Abstract: Apparatus and methods are disclosed that control power supplies to automatically provide the appropriate voltage to drive constant current devices. A lighting system according to the present invention comprises a lighting module having a constant current device that provides a constant current in response to constant current voltage. A power supply is included that generates a power supply voltage coupled to the lighting module. A feedback circuit is included from the lighting module to the power supply causing the power supply voltage to be sufficient to provide a constant current voltage at the LED module. A method according to the present invention for generating a constant current voltage to drive a constant current device, comprises providing a drive voltage to a constant current device. The current at the constant current device is sensed a first time, and the drive voltage is increased. The current to the constant current device is sensed a second time.

Abstract: The present invention is directed to LED packages and LED displays utilizing LED packages where the peak emission of the LED displays can exhibit improved emission characteristics. In some embodiments the improved characteristics include a wider horizontal emission angle for the LED packages according to the present invention, which results in improved emission characteristics for the LED display such as a wider far field pattern. This provides improved picture intensity and quality when viewing the display at different horizontal viewing angles. Different embodiments also provide for improved emission characteristics for LED packages emitting different colors of light when viewing at different vertical angles. In one embodiment the red and green LED packages can have emission patterns that are substantially the same at different vertical viewing angles within a range. This helps the colors of the display appear consistent at those angles.

Abstract: A method of making a diode begins by depositing an AlxGa1-xN nucleation layer on a SiC substrate, then depositing an n+ GaN buffer layer, an n? GaN layer, an AlxGa1-xN barrier layer, and an SiO2 dielectric layer. A portion of the dielectric layer is removed and a Schottky metal deposited in the void. The dielectric layer is affixed to the support layer with a metal bonding layer using an Au—Sn utectic wafer bonding process, the substrate is removed using reactive ion etching to expose the n+ layer, selected portions of the n+, n?, and barrier layers are removed to form a mesa diode structure on the dielectric layer over the Schottky metal, and an ohmic contact is deposited on the n+ layer.

Abstract: A locking device for securing a structure comprising an inner body having an inner surface for attachment to the structure, an outer cover located circumferentially about the inner body, the outer cover freely rotating around the inner body in its securing configuration and a key for insertion into an opening in the outer body. First and second magnets are located in spaced apart first and second cavities within the key such that the magnets are oriented with the south pole of the first magnet and the north pole of the second magnet facing in the same direction. The magnets act on a pin within the body of the lock such that, in a first embodiment, when the key is removed from the lock body the pin is magnetically held away from contact with the inner body resulting in a free turning, locked configuration.

Abstract: An ESD protection circuit for a switching power converter which includes a high-side switching element connected between a supply voltage and the switching node, and a low-side switching element connected between the switching node and a common node. A current conduction path couples an ESD event that occurs on the switching node to an ESD sense node, and an ESD sensing circuit coupled to the sense node generates a trigger signal when an ESD event is sensed. A first logic gate keeps the high-side switching element off when the trigger signal indicates the sensing of an ESD event, and a second logic gate causes the low-side switching element to turn on when an ESD event is sensed such that the low-side switching element provides a conductive discharge path between the switching node and common node.

Abstract: An optical angle of arrival measurement system uses an optical element to form at least one narrow width line on a focal plane array (FPA) which is oblique with respect to the FPA's row and column axes and which traverses at least two rows or columns along its length; forming two perpendicular narrow width lines in a cross-pattern is preferred. Interpolating the position of the lines on the FPA provides coordinates that can be used to calculate the optical angle of arrival in accordance with ?x=A(x)·tan?1(x/f), and ?y=B(y)·tan?1(y/f), where f is the focal length of the optical element, and A(x) and B(y) are parameters that account for optical distortion and other imperfections of the system. The resolution ?? of the angle of arrival measurement can be improved to at least ??˜(d/n)/f, where d is the FPA pixel width and n is the length in pixels of the imaged line.

Abstract: A system for time-sequential LED-string excitation includes a controller coupled to at least two LED strings and arranged to sequentially excite the strings—preferably by pulse-width modulating their respective currents—such that each string conducts a desired current and/or provides a desired light intensity. Individual string currents and/or light intensities are provided to the controller as feedback signals. The controller preferably pulse-width modulates each string such that it conducts a current which approximates the performance that would be provided if the string were made to continuously conduct an ‘optimal’ current. A voltage converter may be included to provide the supply voltage connected to the top of each LED string, and to adjust the supply voltage as needed to ensure that each string conducts a desired current.

Abstract: Methods and devices for light emitting diode (LED) chips are provided. In one embodiment of a method, a pre-formed capping wafer is provided, with the capping wafer comprising a conversion material. A wire-bond free LED wafer is fabricated comprising a plurality of LEDs. The capping wafer is bonded to the LED wafer using an adhesive. The LED chips are later singulated upon completion of all final fabrication steps. The capping wafer provides a robust mechanical support for the LED chips during fabrication, which improves the strength of the chips during fabrication. Additionally, the capping wafer may comprise an integrated conversion material, which simplifies the fabrication process. In one possible embodiment for an LED chip wafer, a submount wafer is provided, along with a plurality of LEDs flip-chip mounted on the submount wafer. Additionally, a capping wafer is bonded to the LEDs using an adhesive, and the capping wafer comprises a conversion material.

Abstract: An LED made from a wide band gap semiconductor material and having a low resistance p-type confinement layer with a tunnel junction in a wide band gap semiconductor device is disclosed. A dissimilar material is placed at the tunnel junction where the material generates a natural dipole. This natural dipole is used to form a junction having a tunnel width that is smaller than such a width would be without the dissimilar material. A low resistance p-type confinement layer having a tunnel junction in a wide band gap semiconductor device may be fabricated by generating a polarization charge in the junction of the confinement layer, and forming a tunnel width in the junction that is smaller than the width would be without the polarization charge. Tunneling through the tunnel junction in the confinement layer may be enhanced by the addition of impurities within the junction. These impurities may form band gap states in the junction.

Abstract: An oscillator synchronization system employs two oscillators, each of which includes an integrator which provides a ramping signal at its output, a comparator which receives the ramping signal and a reference signal at respective inputs and toggles an output when the ramping voltage crosses the reference signal, and a one-shot circuit that generates the integrator's reset signal when triggered. The system is preferably arranged such that the oscillators can be operated independently, in which case each oscillator's one-shot is triggered by its own comparator output, or synchronously, in which case each oscillator's one-shot is triggered by the other oscillator's comparator output—with the ramp signal of each oscillator operating to reset the integrator of the other oscillator. The oscillators are typically out-of-phase when synchronized, with the phase difference varying with the magnitude of the reference signals applied to the comparators.

Abstract: The present invention provides a method of reconstructing a tomographic image. In a first step, a tomographic image is forward-projected along a list of geometrical lines in a GPU. This list of geometrical lines may be list-mode event data acquired from a tomographic scanner. Alternatively, the list may be a list of weighted lines derived from a sinogram, a histogram, or a timogram acquired from a tomographic scanner. Next, the list of geometrical lines is back-projected into a 3-dimensional volume using the GPU. The results of the forward- and back-projection are then used to reconstruct the tomographic image, which is then provided as an output, e.g. to make the image available for further processing. Examples of output include storage on a storage medium and display on a display device.

Abstract: An adhesion promoter for enhancing the bond between adjacent layers of a multilayer structure to prevent delamination thereof is disclosed. The adhesion promoter comprises an aromatic polyimide-based UV-cured acrylate. Also disclosed are laminated structures including liquid crystal displays and bonded missile domes that utilize an adhesion promoter of the invention, and methods for fabricating such structures.

Abstract: Devices, systems and methods for fabricating improved ceramic composite turbine shrouds with abradable seals are disclosed. A high temperature seal with an abradable coating is provided. The seal comprises a three-dimensional, high-density woven composite base structure recessed below the abradable coating, with loops incorporated in and protruding from the base structure. The abradable coating is integrally attached to the base structure via the loops. Additionally, a graded density seal is provided with a three-dimensional, low-density woven composite structure. The low-density structure is abradable. A three-dimensional, high-density woven composite base structure is recessed below the low-density structure, with the low-density structure integrally attached to the base structure via weaving.

Abstract: A spa speaker system having a housing with a speaker mounted therein, wherein the housing is mounted within a hole in the wall of a spa. The speaker system is arranged at an angle within the housing, and is rotatable with respect to the hole. The system can also comprise a watertight membrane arranged to prevent water and contaminants from interfering with speaker components. A system for providing audio to a spa is also disclosed. The system comprises a spa having walls and at least one speaker unit mounted in a spa wall. Each of the speaker units is capable of receiving an audio signal, and generating sound towards the occupants of the spa. Each of the speaker units comprises a speaker that is individually rotatable and arranged at an angle to direct the sound.

Abstract: A glove for sports and other uses is provided comprising a palm portion configured to substantially cover a user's palm and palm side surface of the user's fingers and thumb, and a back portion configured to substantially cover the back of a user's hand and back surface of the user's fingers and thumb. One or more inserts are provided between at least two of the fingers, with the inserts webbing the fingers together and spacing them apart. Alternatively, one or more inserts are provided between at least two of the fingers, with the inserts spacing the fingers apart without webbing them together. The inserts assist in improving the grip of the user. They are also beneficial for aiding in the absorption of shock.

Abstract: A white light emitting solid-state lamp is disclosed having an output of at least 75 lumens per watt at 20 milliamps drive current. The lamp includes a light emitting diode, an encapsulant, and a header. The diode includes a conductive silicon carbide substrate for electrical contact and a Group III nitride active portion on the silicon carbide substrate for generating desired frequency photons under the application of current across the diode. The header includes a reflective cup for supporting the diode and for providing electrical contact to the diode and to the active portion. The encapsulant includes a phosphor, present in at least portions of the encapsulant for generating responsive frequencies when the phosphor is excited by the frequencies emitted by the diode.