Patents Represented by Attorney, Agent or Law Firm Hayes, Soloway, Hennessey, Grossman & Hage, P.C.
  • Patent number: 6170560
    Abstract: A method for producing a mold for making an integrally formed three-dimensional truss structure, containing outer top and bottom plane surfaces thereof comprising interconnected rod segments integrally formed at their points of intersection on the outer top and bottom surfaces, the top and bottom surfaces also integrally joined together through additional interconnected rod segments passing through an integrally formed intersection, wherein the additional interconnected rod segments passing through the integrally formed intersection form a three-dimensional continuous array of triangles.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: January 9, 2001
    Assignee: Nu-Cast Inc.
    Inventors: Carl S. Daily, Daniel A. Lees, Dennis Donald McKitterick
  • Patent number: 6167836
    Abstract: There is provided a plasma-enhanced chemical vapor deposition apparatus including a reaction chamber into which a process gas is introduced and from which an exhausted gas is discharged, a susceptor having a first region on which a semiconductor substrate is to be placed and a second region other than the first region, an electrode located in facing relation with the susceptor and cooperating with the susceptor to generate plasma therebetween for forming a thin film on the semiconductor substrate placed on the first region of the susceptor, and a ceramics insulator covering the second region of the susceptor therewith. The above-mentioned plasma-enhanced chemical vapor deposition apparatus enhances uniformity of a thin metal film to be formed on a semiconductor substrate, and further improves a barrier characteristic of the thin metal film.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: January 2, 2001
    Assignee: NEC Corporation
    Inventor: Tetsuya Taguwa
  • Patent number: 6164738
    Abstract: A storage and sterilization tray assembly for sterilizing, transporting and storing surgical instruments includes a rack having a top, a bottom and four sides, and at least one slidably mounted drawer carried therein. At least one of the sides includes at least one pivotally mounted door which is moveable between a closed position in which the at least one slidably mounted drawer is retained in the rack, and an open position in which the at least one slidably mounted drawer may be slid at least partially out of the rack. The door also serves to stabilize the rack against tipping when in its open position. Preferably, one or more removable trays are carried in the drawer, and the rack includes a plurality of openings in the top, bottom and sides, aligned with openings in the drawer, for permitting ingress and egress of sterilant therethrough.
    Type: Grant
    Filed: January 29, 1999
    Date of Patent: December 26, 2000
    Assignee: Poly Vac, Inc.
    Inventors: Gary T. Dane, Valentine T. Faust, III, Todd Bettenhausen, Cary Bettenhausen
  • Patent number: 6165818
    Abstract: A semiconductor device is disclosed wherein a pair of radiating terminals and a plurality of lead terminals are formed from a single lead frame. A hole or holes in each radiating terminal are formed with an equal width and in an equal pitch to those of gaps between the lead terminals, and the opposite sides of each hole of the radiating terminal are connected to each other by a support element. The support elements of the radiating terminals and support elements which interconnect the lead terminals are formed with an equal length and in an equal pitch to allow the support elements to be cut away by a plurality of punches which are arranged in an equal pitch and have an equal width.
    Type: Grant
    Filed: May 7, 1998
    Date of Patent: December 26, 2000
    Assignee: NEC Corporation
    Inventors: Seiji Ichikawa, Takeshi Umemoto, Toshiaki Nishibe, Kazunari Sato, Kunihiko Tsubota, Masato Suga, Yoshikazu Nishimura, Keita Okahira, Tatsuya Miya, Toru Kitakoga, Kazuhiro Tahara
  • Patent number: 6166443
    Abstract: Internal electrodes and external lead wiring lines are formed on the front surface of a substrate of a semiconductor device, and solder bumps electrically connected to the external lead wiring lines via through holes are provided on the rear surface of the substrate. A first semiconductor chip is mounted on the surface of the substrate, and a second semiconductor chip is mounted on the rear surface of the substrate. Electrodes of the first semiconductor chip are connected to bonding pads at one side ends of the internal wiring lines, and electrodes of the second semiconductor chip are connected to the bonding pads at the other ends of the internal wiring lines and the external lead wiring lines with bonding wires passing through openings provided in the substrate.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: December 26, 2000
    Assignee: NEC Corporation
    Inventors: Takehito Inaba, Michihiko Ichinose, Kenji Oyachi
  • Patent number: 6166965
    Abstract: In a semiconductor memory device including a data bus, a data bus charging circuit for charging the data bus, a data bus discharging circuit for discharging the data bus in accordance with a cell read data signal, and a push-pull type output circuit formed by a first N-channel MOS transistor connected between a first power supply terminal and an output terminal and a second N-channel MOS transistor connected between the output terminal and a second power supply terminal, a step-up circuit is connected between the data bus and a gate of the first N-channel MOS transistor to generate a step-up voltage in accordance with a voltage at the data bus.
    Type: Grant
    Filed: October 28, 1999
    Date of Patent: December 26, 2000
    Assignee: NEC Corporation
    Inventor: Hiroyuki Yamakoshi
  • Patent number: 6160580
    Abstract: A charge-coupled device image sensor comprises a matrix array of photodiodes and a horizontal charge-coupled device (CCD). First vertical CCDs are provided, each on one side of each column of the photodiodes for receiving charge packets from the photodiodes of odd-numbered rows and moving the charge packets to the horizontal CCD and second vertical CCDs are provided, each on the other side of each column of the photodiodes for receiving charge packets from the photodiodes of even-numbered rows and moving the charge packets to the horizontal CCD. The horizontal CCD receives the charge packets from the first and second vertical CCDs and transfers the received charge packets to external circuitry. According to a modified embodiment, a second horizontal CCD is provided for receiving the charge packets from the second vertical CCDs.
    Type: Grant
    Filed: September 19, 1997
    Date of Patent: December 12, 2000
    Assignee: NEC Corporation
    Inventor: Yasutaka Nakashiba
  • Patent number: 6159516
    Abstract: A process for forming starch into a molded article using melt processing techniques which process comprises combining starch and water to form a mixture wherein the water content is in the range of about 20.0 to 40.0% by weight with respect to that of the starch and introducing and heating the mixture in an extruder wherein the water content of the product upon discharge from the extruder is less than the water content of the mixture entering the extruder. The extrudate is then, optionally dried, and introduced to a heated injection molding machine and injection molded and cooled to form a molded article wherein the water content of the molded article is at or below about 20% by weight.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: December 12, 2000
    Assignee: TFH Publication, Inc.
    Inventors: Glen S. Axelrod, Ajay Gajria
  • Patent number: 6158649
    Abstract: By providing a mechanism for removing static electricity, even slight electric charge caused by natural electrification is removed before holding solder balls. A necessary number of solder balls are held securely. The solder balls attracted by vacuum suction are brought close to pads until the solder balls come in contact with flux surfaces of pads. While continuously holding the solder balls using vacuum suction, the solder balls are pressed against the pads. The solder balls are embedded in the flux having adherence power and held. In a solder ball mounting apparatus, therefore, solder balls can be mounted on pads of a substrate securely without using electrostatic force which is difficult to control.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: December 12, 2000
    Assignee: NEC Corporation
    Inventor: Takeo Miura
  • Patent number: 6159589
    Abstract: An injection molded fiber-impregnated thermoplastic composite material comprising a plastic polymer matrix wherein the fibers are sufficiently interwoven and entangled in said polymer matrix to provide improved resistance to mechanical loading, and wherein said composite material is particularly suited for the preparation of an injection molded toe cap for a protective shoe.
    Type: Grant
    Filed: November 26, 1997
    Date of Patent: December 12, 2000
    Assignee: H.H. Brown Shoe Company
    Inventors: Paul C. Isenberg, Christopher J. Beard, Nick R. Schott
  • Patent number: 6158795
    Abstract: A vehicle passenger compartment console assembly including a console body having an outer shell and an access opening disposed in the console body outer shell. A positioning apparatus is movably supported within the console body outer shell. At least two storage modules are disposed within the shell and are movably supported on the positioning apparatus. The storage modules are sequentially movable between one or more concealed positions displaced from the access opening and a displayed position adjacent the access opening. The positioning apparatus is configured to support any one of the storage modules in the display position while simultaneously supporting at least one of the other storage modules in a concealed position. This arrangement allows passenger compartment occupants to gain physical access to a module and its contents through the access opening while leaving other modules concealed within the shell.
    Type: Grant
    Filed: July 16, 1998
    Date of Patent: December 12, 2000
    Assignee: Textron Automotive Company, Inc.
    Inventors: John D. Gray, Scott J. Duletzke
  • Patent number: 6157083
    Abstract: A semiconductor device is manufactured by forming a first fluorine doped plasma silicon oxide film having a high fluorine concentration on first metallic interconnections formed on a semiconductor substrate surface, forming, a second fluorine doped plasma silicon oxide film having a low fluorine concentrations on the first film, and carrying out chemical machine polishing (CMP) only on the second fluorine doped plasma silicon oxide film.
    Type: Grant
    Filed: May 28, 1997
    Date of Patent: December 5, 2000
    Assignee: NEC Corporation
    Inventors: Tatsuya Usami, Hiraku Ishikawa
  • Patent number: 6157053
    Abstract: There is provided a charge transfer device including (a) a charge transfer channel for transferring signal charges therethrough, (b) a floating diffusion region for accumulating therein charges transferred from the charge transfer channel, (c) a field effect transistor for resetting the floating diffusion region so that the floating diffusion region is at a predetermined potential and (d) a bias charge input section through which a bias charge is supplied and which is connected to either the charge transfer channel or the floating diffusion region. The field effect transistor includes a reset gate electrode and a reset drain.
    Type: Grant
    Filed: May 26, 1998
    Date of Patent: December 5, 2000
    Assignee: NEC Corporation
    Inventor: Akihito Tanabe
  • Patent number: 6156666
    Abstract: There is provided a method of dry etching a nickel film formed on a substrate by means of plasma of an etching gas, wherein the etching gas includes at least one of CO and CO.sub.2 gases, and the substrate is kept at a temperature in the range of -25.degree. C. to 40.degree. C. both inclusive, while the substrate is being etched. For instance, the etching gas is a mixture gas including CO and CO.sub.2 gases, a mixture gas including CO, CO.sub.2 and H.sub.2 gases, or a mixture gas including CO and H.sub.2 gases. The above-mentioned method provides higher etching accuracy, higher etching rate, and less etching damage in a substrate.
    Type: Grant
    Filed: November 12, 1997
    Date of Patent: December 5, 2000
    Assignee: NEC Corporation
    Inventor: Masatoshi Tokushima
  • Patent number: 6153978
    Abstract: In a field emission cold cathode device including one emitter, a supporting region formed of a conductor or a semiconductor for supporting the emitter, and a gate electrode provided in the proximity of the emitter, electrons are supplied to the emitter from a capacitance formed by a pair of electrodes separated from each other, one of the pair of electrodes being DC connected to the emitter. The emitted electron amount can be controlled by controlling a voltage applied to the other of the pair of electrodes. Thus, it is possible to minimize the variation in the emission current caused by variation in the emitter devices, which was unavoidable in the prior art.
    Type: Grant
    Filed: October 28, 1999
    Date of Patent: November 28, 2000
    Assignee: NEC Corporation
    Inventor: Akihiko Okamoto
  • Patent number: 6153132
    Abstract: A method of expanding a tube of plastics material in which a longitudinally travelling tube is progressively diametrically expanded in internal fluid pressure in an expansion zone between an upstream plug and an expandable downstream plug. Expansion of the tube is controlled in response to parameters which directly or indirectly indicate variation in the relative velocity at which material is delivered to and removed from the expansion zone, such as detecting upstream velocity, early expansion diameter, axial force on a sizing device or the tube diameter just before the expansion zone.
    Type: Grant
    Filed: April 29, 1998
    Date of Patent: November 28, 2000
    Assignees: Vinidex Tubemakers Pty. Limited, Uponor Innovation AB
    Inventors: Peter Glanville Chapman, Allan Kenneth Wallace
  • Patent number: 6154395
    Abstract: An object of the invention is to provide a semiconductor memory device suppressing variations in input terminal capacitances of address input terminals and control signal input terminals and enabling a high-speed access. The invention arranges a plurality of terminal capacitance adjusting elements each of which is composed of an ESD element (punch-through element) 6a, 6b or 6c and a terminal capacitance adjusting terminal capacitance element 7a, 7b or 7c through connection changeover aluminum wiring 8a, 8b and 8c in the course of an aluminum wiring 4 from an input terminal to an internal circuit.
    Type: Grant
    Filed: June 28, 1999
    Date of Patent: November 28, 2000
    Assignee: NEC Corporation
    Inventor: Kazuyoshi Saka
  • Patent number: 6152130
    Abstract: An fluid sensor to activate and control various components of an inhalation device. The fluid sensor includes an acoustic element, such as a microphone, positioned within said inhalation device to detect fluid within the device and output signals representative of the frequency and/or amplitude of the fluid. These signals control and activate an electrostatic plate and/or a high frequency vibrator.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: November 28, 2000
    Assignee: Microdose Technologies, Inc.
    Inventors: Andrew L. Abrams, Anand V. Gumaste, Scott Fleming
  • Patent number: D435913
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: January 2, 2001
    Assignee: Brookstone Company, Inc.
    Inventors: David Harris, Rudy Woodard
  • Patent number: D434251
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: November 28, 2000
    Inventor: Bunji Nakada