Abstract: The present invention relates to two-part, curable, (meth)acrylic adhesives containing naturally occurring fillers which inhibit free radical cure, such as wood flour, and oxygen scavenging components. Also provided are methods of preparing such adhesive compositions and methods of bonding substrates together with such adhesive compositions.
Type:
Grant
Filed:
January 5, 2010
Date of Patent:
July 31, 2012
Assignee:
Henkel Corporation
Inventors:
Charles F. Schuft, Douglas E. Frost, David N. Mason
Abstract: This invention relates to (meth)acrylate-based polymerizable compositions and adhesive systems prepared therefrom, which include a alkylated borohydride or tetraalkyl borane metal or ammonium salt and an amino silane or an amino silane capped polymer. The inventive compositions and adhesive systems are particularly well suited for bonding applications which involve at least one low energy bonding surface, for example, the polyolefins, polyethylene, and polypropylene.
Type:
Grant
Filed:
December 3, 2004
Date of Patent:
June 19, 2012
Assignee:
Loctite (R&D) Limited
Inventors:
Brendan J. Kneafsey, Edward Patrick Scott, Rachel Miriam Hersee
Abstract: The present invention relates to thickened cyanoacrylate compositions, such as those in gel or non-flowable forms. More particularly, the present invention relates to non-flowable cyanoacrylate compositions which can be packaged in a convenient pocket-sized applicator dispenser for use in spreading the cyanoacrylate compositions onto substrates.
Abstract: UV curable coating compositions and methods for applying such compositions to surfaces to provide abrasion resistance and/or structural rigidity thereto. The UV curable compositions of the present invention include at least one curable (meth)acrylate, at least one photoinitiator which absorbs only in the UV range of the electromagnetic spectrum, and an inorganic filler, at least a portion of which having a particle size in the range of 1 to 1,000 nm. The compositions may further comprise a reactive diluent.
Type:
Grant
Filed:
April 12, 2005
Date of Patent:
May 29, 2012
Assignee:
Henkel Corporation
Inventors:
Alan Edward Litke, Victor Karol Kadziela
Abstract: The present invention relates to new cure accelerator systems for anaerobic curable compositions. These anaerobic cure accelerator systems include the combination of a cationic initiator and a reducing agent, plus either (a) an aromatic nitrogen-containing compound and a thiol or (b) acetyl phenyl hydrazine.
Abstract: The invention relates to a curable benzoxazine macromonomer containing at least 3 benzoxazine rings and at least one aliphatic, heteroaliphatic, araliphatic, hetereoaraliphatic, aromatic or heteroaromatic fragment, the fragment comprising a shortest atom chain containing at least 40 consecutive atoms between two benzoxazine nitrogen atoms or between two benzoxazine oxygen atoms, and said atom chain must not include any oxazine ring atoms (“soft fragment”). The invention further relates to cured products made thereof and a method or producing the same.
Type:
Grant
Filed:
April 23, 2010
Date of Patent:
May 1, 2012
Assignees:
Henkel AG & Co. KGaA, Henkel Corporation
Inventors:
Andreas Taden, Ursula Tenhaef, Stefan Kreiling, Rainer Schoenfeld, Stanley Leroy Lehmann
Abstract: Polymerizable combinations, comprising at least one first component selected from the group of benzoxazine monomers and at least one second component selected from the group of aromatic esters are described. Further on the use of aromatic esters as additives to benzoxazine monomers as well as methods of coating a device by heating the above mentioned combination, and a device, coated by that way is explained.
Type:
Grant
Filed:
November 19, 2009
Date of Patent:
April 17, 2012
Assignee:
Henkel AG & Co. KGaA
Inventors:
Atsushi Sudo, Ryoichi Kudoh, Kazuya Uenishi, Takeshi Endo, Andreas Taden, Rainer Schönfeld, Thomas Huver
Abstract: This invention relates to (meth)acrylate-based polymerizable compositions and adhesive systems prepared therefrom, which include a alkylated borohydride or tetraalkyl borane metal or ammonium salt and a polymerizable siloxane. The inventive compositions and adhesive systems are particularly well suited for bonding applications which involve at least one low energy bonding surface, for example, the polyolefins, polyethylene, and polypropylene.
Abstract: The reaction of diner acids, C10-C20 dicarboxylic acids, and alkylene diamines having from 2 to 8 carbon atoms provides polyamides having good oil and solvent resistance, high heat resistance, flexibility, and relatively low melt viscosities.
Abstract: This application relates to polysiloxane compositions grafted with improved heat curable, moisture curable, or heat/moisture curable groups. In particular, the polysiloxane compositions have reactive groups on the terminal or pendent areas of the siloxane backbone, which once reacted provide improved heat and/or moisture curable polysiloxanes.
Type:
Grant
Filed:
November 26, 2008
Date of Patent:
February 21, 2012
Assignee:
Henkel Corporation
Inventors:
Bahram Issari, Michael P. Levandoski, Richard Corrao, Hsien-Kun Chu, Robert P. Cross
Abstract: Room temperature curing structural adhesive compositions including polyurethane oligomers having multi-methacrylate functionality, cycloalkylmethacrylate, at least one maleimide-functionalized compound and a cure system are disclosed. These compositions exhibit enhanced high temperature properties, including hot strength, heat/humidity strength, and heat aging strength, without compromising initial tensile strength and fixture speeds and still possessing a room temperature cure.
Type:
Grant
Filed:
December 8, 2009
Date of Patent:
February 21, 2012
Assignee:
Henkel Corporation
Inventors:
Susan Lamtroung Levandoski, Christopher J. Verosky, Brian M. Czabaj
Abstract: The present invention provides moisture curable polyacrylate compositions, which cured elastomers thereof demonstrate improved resistance to shrinkage when exposed to hydrocarbon fluids such as transmission fluids and oil and fuel based fluids. Such compositions include: a) a moisture curable silyl functionalized polyacrylate; and b) at least one hydrocarbon fluid-absorbing component, wherein the hydrocarbon-fluid absorbing component is present in an amount sufficient to reduce shrinkage of the cured composition when exposed to a hydrocarbon fluid.
Type:
Grant
Filed:
October 13, 2006
Date of Patent:
February 21, 2012
Assignee:
Henkel Corporation
Inventors:
Chiu-Sing Lin, Thomas Fay-Oy Lim, Bahram Issari
Abstract: A two-part moisture-curing composition having as a first part water and an hydroxy-terminated diorganosiloxane; and a second part which includes a reactive silicone, at least one end-capping silane which includes one or more enoxy groups, at least one end-capping catalyst and at least one moisture cure catalyst. Enhanced and controlled cure speed is obtained by these compositions.
Type:
Grant
Filed:
September 18, 2009
Date of Patent:
February 7, 2012
Assignee:
Henkel Corporation
Inventors:
Michael P. Levandoski, Jennifer Lynn Smith McCarthy
Abstract: Reaction products prepared from reactants including: (a) at least one compound of structural Formula (I): wherein R1 is selected from aryl and heteroaryl; X is selected from a direct bond, —O—, —S—, —NH—, alkylene, cycloalkylene, heterocyclylene, arylene, alkarylene, and heteroarylene; Y is a substituted alkylene group having at least two contiguous carbon atoms and which can be interrupted by one or more —O—, —S—, or —NH— moieties as defined herein, wherein the alkylene group of Y has substituents independently selected from —OH, —NH2, —SH, cycloalkyl, heterocyclyl, aryl, and heteroaryl, or two hydrogen atoms on the same carbon atom of Y are replaced by carbonyl, and wherein at least two substituents of Y are each independently selected from —OH, —NH2, and —SH, as defined herein; and (b) at least one isocyanate functional material.
Type:
Grant
Filed:
May 7, 2008
Date of Patent:
January 31, 2012
Assignee:
Henkel Corporation
Inventors:
Anthony F. Jacobine, Andrew Messana, David M. Glaser, Steven Thomas Nakos
Abstract: The present invention provides curable poly(acrylate) compositions, cured reaction products of which demonstrate improved resistance to shrinkage when exposed to hydrocarbon fluids, such as transmission fluids and oil- and fuel-based fluids.
Type:
Grant
Filed:
September 26, 2006
Date of Patent:
January 3, 2012
Assignee:
Henkel Corporation
Inventors:
Chiu-Sing Lin, Qinyan Zhu, Robert P. Cross
Abstract: The invention relates to silane cross-linking curable compositions, comprising a polymer P with at least two terminal groups of the following formulae (I) and (II) -Am-K1—SiXYZ (I), -Am-K2—SiXYZ (II), and/or two polymers P1 and P2, the polymer P1 having terminal groups of the following formula (I) -Am-K1—SiXYZ (I), and the polymer P2 having terminal groups of the following formula (II) -Am-K2—SiXYZ (II). In said formulae, A represents a bivalent binding group K1 and K2 independently of one another represent a bivalent aliphatic hydrocarbon group with a main chain of between 1 and 6 carbon atoms, the hydrocarbon groups K1, K2 being different, X, Y and Z independently of one another represent a hydroxy group of a hydrolysable group and m stands for 0 or 1.
Type:
Grant
Filed:
March 26, 2010
Date of Patent:
December 13, 2011
Assignee:
Henkel AG & Co. KGaA
Inventors:
Ulrich Neuhausen, Daniela Braun, Johann Klein, Christiane Kunze, Sara Gonzalez, Lars Zander, Thomas Bachon
Abstract: This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (“snap cure underfills”), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55° C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.
Type:
Grant
Filed:
October 24, 2006
Date of Patent:
December 13, 2011
Assignee:
Henkel Corporation
Inventors:
Qing Ji, Chew B. Chan, Hwang K. Yun, Renzhe Zhao, Weitong Shi
Abstract: This invention relates to a system for forming a composite from a cyanoacrylate composition and a filler within depressions, holes, cracks or spaces in a substrate. The system also allows for the placement of a cantilevered member in the filled depression, hole, crack or space in the substrate to support a load when the cyanoacrylate has cured.
Type:
Grant
Filed:
December 19, 2005
Date of Patent:
December 6, 2011
Assignee:
Loctite (R&D) Limited
Inventors:
Patrick F. McDonnell, Brendan J. Kneafsey, Robert J. Lambert