Light emitting diode chip

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Description

FIG. 1 is a top, front perspective view of a light emitting diode chip showing my new design;

FIG. 2 is a bottom, rear perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom view thereof; and

FIG. 9 is a top plan view thereof, shown without the transparent cavity lens; and,

FIG. 10 is a cross sectional view taken along line 10-10 in FIG. 7.

Broken lines depictions of transparent cavity lens of the light emitting diode chip shown in the drawings indicate unclaimed portions of the design, and thus illustrative purpose only and form no part of the claimed design.

Claims

The ornamental design for a light emitting diode chip, as shown and described.

Referenced Cited
U.S. Patent Documents
D521948 May 30, 2006 Inoue
D778849 February 14, 2017 Maruyama
D857638 August 27, 2019 Maruyama et al.
20050173721 August 11, 2005 Isoda
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20130049565 February 28, 2013 Jung
20130141920 June 6, 2013 Emerson
20150171274 June 18, 2015 Guo
20150340581 November 26, 2015 Han
20160079478 March 17, 2016 Kong
20170069606 March 9, 2017 Gould
20170179352 June 22, 2017 Song
20180151790 May 31, 2018 Kim
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20200350468 November 5, 2020 Lee
Patent History
Patent number: D915309
Type: Grant
Filed: Nov 19, 2019
Date of Patent: Apr 6, 2021
Assignee: DOWA Electronics Materials Co., Ltd. (Tokyo)
Inventor: Tsukasa Maruyama (Akita)
Primary Examiner: Selina Sikder
Application Number: 29/713,754
Classifications