Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
Type:
Grant
Filed:
April 26, 2005
Date of Patent:
September 1, 2009
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Jacek M. Knop, John G. Carter, Donald E. Cleary
Abstract: An electroless gold plating solution that can form a gold plating film with excellent adhesion and that does not cause corrosion of a base metal film such as nickel, copper, cobalt, or palladium, or the like.
Abstract: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.
Type:
Grant
Filed:
July 6, 2007
Date of Patent:
May 5, 2009
Assignee:
Rohm and Haas Electronic Materials LLP
Inventors:
Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
Abstract: Compositions and methods for depositing one or more metal or metal alloy films on substrates. The compositions contain a catalyst, one or more carrier particles and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.
Abstract: Plating baths containing a mixture of leveling agents, where the mixture includes a first level agent having a first diffusion coefficient and a second leveling agent having a second diffusion coefficient, are provided. Such plating baths deposit a metal layer, particularly a copper layer, that is substantially planar across a range of electrolyte concentrations. Methods of depositing metal layers using such plating baths are also disclosed. These baths and methods are useful for providing a planar layer of copper on a substrate having small apertures, such as an electronic device.
Type:
Grant
Filed:
July 16, 2005
Date of Patent:
March 31, 2009
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Deyan Wang, Robert D. Mikkola, Chunyi Wu, George G. Barclay
Abstract: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.
Type:
Grant
Filed:
July 6, 2007
Date of Patent:
March 10, 2009
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Mark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
Abstract: Photoresist compositions having a resin binder with an acid labile blocking group with an activation energy in excess of 20 Kcal/mol. for deblocking, a photoacid generator capable of generating a halogenated sulfonic acid upon photolysis and optionally, a base.
Type:
Grant
Filed:
March 23, 2006
Date of Patent:
January 27, 2009
Assignee:
Shipley Company, L.L.C.
Inventors:
James W. Thackeray, James F. Cameron, Roger F. Sinta
Abstract: An acid electrolyte and method of using the electrolyte to both deposit tin and tin-alloys on iron containing substrates and at the same time perform as a flux to inhibit the formation of haze and stains on the tin and tin-alloys. The electrolytes and methods are suitable for plating on steel.
Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.
Abstract: A chemical vapor deposited, ? phase polycrystalline silicon carbide having a high thermal conductivity and reduced stacking faults. The silicon carbide is synthesized under specific conditions using hydrogen gas and methyltrichlorosilane gas as reactants. The thermal conductivity of the silicon carbide is sufficiently high such that it can be employed as parts of apparatus and components of electrical devices where a high heat load is generated. Such components may include active thermoelectric coolers, heat sinks and fans.
Type:
Grant
Filed:
August 2, 2004
Date of Patent:
October 21, 2008
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Nathaniel E. Brese, Jitendra S. Goela, Michael A. Pickering
Abstract: Analytical methods are disclosed for determining the quantity of brightener and leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. The methods improve the reproducibility of measuring brighteners and levelers in electroplating baths.
Type:
Grant
Filed:
April 24, 2004
Date of Patent:
June 10, 2008
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Wade Sonnenberg, Leon R. Barstad, Raymond Cruz, Gary Hamm, Mark J. Kapeckas, Erik Reddington, Katie Price, Thomas Buckley, Trevor Goodrich
Abstract: A polymer having ?,? unsaturated groups and a group that generates a free radical when exposed to actinic radiation. The polymer may be self-cross-linking.
Type:
Grant
Filed:
July 13, 2005
Date of Patent:
April 29, 2008
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Robert K. Barr, Edgardo Anzures, Daniel E. Lundy
Abstract: An electrolyte employed to selectively deposit a tin or tin alloy film on a composite substrate. A method for depositing the tin or tin alloy on the composite substrate also is described.
Type:
Grant
Filed:
August 6, 2004
Date of Patent:
April 15, 2008
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Michael P. Toben, Neil D. Brown, Angelo Chirafisi
Abstract: Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be used in methods of marking.
Type:
Grant
Filed:
February 6, 2004
Date of Patent:
September 18, 2007
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Robert K. Barr, James T. Fahey, Corey O'Connor, James G. Shelnut, John J. Piskorski
Abstract: An apparatus for the manufacture of chemical vapor deposited domes. The apparatus has a vapor deposition chamber with a plurality of sides, a base and a top where the base has a reactant port for receiving a flow of chemical reactants. A male mandrel is joined to one of a plurality of sides of the deposition chamber such that the flow of chemical reactants in the vapor deposition chamber does not impinge on the mandrel.
Abstract: Imaging compositions and methods of using the compositions are disclosed. The imaging compositions are sensitive to low levels of energy such that upon application of the low levels of energy the compositions change color or shade. The compositions may be applied to a work piece to mark it and removed from the work piece by peeling.
Abstract: Electrolyte compositions for the deposition of tin and tin-alloys on a substrate are disclosed, along with methods of electroplating tin and tin-alloys using such compositions. These electrolyte compositions are useful for high speed tin plating.
Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
Abstract: A polymer having ?,? unsaturated groups and a group that generates a free radical when exposed to actinic radiation. The polymer may be self-cross-linking.
Type:
Grant
Filed:
March 18, 2003
Date of Patent:
December 12, 2006
Assignee:
Rohm and Haas Electronic Materials LLC
Inventors:
Robert K. Barr, Edgardo Anzures, Daniel E. Lundy
Abstract: Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.
Type:
Grant
Filed:
January 10, 2005
Date of Patent:
January 23, 2007
Assignee:
Shipley Company, L.L.C.
Inventors:
Neil D. Brown, George A. Federman, Angelo B. Chirafisi, Gregory Lai