Abstract: A memory module may include a circuit board connectable to a system memory bus through a plurality of contacts disposed along one edge of the circuit board, the system memory bus having three positions for connecting memory modules. A plurality of memory chips may be mounted on the circuit board. The circuit board may include a plurality of D/Q traces to couple a corresponding plurality of D/Q signals from respective contacts to the plurality of memory chips or to one or more buffer chips that isolate the system memory bus from the memory chips. Each of the plurality of D/Q traces may have a predetermined trace impedance selected to provide a predetermined D/Q signal quality level when the memory module is installed in any of the three positions on the system memory bus and equivalent memory modules are installed in the other two positions.

Abstract: A liquid delivery wand includes a centrally located fluid storage chamber. An absorbent pad is located within the working end of the wand for applying the treatment liquid to the skin while a vacuum is applied to the skin through an abrasive coated treatment tip. Coaxial, cylindrical tubes with flow channels between tube surfaces control the flow rate, the pressure drop being established by the close fit and length of adjacent surfaces of the coaxial components. The flow rate of the liquid is adjustable by simply rotating the interfitting components. The chamber that holds the liquid is sealed from the atmosphere at the distal and proximal end. When the wand is connected to vacuum and the distal end contacts the skin, the vacuum applies a negative pressure to the fluids within a fluid chamber. A small portion of liquid is thus transferred to wet the filter pad.

Abstract: Pop-up fountain embodiments are provided which successfully combine aesthetics, utility and ease of installation and are thus especially suited for installation into spas, hot tubs, pools and the like. Different embodiments include a fountain body and a fountain valve which is slidingly received in the body. The valve terminates in a cap which substantially fills an aperture of the body when the valve is in a quiescent position. Applied water pressure forces the valve into an energized position where the form of the valve directs water laterally in an aesthetically-pleasing pattern. The valve preferably includes a deflector which is arranged below the cap and configured to control and enhance the lateral deflection.

Abstract: An LED component comprising an array of LED chips mounted on a planar surface of a submount with the LED chips capable of emitting light in response to an electrical signal. The LED chips comprise respective groups emitting at different colors of light, with each of the groups interconnected in a series circuit. A lens is included over the LED chips. Other embodiments can comprise thermal spreading structures included integral to the submount and arranged to dissipate heat from the LED chips.

Abstract: An elongated flexible lighting system according to the present invention comprises an array of light sources that are illuminated by electric power. It further comprises an elongated translucent extrusion of flexible material. The array of light sources is integral to the extrusion with said extrusion transmitting and dispersing the light from the array such that the lighting system gives the appearance that the array of light sources is a continuous light source. The elongated lighting system can be used for many different applications including, but not limited to, the lighting of structural features and illumination of sign features.

Abstract: This invention relates to a method of detecting double-feed of email items (10,12) that allows difficult mail types to be processed correctly, wherein simultaneous views are taking of both the sides and bottom of mail items and these views are processed to determine whether or not double feed has occurred. This can be achieved using either two cameras or a single camera (16,2) with additional optics.

Abstract: A transistor device capable of high performance at high temperatures. The transistor comprises a gate having a contact layer that contacts the active region. The gate contact layer is made of a material that has a high Schottky barrier when used in conjunction with a particular semiconductor system (e.g., Group-III nitrides) and exhibits decreased degradation when operating at high temperatures. The device may also incorporate a field plate to further increase the operating lifetime of the device.

Abstract: A light emitting diode is disclosed that includes a transparent substrate with an absorption coefficient less than 4 per centimeter, epitaxial layers having absorption coefficients of less than 500 per centimeter in the layers other than the active emission layers, an ohmic contact and metallization layer on at least one of the epitaxial layers, with the ohmic contact and metallization layer having a transmission of at least about 80 percent, and bond pads with reflectivity greater than at least about 70 percent.

Abstract: A system and method is disclosed for illuminating a plurality of emitters such as light emitting diodes (LEDs). The system comprises a plurality of LEDs and a circuit to provide a digital signal. An LED drive circuit is included comprising a first converter for converting the digital signal to one or more analog voltages. The LED drive circuit further comprises a second converter that converts the one or more analog voltages into corresponding one or more drive currents. Each of the drive currents is applied to at least one of the plurality of LEDs to cause the at least one of the plurality of LEDs to emit light. The intensity of emission of the LEDs is related to the level of the applied drive current.

Abstract: Activation systems and methods initiate High-Definition Multimedia Interface (HDMI) communication between an HDMI source and an HDMI sink through an HDMI receptacle of the source. These systems and methods are especially suited for use with mobile sources that generally operate from a battery that cannot provide the +5V signal which the HDMI protocol requires sources to place on the +5V pin of their HDMI receptacles. These systems and methods automatically detect the insertion of an HDMI cable into the source's HDMI receptacle and subsequently generate and apply the required +5V signal to the +5V pin of the source's HDMI receptacle to initiate HDMI communication. Because they are directed to use in mobile sources, the embodiments are configured to minimize current drain.

Abstract: A method for fabricating a plurality of LED chips comprises providing a plurality of LEDs and forming a plurality of spacers each of which is on at least one of the LEDs. Coating the LEDs with a conversion material, each of the spacers reducing the amount of conversion material over its one of the LEDs. This reduction causes the plurality of LED chips to emit a wavelength of light in response to an electrical signal that is within a standard deviation of a target wavelength. LEDs, LED chips and LED chip wafers are fabricated using the method according to the present invention. One embodiment of an LED chip wafer according to the present invention comprises a plurality of LEDs on a wafer and a plurality of a spacers, each of which is on a respective one of the LEDs. A conversion material at least partially covers the LEDs and spacers, with at least some light from the LEDs passing through the conversion material and is converted.

Abstract: An through-substrate via fabrication method requires forming a through-substrate via hole in a semiconductor substrate, depositing an electrically insulating, continuous and substantially conformal isolation material onto the substrate and interior walls of the via using ALD, depositing a conductive material into the via and over the isolation material using ALD such that it is electrically continuous across the length of the via hole, and depositing a polymer material over the conductive material such that any continuous top-to-bottom openings present in the via holes are filled by the polymer material. The basic fabrication method may be extended to provide vias with multiple conductive layers, such as coaxial and triaxial vias.

Abstract: An improved safety IV placement device includes a reciprocal tubular needle sheath disposed on the exterior of the syringe body and a latch mechanism engaging the syringe body and the sheath to latch the sheath in a needle-covering position after placement of the IV cannula and removal of the needle from within the cannula. An internal spring, which engages the sheath, expands to move the sheath to cover the needle point prior to placement of the IV cannula and after the needle is removed from the indwelling cannula. The spring is a non-uniform helical spring having multiple 360 turns each turn uniformly spaced from adjacent turns.

Abstract: A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured resin, and curing the resin while the phosphor particles remain distributed.

Abstract: A multiple field plate transistor includes an active region, with a source, a drain, and a gate. A first spacer layer is over the active region between the source and the gate and a second spacer layer over the active region between the drain and the gate. A first field plate on the first spacer layer is connected to the gate. A second field plate on the second spacer layer is connected to the gate. A third spacer layer is on the first spacer layer, the second spacer layer, the first field plate, the gate, and the second field plate, with a third field plate on the third spacer layer and connected to the source. The transistor exhibits a blocking voltage of at least 600 Volts while supporting a current of at least 2 Amps with an on resistance of no more than 5.0 m?-cm2, of at least 600 Volts while supporting a current of at least 3 Amps with an on resistance of no more than 5.3 m?-cm2, of at least 900 Volts while supporting a current of at least 2 Amps with an on resistance of no more than 6.

Abstract: An actuator and method for MEMS array actuation is disclosed. In one embodiment, the actuator having a pixel coupled to a charge integration circuit, the pixel comprising a voltage bias, a variable gap capacitor, and a switch, all in series, the charge integration circuit configured to modulate charge on the variable gap capacitor during an actuation cycle. In one embodiment, the MEMS actuator having a unit cell with parasitic capacitance and coupled to a negative feedback sampling circuit, the unit cell comprising a variable gap capacitor, a voltage bias, a modulated current source, and a voltage-to-current converter, the negative feedback sampling circuit configured to receive an output current from the unit cell, convert the output current from the unit cell to a low voltage signal, sample the low voltage signal, and provide a feedback signal to the modulated current source to compensate for the parasitic capacitance in the unit cell.