Abstract: In some embodiments, the invention includes a snoop filter, wherein entries in the snoop filter are allocated in response to initial accesses of local cache lines by a remote node, but entries in the snoop filter are not allocated in response to accesses of the local cache lines by a local node. Other embodiments are described and claimed.

Abstract: In some embodiments, the invention includes a system having a clock recovery circuitry to receive a data signal and a reference clock signal and in response thereto to produce an in phase clock signal which is in phase with the data signal and mirrors frequency changes in the data signal, wherein the data signal has embedded clock information and a varying frequency. The system also includes a receiving gate to receive the data signal and the in phase clock signal and to gate the data signal to produce a gated data signal in response to the in phase clock signal. Other embodiments are described and claimed.

Abstract: In some embodiments, the invention includes a system having first, second, third and fourth modules; and a circuit board including first, second, third, and fourth module connectors to receive the first and second modules, respectively. The system includes among other things a first group of paths of conductors extending from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector, to the second module, back to the second module connector, to terminations, wherein the first group of paths include a first short loop through section in the first module and a second short loop through section in the second module, to each couple to stubs for corresponding first and second chips of the first and second modules.

Abstract: In some embodiments, a chip includes first and second nodes, a variable voltage source, and transmitter and control circuitry. The transmitter includes a driver coupled to the first and second nodes, and first and second resistive structures coupled between the first and second nodes, respectively, and the variable voltage source. The control circuitry selects an impedance level for the first and second resistive structures, and detect coupling of a remote receiver to the transmitter through interconnects and detect decoupling of the remote receiver from the transmitter. Other embodiments are described and claimed.

Abstract: In some embodiments, the invention involves a system having a first group of integrated circuits connected in a truncated ring fashion, wherein the truncated ring includes a truncated region to allow for additional integrated circuits to be added to the ring. In some embodiments, the invention involves a system having a group of integrated circuits connected in a pseudo ring fashion, wherein the pseudo ring is created by data flow of bi-directional signaling between the integrated circuits. In some embodiments, the invention involves a system having a group of integrated circuits connected in a pseudo differential arrangement in which multiple conductors carrying signals share a common reference signal conductor.

Abstract: In some embodiments, the invention involves a die having a first conductor carrying a power supply voltage and a second conductor carrying a ground voltage. A semiconductor capacitor operating in depletion mode is coupled between the first and second conductors to provide decoupling capacitance between the first and second conductors, the semiconductor capacitor having a gate voltage. Various configurations may be used including: n+ gate poly and n+ source/drain regions in an n-body; p+ gate poly and n+ source/drain regions in an n-body; p+ gate poly and p+ source/drain regions in an n-body; p+ gate poly and p+ source/drain regions in a p-body; n+ gate poly and p+ source/drain regions in a p-body; n+ gate poly and n+ source/drain regions in a p-body. The power supply voltage may have a larger absolute value than does a flatband voltage.

Abstract: In some embodiments, a chip includes first and second nodes, a variable voltage source, a transmitter, change detection circuitry, and control circuitry. The transmitter includes a driver coupled to the first and second nodes, and first and second resistive structures coupled between the first and second nodes, respectively, and the variable voltage source. The change detection circuitry detects changes in voltages of the first and second nodes following a change in voltage of the variable voltage source. The control circuitry determines whether the changes in voltages of the first and second nodes are consistent with the transmitter being coupled through interconnects to a remote receiver. Other embodiments are described and claimed.

Abstract: In some embodiments, the invention includes a system having a memory controller, a bus, and first and second memory devices. The memory controller requests read and write operations and operates with a burst length. The first and second memory devices are coupled to the memory controller through the bus, the first and second memory devices each having a prefetch length that is greater than the burst length, but performing the requested read and write operations with the burst length. Other embodiments are described and claimed.

Abstract: In one embodiment of the invention, a processor includes an execution pipeline to concurrently execute at least portions of threads, wherein at least one of the threads is dependent on at least another one of the threads. The processor also includes detection circuitry to detect speculation errors in the execution of the threads. In another embodiment, the processor includes thread management logic to control dynamic creation of threads from a program.

Abstract: In some embodiments, the invention includes a system having first and second modules and a circuit board including first and second module connectors to receive the first and second modules, respectively. A first path of conductors extends from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector and to the second module. The first path couples to chips of the first and second modules, and each of the chips include on die terminations, but only some of the chips include on die terminations that are enabled.

Abstract: In some embodiments, the invention involves multiple integrated circuit stubs coupled in series. At least one of the integrated circuit stubs including first conductors to receive signals from a first adjacent one of the integrated circuit stubs, second conductors to provide signals to a second adjacent one of the integrated circuit stubs, and third conductors to provide signals to an integrated circuit chip. The integrated circuit stubs include first drivers and second drivers coupled to the first, second, and third conductors, wherein the first drivers receive the external signals from the first conductors and drive them onto the second conductors and the second drivers receive signals from the first conductors and drive them onto the third conductors.

Abstract: In one embodiment, the invention includes a field effect transistor having a substrate, a source, and a drain. An electric field terminal region is lower than the source and drain and is in the substrate. A body is above the electric field terminal region between the source and drain. In another embodiment, the invention includes a field effect transistor having an insulator layer and a body above the insulator layer between a source and a drain. A substrate is below the insulator layer. A gate is above the body and between the source and drain. An electric field terminal region is included in the substrate. The body may be undoped and the threshold voltage be set by setting the distance between the insulator layer and a gate insulator. The body, substrate, and electric field terminal region may float or one or more of them may be biased.

Abstract: In some embodiments, the invention includes a system having first and second modules; and a circuit board including first and second module connectors to receive the first and second modules, respectively. A first path of conductors extending from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector and to the second module, and wherein the first path in the first module couples to stubs for first and second chips of the first module and the first path in the second module couples to stubs for first and second chips of the first module; and each of the first and second chips include selectable on die terminations.

Abstract: In some embodiments, the invention includes a system having first and second modules, the first module having a first group of chips and the second module having a second group of chips, and a circuit board including first and second module connectors to receive the first and second modules, respectively. The system also includes a first buffer on the first module and a second buffer on the second module, and a path including conductors in a first section that splits into a second section and third section, wherein the second section couples to the first buffer and the third section couples to the second buffer, and wherein impedances of the second and third sections are at least 50% greater than impedances of the first section.

Abstract: In some embodiments, the invention includes a module including a circuit board and first and second groups of conductors supported by the circuit board. A first group of chips each include on die terminations that are enabled. At least some of a second group of chips have on die terminations that are disabled. The first group of chips are coupled to conductors of the first group of conductors and the second group of chips are coupled to conductors of the second group of conductors, and wherein the second group of conductors have higher impedances than do the first group of conductors.

Abstract: In some embodiments, the invention includes system comprising a circuit board including a circuit board trace. This system includes a packaged chip supported by the circuit board including, the packaged chip having a package, wherein the circuit board trace is connected to the package in a circuit board breakout region, and wherein the circuit board trace includes a fan-out trace section having an impedance Zo1, a matching region trace section having an impedance Zo2, and a package trace compensation section having an impedance Zo3, wherein an effective impedance of the matching region trace section and the package trace compensation section is approximately equal to impedance Zo1, where Zo3<Zo1<Zo2.

Abstract: In some embodiments, the invention includes a termination card having a substrate having groups of fingers on a first side of the substrate and groups of fingers on a second side of the substrate and wherein some of the groups of fingers on the first side and some of the groups of fingers on the second side are connected through module connectors, and others of the groups of fingers on the first side are coupled to on module terminations on the first side.

Abstract: In some embodiments, the invention includes a system having first and second modules and a circuit board including first and second module connectors to receive the first and second modules, respectively. The system includes a first path of conductors extending from the circuit board to the first module connector, to the first module, back to the first module connector, to the circuit board, to the second module connector, to the second module, and to on module terminations of the second module; and a second path of conductors extending from the circuit board to the second module connector, to the second module, back to the second module connector, to the circuit board, to the first module connector, to the first module, and to on module terminations of the first module.

Abstract: In some embodiments, the invention includes a system having first and second modules; and a circuit board including first and second module connectors to receive the first and second modules, respectively. The system also includes a first clock path of conductors to carry a first clock signal to first, second, third, and fourth chips on the first module and then to first, second, third, and fourth chips on the second module; and a second clock path of conductors to carry a second clock signal to the first, second, third, and fourth chips on the second module and then to the first, second, third, and fourth chips on the first module.

Abstract: In some embodiments, the invention includes an interconnect system having a single ended driver and a single ended hysteretic receiver. A single ended interconnect is coupled between the single ended driver and single ended receiver. In other embodiments, the invention involves an interconnect system including interconnects, single ended drivers, and single ended hysteretic receivers connected to respective ones of the interconnects. The single ended drivers receive respective data-in signals and an enable signal and wherein the drivers transmit interconnect signals on the interconnects when the enable signal is asserted. In yet other embodiments, the invention includes an interconnect system having interconnects, quasi-static drivers and receivers connected to respective ones of the interconnects.