Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.

Abstract: An opaque, low resistivity silicon carbide and a method of making the opaque, low resistivity silicon carbide. The opaque, low resistivity silicon carbide is doped with a sufficient amount of nitrogen to provide the desired properties of the silicon carbide. The opaque, low resistivity silicon carbide is a free-standing bulk material that may be machined to form furniture used for holding semi-conductor wafers during processing of the wafers. The opaque, low resistivity silicon carbide is opaque at wavelengths of light where semi-conductor wafers are processed. Such opaqueness provides for improved semi-conductor wafer manufacturing. Edge rings fashioned from the opaque, low resistivity silicon carbide can be employed in RTP chambers.

Abstract: Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.

Abstract: To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes.

Abstract: Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.

Abstract: Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.

Abstract: Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.

Abstract: A composition and method are disclosed. The composition both conditions and activates a dielectric material for metal deposition. The metal may be deposited on the dielectric by electroless methods. The metallized dielectric may be used in electronic devices.

Abstract: Electrolytes for white bronzes are disclosed as well as methods of depositing the white bronzes. The electrolytes for depositing the white bronzes are cyanide free and provide a uniform white color.

Abstract: An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.

Abstract: Compositions and methods useful for the removal of polymeric material from substrates, such as electronic devices are provided. These compositions and methods are particularly suitable for removing polymer residues from electronic devices following plasma etch processes.

Abstract: Semiconductor processing and equipment are disclosed. The semiconductor equipment and processing provide semiconductor wafers with reduced defects.

Abstract: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Abstract: Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.

Abstract: A metallic copper and resin composite body manufacturing method of forming a copper wiring layer that forms an inner layer circuit, establishing an insulating layer with a resin on said wiring layer, forming via holes which expose the copper surface under the insulative layer, and depositing a metal on the copper surface that is exposed at the bottom of the via holes. The method includes a step of: removing copper oxide which forms on the surface of the copper that is exposed in the bottom of the via holes using a phosphoric acid aqueous solution with a pH between 1 and 3. The method suppresses haloing is and via holes with excellent solder bonding are formed.

Abstract: A mask is described for forming an image on a substrate. The mask may be selectively applied to a radiant energy sensitive material on the substrate. Actinic radiation applied to the composite chemically changes portions of the radiant energy sensitive material not covered by the mask. The mask and portions of the radiant energy sensitive material are removed using a suitable aqueous base developer. The mask is composed of aqueous base soluble or dispersible polymers and light-blocking agents.

Abstract: An imaging method is disclosed. An imaging composition is coated on a work piece followed by applying a sufficient amount of energy from a 3-D imaging system to form an image on the coated work piece. The image may be a logo or marker for alignment of parts.

Abstract: Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.

Abstract: Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

Abstract: Methods are disclosed for providing reduced particle generating silicon carbide. The silicon carbide articles may be used as component parts in apparatus used to process semiconductor wafers. The reduced particle generation during semiconductor processing reduces contamination on semiconductor wafers thus increasing their yield.