Abstract: A photoinitiated cationically curable composition is provided, including at least one substantially saturated epoxy component comprising at least two glycidyl ether groups; at least one acrylonitrile/butadiene copolymer; and at least one cationic photoinitiator. The compositions exhibit excellent strength properties as well as reduced color formation upon curing, particularly after post-curing thermal treatments. Methods of bonding substrates with such compositions and articles prepared therefrom are also provided through the invention.
Abstract: Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin in advanced processes, such as resin transfer molding, vacuum assisted transfer molding and resin film infusion, and their use in such advanced processes form the basis of the present invention.
Type:
Grant
Filed:
August 5, 2004
Date of Patent:
May 4, 2010
Assignee:
Henkel Corporation
Inventors:
Stanley L. Lehmann, Wei Helen Li, Raymond S. Wong
Abstract: The present invention relates to new cure accelerators for anaerobic curable compositions. These anaerobic cure accelerators are generally sulfonimide derivatives and sulfonamide derivatives.
Abstract: The present invention is directed to reaction products prepared from at least one Michael addition donor material including two or more active methylene hydrogens; and at least one material capable of reacting with a Michael addition donor, the material having one Michael addition acceptor and at least one functional group selected from the group consisting of hydroxy, hydroxyalkyl, vinyl ether, amino, aminoalkyl, carboxy, carboxyalkyl, cyano, and cyanoalkyl groups; or reaction products prepared from (a) at least one Michael addition donor material comprising at least one Michael Addition donor group selected from the group consisting of cyano functional groups and phosphono functional groups; and (b) at least one material capable of reacting with the at least one Michael addition donor group, the material having at least one Michael addition acceptor, wherein the above reaction products are capable of forming free radicals upon exposure to actinic radiation; as well as compositions, and processes for making
Type:
Grant
Filed:
July 23, 2007
Date of Patent:
April 27, 2010
Assignee:
Henkel Corporation
Inventors:
Anthony F. Jacobine, John G. Woods, Joel D. Schall, Steven T. Nakos, Andrew D. Messana, David M. Glaser
Abstract: The present invention generally relates to a moisture curable composition in the form of a hot melt. The inventive compositions contain hydrolyzable silyl groups connected to a polymer which is capable of crosslinking when exposed to moisture.
Type:
Grant
Filed:
October 29, 2007
Date of Patent:
April 6, 2010
Assignee:
Henkel Corporation
Inventors:
Thomas Fay-Oy Lim, David Dworak, Jessica Fedorchick, Hsien-Kun Chu
Abstract: A curable composition exhibiting excellent moldability without mold staining or delamination is provided, including an epoxy resin, a curing agent for the epoxy resin, and a polyphenylene oxide compound having a glass transition temperature between about 165° C. and about 190° C. The polyphenylene oxide compound may be provided as a melt blended mixture of two polyphenylene oxide compounds having distinct glass transition temperatures. The curable compositions may further include a bulk filler, and are therefore particularly useful as molding compounds encapsulation of electrical and/or electronic parts in transfer molding operations.
Abstract: A two-part curable foaming composition comprising: (A) A first part comprising: (i) an alkoxysilyl capped prepolymer; and (ii) a polyhydrogen siloxane; (iii) optionally a catalyst which accelerates both foaming and cross-linking through said alkoxysilyl groups; and (B) A second part comprising: (i) a nitrogen-containing compound having an active hydrogen; (ii) water; and (iii) optionally a catalyst which accelerates both foaming and cross-linking through said alkoxysilyl groups; provided that at least one of the parts contain a catalyst and wherein after mixing together the first and second parts a cured elastomeric foam is formed.
Type:
Grant
Filed:
March 24, 2003
Date of Patent:
March 9, 2010
Assignee:
Henkel Corporation
Inventors:
Thomas Fay-Oy Lim, James E. Lionberger, Steven T. Nakos
Abstract: The present invention concerns ?-silyl terminated polydiorganosiloxanes, a method of making the ?-silyl terminated polydiorganosiloxanes, and sealant compositions containing said compounds and a method of using such sealant compositions.
Type:
Grant
Filed:
October 26, 2006
Date of Patent:
March 9, 2010
Assignee:
Henkel AG & Co. KGaA
Inventors:
Matthias Koch, Thomas Bachon, Andreas Ferencz, Thomas F. Lim
Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
Type:
Grant
Filed:
July 21, 2008
Date of Patent:
March 2, 2010
Assignee:
Henkel Corporation
Inventors:
John G. Woods, Yuhshi Lu, Bruce C. B. Chan, Philip T. Klemarczyk, Andrew D. Messana
Abstract: Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an adhesive, and form the basis of the present invention.
Type:
Grant
Filed:
December 3, 2004
Date of Patent:
February 23, 2010
Assignee:
Henkel Corporation
Inventors:
Wei Helen Li, Stanley L. Lehmann, Raymond S. Wong
Abstract: This invention relates to a process for producing electron deficient olefins, such as 2-cyanoacrylates, in a polar solvent, such as an ionic liquid.
Abstract: A curable composition and method for producing a tear resistant, yet soft and deformable in-the-ear product yielding the user greater comfort and durability. The curable composition incorporated into a hearing aid apparatus provides a deformable, yet tear resistant housing, which may be mated to a soft tip component. The hearing aid housing provides better comfort, durability and acoustic performance for a variety of ear canal shapes. The curable composition that provides these properties includes at least one urethane acrylate oligomer, at least one reactive diluent and a cure system. The composition when cured desirably produces a tear strength of at least about 75 pli and a hardness of about Shore A 60 to about 75.
Type:
Grant
Filed:
January 14, 2009
Date of Patent:
February 9, 2010
Assignee:
Henkel Corporation
Inventors:
Alan Edward Litke, JoAnn DeMarco, Victor Karol Kadziela
Abstract: The present invention relates to curable compositions of benzoxazines, a combination of adducts one of which is prepared from hydroxy-containing compounds, isocyanate-containing compounds and phenolic compounds and the second of which is prepared from the first adduct and epoxy-containing compounds and phenolic compounds, epoxy resins and optionally tougheners.
Type:
Grant
Filed:
December 2, 2005
Date of Patent:
January 19, 2010
Assignee:
Henkel Corporation
Inventors:
Wei Helen Li, Stanley L. Lehmann, Raymond S. Wong
Abstract: Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an adhesive, and form the basis of the present invention.
Type:
Grant
Filed:
October 26, 2006
Date of Patent:
January 19, 2010
Assignee:
Henkel Corporation
Inventors:
Wei Helen Li, Stanley L. Lehmann, Raymond S. Wong
Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applications, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
Type:
Grant
Filed:
September 5, 2006
Date of Patent:
January 12, 2010
Assignee:
Henkel Corporation
Inventors:
Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna, Jr.
Abstract: The present invention provides curable hot melt compositions including reactive polymers, which are reinforced by organic polymers to impart higher tensile strength and elongation to the compositions upon cure. In particular, the present invention provides curable hot melt compositions including a silicone urea based polymer and a reinforcement polymer. In some embodiments, the compositions cure upon exposure to moisture and/or radiation. The compositions may be used, for example, as sealants or adhesives.
Type:
Grant
Filed:
October 27, 2006
Date of Patent:
December 1, 2009
Assignee:
Henkel Corporation
Inventors:
Thomas Fay-Oy Lim, David P. Dworak, Mathias E. Liistro, Jr., Hsien-Kun Chu
Abstract: A cap assembly for closing a container. The cap assembly has: (i) an undercap having a cap body with a top end (or wall) and with at least one endless side wall depending from the top end (or wall) to form a housing for receiving the neck of a container; (ii) an overcap having an overcap body with a top end and with at least one endless side wall depending from the top end to form a housing for receiving and engaging the (cap body of the) undercap; and (iii) an applicator having a stem with a first end for engagement with, or integrally formed with, the undercap within the housing, so that the stem projects from the housing, and a second free end for applying product. The exterior of the undercap body has a series of circumferentially arranged teeth for interengagement with a corresponding series of circumferentially arranged teeth within the housing of the overcap.
Type:
Grant
Filed:
February 7, 2001
Date of Patent:
November 24, 2009
Assignee:
Locite (R&D) Limited
Inventors:
Michael A. Doherty, Geoffrey F. Seymour
Abstract: A molding compound is provided for use in encapsulating electronic packages which include an optoelectronic component, such as an LED. The molding compound includes a partially cured epoxy composition, an antioxidant, and, optionally, a phosphor material substantially uniformly distributed throughout the epoxy composition. The optional phosphor material may be suspended within the epoxy composition by pre-reacting a portion of the epoxy composition prior to B-staging of the molding compound. As such, the optional phosphor material is suspended within the epoxy composition, thereby preventing settling of the phosphor material during B-staging, as well as during curing of the molding compound in the encapsulation process.