second pattern being at a second pressure.

Abstract: A micro-conformal nanoimprint lithography template includes a backing layer and a nanopatterned layer adhered to the backing layer. The elastic modulus of the backing layer exceeds the elastic modulus of the nanopatterned layer. The micro-conformal nanoimprint lithography template can be used to form a patterned layer from an imprint resist on a substrate, the substrate having a micron-scale defect, such that an excluded distance from an exterior surface of the micron-scale defect to the patterned layer formed by the nanoimprint lithography template is less than a height of the defect. The nanoimprint lithography template can be used to form multiple imprints with no reduction in feature fidelity.

Abstract: A method comprises providing a mold comprising a surface with at least one identification region, the at least one identification region comprising at least one identification feature that has a lateral dimension of 100 microns or less; and molding an item from a moldable material using the mold, such that the at least one identification region is transferred to a surface of the item.

Abstract: The present invention relates to an improved process for producing highly ordered nanopillar or nanohole structures, in particular on large areas, which can be used as masters in NIL, hot embossing or injection molding processes. The process involves decorating a surface with an ordered array of metal nanoparticles produced by means of a micellar block- copolymer nano-lithography process; etching the primary substrate to a depth of 50 to 500 nm, where the nanoparticles act as a mask and an ordered array of nanopillars or nanocones corresponding to the positions of the nanoparticles is thus produced; using the nanostructured master or stamp in a structuring processes. Also the finished nanostructured substrate surface can be used as a sacrificial master which is coated with a continuous metal layer and the master is then etched away to leave a metal stamp having an ordered array of nanoholes which is a negative of the original array of nanopillars or nanocones.

Abstract: A process and an apparatus for performing a UV nano-imprint lithography are provided. The process uses a polymer pad which allows a uniform application of pressure to a patterned template and an easy removal of a residual resin layer. The apparatus includes a tilt and decentering corrector which allows an accurate alignment of layers during the nano-imprint lithography process.

Abstract: Synthetic polymer substrates comprising a hierarchical surface structure of multiple domes and multiple pillars on said domes, wherein said substrate is a synthetic polymer film, said domes have diameters in the range from about 5 ?m to about 400 ?m, heights in the range from about 2.5 ?m and about 500 ?m, and said pillars have diameters in the range from about 20 nm to about 5 ?m and aspect ratios of from about 2 to about 50, and methods of making and using them.

Abstract: Methods for creating nano-shaped patterns are described. This approach may be used to directly pattern substrates and/or create imprint lithography molds that may be subsequently used to directly replicate nano-shaped patterns into other substrates in a high throughput process.

Abstract: A pattern forming method including: (a) forming a porous layer above an etching target layer; (b) forming an organic material with a transferred pattern on the porous layer; (c) forming, by use of the transferred pattern, a processed pattern in a transfer oxide film that is more resistant to etching than the porous layer; and (d) transferring the processed pattern to the etching target layer by use of the transfer oxide film as a mask.

Abstract: An imprint method, in which pattern forming is performed by having a light curable material applied on a sample face of a substrate being a processing target hardened by being exposed to light in a state where the light curable material and a pattern formed surface of a template contact each other, the pattern formed surface having a concave-convex pattern formed thereon; wherein in one exposure performed with respect to a predetermined shot of the light curable material, an exposure amount at a light curable material on a first region which contacts a pattern formed region including the concave-convex pattern of the template is greater than an exposure amount at a light curable material on a second region which at least contacts a part of a pattern periphery region of the template, the pattern periphery region existing in a periphery of the pattern formed region of the template.

Abstract: A polymer waveguide for coupling with one or more light transmissible devices, a method of fabricating a polymer waveguide for coupling with one or more light transmissible devices, and a method of coupling a polymer waveguide with one or more light transmissible devices. The polymeric waveguide comprises a grating structure.

Abstract: A method and a mechanism for nano scale patterns with high aspect ratios etched on both photoresist layers and a carrier substrate and uses two complementary photoresist layers as an etch mask and the laser direct-write lithography technology to quickly fabricate large-size & nano scale patterns features (1) inorganic photoresist as material of a first layer of photoresist for nano scale patterns defined by laser beam direct-write lithography and (2) polymeric organic photoresist as material of a second layer of photoresist to thicken an etch mask because of effect of oxygen plasma, which has a higher etching rate on a polymeric organic photoresist layer but a lower one on an inorganic photoresist layer. For various materials of carrier substrates applied to the present invention, there are several types of Inductively Coupled Plasma-Reactive Ion Etching technologies available for nano scale patterns continuously transferred to a carrier substrate.

Abstract: A semiconductor device is formed with sub-resolution features and at least one additional feature having a relatively larger critical dimension using only two masks. An embodiment includes forming a plurality of first mandrels, having a first width, and at least one second mandrel, having a second width greater than the first width, overlying a target layer using a first mask, forming sidewall spacers along the length and width of the first and second mandrels, forming a filler adjacent each sidewall spacer, the filler having the first width, removing the filler adjacent sidewall spacers along the widths of the first and second mandrels using a second mask, removing the sidewall spacers, and etching the target layer between the filler and the first and second mandrels, thereby forming at least two target features with different critical dimensions.

Abstract: Disclosed is a method for manufacturing a nano wire grid polarizer, including: applying a curable resin on a glass substrate, and then forming a nano pattern by pressurizing the curable resin with a nano imprint mold; processing a surface of the nano pattern in which an upper part of the nano pattern is hydrophobicized and an inside of the nano pattern is hydrophilicized; filling the inside of the nano pattern with nano metal particles; and forming a nano wire grid polarizer by removing the nano pattern.

Abstract: A method of manufacturing a light emitting diode, includes a process of forming an n-type nitride semiconductor layer, a light emitting layer, and a p-type nitride semiconductor layer on a temporary substrate, a process of forming a p-type electrode on the p-type nitride semiconductor layer, a process of forming a conductive substrate on the p-type electrode, a process of removing the temporary substrate to expose the n-type nitride semiconductor layer, a process of forming a nanoimprint resist layer on the n-type nitride semiconductor layer, a process of pressing the nanoimprint mold on the nanoimprint resist layer to transfer the nano-pattern onto the nanoimprint resist layer, and a process of separating the nanoimprint mold from the nanoimprint resist layer having the nano-pattern and etching a portion of the nanoimprint resist layer having the nano-pattern to form an n-type electrode.

Abstract: A large area patterned film includes a first patterned area; a second patterned area; and a seam joining the first patterned area and the second patterned area, wherein the seam has a width less than about 20 micrometers. A method for tiling patterned areas includes depositing a predetermined thickness of a curable material; contacting a first portion of the curable material with a mold; curing the first portion of the curable material; removing the mold from the cured first portion of the curable material; contacting a second portion of the curable material with the mold, such that the mold contacts a portion of the cured first portion of the curable material; curing the second portion of the curable material; and removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.

Abstract: An imprint method includes applying a light curable resin on a substrate to be processed, the substrate including first and second regions on which the light curable resin is applied, contacting an imprint mold with the light curable resin, curing the light curable resin by irradiating the light curable resin with light passing through the imprint mold, generating gas by performing a predetermined process to the light curable resin applied on a region of the substrate, the region including at least the first region, wherein an amount of gas generated from the light curable resin applied on the first region is larger than an amount of gas generated from the light curable resin of the second region, and forming a pattern by separating the imprint mold from the light curable resin after the gas being generated.

Abstract: A nanoimprint lithography method includes the following steps. First, a first sacrifice layer, a second sacrifice layer and a nanoimprint resist are formed on a substrate. The nanoimprint resist includes a hyperbranched polyurethane oligomer, a perfluoropolyether; a methylmethacrylate, and a diluent solvent. Second, a master stamp with a first nanopattern formed by a number of projecting portions and gaps is provided, and the first nanopattern is pressed into the nanoimprint resist to form a second nanopattern in the nanoimprint resist. Third, the second nanopattern is transferred to the substrate.

Abstract: An imprint apparatus molds resin dispensed on a shot region of a substrate with a mold and forms a pattern of resin on the shot region. The apparatus includes a mold stage configured to hold the mold, a substrate stage configured to hold the substrate, a drive mechanism configured to change a relative positional relationship between the mold stage and the substrate stage in an X-Y plane that defines a coordinate of the shot region and a Z-axis direction perpendicular to the X-Y plane, and a controller. The controller is configured to control the drive mechanism so that the mold and the shot region perform relative vibration, in the X-Y plane, with respect to a relative position where the mold and the shot region align, and a distance between the mold and the shot region decreases in the Z-axis direction in parallel with the vibration, and the resin is molded by the mold.

Abstract: An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto.

Abstract: An imprint lithography method is disclosed for forming a patterned layer from a UV-curable, imprintable liquid medium on a substrate by means of an imprint template with a patterned surface. The method involves bringing together the patterned surface and the UV-curable medium for a filling period, illuminating the UV-curable medium with UV-radiation for an illumination period, holding the patterned surface and the UV-curable imprintable liquid medium together for a holding period such that the UV-curable medium has formed a self-supporting patterned layer, and separating the patterned surface and the patterned layer at the end of the holding period. The start time of the illumination period is earlier than the end time of the filling period by a pre-cure period. Also, a method is disclosed where the end time of the illumination period is earlier than the end time of the holding period.